UP7706ADC8

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Features

Pin Configuration & Typical Application Circuit VOUT 5VCC VIN FB 100uF POK VOUTVIN EN CNTL 0.1uF 10K 10K 12.5K uP7706 GND option 22uF GNDPOK FB VOUT NC EN VIN CNTL GND FB VOUT GND NC POK EN VIN CNTL GND DFN6x5-8L PSOP-8

uPI Semiconductor Corp., http://www.upi-semi.com Rev. F00, File Name: uP7706-DS-F0000 uP7706 .oNniPe maNn oitcnuFniP 1K OP .noitacidnIKOrewoP Vecnoecnadepmihgihtessidnatuptuoniard-neponasinipsihT TUO .egatlovgnitarstifo%29sehcaer 2N E .tupnIelbanE tnerructnecseiuqehtgnicuder,fforotalugerehtsnrutV8.0wolebnipsihtgnilluP .eulavgnitarepostifonoitcarfaot 3N IV .egatloVtupnI .niptuptuoehtottnerrucylppustahtecivedrewopehtottupniniardehtsisihT ehttneverponipsihtotesolcyllacisyhpdecalpebdluohsRSEwolhtiwsroticapacklubegraL dednemmocersiroticapaccimarecFu01A.tneisnartdaolegralgnirudgnippordmorfliartupni .nipsihtta 4L TNC .tiucriClortnoCroftupnIylppuS dnayrtiucriclortnocehtotegatlovsaibsedivorpnipsihT VehtotdenoitroporpsitnerructuptuofoytilibapacgnivirdehT.rotsisnartssapehtrofrevird LTNC . tuptuoehtnahtretaergV5.1tsaeltaebtsumnipsihtnoegatloveht,etalugerotecivedehtroF Vnahtsselondna,egatlov .NIM_LTNC 5C N .detcennoCyllanretnItoN 6T UOV .egatloVtuptuO ehtnehwstsixeecnatsiserwolllupA.ecivedehtfotuptuorewopsinipsihT egralotesnopsertneisnartetauqedaniatniamoT.nipNEehtwolgnillupybdelbasidsiecived erasroticapaccimarecFu01htiwroticapaccitylortcelelAFu0001foeulavlacipyt,egnahcdaol .TUOVnostneisnarttnerrucfostceffeehtecuderotdednemmocer 7B F .egatloVkcabdeeF morfredividrotsiserA.reifilpmarorreehtottupnignitrevniehtsinipsihT VsaegatlovnoitalugerehttesotdesusiDNGottuptuoeht TUO )V(1R/)2R+1R(x8.0= 8D NG .dnuorG desopxE daP DNG .dnuorG deredlosebdluohsdnahtapnoitapissidrewoptnanimodehtstcadapdesopxeehT ehtnidebircsedsasdapBCPngisedllewot .retpahCsnoitamrofnInoitacilppA Functional Pin Description Functional Block Diagram VIN Power On Reset Softstart & Control Logic Thermal Limit Current Limit Delay 92% VREF 0.3V CNTLEN FB POK GND 0.8V VREF

uPI Semiconductor Corp., http://www.upi-semi.com Rev. F00, File Name: uP7706-DS-F0000 uP7706 ESD Rating (Note 2) Package Thermal Resistance (Note 3) Power Dissipation, PD @ TA = 25°C retemaraPl obmySs noitidnoCtseTn iMp yTx aMs tinU egatloVtupnIylppuS egatloVtupnIlortnoCV LTNC V TUO V= FER 0.3- -5 .5V dlohserhTROPV HTRLTNC --7 .2- -V siseretsyHROPV SYHLTNC --2 .0- -V egatloVtupnIrewoPV NI V TUO V= FER 0.1- -5 .5V nitnerruCtupnIlortnoC nwodtuhS I DS_LTNC V LTNC V= NI I,V0.5= TUO V,A0= NE V0=- -0 20 3A u tnerruCtupnIlortnoCI LTNC V LTNC V= NI V= NE I,V0.5= TUO V,A0= TUO V= FER --0 .15 .1A m tnerruCtnecseiuQI Q V LTNC V= NI V= NE I,V0.5= TUO V,A0= TUO V= FER --0 .15 .1A m (VCNTL = 5V, TA = 25OC, unless otherwise specified) Absolute Maximum Rating Thermal Information Recommended Operation Conditions

