UT01-P01/TR

EHP-C04 EVERLIGHT | Alldatasheet

Document overview

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Technical content

Features

/circle6 Feature of the device: small package with high efficiency /circle6 Color coordinates: x=0.31, y=0.32 according to CIE 1931 /circle6 Typical color temperature: 6500 K. /circle6 ESD protection. /circle6 Soldering methods: SMT /circle6 Grouping parameter: total luminous flux, color coordinates. /circle6 Typical luminous flux: 55 lm @ 500 mA. /circle6 Optical efficiency: 37 lm/W. /circle6 Thermal resistance (junction to sink): 37 °° °° C/W (measured at IF=350 mA DC mode). /circle6 The product itself will remain within RoHS compliant version.

Applications

/circle6 Mobile phone flash /circle6 Exterior and interior illumination applications /circle6 Decorative and entertainment /circle6 Exterior and interior automotive illumination Materials Items Description Substrate Thermally conductive ceramics Encapsulating Resin Silicone resin with phosphor Electrodes Ag plating Die attach Silver paste Chip InGaN

EVERLIGHT ELECTRONICS CO.,LTD. EHP-C04/UT01-P01/TR Device No. : Prepared date: July. 24, 2007 Prepared by: Randal Chiang Dimensions Notes: 1. Dimensions are in millimeters. 2. Tolerances unless dimensions ±0.1mm.

EVERLIGHT ELECTRONICS CO.,LTD. EHP-C04/UT01-P01/TR Device No. : Prepared date: July. 24, 2007 Prepared by: Randal Chiang Maximum Ratings ( T Ambient =25ºC ) Parameter Symbol Rating Unit DC Operating Current IF 350 mA Pulsed Forward Current IF 1000 mA ESD Sensitivity (JEDEC 3b) ESD 8000 V Junction Temperature Tj 125 ° C Operating Temperature Topr -40 ~ +85 ° C Storage Temperature Tstg -40 ~ +120 ° C Power Dissipation (Pulse Mode) Pd 4.9 W Dynamic Resistance R D 0.5 Ω Temp. Coefficient of Forward Voltage △△ △△ VF/△△ △△ Tj -2.1 mV/° C Junction to Heat-Sink Thermal Resistance (1) Rth 37 ° C /W Note. 1. Thermal resistance, junction to sink, is measured at IF=350 mA DC mode when room temp. is 25 °° °° C. Electro-Optical Characteristics ( TAmbient =25ºC ) Parameter Bin Symbol Min Typ. Max Unit Condition J4 39 ---- 45 J5 45 ---- 52 K1 52 ---- 60 Luminous Flux (1) Фv 60 ---- 70 lm Viewing Angle (2) ---- 2θ1/2 ---- 130 ---- deg S4 2.95 ---- 3.35 Forward Voltage (3) VF 3.35 ---- 3.75 V Color Temperature ---- CCT 5000 6500 10000 K IF=500mA Note. 1. Luminous flux measurement tolerance: ±10% 2θ1/2 is the off axis angle from lamp centerline where the luminous intensity is 1/2 of the peak value. 3. Forward voltage measurement tolerance: ±0.1V 4. Electric and optical data is tested at 100 ms pulse condition.

EVERLIGHT ELECTRONICS CO.,LTD. EHP-C04/UT01-P01/TR Device No. : Prepared date: July. 24, 2007 Prepared by: Randal Chiang Color Binning Rank A0 Rank B3 Reference CCT: 9000K-15000K Reference CCT: 7000K-8700K Rank B4 Rank B5 Reference CCT: 6200K-7000K Reference CCT: 7000K-9000K Rank B6 Rank C0 Reference CCT: 5600K-7000K Reference CCT: 4600K-5600K Note. 1. Color coordinates measurement allowance : ±0.01 2. Color bins are defined at I F=500 mA Color Binning Structure Graphic Representation 0.20 0.24 0.28 0.32 0.36 0.40 0.44 y x

EVERLIGHT ELECTRONICS CO.,LTD. EHP-C04/UT01-P01/TR Device No. : Prepared date: July. 24, 2007 Prepared by: Randal Chiang Relative Spectral Distribution, I F=350mA, T Ambient =25ºC Forward Voltage vs Forward Current, T Ambient =25 ºC Luminous Flux vs Forward Current, TAmbient =25 ºC Forward Current Derating Curve, Derating based on T jMAX =125° C at torch mode Typical Electro-Optical Characteristics Curves 0 200 400 600 800 1000 2.8 3.0 3.2 3.4 3.6 3.8 4.0 Forward Voltage(V) Forward current(mA) 0 200 400 600 800 1000

100 Luminous flux (lm)

Forward current (mA@100 ms) 0 20 40 60 80 100 100 200 300 400 500 Ambient temperature ( o Forward Current (mA) 400 450 500 550 600 650 700 750 800 100 Relative Luminous Intensity (%) Wavelength (nm) 500

