V100P000A-680-C OSRAM | Alldatasheet

Document overview

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Technical content

1 Version 1.0 | December - 2023 www.osram-os.com V100P000A-680-C BIDOS® Applications: — Biometric Sensor — Low Light Laser Therapy — Industrial Sensors — Pulse Oximetry Features: — Chip Technology: GaAs VCSEL — Laser Wavelength: 680nm — Optical Power Class: 7.0 mW — Radiation Profile: Multi-Mode

Ordering Information

Type Operational Mode: IF = 15 mA, Ta = 25°C DC = 100% Ordering Code V100P000A-680-C 7.0 mW Q65113A7623 Note: V100P000A-680-C is a Vixar legacy qualified product.

2 Version 1.0 | December - 2023 Note 1: The maximum CW laser current in the Absolute Maximum Ratings is valid for the operating temperature noted at the top of this table; however, the maximum CW laser current decreases with increasing temperature. Contact Vixar for maximum CW laser current values at other temperatures. Note 2: For details refer to the Vixar Application Note "VCSEL EOS/ESD Considerations and Lifetime Optimization". Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated for extended periods of time may affect device reliability. Electro-Optical Characteristics VCSEL Operating Temp (Tv) =25°C & Operating Current=15mA unless otherwise stated) Parameter Symbol Units Min Typ Max Notes Verification (Note 3) Threshold current Ith mA 3.0 5.0 8.0 Wafer test & Qualification Operating voltage Vf Volts -- 2.3 2.6 Final test Series resistance (VCSEL) Rs Ohms -- 25 -- Wafer test Slope efficiency SE mW/mA -- 0.7 -- Wafer test & Qualification Optical output power Lop mW 5 7.0 T=25°C Final test Reverse breakdown voltage V 10 -- -- Ir ≤ 1nA Wafer test Operating wavelength λop nm 675 680 685 Final test Spectral width (RMS) Δλ nm -- -- 1.5 Wafer test & Qualification Beam divergence 1/e2 deg 15 17 21 Whole angle Wafer test Beam divergence FWHM FWHM deg 12 14 18 Whole angle Wafer test Wavelength temp. coefficient nm/°C 0.045 By Design Note 3: Verification indicates how Vixar will verify specification compliance:

  • “By Design” means that these parameters are built in by design. These are controlled by material properties, mask layout, wafer processing controls, or assembly tolerances.
  • “Qualification” means testing that is performed on product to check that these specifications are met with sufficient design margin during the qualification testing process. These will not be measured during production.
  • “Final Test” means that these parameters will be verified after packaging assembly at the final test station.
  • “Wafer Test” means that these parameters will be measured during wafer level testing, 100% during production, so that Known Good Die (KGD) are shipped for assembly Maximum Ratings Parameter Rating Notes Storage temperature -40 to 100 °C Operating temperature (VCSEL) -20°C to 50 °C Lead solder temperature 260°C, 10 seconds CW current (VCSEL) 20 mA (Note 1) Laser reverse voltage 5 V (Note 1)

4 Version 1.0 | December - 2023 Beam Divergence at Room Temperature Figure 3 Beam divergence of multiple K0-0680M-1263-DP0 at 25°C

Package Information

The product will be shipped in a tape & reel package which is inside a sealed ESD bag with moisture sensitivity labels & desiccant. Package Dimension

5 Version 1.0 | December - 2023 Recommended PCB Solder layout Solder Reflow Profile Package Handling Instructions The package should be treated as Moisture Sensitivity Level 5a (MSL 5a) prior to assembly. 1. The shelf life in the sealed bag is 12 months at 5°C-30°C and < 60% R.H. 2. After the package is opened

2.1 It is recommended to bake before the first use:

Baking condition: a. 60+/- 5°C for 24-48 hours and <5% R.H. in tape and reel b. 110+/-5°C for 8-16 hours in bulk type 2.2 The devices should be used within a week and to be stored at <20% R.H. with zip lock sealed: a. Baking is required before soldering when the pack is unsealed after 24 hours b. Bake conditions as described in 2.1

6 Version 1.0 | December - 2023 Tape and Reel information Reel dimensions [mm] A W Nmin W1 W2 max Pieces per PU 180 mm 8.00 ± 0.10 60 8.4 10.4 3000 Barcode-Product-Label (BPL) Dry Packing Process and Materials Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

7 Version 1.0 | December - 2023

Revision History

Changed package photo & drawing. Edited beam divergence spec to narrower angle Changed LIV graph Added a spectral data graph RevA 07/11/2018 remove header/footer, adjust margin, package dimension, method of delivery, pre-release into ISOXpress Rev B 08/06/2018 Added verification notes Removed package drawing and replaced with drawing number Added shipping and handling instructions Edited method of delivery. Rev C 9/19/2018 Addition of Header & Footer, Release into SharePoint Rev D 10/4/2019 Include Reflow Soldering Profile, Package Dimension, Packaging Information, Label and update header

1.0 December 4th - 2023 Update Ordering Code, Product Number and

Barcode-Product-Label (BPL). Mar 2018 Copyright ©VIXAR COMPLIES WITH IEC 60825-1, 2 nd Edition 2007. COMPLIES WITH 21 CFR 1040.10 AND 1040-10.11 EXCEPT FOR DEVIATIONS PURSUANT TO LASER NOTICE NO.50 DATED 27 MAY 2001.