ZXMS6002G ZETEX | Alldatasheet
Document overview
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Technical content
Features
- Status pin (analog status indication) Short circuit protection with auto restart Over voltage protection (active clamp) Thermal shutdown with auto restart Over-current protection Input protection (ESD) Load dump protection (actively protects load) Logic level input High continuous current rating Note: The tab is connected to the drain pin and must be electrically isolated from the source pin. Connection of significant copper to the tab is recommended for best thermal performance. Device Part mark Reel size (inches) Tape width (mm) Quantity per reel ZXMS6002GTA ZXMS6002 7 12 embossed 1000 D Top view S Status IN
Issue 2 - March 2007 2 www.zetex.com © Zetex Semiconductors plc 2007 Functional block diagram Applications and information Especially suited for loads with a high in-rush current such as lamps and motors All types of resistive, inductive and capacitive loads in switching applications /H9262C compatible power switch for 12V and 24V DC applications Automotive rated Replaces electromechanical re lays and discrete circuits Linear mode capability - the current-limiting pr otection circuitry is designed to de-activate at low V DS, in order not to compromise the load current during normal operation. The design max. DC operating current is therefore determin ed by the thermal capability of the package/ board combination, rather than by the protection circuitry Note: This does not compromise the product's abi lity to self-protect during short-circuit load conditions. Status pin voltage reflects the gate drive be ing applied internally to the power MOSFET. With VIN = 5V: Status voltage ~ 5V indicates normal operation. Status voltage ~ (2-3)V indicates that the device is in current-limiting mode. Status voltage < 1V indicates that the device is in thermal shutdown. S Over voltage protection Over current protection Over temperature protection Logic Human body ESD protection D IN dV/dt limitation
Issue 2 - March 2007 3 www.zetex.com © Zetex Semiconductors plc 2007
Issue 2 - March 2007 4 www.zetex.com © Zetex Semiconductors plc 2007 Absolute maximum ratings NOTES: (a) For a device surface mounted on 50mm x 50mm x 1.6mm FR4 board with a high coverage of single sided 2oz weight copper. (b) For a device surface mounted on FR4 board as (a) and measured at t<=10s. Parameter Symbol Limit Unit Continuous drain-source voltage V DS 60 V Drain-source voltage for short circuit protection VIN=5V V DS(SC) 36 V Drain-source voltage for short circuit protection VIN=10V VDS(SC) 20 V Continuous input voltage V IN -0.2 ... +10 V Peak input voltage V IN -0.2 ... +20 V Operating temperature range T j, -40 to +150 °C Storage temperature range T stg -55 to +150 °C Power dissipation @ Tamb =25°C(a) PD 2.5 W Continuous drain current @ VIN=10V; Tamb=25°C(a) ID 1.6 A Continuous drain current @ VIN=5V; Tamb=25°C(a) ID 1.4 A Continuous source current (body diode)(a) IS 3A Pulsed source current (body diode)(b) IS 4.7 A Unclamped single pulse inductive energy E AS 550 mJ Load dump protection V LoadDump 80 V Electrostatic discharge (human body model) V ESD 4000 V DIN humidity category, DIN 40 040 E IEC climatic category, DIN IEC 68-1 40/150/56 Thermal resistance Parameter Symbol Limit Unit Junction to ambient(a) R/H9052JA 50 °C/W Junction to ambient(b) R/H9052JA 28 °C/W
Issue 2 - March 2007 5 www.zetex.com © Zetex Semiconductors plc 2007 Characteristics
Issue 2 - March 2007 6 www.zetex.com © Zetex Semiconductors plc 2007 Electrical characteristics (at Tamb = 25°C unless otherwise stated) Parameter Symbol Min. Typ. Max. Unit Conditions Static characteristics Drain-source clamp voltage V DS(AZ) 60 70 75 V I D=10mA Off state drain current I DSS 0.1 3 /H9262AV DS=12V, VIN=0V Off state drain current I DSS 31 5 /H9262AV DS=32V, VIN=0V Input threshold voltage (*) VIN(th) 12 . 1 V V DS=VGS, ID=1mA Input current I IN 0.7 1.2 mA V IN=+5V Input current I IN 1.5 2.7 mA V IN=+7V Input current I IN 47 m A V IN=+10V Static drain-source on-state resistance RDS(on) 520 675 m /H9024VIN=5V, ID=0.7A Static drain-source on-state resistance RDS(on) 385 500 m /H9024VIN=10V, ID=0.7A Current limit (†) ID(LIM) 0.7 1.0 1.5 A V IN=5V, VDS>5V Current limit(†) ID(LIM) 1.0 1.8 2.3 A V IN=10V, VDS>5V Dynamic characteristics Turn-off time (VIN to 90% ID)t off 13 20 /H9262sR L=22/H9024, VIN=10V to 0V, VDD=12V Slew rate on (70 to 50% VDD)- d V DS/dton 82 0 V / /H9262sR L=22/H9024, VIN=0 to 10V, VDD=12V Slew rate off (50 to 70% VDD)D V DS/dton 3.2 10 V/ /H9262sR L=22/H9024, VIN=10V to 0V, VDD=12V Protection functions (‡) Required input voltage for over temperature protection VPROT 4.5 V Thermal overload trip temperature TJT 150 175 °C Thermal hysteresis 1 °C Unclamped single pulse inductive energy T j=25°C EAS 550 mJ I D(ISO)=0.7A, VDD=32V Unclamped single pulse inductive energy T j=150°C EAS 200 mJ I D(ISO)=0.7A, VDD=32V
