FAN3121 overview

FAN3121 is a component documented by ON Semiconductor. The PDF description identifies it as "Single 9-A High-Speed, Low-Side Gate Driver October-2017, Rev. 2." This guide condenses the most useful engineering information from the available PDF so that designers and sourcing teams can identify the checks that still need confirmation in the original document.

Datasheet snapshot

  • Manufacturer: ON Semiconductor
  • Part number: FAN3121
  • Category: Logic IC
  • Datasheet length: 21 Pages

Key features noted in the PDF

  • Lower supply current due to inactive TTL circuitry.
  • EN inputs have modified TTL thresholds; refer to the ENABLE section.
  • See Timing Diagrams of Figure 8 and Figure 9.
  • Not tested in production.
  • Automotive-qualified F085 version specifications.

Specifications and operating details

The following points were extracted from the PDF text. Check the associated conditions, notes and limits in the complete document before using a value in a design.

  • 23-ns / 19-ns Typical Rise/Fall Times (10 nF Load) !
  • Internal circuitry provides an under -voltage lockout function by holding the output low until the supply voltage is within the operating range.
  • Theta_JL (ΘJL): Thermal resistance between the semiconductor junction and the bottom surface of all the leads (including any thermal pad) that are typically soldered to a PCB.
  • Theta_JT (ΘJT): Thermal resistance between the semiconductor junction and the top surface of the package, assuming it is held at a uniform temperature by a top -side heatsink.
  • Theta_JA (ΘJA): Thermal resistance between junction and ambient, dependent on the PCB design, heat sinking, JESD51-2, JESD51-5, and JESD51-7, as appropriate.
  • Block Diagram** operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
  • In addition, extended exposure to stresses above the recommended operating conditions may affect devic e reliability.

Topics covered by the datasheet

The document includes sections related to:

  • Features
  • Applications
  • Description
  • Ordering Information
  • Electrical Characteristics

Engineering review checklist

  • Confirm repetitive reverse voltage, average forward current, surge current and leakage at the intended temperature.
  • Check forward-voltage loss and reverse-recovery behavior at the actual current and switching frequency.
  • Review package thermal resistance, copper area, polarity marking and transient derating before layout release.

Always confirm values against the latest manufacturer-controlled datasheet, especially when qualifying a substitute or releasing a production BOM.

View the complete PDF and model record

Open the FAN3121 datasheet and model details to review the complete PDF, document pages and available product information.

Source attribution

Adapted from the PDF associated with this DigiCamel model page.

Source model URL: https://www.digicamel.com/product.php?slug=fan3121-on-semiconductor