UP8806AED4

UP8806 UPI | Alldatasheet

Document overview

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Technical content

Features

WDFN1.6x1.6-6L GND EN 1 SC82-4L VOUT 4V I N GND VOUT EN VIN 1 (T)SOT23-5L / SC70-5L NC SOT23-3L GND VOUT VIN3 GND VOUT VIN SOT89-3L (AKA3) VIN 2 3VOUT VIN GND SOT223-3L VIN TO-252-3L GND VIN VOUT VOUT 2GND VOUT VIN SOT89-3L (BKA3) GND Pin Configuration

2 uP8806-DS-F0000, Jan. 2015 www.upi-semi.com

Ordering Information

rebmuNredrOe gakcaPg nikraMpoTk rameR XX-3AMA6088PuL 3-32TOSX XA89S% 5.1-/+:egatloVtuptuO/Am054:PCO XX-5AMA6088Pu L5-32TOS XXA99S% 5.1-/+:egatloVtuptuO/Am054:PCO XX-5AMB6088PuX XB99S% 5.1-/+:egatloVtuptuO/Am007:PCO XX-5AMN6088PuX XN99S% 1-/+:egatloVtuptuO/Am054:PCO XX-5AMM6088PuX XM99S% 1-/+:egatloVtuptuO/Am007:PCO XX-5TMA6088PuL 5-32TOSTX XA56N% 5.1-/+:egatloVtuptuO/Am054:PCO XX-3AJB6088PuL 3-322TOSX XB1AS% 5.1-/+:egatloVtuptuO/Am007:PCO XX-5CEA6088Pu L5-07CS DBT% 5.1-/+:egatloVtuptuO/Am054:PCO XX-5CEB6088PuD BT% 5.1-/+:egatloVtuptuO/Am007:PCO XX-5CEN6088PuD BT% 1-/+:egatloVtuptuO/Am054:PCO XX-6DDA6088PuL 6-6.1x6.1NFDWD BT% 5.1-/+:egatloVtuptuO/Am054:PCO XX-4DEA6088Pu L4-28CS DBT% 5.1-/+:egatloVtuptuO/Am054:PCO XX-4DEN6088PuD BT% 1-/+:egatloVtuptuO/Am054:PCO XX-3AKA6088Pu L3-98TOS XXA2AS% 5.1-/+:egatloVtuptuO/Am054:PCO XX-3AKB6088PuX XB2AS% 5.1-/+:egatloVtuptuO/Am007:PCO XX-3AHB6088PuL 3-252OTX XB3AS% 5.1-/+:egatloVtuptuO/Am007:PCO Note: uPI products are compatible with the current IPC/JEDEC J-STD-020 requirement. They are halogen-free, RoHS compliant and 100% matte tin (Sn) plating that are suitable for use in SnPb or Pb-free soldering processes. egatloVtuptuO:XX

3uP8806-DS-F0000, Jan. 2015 www.upi-semi.com emaNn oitcnuFniP NIV .egatloVtupnI tnerrucseilppustahtrotsisnartssaplanretniehtfoecrruosehtotstcennocnipsihT gnilpuocedehtecalP.roticapaccimarecFu1muminimahtiwDNGotNIVssapyB.niptuptuoehtot .ecivedehtotelbissopsaesolcsayllacisyhproticapac DNG .dnuorG NE .tupnIelbanE aottnerructnecseiuqehtgnicuder,fforotalugerehtsnrutV4.0wolebnipsihtgnilluP .noitarepolamronrofrofV4.1nahtrehgeihnipsihtlluP.eulavgnitarepostifonoitcarf CN .detcennoCyllanretnItoN TUOV .egatloVtuptuO cimarecFu1muminimahtiwnipsihtssapyB.ecivedehtfotuptuorewopsinipsihT .roticapac Functional Pin Description Functional Block Diagram Current LimtPower On Reset Band Gap Thermal Shutdown MOSFET Driver VIN VOUT GND EN Error Amp. 0.8V VREF Soft Start NC VOUT EN VIN GND Enable Disable VIN VOUT C IN 1uF/300mA 2.2uF/500mA C OUT 1uF/300mA 2.2uF/500mA Typical Application Circuit

Some important terminologies for LDO are specified below. The change in output voltage for a change in input voltage. chip temperature is not significantly affected. regulator will operate within specifications. Figure 1. Power Dissipation vs. Temperature bypass capacitor, hence achieving the smallest PCB area. is required for stable operation for any load conditions. to 4.75V with 0.1V increments. current limiter, thermal sensor, and shutdown logic.

