ZXMS6001N3 ZETEX | Alldatasheet
Document overview
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- PDF pages: 10
Technical content
Features
- Short circuit protection with auto restart Over voltage protection (active clamp) Thermal shutdown with auto restart Over-current protection Input protection (ESD) Load dump protection (actively protects load) Low input current
Ordering information
Device Package Part mark Reel size (inches) Tape width (mm) Quantity per reel ZXMS6001N3TA SOT223 ZXMS6001 7 12 embossed 1,000 S SOT223 S D IN
Issue 1 - January 2008 2 www.zetex.com © Zetex Semiconductors plc 2008 Functional block diagram Applications and information Especially suited for loads with a high in-rush current such as lamps and motors. All types of resistive, inductive and capacitive loads in switching applications. µC compatible power switch for 12V and 24V DC applications. Automotive rated. Replaces electromechanical re lays and discrete circuits. Linear Mode capability - the current-limiting protection circuitry is designed to de-activate at low Vds, in order not to compromise the load cu rrent during normal operation. The design max DC operating current is therefore determined by the thermal capability of the package/board combination, rather than by the protection ci rcuitry. This does not compromise the products ability to self protect itself at low V DS. S Over Voltage Protection Over current protection Over temperature protection Logic Human body ESD protection D IN dV/dt limitation
Issue 1 - January 2008 3 www.zetex.com © Zetex Semiconductors plc 2008 Absolute maximum ratings Thermal resistance NOTES: (a) For a device surface mounted on 25mm x 25mm x 1.6mm FR4 board with a high coverage of single sided 2oz weight copper. Allocation of 6cm 2 copper 33% to source tab and 66% to drain pin with source tab and drain pin electrically isolated. (b) For a device surface mounted on FR4 board as (a) and measured at t<=10s. (c) For a device surface mounted on FR4 board with the minimum copper required for electrical connections. Parameter Symbol Limit Unit Continuous Drain-Source Voltage V DS 60 V Drain-Source Voltage for short circuit protection VIN = 5V V DS(SC) 36 V Continuous Input Voltage V IN -0.2 ... +10 V Peak Input Voltage V IN -0.2 ... +20 V Continuous Input Current -0.2V=VIN=10V VIN<-0.2V or VIN>10V IIN No limit | IIN | ≤2 mA Operating Temperature Range T j, -40 to +150 °C Storage Temperature Range T stg -55 to +150 °C Power Dissipation at TA =25°C(a) PD 1.5 W Power Dissipation at TA =25°C(c) PD 0.6 W Continuous Drain Current @ VIN=5V; TA=25°C(a) ID 1.1 A Continuous Drain Current @ VIN=5V; TA=25°C(c) ID 0.7 A Continuous Source Current (Body Diode)(a) IS 2.0 A Pulsed Source Current (Body Diode)(b) IS 3.3 A Unclamped single pulse inductive energy E AS 550 mJ Load dump protection V LoadDump 80 V Electrostatic Discharge (Human Body Model) V ESD 4000 V DIN humidity category, DIN 40 040 E IEC climatic category, DIN IEC 68-1 40/150/56 Parameter Symbol Value Unit Junction to ambient(a) R/H9052JA 83 °C/W Junction to ambient(b) R/H9052JA 45 °C/W Junction to ambient(c) R/H9052JA 208 °C/W
