XBEHVW-H0-0000-00000HBE7

XBEHVW-H0-0000-00000HFE3 CREE | Alldatasheet

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Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree ®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo is a trademark of Cree, Inc. UL® and the UR logo are registered trademarks of UL LLC. ENERGY STAR® is a registered trademark of the U.S. Environmental Protection Agency. Cree, Inc.

4600 Silicon Drive

Durham, NC 27703 USA Tel: +1.919.313.5300 www.CREE .Com/XLAmP CLD-DS75 Rev 2e Cree® XLamp® XB-E High-Voltage White LEDs PRODUCT DESCRIPTION Built on Cree’s SC³ Technology® Platform, the XLamp ® XB-e High-v oltage White (HvW) LeD is optimized to lower cost for high-lumen, omnidirectional replacement lamps. The XB-e HvW LeD delivers high efficacy in the small XB footprint and enables smaller and more efficient driver circuits than standard-voltage LeDs. In addition, the XB-e LeD has a wider light distribution that can improve the omnidirectionality of eNeRGY STAR replacement lamps.

FEATURES

• Binned @ 85 °C & 44mA
• Available in 80-minimum CRI
• 125 mA maximum drive current
• 23.5 V typical forward voltage @ 85 °C, 44 mA
• Wide viewing angle: 140°
• Reflow solderable - JEDEC J-STD-020C compatible
• Unlimited floor life at ≤ 30 °C/85% RH
• electrically neutral thermal path
• RoHS and ReACh compliant
• UL ®-recognized component (E349212) TABLE OF CONTENTS Relative Spectral Power Distribution .... 3

Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo XLamp ® XB-E HVW LED CHARACTERISTICS Characteristics Unit Minimum Typical Maximum Thermal resistance, junction to solder point °C/W 6.5 viewing angle (FWHM) degrees 140 Temperature coefficient of voltage mV/°C -19 ESD classification (HBM per Mil-Std-883D) Class 2 DC forward current mA 125 Reverse voltage v 0.1 Forward voltage (@ 44 mA, 85 °C) v 23.5 26.5 LeD junction temperature °C 150 FLUX CHARACTERISTICS (TJ = 85 °C) The following table provides several base order codes for XLamp XB-e HvW LeDs. It is important to note that the base order codes listed here are a subset of the total available order codes for the product family. For more order codes, as well as a complete description of the order-code nomenclature, please consult the XLamp XB LeD Family Binning and Labeling document. Color CCT Range Minimum Luminous Flux @ 44 mA Calculated Minimum Luminous Flux (lm)** Order Code Minimum Maximum Group Flux (lm) @ 85 °C Flux (lm) @ 25 °C* 66 mA 100 mA

80 CRI Minimum

4750 K 5000 K

R3 122 140 171 236 XBeHvW-H0-0000-00000HFe3 R2 114 131 160 221 XBeHvW-H0-0000-00000Hee3

2700 K 3000 K

Q4 100 118 140 194 XBeHvW-H0-0000-00000HCe7 Q3 93.9 108 132 182 XBeHvW-H0-0000-00000HBe7 Notes:

• Cree maintains a tolerance of ±7% on flux and power measurements, ±0.005 on chromaticity (CCx, CCy) measurements and ±2 on CRI measurements. See the Measurements section (page 7).
• Minimum CRI for 80 CRI Minimum is 80. * Flux values @ 25 °C are calculated and are for reference only. ** Calculated flux values at 66 mA and 100 mA are for 85 °C and are for reference only.

Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo XLamp ® XB-E HVW LED RELATIVE SPECTRAL POWER DISTRIBUTION ELECTRICAL CHARACTERISTICS (TJ = 85 °C) Relative Spectral Power - XB-E 100 380 430 480 530 580 630 680 730 780 Relative Radiant Power (%) Wavelength (nm)

2600 K - 3700 K CCT

3700 K - 5000 K CCT

Electrical Characteristics (Tj = 85ºC) - XB-E - tall dome 100 125 21 22 23 24 25 26 27 Forward Current (mA) Forward Voltage (V)

Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo XLamp ® XB-E HVW LED RELATIVE FLUX VS. CURRENT (TJ = 85 °C) TyPICAL SPATIAL DISTRIBUTION Relative Intensity vs. Current (Tj = 85ºC) - XB-E tall dome 100 150 200 250 0 25 50 75 100 125 Relative Luminous Flux (%) Forward Current (mA) Typical Spatial Radiation Pattern - XB-E tall dome 100 120 -90 -70 -50 -30 -10 10 30 50 70 90 Relative Luminous Intensity (%) Angle (º)

Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo XLamp ® XB-E HVW LED5 THERMAL DESIGN The maximum forward current is determined by the thermal resistance between the LED junction and ambient. It is crucial for the end product to be designed in a manner that minimizes the thermal resistance from the solder point to ambient in order to optimize lamp life and optical characteristics. Thermal Design - XB-E tall dome 100 120 140 0 20 40 60 80 100 120 140 160 Maximum Current (mA) Ambient Temperature (ºC) Rj-a = 10 °C/W Rj-a = 15 °C/W Rj-a = 20 °C/W Rj-a = 25 °C/W

Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo XLamp ® XB-E HVW LED6 REFLOW SOLDERING CHARACTERISTICS In testing, Cree has found XLamp XB-E HVW LEDs to be compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Cree recommends that users follow the recommended soldering profile provided by the manufacturer of the solder paste used. Note that this general guideline may not apply to all PCB designs and configurations of reflow soldering equipment. Profile Feature Lead-Free Solder Average Ramp-Up Rate (Tsmax to Tp) 1.2 °C/second Preheat: Temperature Min (Tsmin) 120 °C Preheat: Temperature Max (Tsmax) 170 °C Preheat: Time (tsmin to tsmax) 65-150 seconds Time Maintained Above: Temperature (TL) 217 °C Time Maintained Above: Time (tL) 45-90 seconds Peak/Classification Temperature (Tp) 235 - 245 °C Time Within 5 °C of Actual Peak Temperature (tp) 20-40 seconds Ramp-Down Rate 1 - 6 °C/second Time 25 °C to Peak Temperature 4 minutes max. Note: All temperatures refer to the topside of the package, measured on the package body surface. IPC/JEDEC J-STD-020C TP TL Temperature Time t 25˚C to Peak Preheat ts tS tP Ramp-down Ramp-up Critical Zone TL to TP Tsmax Tsmin

Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo XLamp ® XB-E HVW LED7 NOTES Measurements The luminous flux, radiant power, chromaticity and CRI measurements in this document are binning specifications only and solely represent product measurements as of the date of shipment. These measurements will change over time based on a number of factors that are not within Cree’s control and are not intended or provided as operational specifications for the products. Calculated values are provided for informational purposes only and are not intended as specifications. Pre‑Release Qualification Testing Please read the LeD Reliability Overview for details of the qualification process Cree applies to ensure long-term reliability for XLamp LEDs and details of Cree’s pre-release qualification testing for XLamp LEDs. Lumen Maintenance Cree now uses standardized IES LM-80-08 and TM-21-11 methods for collecting long-term data and extrapolating LED lumen maintenance. For information on the specific LM-80 data sets available for this LED, refer to the public LM-80 results document. Please read the Long-Term Lumen Maintenance application note for more details on Cree’s lumen maintenance testing and forecasting. Please read the Thermal Management application note for details on how thermal design, ambient temperature, and drive current affect the LeD junction temperature. Moisture Sensitivity Cree recommends keeping XLamp LeDs in the provided, resealable moisture-barrier packaging (MBP) until immediately prior to soldering. Unopened MBPs that contain XLamp LeDs do not need special storage for moisture sensitivity. Once the MBP is opened, XLamp XB-E HVW LEDs may be stored as MSL 1 per JEDEC J-STD-033, meaning they have unlimited floor life in conditions of ≤ 30 ºC/85% relative humidity (RH). Regardless of storage condition, Cree recommends sealing any unsoldered LEDs in the original MBP . RoHS Compliance The levels of RoHS restricted materials in this product are below the maximum concentration values (also referred to as the threshold limits) permitted for such substances, or are used in an exempted application, in accordance with EU Directive 2011/65/EC (RoHS2), as implemented January 2, 2013. RoHS Declarations for this product can be obtained from your Cree representative or from the Product Documentation sections of www.cree.com. REACh Compliance ReACh substances of very high concern (SvHCs) information is available for this product. Since the european Chemical Agency (eCHA) has published notice of their intent to frequently revise the SVHC listing for the foreseeable future, please contact a Cree representative to insure you get the most up-to-date ReACh SvHC Declaration. ReACh banned substance information (ReACh Article 67) is also available upon request.

Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo XLamp ® XB-E HVW LED UL® Recognized Component Level 4 enclosure consideration. The LED package or a portion thereof has been investigated as a fire and electrical enclosure per ANSI/ UL 8750. Vision Advisory WARNING: Do not look at exposed lamp in operation. Eye injury can result. For more information about LEDs and eye safety, please refer to the LeD eye Safety application note. NOTES - CONTINUED

Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo XLamp ® XB-E HVW LED9 MECHANICAL DIMENSIONS Thermal vias, if present, are not shown on these drawings. All measurements are ±.13 mm unless otherwise indicated. Top View Side View Bottom View Recommended PCB Solder Pad Recommended Stencil Pattern SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE A B C D 123456 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon DriveDurham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE FOR SHEET METAL PARTS ONLY UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 1.14 0.46 0.82 0.92 0.36 0.33 0.94 0.2 90° 0.73 2.45 2.45 2.2 ±0.1 mm 0.82 0.46 0.36 0.36 0.28 0.36 2.34 0.92 0.36 2.34 1.17 0.43 0.43 0.85 2.27 0.28 0.28 0.28 1.14 2.27 1/131.000 D2610-00034 XBE/XBG OUTLINE 05/14/13D. CRONIN REVISONS REV DESCRIPTION BY DATE APP'D B PUT LARGER LENS IN PLACE DC 10/10/13 JB C ADJUSTED HEIGHT DC 6/9/14 D ADJUSTED HEIGHT DC 11/20/15SL RECOMMENDED STENCIL PATTERN RECOMMENDED PCB SOLDER PAD SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE A B C D 123456 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon DriveDurham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE FOR SHEET METAL PARTS ONLY UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 1.14 0.46 0.82 0.92 0.36 0.33 0.94 0.2 90° 0.73 2.45 2.45 2.2 ±0.1 mm 0.82 0.46 0.36 0.36 0.28 0.36 2.34 0.92 0.36 2.34 1.17 0.43 0.43 0.85 2.27 0.28 0.28 0.28 1.14 2.27 1/131.000 D2610-00034 XBE/XBG OUTLINE 05/14/13D. CRONIN REVISONS REV DESCRIPTION BY DATE APP'D B PUT LARGER LENS IN PLACE DC 10/10/13 JB C ADJUSTED HEIGHT DC 6/9/14 D ADJUSTED HEIGHT DC 11/20/15SL RECOMMENDED STENCIL PATTERN RECOMMENDED PCB SOLDER PAD SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE A B C D 123456 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon DriveDurham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE FOR SHEET METAL PARTS ONLY UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 1.14 0.46 0.82 0.92 0.36 0.33 0.94 0.2 90° 0.73 2.45 2.45 2.2 ±0.1 mm 0.82 0.46 0.36 0.36 0.28 0.36 2.34 0.92 0.36 2.34 1.17 0.43 0.43 0.85 2.27 0.28 0.28 0.28 1.14 2.27 1/131.000 D2610-00034 XBE/XBG OUTLINE 05/14/13D. CRONIN REVISONS REV DESCRIPTION BY DATE APP'D B PUT LARGER LENS IN PLACE DC 10/10/13 JB C ADJUSTED HEIGHT DC 6/9/14 D ADJUSTED HEIGHT DC 11/20/15SL RECOMMENDED STENCIL PATTERN RECOMMENDED PCB SOLDER PAD ANODe SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE A B C D 123456 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 4600 Silicon DriveDurham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE FOR SHEET METAL PARTS ONLY UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 1.14 0.46 0.82 0.92 0.36 0.33 0.94 0.2 90° 0.73 2.45 2.45 2.2 ±0.1 mm 0.82 0.46 0.36 0.36 0.28 0.36 2.34 0.92 0.36 2.34 1.17 0.43 0.43 0.85 2.27 0.28 0.28 0.28 1.14 2.27 1/131.000 D2610-00034 XBE/XBG OUTLINE 05/14/13D. CRONIN REVISONS REV DESCRIPTION BY DATE APP'D B PUT LARGER LENS IN PLACE DC 10/10/13 JB C ADJUSTED HEIGHT DC 6/9/14 D ADJUSTED HEIGHT DC 11/20/15SL RECOMMENDED STENCIL PATTERN RECOMMENDED PCB SOLDER PAD

Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo XLamp ® XB-E HVW LED10 TAPE AND REEL All Cree carrier tapes conform to EIA-481D, Automated Component Handling Systems Standard. Unless otherwise indicated, all dimensions in mm Tolerance unless specified: .xx ±.25, .xx ±.125, x° ± 5° SIZE TITLE OF REV. SHEET C DRAWING NO. DATE DATE DATE CHECK FINAL PROTECTIVE FINISH MATERIAL APPROVED DRAWN BY THIRD ANGLE PROJECTION SCALE A B C D 123456 6 5 4 3 2 1 A B C D Phone (919) 313-5300 Fax (919) 313-5558 Durham, N.C 27703 UNAUTHORIZED PERSON WITHOUT THE WRITTEN CONSENT MAY NOT BE COPIED, REPRODUCED OR DISCLOSED TO ANY CONFIDENTIAL INFORMATION OF CREE, INC. THIS PLOT CONTAINED WITHIN ARE THE PROPRIETARY AND CREE CONFIDENTIAL. THIS PLOT AND THE INFORMATION OF CREE INC. NOTICE X° ± .5 ° .XXX ± .25 .XX ± .75 .X ± 1.5 FOR SHEET METAL PARTS ONLY .XX ± .25 .XXX ± .125 X° ± .5 ° UNLESS OTHERWISE SPECIFIED DIMENSIONS ARE IN MILLIMETERS AND AFTER FINISH. TOLERANCE UNLESS SPECIFIED: SURFACE FINISH: 1.6 BB 8.00 ±.10 4.00 ±.10 2.00 ±.10 +.10/-.001.50 ± .101.00 .30 ± .10

12.00 Nominal

12.30 Max

5.50 ±.10 1.75 ±.10 10.25 ±.10 2.60+/-0.1mm 2.05 +/-0.1 2.60 +/-0.1 REVISONS REV DESCRIPTION BY DATE APP'D A Released DC 10/23/11 JL B ADDED CATHODE AND ANODE NOTE DC 2/26/12 C CHANGED POCKET DIMS AND TOLERANCES DC 8/3/12 1/14.000 C2402-00020 Carrier Tape, 2525 HEW 10/23/11D. CRONIN Notes: 1. 10 sprocket hole pitch cumulative tolerance ± 0.2mm REFERENCE VENDOR PART NUMBER 020246 CATHODE SIDE ANODE SIDE B-BSECTION Loaded Pockets (1,000 Lamps) Leader 400mm (min) of empty pockets with at least 100mm sealed by tape (50 empty pockets min.) Trailer 160mm (min) of empty pockets sealed with tape (20 pockets min.) STARTEND Cathode Side Anode Side (denoted by + and circle) 160.0 A A B 2.5±.1 SECTION A-A SCALE 2 : 1 1.5±.1 8.0±.1 4.0±.1 1.75±.10 12.0 .0 +.3 DETAIL B SCALE 2 : 1 13mm Cover Tape Pocket Tape User Feed Direction User Feed Direction

Copyright © 2013-2016 Cree, Inc. All rights reserved. The information in this document is subject to change without notice. Cree®, XLamp®, and SC³ Technology® are registered trademarks and the Cree logo XLamp ® XB-E HVW LED11 PACkAGING Patent Label (on bottom of box) Label with Cree Bin Code, Quantity, Reel ID Label with Cree Bin Code, Quantity, Reel ID Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Order Code, Quantity, Reel ID, PO # Label with Cree Bin Code, Quantity, Reel ID Unpackaged Reel Packaged Reel Boxed Reel CREE Bin Code & Barcode Label Vacuum-Sealed Moisture Barrier Bag Label with Customer P/N, Qty, Lot #, PO # Label with Cree Bin Code, Qty, Lot # Label with Cree Bin Code, Qty, Lot # Vacuum-Sealed Moisture Barrier Bag Patent Label Label with Customer Order Code, Qty, Reel ID, PO #