ZXMC6A09DN8 ZETEX | Alldatasheet

Document overview

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Technical content

N-Channel V(BR)DSS = 60V; RDS(ON) = 0.045 ;I D= 5.1A P-Channel V(BR)DSS = -60V; RDS(ON) = 0.055 ;I D= -4.8A

DESCRIPTION

This new generation of trench MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.

FEATURES

  • Low on-resistance
  • Fast switching speed
  • Low threshold
  • Low gate drive
  • Low profile SOIC package

APPLICATIONS

  • Motor drive
  • LCD backlighting DEVICE MARKING ZXMC 6A09 ZXMC6A09DN8 ISSUE 3 - AUGUST 2004 COMPLEMENTARY 60V ENHANCEMENT MODE MOSFET DEVICE REEL TAPE WIDTH QUANTITY PER REEL ZXMC6A09DN8TA 7 ’‘ 12mm 500 units ZXMC6A09DN8TC 13’‘ 12mm 2500 units

ORDERING INFORMATION

Q2 = P-CHANNELQ1 = N-CHANNEL SO8 Top view PINOUT

PARAMETER SYMBOL V ALUE UNIT Junction to Ambient (a)(d) RθJA 100 °C/W Junction to Ambient (b)(e) RθJA 69 °C/W Junction to Ambient (b)(d) RθJA 58 °C/W THERMAL RESISTANCE Notes: (a) For a dual device surface mounted on 25mm x 25mm FR4 PCB with coverage of single sided 1oz copper in still air conditions. (b) For a dual device surface mounted on FR4 PCB measured at t /H1134910 sec. (c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.02 pulse width=300µs - pulse width limited by maximum junction temperature. (d) For a dual device with one active die. (e) For dual device with 2 active die running at equal power. PARAMETER SYMBOL N-Channe l P-Channel UNIT Drain-Source Voltage V DSS 60 -60 V Gate-Source Voltage V GS /H1100620 /H1100620 V Continuous Drain Current@V GS=10V; T A=25 /H11034C (b)(d) @VGS=10V; T A=25 /H11034C (b)(d) @VGS=10V; T A=25 /H11034C (a)(d) ID 5.1 4.1 3.9 -4.8 -3.8 -3.7 A A Pulsed Drain Current (c) IDM 25.4 -23.8 A Continuous Source Current (Body Diode) (b) IS 3.5 -3.3 A Pulsed Source Current (Body Diode) (c) ISM 25.4 -23.8 A Power Dissipation at T A=25°C (a)(d) Linear Derating Factor PD 1.25 W mW/°C Power Dissipation at T A=25°C (a)(e) Linear Derating Factor PD 1.8 W mW/°C Power Dissipation at T A=25°C (b)(d) Linear Derating Factor PD 2.1 W mW/°C Operating and Storage Temperature Range T j:Tstg -55 to +150 °C ABSOLUTE MAXIMUM RATINGS

PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS STATIC Drain-Source Breakdown Voltage V (BR)DSS 60 V ID=250 µA, V GS=0V Zero Gate Voltage Drain Current I DSS 1.0 /H9262AV DS=60V, V GS=0V Gate-Body Leakage I GSS 100 nA V GS=/H1100620V, V DS=0V Gate-Source Threshold Voltage V GS(th) 1.0 V I D=250 /H9262A, V DS=V GS Static Drain-Source On-State Resistance (1) RDS(on) 0.045 0.070 /H9024 /H9024 VGS=10V, I D=8.2A VGS=4.5V, I D=7.4A Forward Transconductance (1)(3) gfs 15 S V DS=15V,I D=8.2A DYNAMIC (3) Input Capacitance C iss 1407 pF VDS=40V, V GS=0V, f=1MHzOutput Capacitance C oss 121 pF Reverse Transfer Capacitance C rss 59 pF SWITCHING (2) (3) Turn-On Delay Time t d(on) 4.9 ns VDD =30V, I D=1.0A RG 6.0 Ω,V GS=10V Rise Time t r 3.3 ns Turn-Off Delay Time t d(off) 28.5 ns Fall Time t f 11.0 ns Gate Charge Q g 12.4 nC V DS=15V,V GS=5V, ID=3.5A Total Gate Charge Q g 24.2 nC VDS=15V,V GS=10V, ID=3.5AGate-Source Charge Q gs 5.2 nC Gate-Drain Charge Q gd 3.5 nC SOURCE-DRAIN DIODE Diode Forward Voltage (1) VSD 0.85 0.95 V T J=25°C, I S=6.6A, VGS=0V Reverse Recovery Time (3) trr 26.3 ns T J=25°C, I F=3.5A, di/dt= 100A/ /H9262s Reverse Recovery Charge (3) Qrr 26.6 nC N-CHANNEL ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated) NOTES (1) Measured under pulsed conditions. Width ≤300µs. Duty cycle ≤ 2% . (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing.

PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS STATIC Drain-Source Breakdown Voltage V (BR)DSS -60 V ID=-250 µA, V GS=0V Zero Gate Voltage Drain Current I DSS -1.0 /H9262AV DS=-60V, V GS=0V Gate-Body Leakage I GSS 100 nA V GS=/H1100620V, V DS=0V Gate-Source Threshold Voltage V GS(th) -1.0 V I D=-250 /H9262A, V DS=V GS Static Drain-Source On-State Resistance (1) RDS(on) 0.055 0.080 /H9024 /H9024 VGS=-10V, I D=-3.5A VGS=-4.5V, I D=-2.9A Forward Transconductance (1)(3) gfs 9.3 S V DS=-15V,I D=-3.5A DYNAMIC (3) Input Capacitance C iss 1706 pF VDS=-30 V, V GS=0V, f=1MHzOutput Capacitance C oss 111 pF Reverse Transfer Capacitance C rss 68.0 pF SWITCHING (2) (3) Turn-On Delay Time t d(on) 2.3 ns VDD =-30V, I D=-1A RG 6.0 Ω,V GS=-10V Rise Time t r 29.0 ns Turn-Off Delay Time t d(off) 59.8 ns Fall Time t f 28.1 ns Gate Charge Q g 20.8 nC V DS=-30V,V GS=-5V, ID=-3.5A Total Gate Charge Q g 41.0 nC VDS=-30V,V GS=-10V, ID=-3.5AGate-Source Charge Q gs 4.1 nC Gate-Drain Charge Q gd 6.8 nC SOURCE-DRAIN DIODE Diode Forward Voltage (1) VSD -0.85 -0.95 V T J=25°C, I S=-4.2A, VGS=0V Reverse Recovery Time (3) trr 30.6 ns T J=25°C, I F=-2.1A, di/dt= 100A/ µs Reverse Recovery Charge (3) Qrr 41.3 nC P-CHANNEL ELECTRICAL CHARACTERISTICS (at Tamb = 25°C unless otherwise stated) NOTES (1) Measured under pulsed conditions. Width ≤300µs. Duty cycle ≤ 2% . (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing.

N-CHANNEL TYPICAL CHARACTERISTICS

VGS=0 V f=1 M H z C Capacitance (pF) VDS -D r a i n-S o u r c eV o l t a g e( V ) 0 5 10 15 20 250 ID =3 . 5 A VDS= 15V G a t e - S o u r c eV o l t a g evG a t eC h a r g eCapacitance v Drain-Source Voltage Q - Charge (nC) VGS Gate-Source Voltage (V) N-CHANNEL TYPICAL CHARACTERISTICS

P-CHANNEL TYPICAL CHARACTERISTICS

0.1 1 100 250 500 750 1000 1250 1500 1750 2000 2250 2500 CRSS COSS CISS VGS=0 V f=1 M H z C Capacitance (pF) -VDS -D r a i n-S o u r c eV o l t a g e( V ) 0 1 02 03 04 00 ID = -3.5A VDS= -30V G a t e - S o u r c eV o l t a g evG a t eC h a r g eCapacitance v Drain-Source Voltage Q - Charge (nC) -VGS Gate-Source Voltage (V) P-CHANNEL TYPICAL CHARACTERISTICS

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Hauppauge, NY 11788 USA Telephone: (1) 631 360 2222 Fax: (1) 631 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza Tower 1 Hing Fong Road, Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com Corporate Headquarters Zetex Semiconductors plc Lansdowne Road, Chadderton Oldham, OL9 9TY United Kingdom Telephone (44) 161 622 4444 Fax: (44) 161 622 4446 hq@zetex.com These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com © Zetex Semiconductors plc 2004 PACKAGE OUTLINE CONTROLLING DIMENSIONS ARE IN INCHES APPROX IN MILLIMETERS DIM Millimeters Inches DIM Millimeters Inches Min Max Min Max Min Max Min Max H 5.80 6.20 0.228 0.244 /H90520° 8° 0° 8° PACKAGE DIMENSIONS