Electrical Characteristics

uPI Semiconductor Corp., http://www.upi-semi.com Rev. F00, File Name: uP7706-DS-F0000 Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. Devices are ESD sensitive. Handling precaution recommended. Note 3. θ JA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of JEDEC 51-3 thermal measurement standard. Note 4. The device is not guaranteed to function outside its operating conditions. retemaraPl obmySs noitidnoCtseTn iMp yTx aMs tinU egatloVkcabdeeF tnerruCtupnIkcabdeeFI BF --0 2- -A n VNI noitalugeReniLV )ENIL(FER V<V2.1 NI V,V0.5< LTNC V= NE I,V0.5= TUO V.A0= TUO = V FER --1 0.01 .0V /% V LTNC noitalugeReniLV )LTNC(FER VNI I,V3.3= TUO V.A0= TUO V= FER --1 0.01 .0V /% noitalugeRdaoLV )DAOL(FER I<Am01 TUO V,A3< LTNC V= NI V= NE V,V0.5= TUO V= FER --8 .05 .1A /% revonoitalugeRdaoL erutarepmeT V )DAOL(FER I<Am01 TUO V,A3< LTNC V= NI V= NE V,V0.5= TUO V= FER , 04- O T<C J 521< OC --4 .13 % egatloVtuoporDV PORD I TUO V,A2= LTNC V= NE V,V0.5= TUO V= FER --0 020 42 Vm I TUO V,A3= LTNC V= NE V,V0.5= TUO V= FER 0030 63 V TUO ecnatsiseRwoLlluPV LTNC V= NI V,V0.5= NE ,V0=- -0 9- - Ω elbanE leveLhgiHelbanEV NE --- -4 .1V leveLwoLelbasiDV DS 8.0- -- -V tnerruCtupnINEI NE V NE V= LTNC V0.5=- -2 10 2A u ecnadepmItupnINEZ NE --5 6- -K Ω KORWP dlohserhTKOrewoPBFV HTKOP I TUO V,A0= LTNC V= NI V= NE V,V0.5= TUO V= FER --2 9- -% siseretsyHKOrewoPV SYHKOP I TUO V,A0= LTNC V= NI V= NE V,V0.5= TUO V= FER --8 - -% noitcetorPtnerrucrevO leveLdlohserhTPCOI PCO V LTNC V= NI V= NE V,V0.5= TUO V= FER --4 - -A tiucriCtrohStuptuO tnerruC I CS V LTNC V= NI V= NE V,V0.5= TUO V= FER --0 01- -A m noitcetorPlamrehT nwodtuhSlamrehT erutarepmeT T DS I TUO V,A0= LTNC V= NI V= NE V,V0.5= TUO V= FER --0 71- - OC nwodtuhSlamrehT siseretsyH T SYHDS I TUO V,A0= LTNC V= NI V= NE V,V0.5= TUO V= FER --0 3- - OC

uPI Semiconductor Corp., http://www.upi-semi.com Rev. F00, File Name: uP7706-DS-F0000 uP7706 VCNTL (5V/Div) VOUT (1V/Div) POK (5V/Div) IIN (1A/Div) Typical Operation Characteristics 0A 1A 2A 3A 0mV 2mV 4mV 0A 1A 2A 3A 4A 5A 1.5V 0.5V 0A 1A 3A2A0mV 100mV 200mV 300mV VEN (5V/Div) VOUT (1V/Div) POK (5V/Div) IIN (1A/Div) VIN (2V/Div) VOUT (1V/Div) POK (5V/Div) IIN (1A/Div) Ouput Voltage vs. Ouptut Current Output Current (A) Output Voltage Deviation (mV) Power On from VIN 1ms/Div VCNTL =5V, VIN = 3.3V, COUT = 1000uF, No Load. Power On from V CNTL 1ms/Div VCNTL =5V, VIN = 3.3V, COUT = 1000uF, No Load. Output Short Circuit Output Current (A) Output Voltage (V) Turn On from EN 1ms/Div VCNTL =5V, VIN = 3.3V, COUT = 1000uF, No Load. Dropout Voltage vs. Output Current Output Current (A) Dropout Voltgae (mV)

