XP06401 PANASONIC | Alldatasheet

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1Publication date: February 2004 SJJ00212BED Composite Transistors XP06401 (XP6401) Silicon PNP epitaxial planar type For general amplification ■ Features

  • Two elements incorporated into one package
  • Reduction of the mounting area and assembly cost by one half ■ Basic Part Number
  • 2SB0709A (2SB709A) × 2 ■ Absolute Maximum Ratings Ta = 25°C Unit: mm Internal Connection Marking Symbol: 5O Parameter Symbol Rating Unit Collector-base voltage (Emitter open) V CBO −60 V Collector-emitter voltage (Base open) V CEO −50 V Emitter-base voltage (Collector open) V EBO −7V Collector current I C −100 mA Peak collector current I CP −200 mA Total power dissipation P T 150 mW Junction temperature T j 150 °C Storage temperature T stg −55 to +150 °C Note) 1. Measuring methods are based on JAPANESE INDUSTRIAL STANDARD JIS C 7030 measuring methods for transistors. 2. *: Ratio between 2 elements 123 46 5 Tr2Tr1 Note) The part number in the parenthesis shows conventional part number. ■ Electrical Characteristics Ta = 25°C ± 3°C Parameter Symbol Conditions Min Typ Max Unit Collector-base voltage (Emitter open) V CBO IC = −10 µA, IE = 0 −60 V Collector-emitter voltage (Base open) V CEO IC = −2 mA, IB = 0 −50 V Emitter-base voltage (Collector open) V EBO IE = −10 µA, IC = 0 −7V Collector-base cutoff current (Emitter open) ICBO VCB = −20 V, IE = 0 − 0.1 µA Collector-emitter cutoff current (Base open) ICEO VCE = −10 V, IB = 0 −100 µA Forward current transfer ratio h FE VCE = −10 V, IC = −2 mA 160 460  hFE ratio * hFE(Small/ VCE = −10 V, IC = −2 mA 0.50 0.99  Large) Collector-emitter saturation voltage V CE(sat) IC = −100 mA, IB = −10 mA − 0.5 V Transition frequency f T VCB = −10 V, IE = 1 mA, f = 200 MHz 80 MHz Collector output capacitance C ob VCB = −10 V, IE = 0, f = 1 MHz 2.7 pF (Common base, input open circuited) 10˚ 2.1±0.1 1.25±0.10 1 32 0.2±0.05 0.12+0.05 –0.02 0.2±0.1 (0.425) 1.3±0.1 2.0±0.1 0 to 0.1 0.9±0.1 0.9+0.2 –0.1 6 5 4 (0.65) (0.65) 1: Emitter (Tr1) 4: Collector (Tr2) 2: Emitter (Tr2) 5: Base (Tr1) 3: Base (Tr2) 6: Collector (Tr1) EIAJ: SC-88 SMini6-G1 Package

2 SJJ00212BED

PT  Ta IC  VCE IC  IB IB  VBE IC  VBE VCE(sat)  IC hFE  IC fT  IE Cob  VCB 0 160 40 120 80 250 100 200 150 Total power dissipation PT (mW) Ambient temperature Ta (°C) 0 −4 −8 −12 −16 −60 −50 −40 −30 −20 −10 Collector current IC (mA) Collector-emitter voltage VCE (V) Ta = 25°C IB = − 300 µA −250 µA −200 µA −150 µA −100 µA −50 µA 0 −100 −200 −300 −400 −60 −50 −40 −30 −20 −10 Base current IB (µA) Collector current IC (mA) VCE = −5 V Ta = 25°C −400 −350 −300 −250 −200 −150 −100 −50 Base-emitter voltage VBE (V) Base current IB (µA) VCE = −5 V Ta = 25°C −240 −200 −160 −120 −80 −40 Base-emitter voltage VBE (V) Collector current IC (mA) VCE = −5 V Ta = 75°C −25°C 25°C Collector-emitter saturation voltage VCE(sat) (V) Collector current IC (mA) −10−3 −10−2 −10−1 −10 −10 −102 −103 IC / IB = 10 Ta = 75°C25°C −25°C 600 500 400 300 200 100 Forward current transfer ratio hFE Collector current IC (mA) −1 −10 −102 −103 VCE = –10 V Ta = 75°C 25°C −25°C 120 160 140 100 Transition frequency fT (MHz) Emitter current IE (mA) 10−1 11 0 1 0 2 VCB = −10 V Ta = 25°C Collector output capacitance (Common base, input open circuited) Cob (pF) Collector-base voltage VCB (V) −1 −10 −102 f = 1 MHz IE = 0 Ta = 25°C

NF  IE NF  IE h parameter  IE h parameter  VCE Noise figure NF (dB) Emitter current IE (mA) 10−2 10−1 11 0 VCB = −5 V f = 1 kHz Rg = 2 kΩ Ta = 25°C Noise figure NF (dB) Emitter current IE (mA) 10−1 11 0 VCB = −5 V Rg = 50 kΩ Ta = 25°C f = 100 Hz 10 kHz 1 kHz h parameter Emitter current IE (mA) 10−1 102 11 0 VCE = −5 V f = 270 Hz Ta = 25°C hfe hoe (µS) hie (kΩ) hre (× 10−4) h parameter Collector-emitter voltage VCE (V) 102 −10 −102 hfe hoe (µS) hie (kΩ) hre (× 10−4) IE = 2 mA f = 270 Hz Ta = 25°C

Request for your special attention and precautions in using the technical information and semiconductors described in this material (1) An export permit needs to be obtained from the competent authorities of the Japanese Government if any of the products or technical information described in this material and controlled under the "Foreign Exchange and Foreign Trade Law" is to be exported or taken out of Japan. (2) The technical information described in this material is limited to showing representative characteristics and applied circuits examples of the products. It neither warrants non-infringement of intellectual property right or any other rights owned by our company or a third party, nor grants any license. (3) We are not liable for the infringement of rights owned by a third party arising out of the use of the technical information as described in this material. (4) The products described in this material are intended to be used for standard applications or general elec- tronic equipment (such as office equipment, communications equipment, measuring instruments and house- hold appliances). Consult our sales staff in advance for information on the following applications:

  • Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combus- tion equipment, life support systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
  • Any applications other than the standard applications intended. (5) The products and product specifications described in this material are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product Standards in advance to make sure that the latest specifica- tions satisfy your requirements. (6) When designing your equipment, comply with the guaranteed values, in particular those of maximum rat- ing, the range of operating power supply voltage, and heat radiation characteristics. Otherwise, we will not be liable for any defect which may arise later in your equipment. Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products. (7) When using products for which damp-proof packing is required, observe the conditions (including shelf life and amount of time let standing of unsealed items) agreed upon when specification sheets are individually exchanged. (8) This material may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita Electric Industrial Co., Ltd.

2003 SEP