MITX-KBL-S KONTRON | Alldatasheet
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Technical content
EXTENDED TEMPERATURE SUPPORT 1x LVDS / 1x VGA, 2x DP, 1x DVI-D for display output 2x GbE LAN for Ethernet Up to 6x USB 3.0, up to 6x USB 2.0, 3x RS232/422/485, 3x RS232, 8-bit DIO 4x SATA 3.0, up to 2x mSATA for storage Up to 2x mPCIe, 1x PCIe x16 for expansion MINI-ITX INDUSTRIAL MOTHERBOARD WITH 7TH GEN INTEL® CORE™ / CELERON® S-SERIES PROCESSORS
// 2 www.kontron.com PRODUCT HIGHLIGHTS 7th Gen Intel® Core™ / Celeron® S-Series CPU (FCLGA1151 Socket) Intel® Q170 / H110 Express Chipset 2x DDR4 SO-DIMM memory socket 4x SATA 3.0, up to 2x mSATA for storage RAID support for Q170 models 1x LVDS / 1x VGA, 2x DP, 1x DVI-D for display output 2x GbE LAN for Ethernet Up to 6x USB 3.0, up to 6x USB 2.0, 6x COM, 8-bit DIO 1x PCIe x16, up to 2x mPCIe for expansion Extended temperature model available mITX-KBL-S-Q170/H110 MINI-ITX INDUSTRIAL MOTHERBOARD WITH 7TH GEN INTEL® CORE™ / CELERON® S-SERIES PROCESSORS mITX-KBL-S-Q170/H110 is a Mini-ITX industrial motherboard equipped with 7th Generation Intel® Core™ / Celeron® S-Series Processors. It delivers greatly improved graphics performance, power efficiency and wireless connectivity in comparison with the models powered by the previous generation processors. In addition, the mITX-KBL-S-Q170/H110 features 1x DVI-D, 2x DP, 1x VGA / 1x LVDS, up to 6x USB 3.0, up to 6x USB 2.0, 6x COM, 8-bit DIO and 2x GbE LAN for display support, peripheral applications and wired networking. It has a variety of expansion slots / sockets for wireless, storage or other function expansion, including PCIe x16, mPCIe, SATA 3.0 and mSATA slots / sockets. Finally, an extended temperature model is offered, allowing opera- tion under extreme high, low or radically fluctuating temperatures, which is common in industrial environments. DVI-DGbE USB 2.0 USB 3.0 GbE BLOCK DIAGRAM RS232/422/485 DP DPRS232/422/485 Line-In Mic-InUSB 3.0 Line-Out 7th Gen Intel® Core™ / Celeron® S-Series Processor with LGA1151 Socket 2x mPCIe/ mSATA Socket SIM Card Holder 2x DDR4 SO-DIMM 2x Smart FAN 3x RS232 Port PCIe x1 / SATA UARTs SIM DDIADisplay Port Connector DDIB DDIC DMI 4x USB 3.0 Port 4x SATA Connector 8x USB 2.0 Port USB 3.0 USB 2.0 SATA Q170 / H110 Chipset DDR4 2133 PCIe x16 Slot PCIe x16 8-bit Digital I/O 3x RS232/ PortNCT6106D Super I/O UARTs GPIOs Smart FAN RJ45 Connector RJ45 Connector I210-AT GbE Controller GbE GbEI219-LM GbE PHY 3x Audio Jack L-Out/M-InALC888S Audio Codec PS/2 KB/MS PS/2 SLB9660 TPM Chip LPC PCIe x1 PCIe x1 HDA Front Audio Header ATX Power Supply DVI-D Connector Display Port Connector L-Out/M-In EDP CH7511 Converter to LVDS EDP CH7517 Converter to VGA
STORAGE & EXPANSION POWER FIRMWARE SYSTEM CONTROL & MONITORING COOLING SOFTWARE MECHANICAL ENVIRONMENTAL CERTIFICATION PROCESSOR CHIPSET MEMORY GRAPHICS DISPLAY INTERFACE MULTIPLE DISPLAY AUDIO CODEC AUDIO INTERFACE ETHERNET USB SERIAL PORT OTHER I/Os SATA mSATA / mPCIe mPCIe PCIe SIM CARD HOLDER CONNECTOR & INPUT VOLTAGE BIOS WATCHDOG H/W MONITOR REAL TIME CLOCK SECURITY iAMT FP HEADER FAN OS SUPPORT DIMENSION (L x W) OPERATING TEMPERATURE STORAGE TEMPERATURE HUMIDITY EMC & SAFETY 7th Gen Intel® Core™ / Celeron® S-Series Processors (FCLGA1151 Socket) Intel® Q170 Intel® H110 2x DDR4 2133 / 2400 SO-DIMM up to 32 GByte (Core™ CPU) 2x DDR4 2133 SO-DIMM up to 32 GByte (Celeron® CPU) Intel® HD Graphics 630 (Core™ CPU) Intel® HD Graphics 610 (Celeron® CPU) 1x LVDS (24-bit, 2-ch, 1920 x 1200 @ 60 Hz) 1x VGA (by header, 1920 x 1200 @ 60 Hz) 1x DVI-D (on rear, 1920 x 1200 @ 60 Hz) 2x DP (on rear, 4096 x 2304 @ 60 Hz) Dual (model w/ H110 chipset, LVDS and VGA are alternative each other) Triple (model w/ Q170 chipset, LVDS and VGA are alternative each other) Realtek