5uP8806-DS-F0000, Jan. 2015 www.upi-semi.com Enable/Shutdown The uP8806 features an active-high enable pin that allows the regulator to be disabled. Forcing the enable pin lower than 0.4V shuts down the regulator and reduces its quiescent current less than 1uA. The voltage reference, error amplifier, gate-driver circuit and pass transistor are disabled in the shutdown state. Forcing the enable pin higher than 1.4V enables the output voltage (once the input voltage is higher than its POR threshold level). If the enable function is not needed in a specific application, it may be tied to VIN to keep the regulator in an always on state. The enable pin uses CMOS technology and cannot be left floating, as this may cause an indeterminate state on the output. Current Limit and Short-Circuit Protection The uP8806 includes a current limiter that monitors and controls the gate voltage of pass transistor to limit the output current to 450mA(uP8806A/N) or 700mA(uP8806B/M) typically. A short circuit protector monitors the output voltage and asserts output short circuit if V OUT is lower than 40% of VNOM . The current limiting level is reduced to around 110mA and overtemperature threshold level is lowered to 100 O C when output short circuit occurs. This limits the junction temperature to a safe level and allows the output to be shorted to ground for an indefinite duration without damaging the device. The output voltage is rebuilt after short circuit is removed. Over Temperature Protection The over temperature protection limits total power dissipation in the uP8806 when the junction temperature exceeds T J = 150O C, the thermal sensor signal the shutdowns logic, turning off the pass transistor and allows the device to cool down. The thermal sensor turns on the pass transistor again after the devices junction temperature drops by 30 O C, resulting in a pulsed output during continuous thermal-overload conditions. The overtemperature protection is designed to protect the device in the event of a fault condition. For continual operation, do not exceed the recommended temperature of T J = 125O C for maximum reliability. Functional Description

6 uP8806-DS-F0000, Jan. 2015 www.upi-semi.com (Note 1) ESD Rating (Note 2) Package Thermal Resistance (Note 3) Power Dissipation, PD @ TA = 25O C (Note 4) Absolute Maximum Rating Thermal Information Recommended Operation Conditions Note 1. Stresses listed as the above Absolute Maximum Ratings may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. Devices are ESD sensitive. Handling precaution recommended. Note 3. θ JA is measured in the natural convection at TA = 25O C on a low effective thermal conductivity test board of JEDEC 51-3 thermal measurement standard. Note 4. The device is not guaranteed to function outside its operating conditions.

