WL2810 WILLSEMI | Alldatasheet
Document overview
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- PDF pages: 12
Technical content
Features
Input voltage : 2.2V~5.5V Output range : 1.0V~3.3V Output current : 300mA PSRR : 70dB @ 217Hz Dropout voltage : 250mV @ IOUT=300mA Quiescent current : 42μA Typ. Shut-down current : < 1μA Recommend capacitor : 1uF
Applications
MP3/MP4 Players Cellphones, radiophone, digital cameras Bluetooth, wireless handsets Others portable electronics device Http://www.sh-willsemi.com SOT-353 DFN1X1-4L PinConfiguration (TopView) B * M B:Package Code D:Package Code *:VoltageCode *:VoltageCode M:Month(A~Z) Y:YearCode W:WeekCode For detail marking information, please see page 10. Marking OrderInformation For detail order information, please see page 10.
WillSemiconductorLtd. 2 Aug,2017–Rev1.9 TypicalApplication BlockDiagram PinDescription SOT-353 DFN1X1-4L PIN Symbol Description
1 VIN Input
2 GND Ground
3 EN Enable (Active high)
4 NC Not connected
5 VOUT Output
1 VOUT Output
4 VIN Input
EP GND level, this pin must connect to GND.
WillSemiconductorLtd. 3 Aug,2017–Rev1.9 AbsoluteMaximumRatings RecommendOperatingRatings Parameter Value Unit Power Dissipation, PD@TA=25℃ 400 mW VIN Range -0.3~6.5 V VEN Range -0.3~VIN V VOUT Range -0.3~VIN V IOUT 400 mA Lead Temperature Range 260 oC Storage Temperature Range -55 ~ 150 oC Operating Junction Temperature Range 150 oC ESD Ratings HBM 8000 V MM 400 V Parameter Value Unit Operating Supply voltage 2.2~5.5 V Operating Temperature Range -40~85 oC Thermal Resistance, RθJA (SOT-353) 250 oC/W Thermal Resistance, RθJA (DFN1x1-4L) 250 oC/W
WillSemiconductorLtd. 4 Aug,2017–Rev1.9 ElectronicsCharacteristics(Ta=25oC,VIN=VOUT+1V,CIN=COUT=1uF,unlessotherwisenoted) Parameter Symbol Condition Min. Typ. Max. Unit Output Voltage VOUT VOUT ≤1.5V, VIN=2.7V, IOUT=1mA 0.97 VOUT VOUT 1.03 VOUT V VOUT>1.5V, IOUT=1mA 0.98 VOUT VOUT 1.02 VOUT Current Limit ILIM VEN=VIN 300 mA Dropout Voltage VDROP VOUT=3.3V, IOUT=300mA 220 330 mV VOUT=3.0V, IOUT=300mA 240 360 VOUT=2.8V, IOUT=300mA 250 375 VOUT=2.5V, IOUT=300mA 280 420 VOUT=1.8V, IOUT=300mA 400 600 VOUT≤1.5V, IOUT=300mA Vin-min=2.2V Line Regulation △VLINE VIN=2.7~5.5V, IOUT=1mA 0.01 0.1 %/V Load Regulation △VLoad VOUT=2.8V , IOUT=1~300mA 10 30 mV Quiescent Current IQ VOUT=2.8V, IOUT=0 42 70 μA Short Current ISHORT VEN=VIN, VOUT Short to GND with 1Ω 80 mA Shut-down Current ISHDN VEN=0V 1.0 μA Power Supply Rejection Rate PSRR VIN=(VOUT+1V)DC+0.5VP-P F=217Hz ,Iout=10mA dB VIN=(VOUT+1V)DC+0.5VP-P F=10KHz, Iout=10mA EN logic high voltage VENH VIN=5.5V, IOUT=1mA 1.2 V EN logic low voltage VENL VIN=5.5V, VOUT=0V 0.4 V EN Input Current IEN VEN= 0 to 5.5V 1.0 μA Output Noise Voltage eNO 10Hz to 100KHz, COUT=1μF 55 μVRMS Thermal shutdown threshold TSD 165 oC Thermal shutdown hysteresis △ TSD 30 oC
WillSemiconductorLtd. 5 Aug,2017–Rev1.9 Typicalcharacteristics(Ta=25oC,VIN=3.8V,VOUT= 2.8VCIN=COUT=1uF,unlessotherwisenoted) Quiescentcurrentvs.Supplyvoltage Quiescent currentvs.Supplyvoltage Outputvoltagevs.Supplyvoltage Outputvoltagevs.Supplyvoltage Outputvoltagevs.Outputcurrent Outputvoltagevs.Outputcurrent
WillSemiconductorLtd. 6 Aug,2017–Rev1.9 OutputVoltagevs.Temperature OutputVoltagevs.Temperature DropoutVoltagevs.OutputCurrent PSRR
WillSemiconductorLtd. 7 Aug,2017–Rev1.9 SoftStartformEN SoftStartform EN ENShutdown ENShutdown LoadStep Load Step LineStep LineStep
WillSemiconductorLtd. 8 Aug,2017–Rev1.9 PACKAGEOUTLINEDIMENSIONS SOT-353 θ L E A D e b TOP VIEW SIDE VIEW SIDE VIEW 0.2 C RecommendPCB Layout(Unit:mm) Symbol Dimensionsin Millimeters Min. Typ. Max. A 0.85 - 1.10 A1 0.00 - 0.10 A2 0.80 0.90 1.00 b 0.15 0.25 0.35 c 0.08 - 0.15 D 2.00 2.10 2.20 E 1.15 1.25 1.35 E1 2.15 2.30 2.45 e 0.65 Typ. e1 1.20 1.30 1.40 L 0.50 Ref. L1 0.26 0.36 0.46 θ 0︒ - 8︒ 0.650.40 0.80 1.94 1.30 Notes: This recommended land pattern is for reference purposes only. Please consult your manufacturing group to ensure your PCB design guidelines are met.