ALC888S 1x Line-in (on rear) 2x Line-out (1x on rear, 1x by header) 2x Mic-in (1x on rear, 1x by header) 1x S/PDIF (by header) 2x GbE LAN (RJ45 on rear, 1x Intel® I219-LM, 1x Intel® I210-AT) 4x USB 3.0 (Type A on rear, for H110 model) 6x USB 3.0 (4x Type A on rear, 2x by header, for Q170 model) 4x USB 2.0 (2x Type A on rear, 2x by header, for H110 model) 6x USB 2.0 (2x Type A on rear, 4x by header, for Q170 model) 3x RS232/422/485 (2x DB9 on rear, 1x by header) 3x RS232 (by header) 1x PS/2 Keyboard/Mouse (by wafer) 1x 8-bit DIO (by wafer) 4x SATA 3.0 (RAID support for Q170 model) 2x mSATA / mPCIe (1x full size, 1x half size, for Q170 model) 2x mPCIe (1x full size, 1x half size, for H110 model) 1x PCIe x16 1x SIM Card Cage (by wafer) 2x12-pin ATX connector (DC +5 V / -5 V / +12 V / -12 V / +3.3 V / 5 VSB) 2x2-pin ATX connector (DC 12 V) AMI uEFI BIOS w/ 128 Mb SPI Flash Programmable WDT to generate system reset event Input & Core Voltages, CPU & System Temperatures Chipset integrated RTC TPM 2.0 supported for Q170 model (Infineon SLB 9665) Supported for Q170 model 1x Header for Reset button, HDD LED & External Speaker 1x Header for Power button, Power LED & SM bus 1x Header for LAN LED 1x Header for Port-80 Display 1x Wafer for CPU Smart Fan 1x Wafer for System Smart Fan Windows 10, Linux Mini-ITX (170 mm x 170 mm / 6.70" x 6.70") 0 °C ~ 60 °C / 32 °F ~ 140 °F (Standard) -20 °C ~ 70 °C / -4 °F ~ 158 °F (Extended) -20 °C ~ 80 °C / -4 °F ~ 176 °F (Standard) -40 °C ~ 85 °C / -40 °F ~ 185 °F (Extended) 0 % ~ 95 % CE Class A, FCC Class A // 3www.kontron.com
Copyright © 2021 Kontron AG. All rights reserved. All data is for information purposes only and not guaranteed for legal purposes. Information has been carefully checked and is believed to be accurate; however, no responsibility is assumed for inaccuracies. Kontron and the Kontron logo and all other trademarks or registered trademarks are the property of their respective owners and are recognized. Specifications are subject to change without notice. mITX-KBL-S-20210617 - WMH ORDERI NG INFORMATION ARTICLE mITX-KBL-S-Q170 mITX-KBL-S-H110 mITX-KBL-S-Q170-ET mITX-KBL-S-H110-ET
DESCRIPTION
Intel® Q170 Chipset, 6x USB 3.0, 6x USB 2.0, 2x mSATA / mPCIe, w/ TPM 2.0, w/ RAID, Operating temperature: 0 °C ~ 60 °C Intel® H110 Chipset, 4x USB 3.0, 4x USB 2.0, 2x mPCIe, w/o TPM, w/o RAID, Operating temperature: 0 °C ~ 60 °C Intel® Q170 Chipset, 6x USB 3.0, 6x USB 2.0, 2x mSATA / mPCIe, w/ TPM 2.0, w/ RAID, Operating temperature: -20 °C ~ 70 °C Intel® H110 Chipset, 4x USB 3.0, 4x USB 2.0, 2x mPCIe, w/o TPM, w/o RAID, Operating temperature: -20 °C ~ 70 °C ACCESSORIES COM PORT CABLE* DIO CABLE* USB 3.0 CABLE* USB 2.0 CABLE (2 PORT)* SATA CABLE WITH LOCK* PS/2 CABLE* VGA CABLE* 3G MINI SIM CARD HOLDER KIT* PROCESSOR SERIES COOLER* I/O SHIELD (* = Optional) D-SUB 9P (male) to KB915-10H 1x10P 1.25 pitch, L = 230 mm WL1025H-10P(51021) 1x10P 1.25 pitch to F83N-3.81-10P 1x10P(female) + F736-3.81-10P 1x10P(male), L = 100 mm Internal DP 2.0 20pin 2x10P to TypeA, L = 450 mm 2.54 mm 2x5P to 2x USB connectors, L = 340 mm SATA 1x7P Pitch: 1.27 mm, L = 460 mm Y-cable, 6-pin pitch 2.0 mm wafer connector to KB & MS connector, L = 250 mm WL2004H-2x8P 2x8P 2.0 pitch to D-SUB 15P, L = 300 mm W/ SIM card holder *1, 3G SIM card cable *1 LGA1156 Type, AL Heat Sink + FAN 88.0 x 88.0 x 36.7 (H) mm, 12V DC-In small 4P, Support to 85Watt, FAN Speed: 4300RPM, 34.5dBA // 4 KONTRON S&T AG Lise-Meitner-Str. 3-5
86156 Augsburg, Germany
Tel.: + 49 821 4086 0 Fax: + 49 821 4086 111 info@kontron.com www.kontron.c om GLOBAL HEADQUATERS 0C5020000003010L 0C5020000003830L 0C5020000004280L 0C5040000000110L 0C5020000004240L 0C5020002500010L 0C5020000002870L 0ZHK12003GSIM003 0H05XX000001690L 0F0000000000290L ARTICLE DESCRIPTIONPART NO.