X24C01 ICMIC | Alldatasheet
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Technical content
This X24C01 device has been acquired by IC Microsystems from Xicor, Inc. Serial E 2PROM © Xicor, 1991 Patents Pending Characteristics subject to change without notice
DESCRIPTION
The X24C01 is a CMOS 1024 bit serial E 2PROM, internally organized as 128 x 8. The X24C01 features a serial interface and software protocol allowing operation on a simple two wire bus. Xicor E 2PROMs are designed and tested for applica- tions requiring extended endurance. Inherent data retention is greater than 100 years.
FEATURES
- 2.7V to 5.5V Power Supply
- Low Power CMOS — Active Current Less Than 1 mA —Standby Current Less Than 50 µA
- Internally Organized 128 x 8
- 2 Wire Serial Interface — Bidirectional Data Transfer Protocol
- Four Byte Page Write Mode
- Self Timed Write Cycle — Typical Write Cycle Time of 5 ms
- High Reliability — Endurance: 100,000 Cycles —Data Retention: 100 Years
- 8-Pin Mini-DIP, 8-PIN MSOP, and 8-PIN SOIC Packages 1K X24C01 128 x 8 Bit
3837 FHD F01
H.V. GENERATION TIMING & CONTROL WORD ADDRESS COUNTER XDEC YDEC DOUT ACK E2PROM
32 X 32
(8) V CC R/W PIN (4) V SS (5) SDA (6) SCL DOUT LOAD INC CK 3837-1.2 7/28/97 T1/C0/D0 SH ICmic IC MICROSYSTEMS TM
PIN CONFIGURATION PIN DESCRIPTIONS Serial Clock (SCL) The SCL input is used to clock all data into and out of the device. Serial Data (SDA) SDA is a bidirectional pin used to transfer data into and out of the device. It is an open drain output and may be wire -ORed with any number of open drain or open collector outputs. An open drain output requires the use of a pull-up resistor. For selecting typical values, refer to the Guide- lines for Calculating Typical Values of Bus Pull-Up Resistors graph. PIN NAMES Symbol Description NC No Connect VSS Ground VCC Supply Voltage SDA Serial Data SCL Serial Clock
3837 PGM T01
A.C. CONDITIONS OF TEST Input Pulse Levels VCC x 0.1 to V CC x 0.9 Input Rise and Fall Times 10 ns Input and Output Timing Levels VCC x 0.5
3837 PGM T02
3837 FHD F02
3837 FHD F03
EQUIVALENT A.C. LOAD CIRCUIT
3837 FHD F16
2190 Ο 100pF OUTPUT DIP NC NC NC VSS VCC NC SCL SDA X24C01 SOIC/MSOP
any command until this condition has been met. Figure 1. Data Validity
3837 FHD F06
issued after the transmitting device has released the bus. to acknowledge that it received the eight bits of data. place the device into a known state. Figure 2. Definition of Start and Stop
3837 FHD F07
Figure 3. Acknowledge Response From Receiver
3837 FHD F08
begins the internal write cycle to the nonvolatile memory. address, acknowledge and data transfer sequence. byte, the X24C01 will respond with an acknowledge. disabled until completion of the internal write cycle. Figure 4. Byte Write
3837 FHD F09
Figure 5. Page Write
3837 FHD F10
Figure 6. ACK Polling Sequence operation the X24C01 initiates the internal write cycle. next read or write operation. operations: byte read and sequential read. clock cycle and then issue a stop condition. with an acknowl edge and by issuing a stop condition. acknowledge and data transfer sequence.
