ZXMN10A11G ZETEX | Alldatasheet
Document overview
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Technical content
V(BR)DSS= 100V; RDS(ON)= 0.6 ID= 1.8A
DESCRIPTION
This new generation of TRENCH MOSFETs from Zetex utilises a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.
FEATURES
- Low on-resistance
- Fast switching speed
- Low threshold
- Low gate drive
- SOT223 package
APPLICATIONS
- DC - DC Converters
- Power Management Functions
- Relay and Solenoid driving
- Motor control DEVICE MARKING
- ZXMN 10A11 ZXMN10A11G ISSUE 1 - MARCH 2002 100V N-CHANNEL ENHANCEMENT MODE MOSFET Top View SOT223 DEVICE REEL SIZE TAPE WIDTH QUANTITY PER REEL ZXMN10A11GFTA 7” 12mm 1000 units ZXMN10A11GFTC 13” 12mm 4000 units
ORDERING INFORMATION
PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DSS 100 V Gate-Source Voltage V GS 20 V Continuous Drain Current V GS=10V; T A=25°C(b) VGS=10V; T A=70°C(b) VGS=10V; T A=25°C(a) ID 1.8 1.4 1.3 A Pulsed Drain Current (c) I DM 5.8 A Continuous Source Current (Body Diode) (b) I S 4.6 A Pulsed Source Current (Body Diode)(c) I SM 5.8 A Power Dissipation at T A=25°C (a) Linear Derating Factor PD 2 W mW/°C Power Dissipation at T A=25°C (b) Linear Derating Factor PD 3.9 W mW/°C Operating and Storage Temperature Range T j:Tstg -55 to +150 °C ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a) RθJA 62.5 °C/W Junction to Ambient (b) RθJA 32 °C/W THERMAL RESISTANCE NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t/H1108810 secs. (c) Repetitive rating 25mm x 25mm FRA PCB, D=0.05 pulse width = 10/H9262s - pulse width limited by maximum junction temperature. Refer to Transient Thermal Impedance graph.
PARAMETER SYMBOL MIN. TYP . MAX. UNIT C ONDITIONS. STATIC Drain-Source Breakdown Voltage V (BR)DSS 100 V I D=250 /H9262A, V GS=0V Zero Gate Voltage Drain Current I DSS 1 /H9262AV DS=100V, V GS=0V Gate-Body Leakage I GSS 100 nA VGS=±20V, V DS=0V Gate-Source Threshold Voltage V GS(th) 2.0 4.0 V I D=250 /H9262A, V DS=V GS Static Drain-Source On-State Resistance (1) RDS(on) 0.60 0.70 /H9024 /H9024 VGS=10V, I D=2.6A VGS=6V, I D=1.3A Forward Transconductance (3) g fs 3.95 S V DS=15V,I D=2.6A DYNAMIC (3) Input Capacitance C iss 274 pF VDS= 5 0V ,VGS=0V, f=1MHzOutput Capacitance C oss 21 pF Reverse Transfer Capacitance C rss 11 pF SWITCHING (2) (3) Turn-On Delay Time t d(on) 2.7 ns VDD =50V, I D=1A RG=6.0 /H9024,V GS=10V Rise Time t r 1.7 ns Turn-Off Delay Time t d(off) 7.4 ns Fall Time t f 3.5 ns Gate Charge Q g 3n C V DS=50V, V GS=5V, ID=2.5A Total Gate Charge Q g 5.4 nC VDS=50V,V GS=10V, ID=2.5AGate-Source Charge Q gs 1.4 nC Gate-Drain Charge Q gd 1.5 nC SOURCE-DRAIN DIODE Diode Forward Voltage (1) V SD 0.85 0.95 V T J=25°C, I S=1.85A, VGS=0V Reverse Recovery Time (3) t rr 26 ns T J=25°C, I F=1.0A, di/dt= 100A/ µsReverse Recovery Charge (3) Q rr 30 nC ELECTRICAL CHARACTERISTICS (at TA = 25°C unless otherwise stated) NOTES (1) Measured under pulsed conditions. Width≤300µs. Duty cycle ≤ 2% . (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing.
Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4422 Fax: (44) 161 622 4420 Zetex GmbH Streitfeldstraße 19 D-81673 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 Zetex Inc
700 Veterans Memorial Hwy
Hauppauge, NY11788 USA Telephone: (631) 360 2222 Fax: (631) 360 8222 Zetex (Asia) Ltd 3701-04 Metroplaza, Tower 1 Hing Fong Road Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com © Zetex plc 2002 ZXMN10A11G ISSUE 1 - MARCH 2002 DIM MILLIMETRES MIN MAX A /H50071.80 A1 0.02 0.10 A2 1.55 1.65 b 0.66 0.84 b2 2.90 3.10 C 0.23 0.33 D 6.30 6.70 e 2.30 BASIC e1 4.60 BASIC E 6.70 7.30 E1 3.30 3.70 L0 . 9 0 /H5007 PACKAGE DIMENSIONSPACKAGE OUTLINE