WillSemiconductorLtd. 9 Aug,2017–Rev1.9 TAPEANDREELINFORMATION ReelDimensions TapeDimensions QuadrantAssignmentsForPIN1OrientationInTape RD Reel Dimension W Overall width of the carrier tape P1 Pitch between successive cavity centers Pin1 Pin1 Quadrant User Direction of Feed Reel Dimensions RD W Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 7inch 13inch 8mm 12mm 2mm 4mm 8mm
WillSemiconductorLtd. 10 Aug,2017 –Rev1.9 PackagingInformation DFN1x1-4L Symbol DimensionsInMillimeters Min. Typ. Max. A 0.34 0.37 0.40 A1 0.00 0.02 0.105 A3 0.10 REF b 0.17 0.22 0.27 D 0.95 1.00 1.05 E 0.95 1.00 1.05 D2 0.43 0.48 0.53 E2 0.43 0.48 0.53 L 0.20 0.25 0.30 e 0.60 0.65 0.70 K 0.15 - -
WillSemiconductorLtd. 11 Aug,2017–Rev1.9 TAPEANDREELINFORMATION ReelDimensions TapeDimensions QuadrantAssignmentsForPIN1OrientationInTape RD Reel Dimension W Overall width of the carrier tape 1 P1 Pitch between successive cavity centers Pin1 Pin1 Quadrant User Direction of Feed Reel Dimensions RD W Q1 Q2 Q3 Q4 Q1 Q2 Q3 Q4 7inch 13inch 2mm 4mm 8mm 8mm 12mm 16mm
WillSemiconductorLtd. 12 Aug,2017 –Rev1.9 ORDERINFORMATION Marking: B* =DeviceCode D* =DeviceCode M =Month Y =Year W =Week Ordering No. Vout (V) Package Operating Temperature Marking Shipping WL2810B12-5/TR 1.2 SOT-353 -40~+85°C BEM TapeandReel, 3000 WL2810B15-5/TR 1.5 SOT-353 -40~+85°C BGM TapeandReel, 3000 WL2810B18-5/TR 1.8 SOT-353 -40~+85°C BHM TapeandReel, 3000 WL2810B28-5/TR 2.8 SOT-353 -40~+85°C BLM TapeandReel, 3000 WL2810B30-5/TR 3.0 SOT-353 -40~+85°C BMM TapeandReel, 3000 WL2810B33-5/TR 3.3 SOT-353 -40~+85°C BNM TapeandReel, 3000 WL2810D10-4/TR 1.0 DFN1x1-4L -40~+85°C DB YW TapeandReel, 10000 WL2810D105-4/TR 1.05 DFN1x1-4L -40~+85°C DC YW TapeandReel, 10000 WL2810D12-4/TR 1.2 DFN1x1-4L -40~+85°C DE YW TapeandReel, 10000 WL2810D13-4/TR 1.3 DFN1x1-4L -40~+85°C DF YW TapeandReel, 10000 WL2810D15-4/TR 1.5 DFN1x1-4L -40~+85°C DG YW TapeandReel, 10000 WL2810D18-4/TR 1.8 DFN1x1-4L -40~+85°C DH YW TapeandReel, 10000 WL2810D25-4/TR 2.5 DFN1x1-4L -40~+85°C DK YW TapeandReel, 10000 WL2810D28-4/TR 2.8 DFN1x1-4L -40~+85°C DL YW TapeandReel, 10000 WL2810D30-4/TR 3.0 DFN1x1-4L -40~+85°C DM YW TapeandReel, 10000 WL2810D33-4/TR 3.3 DFN1x1-4L -40~+85°C DN YW TapeandReel, 10000