TCS3772 OSRAM | Alldatasheet
Document overview
- Manufacturer or author: Provided By alldatasheet.com(free datasheet download site)
- PDF pages: 51
Technical content
[v1-01] 2018-Mar-14 Document Feedback TCS3772 Color Light‐to‐Digital Converter with Proximity Sensing The TCS3772 device family provides red, green, blue, and clear (RGBC) light sensing and, when coupled with an external IR LED, proximity detection. These devices detect light intensity under a variety of lighting conditions and through a variety of attenuation materials, includin g dark glass. The proximity detection feature allows a large dynamic range of operation for accurate short distance detection, such as in a cell phone, for detecting when the user positions the phone close to their ear. An internal state machine provides the ability to put the device into a low power state in between proximity and RGBC measurements providing very low average power consumption. The color sensing feature is useful in applications such as LED RGB backlight control, solid state lighting, reflected LED color sampler, or fluorescent light co lor temperature de tection. With the addition of an IR blocking filter, the device is an excellent ambient light sensor, color temperature monitor, and general purpose color sensor. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of this device are listed below: Figure 1: Added Value of Using TCS3772 Benefits Features
- Single Device Reduces Board Space • Integrated RGB and Clear Color Sensing and Proximity Detection
- Enables Flexible Operation for Wide Range of Applications • Programmable Color Sensing and Proximity Detection
- Enables Accurate Color and Ambient Light Sensing Under Varying Lighting Conditions
- Integrated IR Blocking Filter
- Enables Operation within Wide Range of Lighting Conditions • 3.8M:1 Dynamic Range General Description
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − General Description
- Color Light Sensing wi th IR-Blocking Filter
- Programmable Analog Ga in and Integration Time
- 3 800 000:1 Dynamic Range
- Very High Sensitivity – Idea lly Suited for Operation Behind Dark Glass
- Proximity Detection
- Ambient Light Rejection
- Programmable Integration Time
- Current Sink Driver for External IR LED
- Maskable Light and Proximity Interrupt
- Programmable Upper and Lower Thresholds with Persistence Filter
- Power Management
- Low Power – 2.5- μA Sleep State
- 6 5 - μA Wait State with Programmable Wait State Time from 2.4 ms to > 7 Seconds
- I 2C Fast Mode Compatible Interface
- Data Rates up to 400 kbit/s
- Input Voltage Levels Compatible with V DD or 1.8 V Bus
- Register Set and Pin Compatib le with the TCS3x71 Series
- Small 2 mm × 2.4 mm Dual Flat No-Lead (FN) Package
Applications
The applications of TCS3772 include:
- RGB LED Backlight Control
- Ambient Light Color Temperature Sensing
- Cell Phone Touch Screen Disable
- Mechanical Switch Replacement
- Industrial Process Control
- Medical Diagnostics End Products and Market Segments
- HDTVs, Mobile Handsets, Ta blets, and Portable Media Payers
- Medical and Commercial Instrumentation
- Toys
- Solid State and General Lighting
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − General Description Block Diagram The functional blocks of this device are shown below: Figure 2: Functional Block Diagram of TCS3772
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Pin Assignment The TCS3772 pin assignments are described below. Figure 3: Pin Diagram Figure 4: Pin Description Package FN Dual Flat No-Lead (T op View): Package drawing is not to scale. Pin Number Pin Name Pin Type Description
1 VDD Supply voltage
2 SCL Input I²C serial clock input terminal – clock signal for I²C serial data. 3 GND Power supply ground. All voltages are referenced to GND. 4 LDR Output LED driver for proximity emitter – open drain. 5 INT Output Interrupt – open drain (active low). 6 SDA Input/Output I²C serial data I/O terminal — serial data I/O for I²C. Pin Assignment
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum rated conditions for extended periods may affect device reliability. Figure 5: Absolute Maximum Ratings over Operating Free-Air Temperature Range (unless otherwise noted) Parameter Min Max Units Comments Supply voltage, VDD 3.8 V All voltages are with respect to GND Input terminal voltage −0.5 3.8 V Output terminal voltage (except LDR) −0.5 3.8 V Output terminal voltage (LDR) −0.5 3.8 V Output terminal current (except LDR) −1 20 mA Storage temperature range, T STRG −40 85 ºC ESD tolerance, human body model ±2000 V Absolute Maximum Ratings