3837 FHD F11
Figure 7. Byte Read
3837 FHD F12
edge and by issuing a stop condition. Figure 8. Sequential Read
3837 FHD F13
Figure 9. Typical System Configuration
3837 FHD F14
X24C01 4.5V to 5.5V X24C01-3.5 3.5V to 5.5V X24C01-3 3.0V to 5.5V X24C01-2.7 2.7V to 5.5V ABSOLUTE MAXIMUM RATINGS* Voltage on any Pin with Lead Temperature (Soldering, *COMMENT Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and the functional operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. RECOMMENDED OPERATING CONDITIONS Temperature Min. Max. Commercial 0 °C 70 °C Industrial –40 °C +85 °C Military –55 °C +125 °C D.C. OPERATING CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified) Limits Symbol Parameter Min. Max. Units Test Conditions I CC (1) VCC Supply Current (Read) 1 mA SCL = V CC x 0.1/V CC x 0.9 Levels I CC (2) VCC Supply Current (Write) 2 @ 100 KHz, SDA = Open I SB1 (1) VCC Standby Current 100 ∝ A SCL = SDA = V CC , VCC = 5V ± 10% I SB2 (1) VCC Standby Current 50 ∝ A SCL = SDA = V CC , V CC = 2.7V ILI Input Leakage Current 10 ∝ A VIN = GND to V CC ILO Output Leakage Current 10 ∝ A VOUT = GND to V CC V lL (2) Input Low Voltage –1.0 VCC x 0.3 V V IH (2) Input High Voltage VCC x 0.7V CC + 0.5 V VOL Output Low Voltage 0.4 V IOL = 2.1 mA
3837 PGM T03
CAPACITANCE TA = 25 °C, f = 1.0 MHz, V CC = 5V Sym bol Parameter Max. Units Test Conditions C I/O (3) Input/Output Capacitance (SDA) 8 pF VI/O = 0V C IN (3) Input Capacitance (SCL) 6 pF VIN = 0V
3837 PGM T05
Notes: (1) Must perform a stop command prior to measurement. (2) VIL min. and V IH max. are for reference only and are not tested. (3) This parameter is periodically sampled and not 100% tested.
A.C. CHARACTERISTICS (Over recommended operating conditions, unless otherwise specified) Read & Write Cycle Limits Symbol Parame ter Min. Max. Units fSCL SCL Clock Frequency 0 100 KHz TI Noise Suppression Time 100 ns Constant at SCL, SDA Inputs tAA SCL Low to SDA Data Out Valid 0.3 3.5 ∝ s tBUF Time the Bus Must Be Free Before a 4.7 ∝ s New Transmission Can Start tHD:STA Start Condition Hold Time 4.0 ∝ s tLOW Clock Low Period 4.7 ∝ s tHIGH Clock High Period 4.0 ∝ s tSU:STA Start Condition Setup Time 4.7 ∝ s tHD:DAT Data In Hold Time 0 ∝ s tSU:DAT Data In Setup Time 250 ns tR SDA and SCL Rise Time 1 ∝ s tF SDA and SCL Fall Time 300 ns tSU:STO Stop Condition Setup Time 4.7 ∝ s tDH Data Out Hold Time 300 ns
3837 PGM T06
Symbol Parameter Max. Units t PUR (4) Power-up to Read Operation 1 ms t PUW (4) Power-up to Write Operation 5 ms
3837 PGM T07
tSU:STA tHD:STA tHD:DAT tSU:DAT tLOW tSU:STO tR tBUF SCL SDA IN SDA OUT tDH tAA tF tHIGH
3837 FHD F04
Note: (4) t PUR and t PUW are the delays required from the time V CC is stable until the specified operation can be initiated. These parameters are periodically sampled and not 100% tested.
Symbol Parameter Min. Typ. (5) Max. Units t WR (6) Write Cycle Time 5 10 ms
3837 PGM T08
The write cycle time is the time from a valid stop condition of a write sequence to the end of the internal erase/program cycle. During the write cycle, the X24C01 Write Cycle Timing bus interface circuits are disabled, SDA is allowed to remain high, and the device does not respond to its word address. SDA 8th BIT WORD n ACK tWR STOP CONDITION START CONDITION X24C01 ADDRESS SCL
3837 FHD F05
Guidelines for Calculating Typical Values of Bus Pull-Up Resistors SYMBOL TABLE Must be steady Will be steady May change from Low to High Will change from Low to High May change from High to Low Will change from High to Low Don’t Care: Changes Allowed Changing: State Not Known N/A Center Line is High Impedance OUTPUTS INPUTS WAVEFORM
3837 FHD F15
BUS CAPACITANCE (pF) MIN. RESISTANCE MAX. RESISTANCE RMAX = CBUS tR RMIN = IOL MIN VCC MAX =2.6K Ο Notes: (5) Typical values are for T A = 25 °C and nominal supply voltage (5V). (6) tWR is the minimum cycle time to be allowed from the system perspective unless polling techniques are used. It is the maximum time the device requires to automatically complete the internal write operation. RESISTANCE (K Ο )
