ZXM62P03G ZETEX | Alldatasheet

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Technical content

V(BR)DSS = -30V: RDS(on) = 0.15 : ID = -4.0A

DESCRIPTION

This new generation of Trench MOSFETs from Zetex utilizes a unique structure that combines the benefits of low on-resistance with fast switching speed. This makes them ideal for high efficiency, low voltage, power management applications.

FEATURES

/c183Low on-resistance /c183Fast switching speed /c183Low threshold /c183Low gate drive /c183SOT223 package

APPLICATIONS

/c183DC-DC Converters /c183Audio Output Stages /c183Relay and Solenoid driving /c183Motor Control DEVICE MARKING /c183ZXM6 2P03 ZXM62P03G 30V P-CHANNEL ENHANCEMENT MODE MOSFET ISSUE 2 - DECEMBER 2002 DEVICE REEL SIZE TAPE WIDTH QUANTITY PER REEL ZXM62P03GTA 7” 12mm 1000 units ZXM62P03GTC 13” 12mm 4000 units

ORDERING INFORMATION

PARAMETER SYMBOL LIMIT UNIT Drain-Source Voltage V DSS -30 V Gate-Source Voltage V GS /H1100620 V Continuous Drain Current (V GS= -10V; T A=25°C)(b) (VGS= -10V; T A=70°C)(b) (VGS= -10V; T A=25°C)(a) ID -4.0 -3.2 -2.9 A Pulsed Drain Current (c) I DM -13 A Continuous Source Current (Body Diode) (b) I S 2.4 A Pulsed Source Current (Body Diode)(c) I SM -13 A Power Dissipation at T A=25°C (a) Linear Derating Factor PD 2.0 W mW/°C Power Dissipation at T A=25°C (b) Linear Derating Factor PD 3.9 W mW/°C Operating and Storage Temperature Range T j:Tstg -55 to +150 °C ABSOLUTE MAXIMUM RATING PARAMETER SYMBOL VALUE UNIT Junction to Ambient (a) R θJA 62.5 °C/W Junction to Ambient (b) R θJA 32.2 °C/W THERMAL RESISTANCE NOTES (a) For a device surface mounted on 25mm x 25mm FR4 PCB with high coverage of single sided 1oz copper, in still air conditions (b) For a device surface mounted on FR4 PCB measured at t/H1108810 secs. (c) Repetitive rating 25mm x 25mm FR4 PCB, D=0.05 pulse width limited by maximum junction temperature.

PARAMETER SYMBOL MIN. TYP. MAX. UNIT CONDITIONS. STATIC Drain-Source Breakdown Voltage V (BR)DSS -30 V ID=-250 µ A, V GS=0V Zero Gate Voltage Drain Current I DSS -1 /H9262AV DS=-30V, V GS=0V Gate-Body Leakage I GSS 100 nA V GS=/H1100620V, V DS=0V Gate-Source Threshold Voltage V GS(th) -1.0 V I D=-250 /H9262A, V DS=V GS Static Drain-Source On-State Resistance (1) RDS(on) 0.15 0.23 /H9024 /H9024 VGS=-10V, I D=-1.6A VGS=-4.5V, I D=-0.8A Forward Transconductance (1)(3) g fs 1.1 S V DS=-10V,I D=-0.8A DYNAMIC (3) Input Capacitance C iss 330 pF VDS=-25V, V GS=0V, f=1MHzOutput Capacitance C oss 120 pF Reverse Transfer Capacitance C rss 45 pF SWITCHING (2) (3) Turn-On Delay Time t d(on) 2.8 ns VDD =-15V, I D=-1.6A RG=6.2 /H9024,VGS=-10V Rise Time t r 6.4 ns Turn-Off Delay Time t d(off) 13.9 ns Fall Time t f 10.3 ns Total Gate Charge Q g 10.2 nC VDS=-24V,V GS=-10V, ID=-1.6AGate-Source Charge Q gs 1.5 nC Gate-Drain Charge Q gd 3n C SOURCE-DRAIN DIODE Diode Forward Voltage (1) V SD -0.95 V T J=25 /H11034C, I S=-1.6A, VGS=0V Reverse Recovery Time (3) t rr 19.9 ns T J=25 /H11034C, I F=-1.6A, di/dt= 100A/ /H9262s Reverse Recovery Charge (3) Q rr 13 nC ELECTRICAL CHARACTERISTICS (at TA = 25°C unless otherwise stated). NOTES (1) Measured under pulsed conditions. Width /H11349300µ s. Duty cycle /H113492% . (2) Switching characteristics are independent of operating junction temperature. (3) For design aid only, not subject to production testing.

Oldham, OL9 8NP United Kingdom Telephone (44) 161 622 4422 Fax: (44) 161 622 4420 uk.sales@zetex.com Zetex GmbH Streitfeldstraße 19 D-81673 München Germany Telefon: (49) 89 45 49 49 0 Fax: (49) 89 45 49 49 49 europe.sales@zetex.com Americas Zetex Inc

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Hauppauge, NY11788 USA Telephone: (631) 360 2222 Fax: (631) 360 8222 usa.sales@zetex.com Asia Pacific Zetex (Asia) Ltd 3701-04 Metroplaza, Tower 1 Hing Fong Road Kwai Fong Hong Kong Telephone: (852) 26100 611 Fax: (852) 24250 494 asia.sales@zetex.com These offices are supported by agents and distributors in major countries world-wide. This publication is issued to provide outline information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose or form part of any order or contract or be regarded as a representation relating to the products or services concerned. The Company reserves the right to alter without notice the specification, design, price or conditions of supply of any product or service. For the latest product information, log on to www.zetex.com © Zetex plc 2002 2.0 min 2.3 1.5 min (3x) (3x) 4.6 6.8 3.8 min 2.0 min PAD LAYOUT DETAILSPACKAGE OUTLINE DIM Millimetres Inches DIM Millimetres Inches Min Max Min Max Min Max Min Max F 0.24 0.32 0.009 0.13 PACKAGE DIMENSIONS