Issue 1 - January 2008 4 www.zetex.com © Zetex Semiconductors plc 2008 Recommended operating conditions The ZXMS6001 is optimized for use with µC operating from 5V supplies. Electrical characteristics (at Tamb = 25°C unless otherwise stated). NOTES: (d) Recommended input voltage range over which protection circuits function as specified. (e) The drain current is limited to a reduced value when Vds exceeds a safe level Symbol Description Min Max Units VIN Input voltage range 0 6 V TA Ambient temperature range -40 125 °C VIH High level input voltage for MOSFET(d) 46V VP Peripheral supply voltage (voltage to which load is referred) 60 V Parameter Symbol Min Typ Max Unit Conditions Static Characteristics Drain-Source Clamp Voltage VDS(AZ) 60 70 75 V I D=10mA Off state Drain Current I DSS 0.1 3 /H9262AV DS=12V, VIN=0V Off state Drain Current I DSS 31 5 /H9262AV DS=32V, VIN=0V Input Threshold Voltage(d) VIN(th) 11 . 8 2 . 5V V DS=VGS, ID=10mA Input Current I IN 150 /H9262AV IN=+3V Input Current I IN 335 500 /H9262AV IN=+5V, all circumstances Static Drain-Source On-State Resistance R DS(on) 12 Ω VIN=3V, ID=0.1A Static Drain-Source On-State Resistance R DS(on) 520 675 m Ω VIN=5V, ID=0.7A Current Limit(e) ID(LIM) 11 . 83 A V IN=5V, VDS>5V Dynamic Characteristics Turn-On Time (VIN to 90% ID) ton 27 40 /H9262sR L=22Ω, VIN=0 to 5V, VDD=12V Turn-Off time IN to 90% ID) toff 26 40 /H9262sR L=22Ω, VIN=5V to 0V, VDD=12V Slew Rate On (70 to 50% V DD) -dVDS/dton 1.4 10 V/ /H9262sR L=22Ω, VIN=0 to 5V, VDD=12V Slew Rate Off (50 to 70% V DD) DVDS/dton 1.2 10 V/ /H9262sR L=22Ω, VIN=5V to 0V, VDD=12V
Issue 1 - January 2008 5 www.zetex.com © Zetex Semiconductors plc 2008 f Integrated protection functions are designed to prevent IC destruction under fault conditions described in the datasheet. Fault conditions are considered as "outside" normal operating range. Protection functions are not designed for continuous, repetitive operation. Parameter Symbol Min Typ Max Unit Conditions Protection Functions (f) Minimum input voltage for over temperature protection V PROT 4 3.5 V Ttrip>150°C Maximum input voltage for over temperature protection V PROT 7 6 V Ttrip>150°C Thermal Overload Trip Temperature T JT 150 175 °C Thermal hysteresis 8 °C Unclamped single pulse inductive energy Tj=25°C E AS 550 mJ I D(ISO)=0.7A, VDD=32V Unclamped single pulse inductive energy Tj=150°C E AS 200 mJ I D(ISO)=0.7A, VDD=32V Inverse Diode Source drain voltage V SD 1V V IN=0V, -ID=1.4A 012345 100 150 200 250 300 350 VDS = 13.5V VIN = 5V IIN - Input Current (µA) VIN - Input Voltage (V) -40 -20 0 20 40 60 80 100 120 140 VIN = 5V Single Pulse = 300µs VDS = 12V Current Limit v TemperatureInput Current v Input Voltage Temperature (°C) IdLim Current Limit (A)
Issue 1 - January 2008 6 www.zetex.com © Zetex Semiconductors plc 2008
Application information
The current-limit protection circuitry is designed to de-activate at low Vds to prevent the load current from being unnecessarily restricted during normal operation. The design max DC operating current is therefore determined by the thermal capability of the package/board combination, rather than by the protection circuitry (see graph page 8 'typical output characteristic'). This does not compromise the products ability to self protect at low V DS. The overtemperature protection circuit trips at a minimum of 150°C. So the available package dissipation reduces as the maximum required ambi ent temperature increases. This leads to the following maximum recommended continuous operating currents. Minimum copper area characteristics For minimum copper condition as described in note (c) Max Ambient Temperature TA Maximum continuous current VIN=5V 25°C at Vin=5V 720 70°C at Vin=5V 575 85°C at Vin=5V 520 125°C at Vin=5V 320 1 10 100 10m 100m 1ms Single Pulse Tamb=25°C RDS(on) Limited 10ms 100ms Safe Operating Area ID Drain Current (A) VDS Drain-Source Voltage (V) DC 0 20 40 60 80 100 120 140 160 0.0 0.2 0.4 0.6 see note (c) - Minimum Copper Derating Curve Temperature (°C) Max Power Dissipation (W) 100µ 1m 10m 100m 1 10 100 1k 100 150