0.020 (0.51) 0.016 (0.41) 0.150 (3.81) 0.125 (3.18) 0.325 (8.25) 0.300 (7.62) 0.110 (2.79) 0.090 (2.29) 0.430 (10.92) 0.360 (9.14) 0.300 (7.62) REF. PIN 1 INDEX 0.140 (3.56) 0.130 (3.30) 0.020 (0.51) 0.015 (0.38) PIN 1 SEATING PLANE 0.062 (1.57) 0.058 (1.47) 0.255 (6.47) 0.245 (6.22) 0.060 (1.52) 0.020 (0.51) TYP. 0.010 (0.25) 15 ° 0.092 (2.34) DIA. NOM. HALF SHOULDER WIDTH ON ALL END PINS OPTIONAL 0.015 (0.38) MAX. PACKAGING INFORMATION 8-LEAD PLASTIC IN -LINE PACKAGE TYPE P NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESES IN MILLIMETERS)
0.150 (3.80) 0.158 (4.00) 0.228 (5.80) 0.244 (6.20) 0.014 (0.35) 0.019 (0.49) PIN 1 PIN 1 INDEX 0.010 (0.25) 0.020 (0.50) 0.050 (1.27) 0.188 (4.78) 0.197 (5.00) 0.004 (0.19) 0.010 (0.25) 0.053 (1.35) 0.069 (1.75) (4X) 7 0.027 (0.683) 0.037 (0.937) 0.0075 (0.19) 0.010 (0.25) 0° – 8 ° X 45 °
3926 FHD F22
8-LEAD PLASTIC SMALL OUTLINE GULL WING PACKAGE TYPE S NOTE: ALL DIMENSIONS IN INCHES (IN PARENTHESIS IN MILLIMETERS)
0.118 ± 0.002 (3.00 ± 0.05) 0.040 ± 0.002 (1.02 ± 0.05) 0.150 (3.81) REF. 0.193 (4.90) REF. 0.030 (0.76) 0.036 (0.91) 0.032 (0.81) 0.007 (0.18) 0.005 (0.13) 0.008 (0.20) 0.004 (0.10) 0.0216 (0.55) ° TYP R 0.014 (0.36) 0.118 ± 0.002 (3.00 ± 0.05) 8-LEAD MINIATURE SMALL OUTLIN E GULL WING PACKAGE TYPE M NOTE: 1. ALL DIMENSIONS IN INCHES AND (MILLIMETERS)
3003 ILL 01
Devices sold by Xicor, Inc. are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. Xicor, Inc. makes no warranty, express, statutory, implied, or by description regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. Xicor, Inc. makes no warranty of mer chantability or fitness for any purpose. Xicor, Inc. reserves the right to discontinue production and change specifications and prices at any time and without notice. Xicor, Inc. assumes no responsibility for the use of any circuitry other than circuitry embodied in a Xicor, Inc. product. No other circuits, patents, licenses are implied. U.S. PATENTS Xicor products are covered by one or more of the following U.S. Patents: 4,263,664; 4,274,012; 4,300,212; 4,314,265; 4,326,134; 4,393,481; 4,404,475; 4,450,402; 4,486,769; 4,488,060; 4,520,461; 4,533,846; 4,599,706; 4,617,652; 4,668,932; 4,752,912; 4,829, 482; 4,874, 967; 4,883, 976. Foreign patents and additional patents pending. LIFE RELATED POLICY In situations where semiconductor component failure may enda nger life, system designers using this product should design the system with appropriate error detection and correction, redundancy and back-up features to prevent such an occurrence. Xicor's products are not authorized for use in critical components in life support devices or systems. 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and whose failure to perform, when properly used in accordance with instr uctions for use provided in the labeling, can be reasonably expected to result in a significant injury to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Device
ORDERING INFORMATION
Blank = 4.5V to 5.5V 3.5 = 3.5V to 5.5V 3 = 3.0V to 5.5V 2.7 = 2.7V to 5.5V Temperature Range Blank = Commercial = 0 °C to +70 °C I = Industrial = –40 °C to +85 °C M = Military = –55 °C to +125 °C Package P = 8-Lead Plastic DIP S = 8-Lead SOIC M = 8-Lead MSOP X24C01 P T G -V X24C01 X G X Blank = 8-Lead SOIC P = 8-Lead Plastic DIP M = 8-Lead MSOP G = RoHS compliant lead free Blank = 4.5V to 5.5V, 0 °C to +70 °C F = 2.7V to 5.5V, 0 °C to +70 °C G = 2.7V to 5.5V, –40 °C to +85 °C I = 4.5V to 5.5V, –40 °C to +85 °C B = 3.5V to 5.5V, 0 °C to +70 °C C = 3.5V to 5.5V, –40 °C to +85 °C D = 3.0V to 5.5V, 0 °C to +70 °C E = 3.0V to 5.5V, –40 °C to +85 °C M = 4.5V to 5.5V, –55 °C to +125 °C Part Mark Convention G= RoHS Compliant Lead Free package Blank = Standard package. Non lead free