UP7102 UPI | Alldatasheet
Document overview
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Technical content
Features
Note: uPI products are compatible with the current IPC/ JEDEC J-STD-020 requirement. They are halogen-free, RoHS compliant and 100% matte tin (Sn) plating that are suitable for use in SnPb or Pb-free soldering processes.
Ordering Information
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2 uP7102-DS-F0000, Sep. 2015 www.upi-semi.com .oNe maNniPn oitcnuFniP 11 PD .rotcennoCoteniLataD+D .+D1-rotcennocBSUotdetcennoC 2D NG .dnuorG 32 PD .rotcennoCoteniLataD+D .+D2-rotcennocBSUotdetcennoC 42 MD .rotcennoCoteniLataD-D .-D2-rotcennocBSUotdetcennoC 5N I .tupnIylppuSrewoP esolcsaDNGotNImorfroticapaccimarecretaergroFu1.0detcennoC .elbissopsaCIehtot 61 MD .rotcennoCoteniLataD-D .-D1-rotcennocBSUotdetcennoC Functional Block Diagram Functional Pin Description Typical Application Circuit IN GND DM1 DP1 DM2 DP2 VBUS GND 100nF USB Connector-1 GND VBUS GND VBUS USB Connector-2 Auto Detection 2.7V1.2V Auto Detection 2.7V1.2V DM 1 DP 1 DM 2 DP 2 Under Voltage Lockout Driver IN GND
3uP7102-DS-F0000, Sep. 2015 www.upi-semi.com Functional Description As USB charging has gained popularity, the 500mA minimum defined by USB 2.0/3.0 has become insufficient for many handset and personal media players which need a higher charging rate. On the other hand, wall adapters can provide much more current than 500mA. Several new standards have been introduced defining protocol handshaking methods that allow host and client devices to acknowledge and draw additional current beyond the 500mA minimum defined by USB 2.0/3.0 while still using a single micro-USB input connector. The uP7102 supports four of the most common protocols: !!!!! Chinese Telecommunications Industry Standard YD/T 1591-2009 All three protocols defined three types of charging ports that provide charging current to client-side devices: !!!!! Standard Downstream Port (SDP) !!!!! Charging Downstream Port (CDP) !!!!! Dedicated Charging Port (DCP) The table below shows the differences between these ports according to BC 1.2 epyTtroP 0.2BSUtroppuS noitacinummoC dewollA.xaM )A(tnerruC )0.2BSU(PDSs eY5 .0 )0.3BSU(PDSs eY9 .0 PDCs eY5 .1 PCDo N5 .1 To determine what type of port it is connected, the hand- shaking process has two steps. !!!!! Step1: The portable equipment outputs a nominal 0.6V output on its D+ line and reads the voltage input on its D- line. """"" Standard Downstream Port (SDP): If the detected D- < 0.3V, the portable device concludes it is connected to a SDP. An SDP is a traditional USB port that follows USB 2.0/3.0 and supplies a minimum of 500mA/900mA per port. USB 2.0 communications is supported, and the host controller must be active to allow charging. """"" Charging Port: If 0.3V < D- < 0.8V. Then to execute the step 2 to determine it is connected to CDP or DCP. !!!!! Step 2: The portable device outputs a nominal 0.6V output on its D- line and reads the voltage input on its D+ line. """"" Charging Downstream Port (CDP): If the detected D+ < 0.3V, the portable device concludes it is connected to a CDP. A CDP is a USB port that follows USB BC 1.2 and supplies a minimum 1.5A per port. It provides power and meets USB 2.0 requirements for device enumeration. USB 2.0 communications is supported, and the host controller must be active to allow charging. """"" Dedicated Charging Port (DCP): If 0.3V < D+ < 0.8V, the portable device concludes it is connected to a DCP . A DCP only provides power and cannot enumerate upstream facing portable equipment. It does not support USB 2.0 communications, but it does provide specific impedance on the data lines reserved for USB 2.0 so that it is identifiable as a dedicated charger.
5uP7102-DS-F0000, Sep. 2015 www.upi-semi.com (Note 1) ESD Rating (Note 2) Package Thermal Resistance (Note 3) Power Dissipation, PD @ TA = 25O C (Note 4) Absolute Maximum Rating Thermal Information Recommended Operation Conditions Note 1. Stresses beyond those listed as the above Absolute Maximum Ratings may cause permanent damage to the device. These are for stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated in the Recommended Operation Condition section of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. Devices are ESD sensitive. Handling precaution recommended. Note 3. θ JA is measured in the natural convection at TA = 25O C on a low effective thermal conductivity test board of JEDEC 51-3 thermal measurement standard. Note 4. The device is not guaranteed to function outside its operating conditions.