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Electrical Characteristics Figure 10: Proximity Characteristics, V DD = 3 V, TA = 25 ºC, PEN = 1 (unless otherwise noted) Note(s): 1. Parameter is ensured by design or characterization and is not tested. 2. Proximity noise is defined as on e standard deviation of 600 samples. 3. Proximity noise typically increases as √PPULSE 4. Greater operating distances are achievable with approp riate optical system design considerations. See available ams application notes for additional information. 5. Maximum operating distance is dependent upon emitter and the reflective properties of the object's surface. 6. Proximity noise test was done using the Figu re 11, “Proximity Noise Test Circuit, ” on page 9. Parameter Conditions Min Typ Max Units IDD Supply current LDR pulse on 3 mA ADC conversion time step size PTIME = 0xFF 2.27 2.4 2.56 ms ADC number of integration steps (1) 12 5 6 s t e p s ADC counts per step (1) PTIME = 0xFF 0 1023 counts ADC count value λp = 850 nm, Ee = 770.1 μW/cm2, PTIME = 0xFB, PPULSE= 1 (3) 1350 1900 counts ADC output responsivity λp = 850 nm, PTIME = 0xFF, PPULSE = 1 (3) 0.175 0.211 0.247 counts/ μW/ cm2 Noise (1) (2) (3) Ee = 0, PTIME = 0xFF, PPULSE = 8 (6) 2 % FS LED pulse count (1) 0 255 pulses LED pulse period 14.0 μs LED pulse width – LED on time 6.3 μs LED drive current ISINK sink current @
1.6 V, LDR pin
PDRIVE = 0 80 106 132 mA PDRIVE = 1 50 PDRIVE = 2 25 PDRIVE = 3 12.5 Maximum operating distance (1) (4) (5) PDRIVE = 0 (100 mA), PPULSE = 64 Emitter: λp = 850 nm, 20° half angle, and 60 mW/sr Object: 16 × 20-inch, 90% reflective Kodak Gray Card (white surface) Optics: Open view (no glass, no optical attenuation) 30 inches
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Typical Operating Characteristics Figure 21: Responsivity Temperature Coefficient Temperature Coefficient - ppm/°C λ - Wavelength - nm
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Detailed Description The TCS3772 is a next-generation digital color light sensor device containing four integrating analog-to-digital converters (ADCs) that integrat e currents from photodiodes. The device contains a 3 × 4 photodiode array used for color measurements and a 1 × 4 photodiode array used for proximity measurements. Integration of all color sensing channels occurs simultaneously. Upon completion of the conversion cycle, the conversion result is transferred to the corresponding data regi sters. The transfers are double-buffered to ensure that the integrity of the data is maintained. Communication with the device is accomplished through a fast (up to 400 kHz), two-wire I 2C serial bus for easy connection to a microcontroller or embedded controller. The device provides a separate pi n for level-style interrupts. The interrupt feature simplifies and improves system efficiency by eliminating the need to poll a sensor for a light intensity value. When interrupts are enabled, an interrupt is generated when the value of a clear channel or proximity conversion is greater than an upper threshold or less than a lower threshold. Once the interrupt is asserted, it rema ins asserted until cleared by the controlling firmware. In addition, a programmable interrupt persistence filter allows the user to set the number of consecutive clear channel or proximity conversions outside of the threshold region that are nece ssary to trigger an interrupt. Interrupt thresholds and pers istence filter settings are configured independently for both clear an d proximity. Proximity detection requires only a single external IR LED. An internal LED driver can be conf igured to provide a constant current sink of 12.5 mA, 25 mA, 50 mA, or 100 mA of current. No external current limiting resistor is required. The number of proximity LED pulses can be programmed from 1 to 255 pulses. Each pulse has a 14- μs period. Detailed Description
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Principles of Operation System State Machine The TCS3772 provides control of RGBC, proximity detection, and power management functionality through an internal state machine ( Figure 22 ). After a power-on-reset, the device is in the sleep mode. As soon as the PON bi t is set, the device will move to the start state. It will then continue through the Prox, Wait, and RGBC states. If these states are enabled, the device will execute each function. If the PO N bit is set to 0, the state machine will continue until all conversions are completed and then go into a low power sleep mode. Figure 22: Simplified State Diagram Note(s): In this document, the nomenclature uses the bit field name in italics followed by the register number and bit number to allow the user to easily identify the register and bit that controls the function. For example, the power on (PON) is in register 0, bit 0. This is represented as PON (r0x00:b0). Principles of Operation
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Principles of Operation RGBC Operation The RGBC engine contains RGBC gain control (AGAIN) and four integrating analog-to-digital converters (ADC) for the RGBC photodiodes. The RGBC integrat ion time (ATIME) impacts both the resolution and the sensitivity of the RGBC reading. Integration of all four channels occurs simultaneously and upon completion of the conversion cycle, the results are transferred to the color data registers. This data is also referred to as channel count. The transfers are double-buffered to ensure that invalid data is not read during the transfer. After the transfer, the device automatically moves to the next state in accordance with the configured state machine. Figure 23: RGBC Operation The registers for programming the integration and wait times are a 2's compliment values. The actual time can be calculated as follows: ATIME = 256 - Integration Time / 2.4 ms Inversely, the time can be calculated from the register value as follows: Integration Time = 2. 4 ms × (256 - ATIME) For example, if a 100-ms integration time is needed, the device needs to be programmed to: 256 - (100 / 2.4) = 256 - 42 = 214 = 0xD6 Conversely, the programmed value of 0xC0 would correspond to: (256 - 0xC0) × 2.4 = 64 × 2.4 = 154 ms