uPI Semiconductor Corp., http://www.upi-semi.com Rev. F00, File Name: uP7706-DS-F0000 Typical Operation Characteristics VOUT (5mV/Div) IOUT (1A/Div) 2.5 3 3.5 4 4.5 5 5.5 6 200 400 600 800 1000 1200 2 . 533 . 544 . 555 . 56 Load Transient Response 25us/Div COUT = 22uF/X5R Quiescent Current vs. Input Voltage Input Voltage VCNTL = VIN (V) Quiescent Current (uA) Shutdown Current vs. Input Voltage Input Voltage VCNTL = VIN (V) Shutdown Current (uA) Line Regulation Input Voltage VCNTL = VIN (V) Feedback Voltage VFB (V) 0.79 0.792 0.794 0.796 0.798 0.8 0.802 0.804 0.806 0.808 0.81 2 . 533 . 544 . 555 . 56 200 400 600 800 1000 1200 1400 -50 -25 0 25 50 75 100 125 Quiescent Current vs. Temperature Junction Temperature ( OC) VCNTL = VIN = 5V Quiescent Current (uA) - 5 0 - 2 502 55 07 51 0 0 1 2 5 Shutdown Current vs. Temperature Junction Temperature ( OC) VCNTL = 5V Shutdown Current (uA)

uPI Semiconductor Corp., http://www.upi-semi.com Rev. F00, File Name: uP7706-DS-F0000 uP7706 Typical Operation Characteristics 0.79 0.792 0.794 0.796 0.798 0.8 0.802 0.804 0.806 0.808 0.81 -50 -25 0 25 50 75 100 125 FB Voltage vs. Temperature Junction Temperature ( OC) VCNTL = 5V, VIN = VOUT + 1V Feedback Voltage VFB (V) On Resistance vs. Temperature Junction Temperature ( OC) VCNTL = 5V, VOUT = 1.6V On Resistance (m Ω ) 100 120 140 - 5 0 - 2 502 55 07 5 1 0 0 1 2 5

uPI Semiconductor Corp., http://www.upi-semi.com Rev. F00, File Name: uP7706-DS-F0000 The uP7706 is a high performance linear regulator specifically designed to deliver up to 3A output current with very low input voltage and ultra low dropout voltage. With dual-supply configuration, the uP7706 operates with a wide input voltage VIN range from 1.0V to 5.5V and is ideal for applications where VOUT is very close to VIN . Supply Voltage for Control Circuit VCNTL Unlike other linear regulators that use a P-Channel MOSFET as the pass transistor, the uP7706 uses an N- Channel as the pass transistor. N-Channel MOSFET provides lower on-resistance and better stability meeting stringent requirements of current generation microprocessors and other sensitive electronic devices. The drain of N-Channel MOSFET is connected to VIN and the source is connected to VOUT. This requires that the supply voltage V CNTL for control circuit is at least 1.5V higher than the output voltage to provide enough overdrive capability for the pass transistor thus to achieve low dropout and fast transient response. It is highly recommended to bias the device with 5V voltage source if available. Use a minimum 0.1uF ceramic capacitor plus a 10 Ω resistor to locally bypass the control voltage. Input/Output Capacitor Selection The uP7706 has a fast transient response that allows it to handle large load changes associated with high current applications. Proper selection of the of the output capacitor and it’s ESR value determines stable operation and optimizes performance. The typical application circuit shown in Figure 1 was tested with a wide range of different capacitors. The circuit was found to be unconditionally stable with capacitor values from 10ìF to 2200ìF and ESR ranging from 0.5mΩ to greater then 75mΩ . VOUT 5VCC VIN FB 100uF POK VOUTVIN EN CNTL 0.1uF 10K 10K 12.5K uP7706 GND option 22uF Figure 1. Typical Application Circuit recommended to be placed directly next to the VIN pin. protect the device from damage during fault conditions.

Application Information

uPI Semiconductor Corp., http://www.upi-semi.com Rev. F00, File Name: uP7706-DS-F0000 Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm. 0.32 - 0.52 4.80 - 5.00 5.80 - 6.20

1.27 BSC

3.80 - 4.00

2.29 BSC

8.00 MIN

1.85 REF

0.76 REF

1.27 REF

6.15 REF

Recommended Solder Pad Layout

2.39 REF

4.00 MIN

3.81 BSC

0.10 - 0.25 0.18 - 0.25 0.41 - 0.89

0.20 BSC

1.75 MAX

1.45 - 1.60

uPI Semiconductor Corp., http://www.upi-semi.com Rev. F00, File Name: uP7706-DS-F0000 uP7706 Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm. VDFN6x5-8L Package Recommended Solder Pitch and Dimensions

1.00 MAX

0.35 - 0.481.27 BSC 5.90 - 6.10 4.90 - 5.10 3.30 - 3.50 0.50 - 0.75 3.90 - 4.10 0.00 - 0.050.20 REF 3.90 - 4.10 3.30 - 3.50 4.30 - 4.50 6.80 - 7.00 0.40 - 0.501.27 BSC