6 uP7102-DS-F0000, Sep. 2015 www.upi-semi.com
Electrical Characteristics
(VIN = 4.5V ~ 5.5V, TA = -40O C ~ 125O C, Typical value are at TA = 25O C, unless otherwise specified) retemaraPl obmySs noitidnoCtseTn iMp yTx aM stinU tupnIylppuS egatloVtupnIgnitarepOV NI --5 .45 .5V tuokcoLegatloVrednU V OVLU V NI gnisir8 .342 .4V V SYH_OVLU V NI gnillaf- -1 .0- -V tnerruCylppuSI NIV V<V5.4 NI V5.5<- -5 510 22A u )V7.2/V7.2(EDOMREDIVID egatlovtuptuo1PDV V7.2_1PD V NI V5=7 5.27 .24 8.2V egatlovtuptuo1MDV V7.2_1MD V NI V5=7 5.27 .24 8.2V ecnadepmituptuo1PDR V7.2_1PD I 1PD Au5-=8 .826 32 .34k Ω ecnadepmituptuo1MDR V7.2_1MD I 1MD Au5-=8 .826 32 .34k Ω egatlovtuptuo2PDV V7.2_2PD V NI V5=7 5.27 .24 8.2V egatlovtuptuo2MDV V7.2_2MD V NI V5=7 5.27 .24 8.2V ecnadepmituptuo2PDR V7.2_2PD I 1PD Au5-=8 .826 32 .34k Ω ecnadepmituptuo2MDR V7.2_2MD I 1MD Au5-=8 .826 32 .34k Ω EDOMV2.1/V2.1 egatlovtuptuo1PDV V2.1_1PD V NI V5=2 1.12 .18 2.1V egatlovtuptuo1MDV V2.1_1MD V NI V5=2 1.12 .18 2.1V ecnatsisergnitrohs1MDdna1PDR 1TROHS_MPD V 1PD I,V8.0= 1MD Am1=- -0 010 02 Ω ecnadepmituptuo1PDR V2.1_1PD I 1PD Au5-=0 82 010 31k Ω ecnadepmituptuo1MDR V2.1_1MD I 1MD Au5-=0 82 010 31k Ω egatlovtuptuo2PDV V2.1_2PD V NI V5=2 1.12 .18 2.1V egatlovtuptuo2MDV V2.1_2MD V NI V5=2 1.12 .18 2.1V ecnatsisergnitrohs2MDdna2PDR 2TROHS_MPD V 2PD I,V8.0= 2MD Am1=- -0 010 02 Ω ecnadepmituptuo2PDR V2.1_2PD I 1PD Au5-=0 82 010 31k Ω ecnadepmituptuo2MDR V2.1_2MD I 1MD Au5-=0 82 010 31k Ω
8 uP7102-DS-F0000, Sep. 2015 www.upi-semi.com Note 1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.15mm.
Package Information
0.30 - 0.50 2.80 - 3.00 2.60 - 3.00
1.90 BSC
0.00 - 0.15
0.95 BSC
1.50 - 1.70 0.08 - 0.22 0.30 - 0.60
1.45 MAX
9uP7102-DS-F0000, Sep. 2015 www.upi-semi.com Important Notice uPI and its subsidiaries reserve the right to make corrections, modifications, enhancements, improvements, and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. uPI products are sold subject to the terms and conditions of sale supplied at the time of order acknowledgment. However, no responsibility is assumed by uPI or its subsidiaries for its use or application of any product or circuit; nor for any infringements of patents or other rights of third parties which may result from its use or application, including but not limited to any consequential or incidental damages. No uPI components are designed, intended or authorized for use in military, aerospace, automotive applications nor in systems for surgical implantation or life-sustaining. No license is granted by implication or otherwise under any patent or patent rights of uPI or its subsidiaries. COPYRIGHT ( C ) 2014, UPI SEMICONDUCTOR CORP . uPI Semiconductor Corp. Headquarter 9F.,No.5, Taiyuan 1st St. Zhubei City, Hsinchu Taiwan, R.O.C. uPI Semiconductor Corp. Sales Branch Office 12F-5, No. 408, Ruiguang Rd. Neihu District, Taipei Taiwan, R.O.C.