WA02A472-FTL

WA02A WALSIN | Alldatasheet

Document overview

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Technical content

Page 1 of 7 ASC_WA02A_V02 Jan - 2013 WA02A Thick film General purpose chip resistors array Size 0201x4 Flat Type *Contents in this sheet are subject to change without prior notice.

Page 2 of 7 ASC_WA02A_V02 Jan - 2013 FEATURE 1. Small size and light weight 2. Reduced size of final equipment 3. Lower surface mounted assembly costs 4. Higher component and equipment reliability 5. Lead free / Halogen free APPLICATION

• Consumer electrical equipment, PDA, Digital Cam-coder, …
• EDP, Computer application
• Mobile phone, Telecom
• Ram module

DESCRIPTION

The resistors array is constructed in a high grade ceramic body (aluminum oxide). Internal metal electrodes are added at each end and connected by a resistive paste that is applied to the top surface of the substrate. The composition of the paste is adjusted to give the approximate resistance required and the value is trimmed to within tolerance by laser cutting of this resistive layer. The resistive layer is covered with a protective coat. Finally, the two external end terminations are added. For ease of soldering the outer layer of these end terminations is a Tin (lead free) solder alloy. Fig 1. Outline of chip-R array WA02A

Page 3 of 7 ASC_WA02A_V02 Jan - 2013 QUICK REFERENCE DATA Item General Specification Series No. WA02A Size 0201x4 (0603x4) Termination construction Flat type Resistance Tolerance ±5% (E24 series) ±1% (E24 series) Resistance Range 10 Ω ~ 1M Ω 10 Ω ~ 100K Ω TCR (ppm/ °C) 10 Ω ~ 29.5 Ω : ≤ ± 350 ppm/ °C 30 Ω ~ 1M Ω : ≤ ± 200 ppm/ °C Max. dissipation at T amb =70 °C 1/32 W Max. Operation Voltage (DC or RMS) 12.5V Max. overload voltage 25V Rated current for Jumper 1A Operation temperature -55 ~ +125’C Note : 1. This is the maximum voltage that may be continuously supplied to the resistor element, see “IEC publication 60115-8” 2. Max. Operation Voltage : So called RCWV (Rated Continuous Working Voltage) is determined by Value Resistance Power Rated RCWV ×= or Max. RCWV listed above, whichever is lower. 3. Jumper is defined as max. 50m Ω DIMENSIONS(unit ：： ：：mm) WA02A L 1.40 ± 0.10 W 0.60 ± 0.10 T 0.35 ± 0.10 P 0.40 typical A1, A2 0.25 ± 0.10 C 0.15 ± 0.10 D 0.20 ± 0.10

Figure 2. Maximum dissipation in percentage of rated power automatic placement systems. Chip placement can be on ceramic substrates and printed-circuit boards (PCBs). Electrical connection to the circuit is by individual soldering condition. The end terminations guarantee a reliable contact.

Page 5 of 7 ASC_WA02A_V02 Jan - 2013 SOLDERING CONDITION The robust construction of chip resistors allows them to be completely immersed in a solder bath of 260 °C for 10 seconds. Therefore, it is possible to mount Surface Mount Resistors on one side of a PCB and other discrete components on the reverse (mixed PCBs). Surface Mount Resistors are tested for solderability at 235°C during 2 seconds. The test condition for no leaching is 260 °C for 30 seconds. Typical examples of soldering processes that provide reliable joints without any damage are given in Fig 3. Fig 3. Infrared soldering profile for Chip Resistors array CATALOGUE NUMBERS The resistors have a catalogue number starting with . WA02 A 472_ J T L Size code WA02 : 0201 Type code A : x4, Flat Resistance code 5% E24 : 2 significant digits followed by no. of zeros and a blank 4.7 Ω =4R7_ 10 Ω =100_ 220 Ω =221_ Jumper =000_ (“_” means a blank) 1%, E24+E96: 3 significant digits followed by no. of zeros 100Ω =1000 37.4K Ω =3742 Tolerance J : ±5% F : ±1% P : Jumper Packaging code T : 7” 10kpcs Reel taping Termination code L = Sn base (lead free) Reeled tape packaging : 8mm width paper taping 7” reel 10,000pcs per reel, Recommended Land Pattern Dimensions:

Page 6 of 7 ASC_WA02A_V02 Jan - 2013 TEST AND REQUIREMENTS Essentially all tests are carried out according to the schedule of IEC publication 115-8, category LCT /UCT /56(rated temperature range : Lower C ategory Temperature, U pper C ategory Temperature; damp heat, long term, 56 days). The testing also meets the requirements specified by EIA, EIAJ and JIS. The tests are carried out in accordance with IEC publication 68, "Recommended basic climatic and mechanical robustness testing procedure for electronic components" and under standard atmospheric conditions according to IEC 60068-1, subclause 5.3. Unless otherwise specified, the following value supplied : Temperature: 15 °C to 35 °C. Relative humidity: 45% to 75%. Air pressure: 86kPa to 106 kPa (860 mbar to 1060 mbar). All soldering tests are performed with midly activated flux. REQUIREMENT TEST PROCEDURE Resistor Jumper Electrical Characteristics JISC5201-1: 1998 Clause 4.8 - DC resistance values measurement - Temperature Coefficient of Resistance (T.C.R) Natural resistance change per change in degree centigrade. ( ) 12 1 12 10 ×− ttR RR (ppm/ °C) t 1 : 20° C+5° C-1° C R 1 : Resistance at reference temperature R 2 : Resistance at test temperature Within the specified tolerance Refer to “QUICK REFERENCE DATA” N/a Short time overload (S.T.O.L) Clause 4.13 Permanent resistance change after a 5 seconds application of a voltage 2.5 times RCWV or the maximum overload voltage specified in the above list, whichever is less. ΔR/R max. ±(2%+0.10 Ω ) < 50m Ω Resistance to soldering heat(R.S.H) Clause 4.18 Un-mounted chips completely immersed for 10±1second in a SAC solder bath at 260 ℃±5ºC ΔR/R max. ±(1%+0.05 Ω) no visible damage < 50m Ω Solderability Clause 4.17 Un-mounted chips completely immersed for 2±0.5 second in a SAC solder bath at 235 ℃±5 ℃ good tinning (>95% covered) no visible damage Temperature cycling Clause 4.19 30 minutes at -55 °C ±3°C, 2~3 minutes at 20° C+5° C-1° C, 30 minutes at +125°C ±3°C, 2~3 minutes at 20° C+5° C-1° C, total 5 continuous cycles ΔR/R max. ±(1%+0.05 Ω) no visible damage < 50m Ω Load life (endurance) Clause 4.25 1000 +48/-0 hours, loaded with RCWV or Vmax in chamber controller 70 ±2ºC, 1.5 hours on and 0.5 hours off ΔR/R max. ±(3%+0.1Ω) no visible damage < 100mΩ Load life in Humidity Clause 4.24 1000 +48/-0 hours, loaded with RCWV or Vmax in humidity chamber controller at 40 °C ±2°C and 90~95% relative humidity, 1.5hours on and 0.5 hours off ΔR/R max. ±(3%+0.1Ω) no visible damage < 50m Ω Adhesion Clause 4.32 Pressurizing force: 5N, Test time: 10 ±1sec. No remarkable damage or removal of the terminations. Bending strength JISC5201-1: 1998 Clause 4.33 Resistors mounted on a 90mm glass epoxy resin PCB(FR4), bending once 3mm for 10sec. ΔR/R max. ±(1%+0.05 Ω) no visible damage < 50m Ω Insulation Resistance Clause 4.6 Apply the maximum overload voltage (DC) for 1minute R ≧1G Ω Dielectric Withstand Voltage Clause 4.7 Apply the maximum overload voltage (AC) for 1 minute No breakdown or flashover

Page 7 of 7 ASC_WA02A_V02 Jan - 2013 PACKAGING Paper Tape Specifications (unit: mm) Reel dimensions Symbol A B C D Peeling force of top cover tape Taping Qty 10,000pieces per 7” reel