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Principles of Operation Proximity Detection Proximity detection is accompli shed by measuring the amount of light energy, generally from an IR LED, reflected off an object to determine its distance. The pr oximity light source, which is external to the TCS3772 device , is driven by the integrated proximity LED current driver. Figure 24: Proximity Detection The LED current driver, output on the LDR terminal, provides a regulated current sink that eliminates the need for an external current limiting resistor. PDRI VE sets the drive current to 100 mA, 50 mA, 25 mA. To drive an external light source with more than 100 mA or to minimize on-chip ground bounce, LDR c a n b e u s e d t o d r i v e a n e x t e r n a l p-type transistor, which, in turn, drives the light source. Referring to the Detailed St ate Machine figure, the LED current driver pulses the external IR LED as shown in Figure 25 during the Prox Accum state. Figure 25 also illustrates that the LED On pulse has a fixed width of 6.3 μs and period of 14.0 μs. So, in addition to setting the pr oximity drive current, 1 to 255 proximity pulses (PPULSE) can be programmed. When deciding on the number of proximity pulses, keep in mind that the signal increases proportionally to PP ULSE, while noise increases by the square root of PPULSE.
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Principles of Operation Interrupts The interrupt feature simplifies and improves system efficiency by eliminating the need to poll the sensor for light intensity or proximity values outside of a user-defined range. While the interrupt function is always enable d and it's status is available in the status register (0x13), th e output of the interrupt state can be enabled using the proxim ity interrupt enable (PIEN) or Clear interrupt enable (AIEN) fields in the enable register (0x00). Four 16-bit interrupt threshold registers allow the user to set limits below and above a desired light level and proximity range. An interrupt can be generated when the Clear data (CDATA) is less than the Clear interrupt low threshold registers (AILTx) or greater than the Clear interrupt high threshold registers (AIHTx). Likewise, an out-of-range proximity interrupt can be generated when the proximity data (PDATA) falls below the proximity interrupt low threshold (PILTx) or exceeds the proximity interrupt high threshold (PIHTx). It is important to note that the thresholds are evaluated in sequence, first the low threshold, then the high threshold. As a result, if the low threshold is set above the high threshold, the high threshold is ignored and only the low threshold is evaluated. To further control when an interrupt occurs, the device provides a persistence filter. The persistence filter allows the user to specify the number of consecutive out-of-range Clear or proximity occurrence s before an interrupt is generated. The persistence register (0x0C) allows the user to set the Clear persistence (APERS) and the proximity persistence (PPERS) values. See the persistence register for details on the persistence filter values. Once the persistence filter generates an interrupt, it will continue until a special function interrupt clear command is received (see command register). Figure 26: Programmable Interrupt
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Principles of Operation System Timing The system state machine shown in Figure 22 provides an overview of the states and state transitions that provide system control of the device. This section highlights the programmable features, which affect the state machine cycle time, and provides details to determine system level timing. When the proximity detection feature is enabled (PEN), the state machine transitions throug h the Prox Accum, Prox Wait, and Prox ADC states. The Prox Wait time is a fixed 2.4ms, whereas the Prox Accum time is determined by the number of proximity LED pulses (PPULSE) and the Prox ADC time is determined by the in tegration time (PTIME). The formulas to determine the Prox Ac cum and Prox ADC times are given in the associated boxes in Figure 27 . If an interrupt is generated as a result of the proximity cycle, it will be asserted at the end of the Prox ADC state. When the power management feature is enabled (WEN), the state machine will transition in turn to the Wait state. The wait time is determined by WLONG, which extends normal operation by 12× when asserted, and WTIME. The formula to determine the wait time is given in the box associated with the Wait state in Figure 27 . When the RGBC feature is enabled (AEN), the state machine will transition through the RGBC Init and RGBC ADC states. The RGBC Init state takes 2.4 ms, while the RGBC ADC time is dependent on the integration ti me (ATIME). The formula to determine RGBC ADC time is gi ven in the associated box in Figure 27 . If an interrupt is generate d as a result of the RGBC cycle, it will be asserted at the end of the RGBC ADC.