7uP8806-DS-F0000, Jan. 2015 www.upi-semi.com retemaraPl obmySs noitidnoCtseTn iMp yTx aMt inU egatloVtupnIylppuS egatloVtupnIylppuSV NI 4.2- -0 .6V dlohserhTROPV HTROP --9 .14 .2V siseretsyHROPV SYHROP --5 3.0- -V tnerruCtnecseiuQI Q V NE I,V5= TUO Am0=- -5 30 5A u tnerruCnwodtuhSI NDHS V NE V0=- -1 .01A u egatloVtuptuO ycaruccAegatloVtuptuOV TUO V NI V= MON I;V0.1+ TUO =A m15 .1-- -5 .1 V% MON V NI V= MON I;V0.1+ TUO Am1= ,5AMM6088Pu,5AMN6088Pu( )4DEN6088Pu,5CEN6088Pu 1-- -1 noitalugeReniLtuptuO ∆ V )ENIL(TUO V<V5.2 NI I,V5.5< TUO Am1=- -1 0.01 .0V /% noitalugeRdaoLtuptuO ∆ V )DAOL(TUO I<Am1 TUO V,Am003< NI V= MON V0.1+- -5 .01 A /% esioNegatloVtuptuOC ;zHM1otzH01 TUO Fu1=- -0 7- -V u )SMR( oitaRnoitcejeRylppuSrewoPR RSP I TUO V,zHk1;Am03= TUO V2.1=- -4 7- - Bd I TUO V,zHk1;Am03= TUO V0.3=- -3 6- - I TUO zHk001;Am03=- -0 4- - I TUO zHM1;Am03=- -5 3- - egatloVtuoporDV PORD I TUO V<V5.2,Am051= MON V3.3<- -0 51- -V m I TUO V<V5.2,Am003= MON V3.3<- -0 03- -V m elbanE leveLhgiHelbanEV NE 4.1- -- -V leveLwoLelbasiDV DS --- -4 .0V tnerruCtupnINEI NE V NI V,V5.5= NE V0roV5.5=1 -0 1 A u emiTyaleDelbanEV mrof NE VotV2> TUO V%01> MON 015 20 5s u ecnatsiseRwoLlluPtuptuO ffOnruTnehW V NI V,V5= TUO V5.0=0 030 050 07 Ω noitcetorP dlohserhTtimiLtnerruCI HT_MIL N/A6088Pu0 330 54- - Am M/B6088Pu0 350 07- - tnerruCtuptuOI TUO Am tnerruCtiucriCtrohSI CS_MIL --5 01- -A m erutarepmeTnwodtuhSlamrehTT DS I TUO V,Am0= NI V= NE V5.5= , --0 51- - O C siseretsyHnwodtuhSlamrehTT SYHDS I TUO V,Am0= NI V= NE V5.5=- -0 3- - O C (VIN = 5V, TA = 25O C, unless otherwise specified)

Electrical Characteristics

8 uP8806-DS-F0000, Jan. 2015 www.upi-semi.com VIN (2V/Div) VOUT (50mV/Div) IOUT (200mA/Div) VIN (2V/Div) VOUT (50mV/Div) IOUT (200mA/Div) EN (2V/Div) VOUT (1V/Div) IOUT (100mA/Div) VIN (2V/Div) VOUT (1V/Div) IOUT (100mA/Div) EN (2V/Div) Vout (1V/Div) IOUT (100mA/Div) VIN (2V/Div) VOUT (1V/Div) IOUT (100mA/Div) Typical Operation Characteristics Power On Waveforms Time: 1ms/Div C IN = Cout = 1uF, Vout = 3.3V, ROUT = 11Ω Turn On Waveforms Time: 20us/Div C IN = Cout = 1uF, Vout = 3.3V, ROUT = 11Ω Power Off Waveforms Time: 2ms/Div C IN = Cout = 1uF, Vout = 3.3V, ROUT = 11Ω Turn Off Waveforms Time: 10us/Div C IN = Cout = 1uF, Vout = 3.3V, ROUT = 11Ω Load Regulation On ResponseLoad Transient Response Time: 200us/Div C IN = Cout = 1uF, Vout = 3.3V, ROUT = 11Ω Time: 2us/Div C IN = Cout = 1uF, Vout = 3.3V, ROUT = 11Ω

9uP8806-DS-F0000, Jan. 2015 www.upi-semi.com VIN (2V/Div) VOUT (2V/Div) IOUT (200mA/Div) VIN (2V/Div) VOUT (2V/Div) IOUT (200mA/Div) 0.0 5.0 10.0 15.0 20.0 25.0 30.0 35.0 40.0 45.0 50.0 -0.20 -0.15 -0.10 -0.05 0.00 0.05 0.10 0.15 0.20 Output Current (A) VOUT = 3.3V Output Voltage (V) VIN (2V/Div) VOUT (50mV/Div) IOUT (200mA/Div) Typical Operation Characteristics Load Transient Off Response Time: 1ms/Div C IN = Cout = 1uF, Vout = 4.3V, ROUT = 11Ω Short Circuit Protection Time: 40us/Div C IN = Cout = 1uF, Vout = 3.3V, VIN = 4.3V Short Circuit Protection Recover Time: 40us/Div C IN = Cout = 1uF, Vout = 3.3V, VIN = 4.3V Output Short Circuit Quiescent Current vs. Input Voltage Input Voltage (V) Quiescent Current (uA) Output Voltage Line Regulation Input Voltage (V) Output Voltage Variation (%)