EVERLIGHT ELECTRONICS CO.,LTD. EHP-C04/UT01-P01/TR Device No. : Prepared date: July. 24, 2007 Prepared by: Randal Chiang Corelated Color Temperature(CCT) vs. Forward Current Axial Illuminance (lux) vs. Drive Current 0 200 400 600 800 1000 5500 6000 6500 7000 7500

8000 Corelated Color Temperature (K)

Forward current (mA@100ms) 0 200 400 600 800 1000

25 Illuminance at 1m distance (lux)

Forward Current (mA@100ms) Notes: All correlation data is tested under superior thermal management with 1” x 1” MCPCB. Typical Representative Spatial Radiation Pattern

EVERLIGHT ELECTRONICS CO.,LTD. EHP-C04/UT01-P01/TR Device No. : Prepared date: July. 24, 2007 Prepared by: Randal Chiang Label Explanation CPN: Customer’s Production Number P/N : Production Number QTY: Packing Quantity CAT: Luminous Flux HUE: Chromaticity Coordinates REF: Forward Voltage LOT No: Lot Number MADE IN TAIWAN: Production Place Reel Dimensions Note: 1. Dimensions are in millimeters. 2. The tolerances unless mentioned is ±0.1mm.

EVERLIGHT ELECTRONICS CO.,LTD. EHP-C04/UT01-P01/TR Device No. : Prepared date: July. 24, 2007 Prepared by: Randal Chiang Carrier Tape Dimensions: Loaded quantity 2000 PCS per reel Note: 1. Dimensions are in millimeters. 2. The tolerances unless mentioned is ±0.1mm. Moisture Resistant Packaging

EVERLIGHT ELECTRONICS CO.,LTD. EHP-C04/UT01-P01/TR Device No. : Prepared date: July. 24, 2007 Prepared by: Randal Chiang Reliability Test Items Stress Test Stress Condition Stress Duration Reflow T sol =260° C, 10sec, 6min 3 times DC Operating Life T a=25° C , IF=350mA 1000 hours Thermal Shock '∫ 10sec.

500 Cycles

'∫ 5min.

1000 Cycles

High Temperature/Humidity T a=85° C , RH=85% 1000 hours High Temperature Storage T a=100° C 1000 hours Low Temperature Storage T a=-40° C 1000 hours Pulse Test Ta=25° C, IF=1000mA 400ms on/ 3600ms off 30000 times High Temperature Operation Life #1 T a=55° C, IF=350mA 1000 hours High Temperature Operation Life #2 T a=85° C, IF=200mA 1000 hours High Temperature /Humidity Operation Life Ta=85° C, RH=60%, IF=200mA 1000 hours ESD Human Body Model 8000V, Interval:0.5sec 3 times *lm: Brightness attenuate difference(1000hrs) ＜＜ ＜＜ 30% *VF: Forward voltage difference ＜＜ ＜＜ 20% Notes: All reliability items are tested under superior thermal management with 1” x 1” MCPCB.

EVERLIGHT ELECTRONICS CO.,LTD. EHP-C04/UT01-P01/TR Device No. : Prepared date: July. 24, 2007 Prepared by: Randal Chiang Precautions For Use 1. Over-current-proof Though EHP-C04 has conducted ESD protection mechanism, customers must not use the device in reverse and should apply resistors for extra protection. Otherwise, slight voltage shift may cause enormous current shift and burn out failure would happen. 2. Storage i. Do not open moisture proof bag before the produc ts are ready to use. ii. Before opening the package, the LEDs should be stored at temperature less than 30° C and less and relative humidity less than 90%. iii. The LEDs should be used within a year. iv. After opening the package, the LEDs should be s tored at temperature less than 30° C and relative humidity less than 70%. v. The LEDs should be used within 168 hours (7 day) after the package was opened. vi. If the moisture absorbent material (silicone ge l) has faded away or the LEDs have exceeded the storage time, baking treatment should be implemented based on the following conditions: Pre-curing at 60±5° C for 24 hours. 3. Thermal Management i. For maintaining the high flux output and achievi ng reliability, EHP-C04 series LEDs should be mounted on a metal core printed circuit board (MCPCB), with proper thermal connection to dissipate approximately 1W to 5W of thermal energy under normal operation. ii. Sufficient thermal management must be conducted , or the die junction temperature will be over the limit under large electronic driving and LEDs lifetime will decrease critically. 4. Soldering Condition 4-1. Soldering pad

EVERLIGHT ELECTRONICS CO.,LTD. EHP-C04/UT01-P01/TR Device No. : Prepared date: July. 24, 2007 Prepared by: Randal Chiang 4-2. For Reflow Process i. Lead reflow soldering temperature profile ii. Reflow soldering should not be done more than t wo times. iii. While soldering, do not put stress on the LEDs during heating. iv. After soldering, do not warp the circuit board.