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Principles of Operation Figure 27: Detailed State Diagram Note(s): 1. There is a 2.4 ms warm‐up delay if PON is enabled. If PON is not enabled, the device will return to the Sleep state as shown . 2. PON, PEN, WEN, and AEN are fields in the Enable register (0x00).
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − I²C Protocol Interface and control are accomplished through an I²C serial compatible interface (standard or fa st mode) to a set of registers that provide access to device co ntrol functions and output data. The devices support the 7-bit I²C addressing protocol. The I²C standard provides for th ree types of bu s transaction: read, write, and a combined protocol ( Figure 30 ). During a write operation, the first byte writte n is a command byte followed by data. In a combined protocol, the first byte written is the command byte followed by reading a series of bytes. If a read command is issued, the register address from the previous command will be used for data access. Likewise, if the MSB of the command is not set, the device will write a series of bytes at the address stored in the last valid command with a register address. The command byte contains either control information or a 5-bit register address. The control commands can also be used to clear interrupts. The I²C bus protocol was deve loped by Philips (now NXP). For a complete description of the I²C protocol, please review the NXP I²C design specification at: http://www.i2c-bus.org/references/ . Figure 30: I²C Protocols I²C Protocol Repeated Start Condition Write (0) Continuation of Protocol Master - to - Slave Slave - to - Master Sr W Acknowledge (0) Not Acknowledged (1) Stop Condition Read (1) Start Condition A N P R S
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Register Description The TCS3772 is controlled and m onitored by data registers and a command register accessed through the serial interface. These registers provide for a variety of control functions and can be read to determine result s of the ADC conversions. The register set is summarized in Figure 31 . Figure 31: Register Set Address Register Name R/W Register Function Reset Value -- COMMAND W Specifies register address 0x00 0x00 ENABLE R/W Enables states and interrupts 0x00 0x01 ATIME R/W RGBC time 0xFF 0x02 PTIME R/W Proximity time 0xFF 0x03 WTIME R/W Wait time 0xFF 0x04 AILTL R/W Clear interrupt low threshold low byte 0x00 0x05 AILTH R/W Clear interrupt low threshold high byte 0x00 0x06 AIHTL R/W Clear interrupt high threshold low byte 0x00 0x07 AIHTH R/W Clear interrupt high threshold high byte 0x00 0x08 PILTL R/W Proximity interrupt low threshold low byte 0x00 0x09 PILTH R/W Proximity interrupt low threshold high byte 0x00 0x0A PIHTL R/W Proximity interrupt high threshold low byte 0x00 0x0B PIHTH R/W Proximity interrupt high threshold high byte 0x00 0x0C PERS R/W Interrupt persistence filters 0x00 0x0D CONFIG R/W Configuration 0x00 0x0E PPULSE R/W Proximity pulse count 0x00 0x0F CONTROL R/W Gain control register 0x00 0x12 ID R Device ID ID 0x13 STATUS R Device status 0x00 0x14 CDATA R Clear ADC data low byte 0x00 0x15 CDATAH R Clear ADC data high byte 0x00 0x16 RDATA R Red ADC data low byte 0x00 0x17 RDATAH R Red ADC data high byte 0x00 0x18 GDATA R Green ADC data low byte 0x00 0x19 GDATAH R Green ADC data high byte 0x00 Register Description