10 uP8806-DS-F0000, Jan. 2015 www.upi-semi.com 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 deg65 deg105 deg25 0.05 0.1 0.15 0.2 0.25 0.3 0.35 deg65 deg105 deg25 -100 -80 -60 -40 -20 100 1000 10000 100000 1000000 300 350 400 450 500 550 600 650 700 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 Disable Enable - 6 0 - 3 00 3 06 09 0 1 2 0 1 5 0 Typical Operation Characteristics Enable /Disable vs. Input Voltage Input Voltage (V) VOUT = 3.3V Enable /Disable Threshold (V) Quiescent Current vs. Temperature Junction Temperature (O C) C IN = Cout = 1uF, Vout = 1.2V Quiescent Current (uA) Output Pull Low Resistance vs. Input Voltage Input Voltage (V) VOUT = 1.2V Pull Low Resistance (mΩ) PSRR Frequecy (Hz) VIN = 5.0V, VOUT = 3.3V, IOUT = 30mA PSRR (dB ) Dropout Voltage vs. Output Current Output Current (A) VOUT = 2.5V Dropout Voltage (V) Output Current vs. Dropout Voltage Output Current (A) VOUT = 3.3V Dropout Voltage (V)

11uP8806-DS-F0000, Jan. 2015 www.upi-semi.com The uP8806 is specially designed to provide low-noise, high PSRR output voltage without a bypassing capacitor on its reference voltage. However, input and output capacitor should be well considered for optimal performance. Input Capacitors The uP8806 requires well-decoupled supply input for optimal performance. A minimum 1uF capacitor is required from- input-to-ground to provide stability. Input capacitors greater than 1uF offer superior input line transient response and will assist in maximizing the highest possible power supply ripple rejection ratio (PSRR). Ceramic, tantalum, or aluminum electrolytic capacitors may be selected for CIN. There is no specific capacitor ESR requirement for CIN. However, low-ESR ceramic capacitors provide optimal performance at a minimum of space and are highly recommended due to their inherent capability over tantalum capacitors to withstand input current surges from low impedance sources such as batteries in portable devices. Additional high frequency capacitors, such as small-valued NPO dielectric type capacitors, help filter out high-frequency noise and are good design practice in any RF-based circuit. Place the capacitors physically as close as possible to the device with wide and direct PCB traces. Output Capacitors and Stability For proper load voltage regulation and operational stability, a capacitor is required between VOUT and GND pins. The uP8806 is designed and optimized to work with low-value, low-cost ceramic capacitors in space saving and performance consideration. Typical output capacitor values for maximum output current conditions range from 1uF to 10uF. Larger capacitors are recommended for applications expecting low output noise and optimum power supply ripple rejection characteristics. Place the capacitors physically as close as possible to the device with wide and direct PCB traces. X7R/X5R dielectric-type ceramic capacitors are recommended because of their temperature performance. X7R type capacitors loss capacitance by 15% over their operating temperature rand and are the most stable type of ceramic capacitors. Z5U or Y5V dielectric capacitors loss their capacitance by 50% and 60% respectively over their operating temperature ranges. If Y5V or Z5U capacitors are used as output capacitors, the capacitance must be much higher than that of X7R capacitors to ensure the same minimum capacitance over the operating temperature range. ESR of output capacitors should be well considered to ensure stable operation of the device. High ESR capacitors may cause high frequency oscillation. No Load Stability The uP8806 is designed to maintain output voltage regulation and stability under operational no load conditions. This is important characteristic for CMOS RAM keep-alive applications where the output current may drop to zero.

