V107C021A-850 OSRAM | Alldatasheet
Document overview
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- PDF pages: 16
Technical content
1 Version 1.0 | 2020-02-25 V107C021A-850 BIDOS® P2835 C VCSEL pulsed laser in small footprint ceramic
Applications
— Virtual Reality — 3D Sensing — Industrial Automation — Access Control (IRIS/Vein Scan, Face Recognition) — Augmented Reality, Mixed Reality — Flash & Autofocus — Gesture Recognition Features: — Package: SMD ceramic package with glass diffuser window — Chip Technology: GaAs VCSEL power array — IR Laser Wavelength: 850 nm — Optical Power Class: 4 W pulsed — Radiation Profile: 60°x45° (Rectangular emission profile) — ESD: 8 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B)
Ordering Information
Type Operational Mode: IF = 5A, TS = 25°C tp = 100µS, DC = 1% Ordering Code V107C021A-850 4W Q65112A9367 Depending on the mode of operation, these devices emit highly concentrated visible and non-visible light which can be hazardous to the human eye. Products which incorporate these devices must follow the safety precautions given in the “Notes” section. www.osram-os.com
2 Version 1.0 | 2020-02-25 Maximum Ratings Ta = 25°C Parameter Symbol Values Operation/Solder temperature tp = 100 μs; DC = 1 % TS min. max. -40 °C 110 °C Storage temperature Tstg min. max. -40 °C 110 °C Forward current Pulsed operation; Tp = 100 μs; DC = 1 %; TS = 25°C If max. 13 A Forward current Direct current operation; DC = 100%; TS = 25°C If max. 8.5 A Reverse Voltage Not designed for reverse operation Reflow soldering temperature TRef max. 260 °C ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 3B) VESD max. 8 kV Note: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device.
3 Version 1.0 | 2020-02-25 Characteristics Ta = 25°C, IF = 5 A; tp = 100µs; DC = 1% Parameter Symbol Values Forward voltage VF typ. 2.3 V Output power Φ typ. 4.0 W Threshold current Ith typ. 0.95 A Slope efficiency SE typ. 1.0 W / A Power conversion efficiency η typ. 36 % Peak wavelength λpeak min. typ. max. 840 nm 850 nm 860 nm Spectral bandwidth at FWHM (50% of Φmax) λFWHM typ. 2 nm Temperature coefficient of wavelength TCλ typ. 0.06 nm /K Field of view at FWHM (HFOV) Θ∥ typ. 60 ° Field of view at FWHM (VFOV) Θ⊥ typ. 45 ° Thermal resistance junction/solder point Rth, JS typ. 15.9 K / W
4 Version 1.0 | 2020-02-25 Relative Spectral Emission 1) Radiation Characteristics 1)
5 Version 1.0 | 2020-02-25 Forward Voltage 1) 2) Optical Output Power 1) 2) Relative Forward Voltage 1) Relative Radiant Power 1)
6 Version 1.0 | 2020-02-25 Max Permissible Pulse Current Max Permissible Current
7 Version 1.0 | 2020-02-25 Dimension Drawings 3) Further Information Approximate Weight: 38 mg Recommended Solder Pad Layout 3)
8 Version 1.0 | 2020-02-25 Profile Feature Symbol Pb-Free (SnAgCu) Assembly Unit Minimum Recommendation Maximum Ramp-up rate to preheat*) 25°C to 150°C 2 3 K/s Time ts Tsmin to TSmax tS 60 100 120 s Ramp-up rate to peak*) TSmax to TP 2 3 K/s Liquidus temperature TL 217 °C Time above liquidus temperature tL 45 60 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 10 20 30 S Ramp-down rate* TP to 100°C 3 6 K/s Time 25°C to TP 480 s All temperatures refer to the center of the package, measured on the top of the component *slope calculation DT/Dt: Dt max. 5s; fulfillment for the whole T-range ±0.
9 Version 1.0 | 2020-02-25 Taping 3) 4)
10 Version 1.0 | 2020-02-25 Tape and Reel 4) Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 330 mm 12 + 0.3 / - 0.1 60 12.4 + 2 18.4 2500
11 Version 1.0 | 2020-02-25 Barcode-Product-Label (BPL) Dry Packing Process and Materials Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
12 Version 1.0 | 2020-02-25 Notes Depending on the mode of operation, these devices emit highly concentrated visible and non-visible light which can be hazardous to the human eye. Products which incorporate these devices must follow the safety precautions given in IEC 60825-1. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related information please visit www.osram-os.com/appnotes
13 Version 1.0 | 2020-02-25 Disclaimer OSRAM OS assumes no liability whatsoever for any use of this document or its content by recipient including, but not limited to, for any design in activities based on this preliminary draft version. OSRAM OS may e.g. decide at its sole discretion to stop developing and/or finalizing the underlying design at any time. Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS website. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer.
14 Version 1.0 | 2020-02-25 Glossary 1) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 2) Testing temperature: Ta = 25°C 3) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 4) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
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Revision History
0.0 Aug 2nd, 2019 Initiation of preliminary datasheet
1.0 Feb 25th, 2020 Production data incorporated
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