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Register Description The mechanics of acce ssing a specific register depends on the specific protocol used. See the section on I²C protocols on the previous pages. In general, th e COMMAND register is written first to specify the specific control/status register for following read/write operations. 0x1A BDATA R Blue ADC data low byte 0x00 0x1B BDATAH R Blue ADC data high byte 0x00 0x1C PDATA R Proximity ADC data low byte 0x00 0x1D PDATAH R Proximity ADC data high byte 0x00 Address Register Name R/W Register Function Reset Value
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Register Description Command Register The COMMAND registers specifies the address of the target register for future write and read operations. Figure 32: Command Register 7654321 0 CMD TYPE ADDR/SF Field Bits Description CMD 7 Select Command Register. Must write as 1 when addressing COMMAND register. TYPE 6:5 Selects type of transaction to follow in subsequent data transfers: FIELD VALUE INTEGRATION TIME
00 Repeated byte protocol transaction
01 Auto-increment protocol transaction
10 Reserved – Do not use
11 Special function – See description below
Byte protocol will repeatedly read the same register with each data access. Block protocol will provide auto-increment function to read successive bytes. ADDR/SF 4:0 Address field/special function field. Depending on the transaction type, see above, this field either specifies a special function command or selects the specific control-status-register for following write and read transactions. The field values listed below apply only to special function commands: FIELD VALUE READ VALUE
00101 Proximity interrupt clear
00110 Clear channel interrupt clear
00111 Proximity and Clear interrupt clear
Other Reserved – Do not write The ALS and Proximity interrupt clear special functions clear any pending interrupt(s) and are self clearing.
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Register Description Enable Register (0x00) The ENABLE register is used primarily to power the TCS3772 device on and off, and enable functions and interrupts as shown below. Figure 33: Enable Register 7 6 5 4 321 0 Reserved PIEN AIEN WEN PEN AEN PON Fields Bits Description Reserved 7:6 Reserved. Write as 0. PIEN 5 Proximity interrupt enable. When asserted, permits proximity interrupts to be generated. AIEN 4 Clear channel interrupt enable. When asserted, permits Clear interrupts to be generated. WEN 3 Wait enable. This bit activates the wait feature. Writing a 1 activates the wait timer. Writing a 0 disables the wait timer. PEN 2 Proximity enable. This bit activates the proximity function. Writing a 1 enables proximity. Writing a 0 disables proximity. AEN 1 RGBC enable. This bit actives the two-channel ADC. Writing a 1 activates RGBC. Writing a 0 disables RGBC. PON 0 Power ON. This bit activates the internal oscillator to permit the timers and ADC channels to operate. Writing a 1 activates the oscillator. Writing a 0 disables the oscillator. During reads and writes over the I²C interface, this bit is temporarily overridden and the oscillator is enabled, independent of the state of PON.