Application Information

12 uP8806-DS-F0000, Jan. 2015 www.upi-semi.com

Package Information

1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm. 0.30 - 0.50 2.80 - 3.00 2.60 - 3.00

1.90 BSC

0.00 - 0.15 1.50 - 1.70 0.08 - 0.22 0.30 - 0.60

0.95 BSC

1.45 MAX

13uP8806-DS-F0000, Jan. 2015 www.upi-semi.com 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm. 0.30 - 0.50 2.80 - 3.00 2.60 - 3.00 0.00 - 0.15 1.50 - 1.70 0.08 - 0.22 0.30 - 0.60

14 uP8806-DS-F0000, Jan. 2015 www.upi-semi.com 0.00 - 0.10 0.08 - 0.25 0.30 - 0.60

1.10 MAX

0.30 - 0.51 2.80 - 3.02 2.60 - 3.00 1.50 - 1.70 Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.

15uP8806-DS-F0000, Jan. 2015 www.upi-semi.com 0.66 - 0.84 2.90 - 3.10 6.70 - 7.30

2.30 BSC

3.30 - 3.70 0.23 - 0.35

0.75 MIN

0.02 - 0.10

1.80 MAX

6.20 - 6.70

4.60 BSC

1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.

16 uP8806-DS-F0000, Jan. 2015 www.upi-semi.com Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm. 0.15 - 0.40 1.80 - 2.20 1.80 - 2.40

1.30 BSC

0.00 - 0.10 0.08 - 0.25 0.21 -0.46 0.65 BSC 1.10 - 1.40

17uP8806-DS-F0000, Jan. 2015 www.upi-semi.com Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm. 0.35 - 0.70 1.80 - 2.20 1.80 - 2.40 0.00 - 0.10 0.08 - 0.26 0.10 -0.46 0.20 - 0.40 1.15 - 1.35 0.80 - 1.10

0.15 BSC

18 uP8806-DS-F0000, Jan. 2015 www.upi-semi.com WDFN1.6x1.6-6L 0.70 - 0.80 0.18 - 0.280.50 BSC 1.50- 1.70 1.50 - 1.70 0.50 - 0.70 0.00 - 0.050.20 REF 4 6 Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.

19uP8806-DS-F0000, Jan. 2015 www.upi-semi.com 0.36 - 0.48 1.35 - 1.83

1.50 BSC

0.35 - 0.44 0.36 - 0.56 12 30.80 - 1.20 2.29 - 2.60 3.94 - 4.25 Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.

20 uP8806-DS-F0000, Jan. 2015 www.upi-semi.com Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm. 0.64 - 0.89 4.95 - 5.46 2.29 BSC 5.33 - 6.20 0.46 - 0.58 2.18 - 2.40 6.35 - 6.73

1.02 MAX

0.46 - 0.58 1.02 - 1.27 1.40 - 1.78 1.52 - 2.03 9.40 - 10.41

4.57 MIN

21uP8806-DS-F0000, Jan. 2015 www.upi-semi.com Important Notice uPI and its subsidiaries reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. uPI products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment. However, no responsibility is assumed by uPI or its subsidiaries for its use or application of any product or circuit; nor for any infringements of patents or other rights of third parties which may result from its use or application, including but not limited to any consequential or incidental damages. No uPI components are designed, intended or authorized for use in military, aerospace, automotive applications nor in systems for surgical implantation or life-sustaining. No license is granted by implication or otherwise under any patent or patent rights of uPI or its subsidiaries. COPYRIGHT ( C ) 2015, UPI SEMICONDUCTOR CORP . uPI Semiconductor Corp. Headquarter 9F.,No.5, Taiyuan 1st St. Zhubei City, Hsinchu Taiwan, R.O.C. uPI Semiconductor Corp. Sales Branch Office 12F-5, No. 408, Ruiguang Rd. Neihu District, Taipei Taiwan, R.O.C.