2520 TEKTRONIX | Alldatasheet
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The Model 2520 Pulsed Laser Diode Test System is an integrated, synchronized system for testing laser diodes early in the manufacturing process, when proper temperature control cannot be easily achieved. The Model 2520 provides all sourcing and measurement capabilities needed for pulsed and continuous LIV (light-currentvoltage) testing of laser diodes in one compact, half-rack instrument. The tight synchronization of source and measure capabilities ensures high measurement accuracy, even when testing with pulse widths as short as 500ns. Key Performance Specifications
- Simplifies laser diode LIV testing prior to packaging or active temperature control
- Integrated solution for in-process LIV production testing of laser diodes at the chip or bar level
- Sweep can be programmed to stop on optical power limit
- Combines high accuracy source and measure capabilities for pulsed and DC testing
- Synchronized DSP based measurement channels ensure highly accurate light intensity and voltage measurements
- Programmable pulse on time from 500ns to 5ms up to 4% duty cycle
- Pulse capability up to 5A, DC capability up to 1A
- 14-bit measurement accuracy on three measurement channels (VF, front photodiode, back photodiode)
- Measurement algorithm increases the pulse measurement’s signal-tonoise ratio
- Up to 1000-point sweep stored in buffer memory eliminates GPIB traffic during test, increasing throughput
- Digital I/O binning and handling operations
- IEEE-488 and RS -232 interfaces
2520 Pulsed Laser Diode Test System
Applications
Production testing of:
- Telecommunication laser diodes
- Optical storage read/write head laser diodes
- Vertical Cavity Surface-Emitting Lasers (VCSELs)
- Thermal impedance
- Junction temperature response Remote Electrical Test Head included
TEK.COM LIV Test Capability The Model 2520 can perform pulsed LIV testing up to 5A and continuous LIV testing up to 1A. Its pulsed testing capability makes it suitable for testing a broad range of laser diodes, including the pump laser designs for Raman amplifiers. The instrument’s ability to perform both DC and pulsed LIV sweeps on the same device simplifies analyzing the impact of thermal transients on the LIV characteristics of the laser diode. Maximize Throughput and Eliminate Production Bottlenecks By working in cooperation with leading laser diode manufacturers, Keithley designed the Model 2520 specifically to enhance chip- and bar-level test stand yield and throughput. Its integrated design, ease of use, high speed, and high accuracy provides a complete solution to help laser diode manufacturers meet their production schedules. Producers of laser diodes face constant pressure to increase test throughput and optimize return on investment for their capital equipment used in production testing. Until recently, these producers were forced to use relatively slow and cumbersome test stands for testing laser diodes at the chip and bar level, which often led to production bottlenecks. Higher Resolution for Higher Yields To achieve the required signal-to-noise ratio, traditional chip- and bar-level LIV testing solutions have required the use of boxcar averagers or test system control software modifications to allow averaging several pulsed measurements. The resolution of these measurements is critical for the “kink” test and threshold current calculations. With earlier test system designs, particularly when performing the kink test, low resolution and poor linearity of the analog digitizer made it extremely difficult to discriminate between noise in the measurement and an actual device kink. The Model 2520’s unique DSP-based measurement approach automatically identifies the settled region of the pulsed waveforms measured. This means the Model 2520 stores only that portion of the pulse that is “flat” and contains meaningful data. All measurements made in the flat portion of the pulse are averaged to improve the Signal- to-Noise ratio still further. If greater resolution is required, the Model 2520 can be programmed to perform several pulse and measure cycles at the same pulse amplitude. By making it possible to conduct more thorough testing at the bar or chip level, the Model 2520 also eliminates the wasted time and costs associated with assembling then scrapping modules with non-compliant diodes. Simple, One-Box Test Solution The Model 2520 offers three channels of source and measurement circuitry. All three channels are controlled by a single digital signal processor (DSP), which ensures tight synchronization of the sourcing and measuring functions. The laser diode drive channel provides a current source coupled with voltage measurement capability. Each of the two photodetector channels supplies an adjustable voltage bias and voltage compliance, in addition to current measurement capability. These three channels provide all the source and measure capabilities needed for full LIV characterization of laser diodes prior to integration into temperature controlled modules. By eliminating the need for GPIB commands to perform test sweeps with multiple separate instruments, the Model 2520’s integrated sourcing and measurement allows a significant improvement in throughput.