Issue 2 - March 2007 7 www.zetex.com © Zetex Semiconductors plc 2007 Status flag Normal operation V STATUS 4.95 V V IN = 5V Current limit operating V STATUS 2.5 V V IN = 5V Thermal shutdown activated V STATUS 0.2 1 V V IN = 5V Normal operation V STATUS 8.0 V V IN = 10V Current limit operation V STATUS 3.0 V V IN = 10V Thermal shutdown activated V STATUS 0.35 1 V V IN = 10V Inverse diode Source drain voltage V SD 1V V IN=0V, -ID=1.4A, NOTES: (*) Protection features may operate outside spec for VIN<4.5V. (†) The drain current is limited to a reduced value when Vds exceeds a safe level (‡) Integrated protection functions are designed to prevent IC destruction under fault co nditions described in the datasheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous, repetitive operation. Electrical characteristics (at Tamb = 25°C unless otherwise stated) Parameter Symbol Min. Typ. Max. Unit Conditions
Issue 2 - March 2007 8 www.zetex.com © Zetex Semiconductors plc 2007 Typical characteristics
Issue 2 - March 2007 9 www.zetex.com © Zetex Semiconductors plc 2007 Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches DIM Millimeters Inches DIM Millimeters Inches Min Max Min Max Min Max Min Max A - 1.80 - 0.071 e 2.30 BSC 0.0905 BSC
Issue 2 - March 2007 10 www.zetex.com © Zetex Semiconductors plc 2007 Definitions Product change Zetex Semiconductors reserves the right to alter, without notice, specifications, design, price or conditions of supply of any product or service. Customers are solely responsible for obtaining the latest relevant information before placing orders. Applications disclaimer The circuits in this design/application note are offered as desi gn ideas. It is the responsibility of the user to ensure that t he circuit is fit for the user’s application and meets with the user’s requirements. No representation or warranty is given and no liability whatsoev er is assumed by Zetex with respect to the accuracy or use of such in formation, or infringement of patents or other intellectual prop erty rights arising from such use or otherwise. Zetex does not assume any le gal responsibility or will not be held legally liable (whether in contract, tort (including negligence), breach of statutory duty, restricti on or otherwise) for any damages, loss of profit, business, con tract, opportunity or consequential loss in the use of these circuit applications, under any circumstances. Life support Zetex products are specifically not authorized for use as critical components in life support devices or systems without the express written approval of the Chief Executive Officer of Zetex Semiconductors plc. As used herein: A. Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labelling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support devi ce or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issu ed to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. Terms and Conditions All products are sold subjects to Zetex’ terms and conditions of sale, and this disclaimer (save in the event of a conflict bet ween the two when the terms of the contract shall prevail) according to region, supplied at the time of order acknowledgement. For the latest information on technology, delivery terms and conditions and prices, please contact your nearest Zetex sales office. Quality of product Zetex is an ISO 9001 and TS16949 certified semiconductor manufacturer. To ensure quality of service and products we strongly advise the purchase of parts dire ctly from Zetex Semiconductors or one of our regionally authorized distributors. For a complete listing of authorized distributors please visit: www.zetex.com/salesnetwork Zetex Semiconductors does not warrant or accept any liability whatsoever in respect of any parts purchased through unauthorized sales channels. ESD (Electrostatic discharge) Semiconductor devices are susceptible to damage by ESD. Suitable precautions should be taken when handling and transporting devices. The possible damage to devices depends on the circumstances of the handling and transporting, and the nature of the device. The extent of damage can vary from immediate functional or parametric malfunc tion to degradation of function or performance in use over ti me. Devices suspected of being affected should be replaced. Green compliance Zetex Semiconductors is committed to envir onmental excellence in all aspects of its operations which includes meeting or exce eding regulatory requirements with respect to the use of hazardous s ubstances. Numerous successful programs have been implemented to reduce the use of hazardous substances and/or emissions. All Zetex components are compliant with the Ro HS directive, and through this it is supporting its customers in their compliance with WEEE and ELV directives. Product status key: “Preview” Future device intended for production at some point. Samples may be available “Active” Product status recommended for new designs “Last time buy (LTB)” Device will be discontinued and last time buy period and delivery is in effect “Not recommended for new designs” Device is still in production to support existing designs and production “Obsolete” Production ha s been discontinued Datasheet status key: “Draft version” This term denotes a very early datasheet ver sion and contains highly provisional information, which may change in any manner without notice. “Provisional version” This term denotes a pre-release datasheet. It provides a clear indication of anticipated performance. However, changes to the test conditions and specifications may occur, at any time and without notice. “Issue” This term denotes an issued datasheet cont aining finalized specifications. However, changes to specifications may occur, at any time and without notice. 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