UP6204

UP6204 UPI | Alldatasheet

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Features

Note: uPI products are compatible with the current IPC/ JEDEC J-STD-020 and RoHS requirements. They are 100% matte tin (Sn) plating and suitable for use in SnPb or Pb- free soldering processes. Middle-High End GPU Core Power ††††† High End Desktop PC Memory Core Power ††††† Low Output Voltage, High Power Density DC-DC Converters ††††† Voltage Regulator Modules GND BOOT1 UGATE1 POK SDA SCL EAP FBRTN CSN CSP ISEN1 ISEN2 ISEN3 IMAX TCS 5VCC RT COMP SS PSI BOOT3 FB UGTE3 MODE VRHOT/EN LGATE1 VCC1 PHASE1 LGATE2 PHASE2 BOOT2 UGATE2 LGATE3 VCC2 PHASE3 VID1 VID0

2uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P0100 Typical Application Circuit IMAX CSN CSP ISEN1 ISEN2 ISEN3 LGATE1 PHASE1 LGATE2 PHASE2 BOOT2 UGATE2 LGATE3 PHASE3 BOOT1 UGATE1 VRHOT/EN RT SS BOOT3 UGTE3 MODE FBRTN COMP FB VID1 VID0 SDA SCL TCS VCC1 VCC2 5VCC GND VIN1 VOUT VIN2 PHASE1 PHASE2 PHASE3 VOUT VIN2 VIN1 uP6204 POK 5VCC EAP PSI PTC NTC

3uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P01000 .oNe maNniPn oitcnuFniP 03/53/13 /2/1TOOB ylppuSpartstooB tcennoC.ylevitcepser3/2/1lennahcfosrevirdetagreppugnitaolfehtrof Croticapacpartstoobeht TOOB mrofotnip3/2/1ESAHPehtdnanip3/2/1TOOBneewteb reppuehtnonrutotegrahcehtsedivorproticapacpartstoobehT.stiucricpartstoob rofseulavlacipyT.TEFSOMC TOOB CtahterusnE.Fu1otFu74.0morfegnar TOOB decalpsi .CIehtraen 92/43/23 /2/1ETAGU .3/2/1lennahCroftuptuOrevirDetaGreppU fosetagehtotsnipesehttcennoC hguorht-toohsevitpadaehtybderotinomerasnipesehT.TEFSOMreppugnidnopserroc .ffodenrutsahTEFSOMreppugnidnopserrocehtnehwenimretedotyrtiucricnoitcetorp 3K OP .noitacidnIKOrewoP sinipsihT.noitacidniKOrewoproftuptuoniard-neponasisihT .sruccotluafondnadnetratstfosretfaecnadepmihgihottes 4L CS .tupnIkcolClaireS .langiskcolcsublairesseviecernipsihT 5A DS .tupnIataDlaireS .langisatadsublairesfotuptuorotupnisinipsihT 6N E/TOHRV .tuptuOgninraWerutarepmeThgiHdnaelbanEpihC stuhsDNGotnipsihtgnilluP .sTEFSOMrewoldnareppuhtobffonrutotwoltuptuosrevirdetagllA.4026Puehtnwod hgihottesdnanoitalugernihtiwsiegatlovtuptuoehtnehwV54.0tadepmalcsinipsihT .noitalugerfotuorotratstfosgnirudsiegatlovtuptuoehtnehwecnadepmi 8/70 /1DIV .yalPrewoProf0/1stupnIlatigiD .liatedrofsnoitcesdetalerehteeS 9T R .gnitteSycneuqerFnoitarepO ehttesotDNGdnanipsihtneewtebrotsiseratcennoC .ycneuqerfnoitarepo /11/01 /2R/3R 4R/1R .yalPrewoProfstupnIegatloVecnerefeR esehtotCCV5morfsredividegatlovtcennoC detalugersiegatlovnipBFehT.yalprewoprofsegatlovecnereferehttesotdnuorgotsnip .liatedrofsnoitcesdetalerehteeS.1DIVdna0DIVybdetcelesnehwsegatlovesehtot 61/51/413 /2/1NESI .3/2/1tupnIgnineStnerruCesahP ehtgnisnesybtnerrucesahpehtesnessnipesehT ehtotsnipesehttcennoC.TEFSOMrewolevitcepserehtssorcapordegatlov rofsnoitcesdetalerehteeS.rotsiserlanretxenahguorhtedonESAHPgnidnopserroc .sliated 71N SC .gnisneStnerruClatoTroftupnIevitageN latotehtsesnesnipNSChtiwgnolanipsihT .sliatedrofsnoitcesdetalerehteeS.tnerrucrotcudni 81P SC gnisneStnerruClatoTroftupnIevitisoP latotehtsesnesnipPSChtiwgnolanipsihT. .sliatedrofsnoitcesdetalerehteeS.tnerrucrotcudni 91N TRBF .gnisneSegatloVetomeRrofhtaPnruteR edondnuorgehtotyltceridnipsihttcennoC .detalugerebotsiegatlovtuptuoehterehw 02B F .egatloVkcabdeeF nipsihttcennoC.reifilpmarorreehtottupnignitrevniehtsinipsihT noitanibmocninipsihtesU.detalugerebotsiegatlovtuptuoehterehwedonehtotyltcerid .retrevnocehtfopoolkcabdeeflortnocegatlovehtetasnepmocotnipPMOCehthtiw 12P MOC .tuptuOreifilpmArorrE gnitrevni-nonehtdna)AE(reifilpmarorreehtfotuptuoehtsisihT etasnepmocotnipBFehthtiwnoitanibmocninipsihtesU.srotarapmocMWPehtfotupni .retrevnocehtfopoolkcabdeeflortnoc-egatloveht 22I SP .gnitteSdlolhserhTnoitcudeResahP ehttesotDNGotnipsihtmorfrotsiseratcennoC noitcuderesahpehtelbasidotV2.0nahtrewolnipsihtlluP.leveldlohserhtnoitcuderesahp .noitcnuf Functional Pin Description

4uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P0100 Functional Pin Description .oNe maNniPn oitcnuFniP 32S S .tuptuOtratStfoS .lavretnitratstfosehttesotDNGotnipsihtmorfroticapacatcennoC 42P AE .reifilpmArorrEehtfotupnIevitisoP egatlovsihtkcartotdetalugersiegatlovBFehT otnipSSotrotsiseratcennoC.noitarepoetatsydaetsdnayalprewop,tratstfosgnirud .epolspoordehtgninut 52X AMI .gnitteStnerruCrevOdnanoitacidnItnerruCtuptuO sihtneewtebrotsiseratcennoC oslanipsihT.noitcetorptnerrucrevorofleveldlohserhtreggirtehttesotDNGdnanip tuptuoehtotlanoitroporpyltceridsiegatlovstiecnisnoitacidnitnerructuptuorofsdnetni .tnerruc 62E DOM .gnitteSnoitarepOforebmuNesahP .noitarepoesahpeerhtrofDNGotnipsihttcennoC esahpelgnisrofneponipsihtteL.noitarepoesahpowtrofCCV5otnipsihttcennoC era2&1esahpylnO.noitarepoesahpelgnisnehwdelbanesi1esahpylnO.noitarepo .noitarepoesahpowtnehwdelbane 72S CT .gnisneSerutarepmeT 82C CV5 .tuptuOrotalugeRlanretnI dnasaiblanretnirofrotalugerraenilfoniptuptuoehtsisihT .Am02siytilibapactnerructuptuoehT.egasulanretxe 13/63/043 /2/1ESAHP .3/2/1lennahCrofedoNhctiwS gnidnopserrocehtfoecruosehtotsnipesehttcennoC oslaerasnipesehT.TEFSOMrewolgnidnopserrocehtfoniardehtdnaTEFSOMreppu reppuehtnehwenimretedotyrtiucricnoitcetorphguorht-toohsevitpadaehtybderotinom sidnuorgdnanipsihtneewtebedoidykttohcSA.ffodenrutsahTEFSOMgnidnopserroc ylppusrewopaninommocsihcihwegatlovtneisnartevitagenecuderotdednemmocer .metsys 23/73/933 /2/1ETAGL .3/2/1lennahCroftuptuOrevirDetaGrewoL gnidnopserrocehtotsnipesehttcennoC noitcetorphguorht-toohsevitpadaehtybderotinomerasnipesehT.TEFSOMrewolfoetag .ffodenrutsahTEFSOMrewolgnidnopserrocehtnehwenimretedotyrtiucric

332 CCV

.3revirDetaGroftupnIylppuS ehtdna,srevirdetagrewolroftnerrucsedivorpnipsihT fotupnirewopehtotnipsihttcennoC.3/2lennahcfosrevirdreppuroftiucricpartstoob .3lennahcro2lennahc

831 CCV

.pihCehtdna2/1revirDetaGroftupnIylppuS etagrewolroftnerrucsedivorpnipsihT ehtfotiucriclortnocehtdna1lennahcfosrevirdreppuroftiucricpartstoobehtdna,srevird .1lennahcfofotupnirewopehtotnipsihttcennoC.4026Pu daPdesopxE DNG14 .CIehtrofdnuorG yllaciartcelednaBCPotredlosllewebdluohsdapdesopxeehT .secartediwdnatrohshtiwenalp/dnalsidnuorgdetcennoc

5uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P01000 Functional Block Diagram PWM2 Amplifier Error Oscillator Phase Selection Current Balance COMP BOOT1 UGATE1 PHASE1 LGATE1 5VCC RT FB VCC1 Internal Regulator GM2 Gate Control Logic POR BOOT2 UGATE2 PHASE2 LGATE2 BOOT3 UGATE3 PHASE3 LGATE3 CSN CSP VRHOT/EN SS MODE TCS Reference & DAC Generator I2C Manager Unit SDA SCL ISEN1 ISEN2 ISEN3 FBRTN IMAX PWM1 Gate Control Logic PWM3 Gate Control Logic VCC2 5VCC GND 3.0V P*IAVG IAVG VID0 VID1 OCP POR 28% of 5VCC VREF VEAP + 200mV VEAP - 300mV OVP UVP POK EAP 0.3V Chip Enable PSI OTA

Table 3. AMD GPU VID Table Table 3. AMD GPU VID Table

12uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P0100 retemaraPl obmySs noitidnoCtseTn iMp yTx aMs tinU tupnIylppuS egatloVylppuSV CC 8.01- -2 .31V tnerruCylppuSI CC V;nepOETAGLdnaETAGU CC gnihctiwS,V21=- -5- -A m tnerruCylppuStnecseiuQI Q_CC --4- -A m dlohserhTROPV HTRCC 89 0 1V siseretsyHROPV SYHCC --3 .0- -V tratStfoS tnerruCtratStfoSI SS V CC V21=0 210 610 02A u CCV5 ycaruccAegatloVtuptuOCCV5V 5CC V 1CC I,V21= 5CC Am0=5 9.40 0.55 0.5V daoLegatloVtuptuOCCV5 noitalugeR ΔV 5CC I 5CC Am02~Am0=5 .0-- -5 .0% PHASE to GND BOOT to GND ESD Rating (Note 2) Package Thermal Resistance (Note 3) Power Dissipation, PD @ TA = 25°C Absolute Maximum Rating Thermal Information Recommended Operation Conditions

Electrical Characteristics

(VCC = 12V, TA = 25OC, unless otherwise specified)

13uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P01000 retemaraPl obmySs noitidnoCtseTn iMp yTx aMs tinU ycaruccAegatloVtuptuO ycaruccAegatloVtuptuO V BF V- ]4:1[1R Vnehw FER ,]4:1[1Rybtes I TUO .A0= 01-- -0 1V m V FER I.C2Iybtes TUO A0=5 .1- -5 .1% rotallicsO ycneuqerFgninnuReerFf CSO R TR k33=0 720 030 33z Hk noitairaVycneuqerF 01-- -0 1% egnaRycneuqerF 05- -0 001z Hk elcyCytuDmumixaM 580 95 9% elcyCytuDmuminiM --0- -% edutilpmApmaR ΔV CSO V CC V21=- -0 .4- -V P-P reifilpmArorrE niaGCDpooLnepOO An giseDybdeetnarauG0 60 7- -B d tcudorPhtdiwdnaB-niaGW BGn giseDybdeetnarauG6 0 1- -z HM etaRwelSR Sn giseDybdeetnarauG3 6 - -s u/V esneStnerruC oitaResneStnerruCI XAMI I/ GVA I GVA R,Au04= XAMI k01= Ω 090 010 11% tnerruCgnicroSmumixaMI XAM_NSC 001- -- -A u tesffOreifilpmAMGV TESFFO V TESFFO V|= PSC V- NSC V,| PSC ,V1.1= RrotsiseratcennoC NSCI k02= Ω morf NSCD NGot 3-- -3V m srevirDetaG ecruoSetaGreppUR CRS_GU V TOOB V- ESAHP I,V21= CRS_GU Am051=- -3 .16 .2 Ω kniSetaGreppUR KNS_GU V TOOB V- ESAHP I,V21= KNS_GU Am051=- -10 .2 Ω ecruoSetaGrewoLI CRS_GL I CRS_GL Am051=- -3 .16 .1 Ω kniSetaGrewoLI KNS_GL I KNS_GL Am051=- -8 .06 .1 Ω emiTdaeDT TD --0 3- -s n gnirotinoMerutarepmeT gninraWerutarepmeTrevO leveLdlohserhT V SCT CCV5foegatnecrep- -8 2- - % dlohserhTnwodtuhSlamrehT leveL V SCT CCV5foegatnecrep- -3 3- - % egatloVpmalCgninraWTOV NE/TOHRV V SCT I,CCV5fo%03= NE/TOHRV Au05=- -5 4.0- -V leveLdlohserhTelbnaEpihCV NE/TOHRV V NE/TOHRV gnisir4 .0- -- -V leveLdlohserhTelbnaEpihCV NE/TOHRV V NE/TOHRV gnillaf- -- -2 .0V

14uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P0100 retemaraPl obmySs noitidnoCtseTn iMp yTx aMs tinU stupnIlortnoC leveLdlohserhThgiHtupnIDIVV ]1:0[DIV gnisir1DIV,0DIV4 .1- -- -V leveLdlohserhTwoLtupnIDIVV ]1:0[DIV gnillaf1DIV,0DIV- -- -4 .0V snoitcetorP dlohserhTnoitcetorPtnerruCrevO leveL V XAMI --0 .3- -V leveLdlohserhTnoitcetorPegatlooVrevOV BF V BF V- FER --0 02- -V m leveLdlohserhTnoitcetorPegatloVrednUV BF V BF V- FER --0 03-- -V m leveLdlohserhTKOrewoPV BF V BF V- FER V, FER .gnisir- -0 3- -V m ytilibapaCgnikniSKOrewoPV KOP I KOP Am4=- -- -0 01V m Note 1. Stresses listed as the above “Absolute Maximum Ratings” may cause permanent damage to the device. These are for stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may remain possibility to affect device reliability. Note 2. Devices are ESD sensitive. Handling precaution recommended. Note 3. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of JEDEC 51-3 thermal measurement standard. Note 4. The device is not guaranteed to function outside its operating conditions.

15uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P01000 LGATE1 (5V/Div) PHASE1 (0.5V/Div) UGATE1 (5V/Div) LGATE1 (5V/Div) PHASE1 (0.5V/Div) UGATE1 (5V/Div) VID0 (2V/Div) VOUT (0.5V/Div) SS (0.5V/Div) VCC1 (5V/Div) VOUT (0.5V/Div) SS (0.5V/Div) 5VCC (2V/Div) VCC1 (5V/Div) VOUT (0.5V/Div) SS (0.5V/Div) 5VCC (2V/Div) EN (2V/Div) VOUT (0.5V/Div) SS (0.5V/Div) PHASE1 (5V/Div) Power On Waveforms Time: (10ms) Power Off Waveforms Time: (10ms) Turn On Waveforms Time: (10ms/Div) Power Play Time: (10ms) Gate Waveforms (UGATE Falling) Time: (25ns) Gate Waveforms (UGATE Rising) Time: (25ns) Typical Operation Characteristics

16uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P0100 4.4 4.5 4.6 4.7 4.8 4.9 5.1 5.2 5 6 7 8 9 1 01 11 21 31 4 4.6 4.7 4.8 4.9 5.1 5.2 5.3 5.4 5.5 5.6 0 1 02 03 04 05 06 07 08 09 0 1 0 0 100 1000 10 100 -0.3 -0.2 -0.1 0.1 0.2 0 1 02 03 04 05 06 07 08 09 0 5VCC Load Regulation 5VCC Output Current (mA) 5VCC Output Voltage (V) Switching Frequency RRT (kΩ) Switching Frequency (kHz) 5VCC Line Regulation VCC1 Voltage (V) 5VCC Output Voltage (V) VFB Loag Regulation Output Current (A) VFB Variation (%) Typical Operation Characteristics PHASE1 (10V/Div) IMAX (2V/Div) VOUT (1V/Div) PHASE2 (10V/Div) PHASE3 (10V/Div) PHASE1 (10V/Div) VOUT (50mV/Div) Steady State Operation Time: (400ns) Over Current Protection Time: (10ms)

17uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P01000 Typical Operation Characteristics 1.59 1.595 1.6 1.605 1.61 56789 1 0 1 1 1 2 1 3 1 4 VREF Line Regulation VCC1 (V) VREF Output Voltage (V) 0.5 1.5 2.5 0 1 02 03 04 05 06 07 08 09 0 IMAX Voltage vs. Output Current Output Current (A) IMAX Output Voltage (V)

18uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P0100

Application Information

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19uPI Semiconductor Corp., http://www.upi-semi.com Rev. P01, File Name: uP6204-DS-P01000

Package Information

1.Package Outline Unit Description: BSC: Basic. Represents theoretical exact dimension or dimension target MIN: Minimum dimension specified. MAX: Maximum dimension specified. REF: Reference. Represents dimension for reference use only. This value is not a device specification. TYP. Typical. Provided as a general value. This value is not a device specification. 2.Dimensions in Millimeters. 3.Drawing not to scale. 4.These dimensions no not include mold flash or protrusions. Mold flash or protrusions shell not exceed 0.15mm. 5.90 - 6.10 Pin 1 mark Bottom View - Exposed Pad 4.75 - 4.85 4.65 -4.95 0.18 - 0.30 4.95 - 5.05 6.55 - 6.65 5.90 - 6.10 0.0 - 0.05 0.80 - 1.00

0.20 BSC

Recommended Solder Pad Pitch and Dimensions 0.18 - 0.30