200 Tamb=25°C
Transient Thermal Impedance D=0.5 D=0.2 D=0.1 Single Pulse D=0.05 Thermal Resistance (°C/W)Pulse Width (s) 100µ 1m 10m 100m 1 10 100 1k 100 Single Pulse Tamb=25°C Pulse Power Dissipation Pulse Width (s) Maximum Power (W)
Issue 1 - January 2008 7 www.zetex.com © Zetex Semiconductors plc 2008 Large copper area characteristics For large copper area as described in note (a) Max Ambient Temperature TA Maximum continuous current VIN=5V 25°C at Vin=5V 1140 70°C at Vin=5V 915 85°C at Vin=5V 825 125°C at Vin=5V 510 1 10 100 10m 100m 1msSingle Pulse Tamb=25°C RDS(on) Limited 10ms 100ms Safe Operating Area ID Drain Current (A) VDS Drain-Source Voltage (V) DC 0 20 40 60 80 100 120 140 160 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 See Note (a) 6cm Copper Derating Curve Temperature (°C) Max Power Dissipation (W) 100µ 1m 10m 100m 1 10 100 1k Tamb=25°C Transient Thermal Impedance D=0.5 D=0.2 D=0.1 Single Pulse D=0.05 Thermal Resistance (°C/W)Pulse Width (s) 100µ 1m 10m 100m 1 10 100 1k 100 Single Pulse Tamb=25°C Pulse Power Dissipation Pulse Width (s) Maximum Power (W)
Issue 1 - January 2008 8 www.zetex.com © Zetex Semiconductors plc 2008 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 -20µ 0 20µ 40µ 60µ 80µ 100µ120µ140µ160µ -50 -25 0 25 50 75 100 125 150 0.4 0.6 0.8 1.0 1.2 1.4 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 0.01 0.1 -50 -25 0 25 50 75 100 125 150 200 400 600 800 1000 Typical Output Characteristic T = 25°C VIN ID Drain Current (A) VDS Drain-Source Voltage (V) Current limit inactive Current limit active RD = 22Ω RIN = 25ΩVDS VIN Switching Speed Voltage (V) Time (s) Threshold Voltage vs Temperature VIN = VDS ID = 1mA Normalised VIN(th) TJ Junction Temperature (°C) On-Resistance vs Input Voltage TJ = 25°C ID = 0.7A RDS(on) On-Resistance (Ω) VIN Input Voltage (V) TJ = 150°C TJ = 25°C Source-Drain Diode Forward Voltage VSD Diode Forward Voltage (V) IS Source Current (A) VIN = 5V ID = 0.7A On-state Resistance vs TemperatureRDS(on) On-Resistance (mΩ) TJ Junction Temperature (°C)
Issue 1 - January 2008 9 www.zetex.com © Zetex Semiconductors plc 2008 Note: Controlling dimensions are in millimeters. Approximate dimensions are provided in inches Dim. Millimeters Inches Dim. Millimeters Inches
Issue 1 - January 2008 10 www.zetex.com © Zetex Semiconductors plc 2008 Zetex sales offices Europe Zetex GmbH Kustermann-park Balanstraße 59 D-81541 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc
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Life support devices or systems are devices or systems which: 1. are intended to implant into the body or 2. support or sustain life and whose failure to perform when proper ly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in significant injury to the user. B. A critical component is any component in a life support devi ce or system whose failure to perform can be reasonably expected to cause the failure of the life support device or to affect its safety or effectiveness. Reproduction The product specifications contained in this publication are issu ed to provide outline information only which (unless agreed by the company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. 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