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Page 1 of 8 ASC_WR01X_V06 JAN - 2017 WR01X 5%, 1% Thick Film General Purpose chip resistors Size 01005 *Contents in this sheet are subject to change without prior notice.
Page 2 of 8 ASC_WR01X_V06 JAN - 2017 FEATURE 1. Ultra small and high precision size and light weight 2. High reliability and stability 3. Reduced size of final equipment 4. Suitable for high density print circuit board assembly 5. Higher component and equipment reliability 6. Lead free product APPLICATION Mobile phone PDA, MP3, Ipod, iPHONE DSC, DVs Palmtop computers Mini module
DESCRIPTION
The resistors are constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to g ive the approximate resistance required and the value is trimmed to nominated value within tolerance which controlled by laser trimming of this resistive layer. The resistive layer is covered with a protective coat. Finally, the two external end terminatio ns are added. For ease of soldering the outer layer of these end terminations is a pure Tin. Fig 1. Construction of Chip-R WR01X
Page 3 of 8 ASC_WR01X_V06 JAN - 2017 QUICK REFERENCE DATA Item General Specification Series No. WR01X Size code 01005 (0402) Resistance Range 4.7 ~ 1M (5%, 1%), Jumper Resistance Tolerance 1% E96/E24 5% E24 TCR (ppm/C) Max. dissipation @ Tamb=70C 1/32 W Max. Operation Voltage (DC or RMS) 15V Max. Overload Voltage (DC or RMS) 30V Climatic category (IEC 60068) 55/125/56 Note : 1. This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication 60115-8” 2. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determ ined by ValueResistancePower RatedRCWV or Max. RCWV listed above, whichever is lower. DIMENSION(unit : mm) WR01X L 0.40 0.02 W 0.20 0.02 T 0.13 0.02 Tb 0.10 0.03 Tt 0.08 0.03 MARKING WR01X has no marking. P rotective coat R esistive layer E nd termination Ceramic S ubstrate T Tb Tt T W L
Figure 2. Maximum dissipation in percentage of rated power φ0.18 pressure jig as shown drawing below. For mounting application, please contact Walsin group for details. discrete components on the reverse (mixed PCBs). any damage are given in Fig 3.
Page 5 of 8 ASC_WR01X_V06 JAN - 2017 CATALOGUE NUMBERS The resistors have a catalogue number starting with : WR01 X 472_ J D L Size code WR01 : 01005 Type code X : Normal W : 1%, < 10ohm Resistance code 5% E24 : 2 signific ant digits followed by no. of zeros and a blank 4.7 =4R7_ 10 =100_ 220 =221_ Jumper =000_ (“_” means a blank) 1%, E24+E96: 3 significant digits followed by no. of zeros 100 =1000 37.4K =3742 Tolerance J : 5% F : 1% P : Jumper Packaging code D : 7” Reeled paper taping (20Kpcs/Reel) L : 7” Reeled embossed taping (35Kpcs/Reel) Termination code L = Sn base (lead free)
Page 6 of 8 ASC_WR01X_V06 JAN - 2017 TEST AND REQUIREMENTS (JIS C 5201-1 : 1998) TEST PROCEDURE / TEST METHOD REQUIREMENT Resistor 0 DC resistance Clause 4.5 DC resistance values measured at the test voltages specified below : Within the specified tolerance <50m Temperature Coefficient of Resistance(T.C.R) Clause 4.8 Natural resistance change per change in degree centi grade. 121 12 10 ttR RR (ppm/C) t1 : 20°C+5°C-1°C R1 : Resistance at reference temperature R2 : Resistance at test temperature Refer to “QUICK REFERENCE DATA” N/a Short time overload (S.T.O.L) Clause 4.13 Permanent resistance change after a 2 second application of a voltage 2.5 times RCWV or the maximum overload voltage specified in the above list, whichever is less. Resistance to soldering heat(R.S.H) IEC 60068-2-58: 2004 Un-mounted chips completely immersed for 10±0.5second in a SAC solder bath at 260℃±5ºC ΔR/R max. ±(1%+0.05Ω) no visible damage <50m Solderability IEC 60068-2-58: 2004 Un-mounted chips completely immersed for 2±0.3second in a SAC solder bath at 235℃±5℃ 95% coverage min., good tinning and no visible damage Temperature cycling Clause 4.19 30 minutes at -55C3C, 2~3 minutes at 20°C+5°C-1°C, 30 minutes at + 125C3C, 2~3 minutes at 20°C+5°C-1°C, total 5 continuous cycles Damp Heat (Load life in humidity) Clause 4.24 1000+48/-0 hours, loaded with RCWV or Vmax in humidity chamber controller at 40 C2C and 90~95% relative humidity, no visible damage < 50m Load Life (Endurance) Clause 4.25 1000+48/-0 hours; loaded with RCWV or V max in chamber controller 70±2ºC, 1.5 hours on and 0.5 hours off no visible damage < 50m Endurance at the upper category temperature 125ºC, no load, 1000 hours R/R max. (5%+0.10) no visible damage < 50m Bending strength Clause 4.33 Resistors mounted on a 90mm glass epoxy resin PCB(FR4), bending once 3mm for 10sec. No visual damage, < 50m Adhesion Clause 4.32 Pressurizing force: 2N, Test time: 10±1sec. No visual damage
Page 7 of 8 ASC_WR01X_V06 JAN - 2017 PACKAGING 1. Paper Tape specifications (unit :mm) Series No. A B W F E Series No. P1 P0 D t1 T WR01X 2.00±0.05 4.00±0.05 1.0 0.050.1 2. Embossed Narrow Tape specifications ( unit: mm ) Series No. A B W E Reel dimensions
Page 8 of 8 ASC_WR01X_V06 JAN - 2017 Symbol A B C D (unit : mm) Paper tape: 9.0+1/-0 Emboss tape: 4.2±0.8 Taping quantity and Tape material - Chip resistors 20,000 pcs/reel, Paper tape. - Chip resistors 35,000 pcs/reel, Embossed tape.