Ordering Information
2520 Pulsed Laser Diode Test System with
User’s Manual, Quick Reference Guide, Triax Cables (2), BNC 10W Coaxial Cables (4) Accessories Available 7007-1 Double Shielded GPIB Cable, 1m (3.3 ft.) 7007-2 Double Shielded GPIB Cable, 2m (6.6 ft.) KPCI-488LPA IEEE-488 Interface/ Controller for the PCI Bus KUSB-488B IEEE-488 USB-to-GPIB Adapter for USB Port Services Available 2520-3Y-EW 1-year factory warranty extended to 3 years from date of shipment C/2520-3Y-DATA 3 (Z540-1 compliant) calibrations within 3 years of purchase* *Not available in all countries
levels of 10μs (off time) and 100ns (on time). limitations often placed barriers on test performance.
- In this test, a 100-point pulsed LIV sweep using a 1μs
faster than existing, semi-custom test systems. FIGURE 1. This schematic reflects the current testing practices of severely limiting the flexibility of the test system. FIGURE 2. The Model 2520 integrates synchronization, source, and head) to provide maximum flexibility and test throughput. FIGURE 3. This plot illustrates the Model 2520’s pulsed LIV sweep
especially when a short duty cycle is used. current value to initiate spectral measurements. head. Production test practices vary widely (automated vs. external handler control and binning operations. FIGURE 4. Model 2520 Remote Test Head
TEK.COM Max.6, 8, 9 Rise/Fall Time 6, 8, 9, 10 Typical Max. 500 mA 10 Ω 1⁄4 Watt Fast 1.0% 70 ns 95 ns 500 mA 10 Ω 1⁄4 Watt Slow 0.1% 1.2 µs 1.5 µs 5.00 A 1.5 Ω 1 Watt Fast 1.0% 100 ns 130 ns Laser Diode Pulse or DC Current Source Specifications Drive Current Off Current 4 Source Range Programming Resolution Approx. Electrical Resolution Accuracy1, 6 ±(%rdg. + mA) 2, 3 RMS Noise (typical) (1kHz–20MHz) Range Programming Resolution Approx. Electrical Resolution Accuracy1 ±(%rdg. + mA) 0–1.0 A DC General DC FLOATING VOLTAGE: User may float common ground up to ±10VDC from chassis ground. COMMON MODE ISOLATION: >109Ω. OVERRANGE: 105% of range on all measurements and voltage compliance. SOURCE OUTPUT MODES: Fixed DC Level Fixed Pulse Level DC Sweep (linear, log, and list) Pulse Sweep (linear, log, and list) Continuous Pulse (continuous – low jitter) PROGRAMMABILITY: IEEE-488 (SCPI-1995.0), RS-232, 5 user-definable power-up states plus factory default and *RST. DIGITAL INTERFACE: Safety Interlock: External mechanical contact connector and removable key switch. Aux. Supply: +5V @ 300mA supply. Digital I/O: 2 trigger input, 4 TTL/Relay Drive outputs (33V @ 500mA max., diode clamped). Trigger Link: 6 programmable trigger input/outputs. Pulse Trigger Out BNC: +5V, 50W output impedance, output trigger corresponding to current source pulse; pulse to trigger delay <100ns. See Figure 3. MAINS INPUT: 100V to 240V rms, 50–60Hz, 140VA. EMC: Conforms to European Union Directive 89/336/EEC (EN61326-1). SAFETY: Conforms to European Union Directive 73/23/EEC (EN61010-1) CAT 1. VIBRATION: MIL-PRF-28800F Class 3, Random. WARM-UP: 1 hour to rated accuracy. DIMENSIONS, WEIGHT: Main Chassis, bench configuration (with handle & feet): 105mm high × 238mm wide × Remote Test Head: 95mm high × 178mm deep (with interlock key installed) × 216mm ENVIRONMENT: Storage: –25° to 65°C. Laser Diode Voltage Measure Specifications Range Minimum Resolution Accuracy ±(%rdg. + volts) 1, 12 RMS Noise (typical) 13 5.00 V 0.33 mV 0.3% + 6.5 mV 90 µV 10.00 V 0.66 mV 0.3% + 8 mV 180 µV Photodiode Current Measure Specifications (each channel) Range