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Register Description Wait Time Register (0x03) Wait time is set 2.4 ms incr ements unless the WLONG bit is asserted, in which case the wait times are 12× longer. WTIME is programmed as a 2’s complement number. Figure 36: Wait Time Register Note(s): 1. The Proximity Wait Time Register should be co nfigured before PEN and/or AEN is/are asserted. Fields Bits Description WTIME 7:0 REGISTER VALUE WAIT TIME TIME (WLONG = 0) TIME (WLONG = 1) 0xFF 1 2.4 ms 0.029 s 0xAB 85 204 ms 2.45 s 0x00 256 614 ms 7.4 s
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Register Description Persistence Filter Register (0x0C) The PERSISTENCE FILTER register controls the filtering interrupt capabilities of the device. Configurable filtering is provided to allow interrupts to be generated after each integr ation cycle or if the integration has produced a result that is outside of the values specified by the threshol d register for some specified amount of time. Separate filterin g is provided for proximity and the clear channel. Figure 39: Persistence Filter Register 76543210 PPERS APERS Field Bits Description PPERS 7:4 Proximity interrupt persistence. Controls rate of proximity interrupt to the host processor. FIELD VALUE INTERRUPT PERSISTENCE FUNCTION
0000 Every proximity cycle generates an interrupt
0001 1 proximity value out of range 0010 2 consecutive proximity values out of range 1111 15 consecutive proximity values out of range
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Register Description Configuration Register (0x0D) The CONFIGURATION register sets the wait long time Figure 40: Configuration Register APERS 3:0 Clear Interrupt persistence. Controls rate of Clear channel in terrupt to the host processor. FIELD VALUE INTERRUPT PERSISTENCE FUNCTION
0000 Every RGBC cycle generates an interrupt
0001 1 clear channel value outside of threshold range 0010 2 clear channel consecutive values out of range 0011 3 clear channel consecutive values out of range 0100 5 clear channel consecutive values out of range 0101 10 clear channel consecutive values out of range 0110 15 clear channel consecutive values out of range 0111 20 clear channel consecutive values out of range 1000 25 clear channel consecutive values out of range 1001 30 clear channel consecutive values out of range 1010 35 clear channel consecutive values out of range 1011 40 clear channel consecutive values out of range 1100 45 clear channel consecutive values out of range 1101 50 clear channel consecutive values out of range 1110 55 clear channel consecutive values out of range 1111 60 clear channel consecutive values out of range 7 6 5 4 321 0 Reserved WLONG Reserved Fields Bits Description Reserved 7:2 Reserved. Write as 0. WLONG 1 Wait Long. When asserted, the wait cycles are increased by a factor 12× from that programmed in the WTIME register. Reserved 0 Reserved. Write as 0. Field Bits Description
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Application Information: Hardware LED Driver Pin with Proximity Detection In a proximity sensing system, the IR LED can be pulsed by the TCS3772 with more than 100 mA of rapidly switching current, therefore, a few design considerations must be kept in mind to get the best performance. The key goal is to reduce the power supply noise coupled back into the device during the LED pulses. The first recommendation is to use two power supplies; one for the device V DD and the other for the IR LED. In many systems, there is a quiet analog supply and a noisy digital supply. By connecting the quie t supply to the V DD pin and the noisy supply to the LED, the key goal can be meet. Place a 1- μF low-ESR decoupling capacitor as close as possible to the V DD pin and another at the LED anode, and a 22- μF capacitor at the output of the LED voltage regulator to supply the 10 0-mA current surge. Figure 47: Proximity Sensing Using Separate Power Supplies If it is not possible to provide two separate powe r supplies, the device can be operated from a single supply. A 22- Ω resistor in series with the V DD supply line and a 1- μF low ESR capacitor effectively filter any power suppl y noise. The previous capacitor placement considerations apply. Application Information: Hardware
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Application Information: Hardware Figure 48: Proximity Sensing Using Single Power Supply VBUS in the above figures refers to the I²C bus voltage which is either V DD or 1.8 V. Be sure to ap ply the specified I²C bus voltage shown in the Available Options table for the specific device being used. The I²C signals and the Interrup t are open-drain outputs and require pull-up resistors. The pull-up resistor (R P) value is a function of the I²C bus speed, the I²C bus voltage, and the capacitive load. The ams EVM running at 400 kbit/s, uses 1.5-k Ω resistors. A 10-k Ω pull-up resistor (R PI) can be used for the interrupt line.
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Application Information: Hardware PCB Pad Layout Suggested land pattern based on the IPC-7351B Generic Requirements for Surface Mount Design and Land Pattern Standard (2010) for the small outline no-lead (SON) package is shown in Figure 49 . Figure 49: Suggested FN Package PCB Layout (Top View) Note(s): 1. All linear dimensions are in millimeters. 2. This drawing is subject to change without notice.
