WR02X_V WALSIN | Alldatasheet
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Page 1 of 7 ASC_WR02X_V_V01 Jun- 2012 WR02X(W) General purpose & Anti-sulfuration chip resistors Size 0201 *Contents in this sheet are subject to change without prior notice.
Page 2 of 7 ASC_WR02X_V_V01 Jun- 2012 FEATURE 1. Small size and light weight 2. High reliability and stability 3. Reduced size of final equipment 4. Suitable for high density print circuit board assembly 5. Anti-sulfuration ASTM B-809 compliant 6. Lead free product APPLICATION
- Mobile phone
- PDA
- Camcorders
- Palmtop computers
- Hybrid module
DESCRIPTION
The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to nominated value within tolerance which controlled by laser trimming of this resistive layer. The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a pure Tin. Fig 1. Construction of Chip-R WR02X
Page 3 of 7 ASC_WR02X_V_V01 Jun- 2012 QUICK REFERENCE DATA Item General Specification Series No. WR02X(W) Size code 0201(0603) Resistance Range 1 Ω ~10M Ω ( ±5% tolerance ), Jumper 1Ω ~3.3M Ω ( ±1% tolerance ) Resistance Tolerance ±1% E96/E24 ±5% E24 TCR (ppm/ °C) 10 Ω - 10M Ω , ≤±200 Max. dissipation @ T amb =70 °C 1/20 W Max. Operation Voltage (DC or RMS) 25V Max. Overload Voltage (DC or RMS) 50V Climatic category (IEC 60068) 55/125/56 Note : 1. This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication 60115-8” 2. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by Value Resistance Power Rated RCWV ×= or Max. RCWV listed above, whichever is lower. DIMENSION(unit : mm) WR02X(W) L 0.60 ± 0.03 W 0.30 ± 0.03 T 0.23 ± 0.03 Tb 0.15 ± 0.05 Tt 0.10 ± 0.05 MARKING WR02X(W) has no marking. P rotective coat R esistive layer E nd termination Ceramic S ubstrate T Tb Tt T W L
Figure 2. Maximum dissipation in percentage of rated power automatic placement systems. Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact. discrete components on the reverse (mixed PCBs). any damage are given in Fig 3.
Page 5 of 7 ASC_WR02X_V_V01 Jun- 2012 CATALOGUE NUMBERS The resistors have a catalogue number starting with : WR02 X 472_ J A L V Size code WR02 : 0201 Type code X : Normal W : 1% For <10 Ω and >1M Ω Resistance code 5%, E24: 2 significant digits followed by no. of zeros 4.7 Ω =4R7_ 10 Ω =100_ 220 Ω =221_ 10K Ω = 103 Jumper =000_ (“_” means a blank) 1%, E24+E96: 3 significant digits followed by no. of zeros 4.7 Ω =4R70 10 Ω =10R0 100Ω =1000 37.4K Ω =3742 Tolerance J : ±5% F : ±1% P : Jumper Packaging code A : 7” Reeled taping (15Kpcs/Reel) D : 7” Reeled taping (20Kpcs/Reel) Termination code L = Sn base (lead free) Special code V = 1. 100% CCD visual inspection 2. Anti-sulfur ASTM B-809 compliant
Page 6 of 7 ASC_WR02X_V_V01 Jun- 2012 TEST AND REQUIREMENTS (JIS C 5201-1 : 1998) REQUIREMENT TEST PROCEDURE / TEST METHOD Resistor 0ΩΩ ΩΩ DC resistance Clause 4.5 DC resistance values measured at the test voltages specified below : <10K Ω @3V, <100K Ω @10V, <1M Ω @25V, <10M Ω @30V Within the specified tolerance <50m Ω Temperature Coefficient of Resistance(T.C.R) Clause 4.8 Natural resistance change per change in degree centigrade. ( ) 12 1 12 10 ×− ttR RR (ppm/ °C) t 1 : 20° C+5° C-1° C R 1 : Resistance at reference temperature R 2 : Resistance at test temperature Refer to “QUICK REFERENCE DATA” N/a Short time overload (S.T.O.L) Clause 4.13 Permanent resistance change after a 5second application of a voltage 2.5 times RCWV or the maximum overload voltage specified in the above list, whichever is less. ΔR/R max. ±(2%+0.10 Ω ) <50m Ω Resistance to soldering heat(R.S.H) Clause 4.18 Un-mounted chips completely immersed for 10 ±1second in a SAC solder bath at 260 ℃±5ºC ΔR/R max. ±(1%+0.05 Ω) no visible damage <50m Ω Solderability Clause 4.17 Un-mounted chips completely immersed for 2±0.8second in a SAC solder bath at 235℃±5 ℃ 95% coverage min., good tinning and no visible damage Temperature cycling Clause 4.19 30 minutes at -55 °C ±3°C, 2~3 minutes at 20° C+5° C-1° C, 30 minutes at +125 °C ±3°C, 2~3 minutes at 20° C+5° C- 1° C, total 5 continuous cycles ΔR/R max. ±(1%+0.05 Ω ) < 50m Ω Damp Heat (Load life in humidity) Clause 4.24 1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber controller at 40 °C ±2°C and 90~95% relative humidity, 1.5hours on and 0.5 hours off 10 Ω≤ R<1M Ω : ΔR/R max. ±(3%+0.10 Ω ) R<10 Ω , R ≥1M Ω : ΔR/R max. ±(5%+0.10 Ω ) < 50m Ω Load Life (Endurance) Clause 4.25 1000+48/-0 hours; loaded with RCWV or V max in chamber controller 70 ±2ºC, 1.5 hours on and 0.5 hours off Ditto. Bending strength Clause 4.33 Resistors mounted on a 90mm glass epoxy resin PCB(FR4), bending once 5mm for 10sec. No visual damaged, ΔR/R max. ±(1%+0.05 Ω ) < 50m Ω Adhesion Clause 4.32 Pressurizing force: 3N, Test time: 10 ±1sec. No remarkable damage or removal of the terminations
Page 7 of 7 ASC_WR02X_V_V01 Jun- 2012 PACKAGING Paper Tape specifications (unit :mm) Series No. A B W F E Series No. P1 P0 Φ D T 0 . 050 . 1+ Φ 0.45 ±0.05 Reel dimensions Symbol A B C D (unit : mm) Φ 180.0+0/-1.5 Φ 60.0 ±1.0 Φ 60.0+1/-0 13.0 ±0.2 9.0+1/-0 Taping quantity and Tape material - Chip resistors 15,000 pcs/reel, Paper tape.