Minimum Resolution 4 DC Input Impedance Accuracy ±(%rdg. + current) 1, 2 RMS Noise (typical) 3 10.00 mA 0.7 µA < 10 Ω 0.3% + 20 µA 90 nA 20.00 mA 1.4 µA < 6 Ω 0.3% + 65 µA 180 nA 50.00 mA 3.4 µA < 3 Ω 0.3% + 90 µA 420 nA 100.00 mA 6.8 µA < 2.5 Ω 0.3% + 175 µA 840 nA System Speeds Reading Rates (ms)15, 16 Number of Source Points 17 To Memory To GPIB 1 5.3 6.8 10 18 9.5 18 100 18 48 120 1000 18 431 1170 Photodiode Current Measure Specifications (each channel) TEMPERATURE COEFFICIENT (0°–18°C & 28°–50°C): ±(0.15 × accuracy specification)/°C. PULSE ON TIME 19: 500ns to 5ms, 100ns programming resolution. PULSE OFF TIME 19: 20µs to 500ms, 10µs programming resolution. PULSE DUTY CYCLE 20, 21: 0 to 99.6% for ≤ 1.0A; 0 to 4% for >1.0A. VOLTAGE COMPLIANCE: 3V to 10V, 10mV programming resolution 5. POLARITY: 1 quadrant source, polarity reversal available through internal relay inversion. OUTPUT OFF: <200m Ω short across laser diode; measured at Remote Test Head connector. TEMPERATURE COEFFICIENT (0°–18°C & 28°–50°C): ±(0.15 × accuracy specification)/°C. MAX. LEAD RESOLUTION: 100Ω for rated accuracy. INPUT IMPEDANCE: 2MΩ differential, 1M Ω from each input to common. Input bias current ±7.5µA max. TEMPERATURE COEFFICIENT (0°–18°C & 28°–50°C): ±(0.15 × accuracy specification)/°C. INPUT PROTECTION: The input is protected against shorting to the associated channel’s internal bias supply. The input is protected for shorts to external supplies up to 20V for up to 1 second with no damage, although calibration may be affected. RANGE: 0 to ±20VDC. PROGRAMMING RESOLUTION: 10mV. ACCURACY: ±(1% + 50mV). CURRENT: 160mA max. with V-Bias shorted to I-Measure. RMS NOISE (1kHz to 5MHz) : 1mV typical.
TEK.COM
- At DC, 10μs measurement pulse width, filter off. 13. Standard deviation of 10,000 readings with 10μs pulse width, filter off, with I source set to 0A DC. 14. The A/D converter has 14 bit resolution. The useful resolution is improved by reading averaging. The useful resolution is: 15. Excluding total programmed (Pulse ON time + Pulse OFF time). 16. Front panel off, calc off, filter off, duty cycle <10%, binary communications. 17. Returning 1 voltage and 2 current measurements for each source point. 18. Sweep mode. 19. Valid for both continuous pulse and sweep modes. 20. Duty Cycle = (pw/(pw+pd)) 21. Valid for continuous pulse mode only. For all other modes, as the pulse width becomes large relative to the pulse delay, the actual pulse delay may be longer than the programmed pulse delay due to time required for measurement processing. Typical minimum pulse delay settings for a given pulse width can be seen in the graph in Figure 4. Notes 1. 1 year, 23°C ±5°C. 2. If Duty Cycle · I exceeds 0.2, accuracy specifications must be derated with an additional error term as follows: 500mA Range: ±0.1% rdg. · D · I 5A Range: ±0.3% rdg. · D · I where: I = current setting D = duty cycle This derating must also be applied for a period equal to the time that D · I was >0.2. 3. Not including overshoot and setting time. 4. Pulse mode only. 5. Output: 500mA DC on 500mA range and 1A DC on 5A range. 6. Refer to Model 2520 Service Manual for test setup of current accuracy. 7. Figures 1 and 2 are typical pulse outputs into resistive loads. 8. Typical. 9. Per ANSI/IEEE Std 181-1977. 10. Per ANSI/IEEE Std 181-1977 10% to 90%. 11. DC accuracy ±700mV @ output terminal. 0.2Ω typical output impedance.
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