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Package Drawings & Markings Figure 50: Package FN – Dual Flat No-L ead Packaging Configuration Note(s): 1. All linear dimensions are in micrometers. 2. The die is centered within the package within a tolerance of ± 75 μm. 3. Double-Half Etch (DHE) is 97 ± 20 μm. Non-DHE is 203 ± 8 μm. 4. Package top surface is molded with an electrically nonconduct ive clear plastic compound having an index of refraction of 1.5 5. 5. Contact finish is copper alloy A194 with pre-plated NiPdAu lead finish. 6. This package contains no lead (Pb). 7. This drawing is subject to change without notice. Package Drawings & Markings Green RoHS
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Carrier Tape & Reel Information Figure 51: Package FN Carrier Tape Note(s): 1. All linear dimensions are in millimeters. Dime nsion tolerance is ± 0.10 mm unless otherwise noted. 2. The dimensions on this drawing are for illustrative purpos es only. Dimensions of an actual carrier may vary slightly. 3. Symbols on drawing A 0, B0, and K 0 are defined in ANSI EIA Standard 481-B 2001. 4. Each reel is 178 millimeters in diameter and contains 3500 parts. 5. ams packaging tape and reel conform to th e requirements of EIA Standard 481-B. 6. In accordance with EIA standard, device pin 1 is located next to sprocket holes in the tape. 7. This drawing is subject to change without notice. Carrier Tape & Reel Information
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Soldering and Storage Information Storage Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previously absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Device s are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambi ent moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions:
- Shelf Life: 12 months
- Ambient Temperature: < 40 °C
- Relative Humidity: < 90% Rebaking of the devices will be required if the devices exceed the 12 month shelf life or the Humidity Indicator Card shows that the devices were expose d to conditions beyond the allowable moisture region. Floor Life The FN package has been assigned a moisture sensitivity level of MSL 3. As a result, the floor life of devices removed from the moisture barrier bag is 168 ho urs from the time the bag was opened, provided that the devices are stored under the following conditions:
- Floor Life: 168 hours
- Ambient Temperature: < 30 °C
- Relative Humidity: < 60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 50 °C for 12 hours.
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Ordering & Contact Information Figure 54:
Ordering Information
Note(s): 1. Contact ams for availability. Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code Device Address Package-Leads Interface Description TCS37725FN TCS37725(1) 0x29 FN−6 I²C VBUS = VDD Interface TCS37727FN TCS37727 0x29 FN−6 I²C VBUS = 1.8 V Interface Ordering & Contact Information
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specif ied lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are unde rway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to prov ide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Copyrights & Disclaimer Copyright ams AG, Tobelbader St rasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used with out the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appe aring in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding th e information set forth herein. ams AG reserves the right to ch ange specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any th ird party shall arise or flow out of ams AG rendering of technical or other services. Copyrights & Disclaimer
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Revision Information Note(s): 1. Page and figure numbers for the previous version may diff er from page and figure numbers in the current revision. 2. Correction of typographical er rors is not explicitly mentioned. Changes from 1-00 (2016-Aug-22) to current revision 1-01 (2018-Mar-14) Page Updated Figure 6 and 7 6 Updated Figure 43 35 Updated Figure 54 44 Revision Information
[v1-01] 2018-Mar-14 Document Feedback TCS3772 − Content Guide
1 General Description
1 Key Benefits & Features
2 Applications
2 End Products and Market Segments
3 Block Diagram
4 Pin Assignment
5A b s o l u t e M a x i m u m R a t i n g s
6 Electrical Characteristics
10 Timing Characteristics
10 Timing Diagrams
11 Typical Operating Characteristics
15 Detailed Description
16 Principles of Operation
16 System State Machine
17 RGBC Operation
18 Proximity Detection
20 Interrupts
21 System Timing
23 Power Management
24 I²C Protocol
25 Register Description
27 Command Register
28 Enable Register (0x00)
29 RGBC Time Register (0x01)
29 Proximity Time Register (0x02)
30 Wait Time Register (0x03)
31 Clear Interrupt Threshold Registers
(0x04 - 0x07)
31 Proximity Interrupt Threshold Registers
(0x08 - 0x0B)
32 Persistence Filter Register (0x0C)
33 Configuration Register (0x0D)
34 Proximity Pulse Count Register (0x0E)
34 Control Register (0x0F)
35 ID Register (0x12)
35 Status Register (0x13)
36 RGBC Channel Data Registers (0x14 - 0x1B)
36 Proximity Data Registers (0x1C - 0x1D)
37 LED Driver Pin with Proximity Detection
39 PCB Pad Layout
41 Carrier Tape & Reel Information
42 Soldering and Storage Information
42 Soldering Information
43 Storage Information
43 Moisture Sensitivity
Document Feedback [v1-01] 2018-Mar-14 TCS3772 − Content Guide