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Page 1 of 7 ASC_WR02X_V18 MAY - 2016 WR02X(W) Thick Film General purpose chip resistors Size 0201 *Contents in this sheet are subject to change without prior notice.
Page 2 of 7 ASC_WR02X_V18 MAY - 2016 FEATURE 1. Small size and light weight 2. High reliability and stability 3. Reduced size of final equipment 4. Suitable for high density print circuit board assembly 5. Higher component and equipment reliability 6. Lead free product APPLICATION
- Mobile phone
- PDA
- Camcorders
- Palmtop computers
- Hybrid module
DESCRIPTION
The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to nominated value within tolerance which controlled by laser trimming of this resistive layer. The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a pure Tin. Fig 1. Construction of Chip-R WR02X
Page 3 of 7 ASC_WR02X_V18 MAY - 2016 QUICK REFERENCE DATA Item General Specification Series No. WR02X(W) Size code 0201(0603) Resistance Range 1Ω ~10M Ω ( ±5% tolerance ), Jumper 1Ω ~ 10MΩ ( ±1% tolerance ) Resistance Tolerance ±1% E96/E24 ±5% E24 TCR (ppm/ °C) 10 Ω - 10M Ω , ≤±200 Max. dissipation @ T amb =70 °C 1/20 W Max. Operation Voltage (DC or RMS) 25V Max. Overload Voltage (DC or RMS) 50V Operation temperature -55 ~ +125’C Note : 1. This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication 60115-8” 2. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by Value Resistance Power Rated RCWV ×= or Max. RCWV listed above, whichever is lower. DIMENSION(unit : mm) WR02X(W) L 0.60 ± 0.03 W 0.30 ± 0.03 T 0.23 ± 0.03 Tb 0.15 ± 0.05 Tt 0.10 ± 0.05 MARKING WR02X(W) has no marking. P rotective coat R esistive layer E nd termination Ceramic S ubstrate T Tb Tt T W L
Figure 2. Maximum dissipation in percentage of rated power automatic placement systems. Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact. discrete components on the reverse (mixed PCBs). any damage are given in Fig 3.
Page 5 of 7 ASC_WR02X_V18 MAY - 2016 CATALOGUE NUMBERS The resistors have a catalogue number starting with : WR02 X 472_ J A L Size code WR02 : 0201 Type code X : Normal W : 1% For <10 Ω and >1M Ω Resistance code 5%, E24: 2 significant digits followed by no. of zeros and a blank 4.7 Ω = 4R7_ 100 Ω = 101_ 10K Ω = 103_ 1%, E24+E96: 3 significant digits followed by no. of zeros 100Ω =1000 37.4K Ω =3742 Tolerance J : ±5% F : ±1% P : Jumper Packaging code A : 7” Reeled taping (15Kpcs/Reel) T : 7” Reeled taping (10Kpcs/Reel) D : 7” Reeled taping (20Kpcs/Reel) H : 13” Reeled taping (50Kpcs/Reel) G : 13” Reeled taping (70Kpcs/Reel) Termination code L = Sn base (lead free) TEST CONDITION FOR JUMPER (0 ΩΩ ΩΩ ) Item WR02 Power Rating At 70 °C 1/20W Resistance MAX.50m Ω Rated Current 1A Peak Current within 5 sec 2.5A Operating Temperature -55 ~ +125°C
Page 6 of 7 ASC_WR02X_V18 MAY - 2016 TEST AND REQUIREMENTS (JIS C 5201-1 : 1998) REQUIREMENT TEST PROCEDURE / TEST METHOD Resistor 0ΩΩ ΩΩ
Electrical Characteristics
JISC5201-1: 1998 Clause 4.8 - DC resistance values measurement - Temperature Coefficient of Resistance (T.C.R) Natural resistance change per change in degree centigrade. ( ) 12 1 12 10 ×− ttR RR (ppm/ °C) t 1 : 20° C+5° C-1° C R 1 : Resistance at reference temperature (20° C+5° C/- 1° C) R 2 : Resistance at test temperature (-55° C or +125° C) Within the specified tolerance Refer to “QUICK REFERENCE DATA” <50m Ω Short time overload (S.T.O.L) Clause 4.13 Permanent resistance change after a 5second application of a voltage 2.5 times RCWV or the maximum overload voltage specified in the above list, whichever is less. ΔR/R max. ±(2%+0.10 Ω ) <50m Ω Resistance to soldering heat(R.S.H) Clause 4.18 Un-mounted chips completely immersed for 10 ±1second in a SAC solder bath at 260 ℃±5ºC ΔR/R max. ±(1%+0.05 Ω) no visible damage <50m Ω Solderability Clause 4.17 Un-mounted chips completely immersed for 2±0.8second in a SAC solder bath at 235℃±5 ℃ 95% coverage min., good tinning and no visible damage Temperature cycling Clause 4.19 30 minutes at -55 °C ±3°C, 2~3 minutes at 20° C+5° C-1° C, 30 minutes at +125 °C ±3°C, 2~3 minutes at 20° C+5° C- 1° C, total 5 continuous cycles ΔR/R max. ±(1%+0.05 Ω ) < 50m Ω Damp Heat (Load life in humidity) Clause 4.24 1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber controller at 40 °C ±2°C and 90~95% relative humidity, 1.5hours on and 0.5 hours off 10 Ω≤ R<1M Ω : ΔR/R max. ±(3%+0.10 Ω ) R<10 Ω , R ≥1M Ω : ΔR/R max. ±(5%+0.10 Ω ) < 50m Ω Load Life (Endurance) Clause 4.25 1000+48/-0 hours; loaded with RCWV or V max in chamber controller 70 ±2ºC, 1.5 hours on and 0.5 hours off Ditto. Bending strength Clause 4.33 Resistors mounted on a 90mm glass epoxy resin PCB(FR4), bending once 5mm for 10sec. No visual damaged, ΔR/R max. ±(1%+0.05 Ω ) < 50m Ω Adhesion Clause 4.32 Pressurizing force: 3N, Test time: 10 ±1sec. No remarkable damage or removal of the terminations
Page 7 of 7 ASC_WR02X_V18 MAY - 2016 PACKAGING Paper Tape specifications (unit :mm) Series No. A B W F E Series No. P1 P0 Φ D T 0 . 050 . 1+ Φ 0.45 ±0.05 Reel dimensions Symbol A B C D Taping quantity and Tape material - Chip resistors 10,000 / 15,000 / 20,000 pcs 7” Reel, Paper tape. - Chip resistors 50,000 / 70,000 pcs 13” Reel, Paper tape.