U6268B

U6268B ATMEL | Alldatasheet

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Technical content

Features

• Two Identical Interface Channels  Pre-regulated Smoothed Voltage and a Supply Current up to 50 mA for the Sensors  Data from the Sensors by Current Modulation with a Transmission Rate of 60 kBaud (Transmission Bandwidth 500 kHz)  TTL-compatible Input Activates the Sensor  Data Output Can be Directly Connected to a Microcontroller Input  Operation Supply Voltage Range 5.7V ≤ VS ≤ 40V  ESD Protection According to MIL-STD-883C Test Method 3015.7  High-level EMI Protection Benefits  Simple Wiring Thanks to One Common Line for Supply of the Sensor and Data Transmission from the Sensor to the U6268B  Current Modulation Provides High Noise Immunity for Data Transfer 1. Description The U6268B is an interface IC for remote automotive sensors. It links the crash sen- sors in the driver and passenger door with the main airbag unit in the dashboard. Two identical channels supply the external sens ors and receive digital information from them via one active wire each. The interface supplies the external sensors with a pre- regulated smoothed voltage, the external units transmit the digital information back to the interface by current modulation. As the device is designed for safety-critical applications, the highest data transmission security is mandatory. With high immunity against cross coupling between the two channels, the U6268B is tailored for the harsh automotive environment. Figure 1-1. Block Diagram Short circuit detection Temperature monitor Smoothed voltage regulator I/V converter Smoothed voltage regulator I/V converterVoltage comparatorChannel 1 Data Enable Enable Voltage comparator Channel 2 Data Crash sensor Channel 1 Channel 2 Channel 1 power supply Data trans- mission Crash sensor Channel 2 power supply Data trans- mission Microcontroller Side-airbag Sensor Dual Interface U6268B Rev. 4808B–AUTO–09/05

4808B–AUTO–09/05 U6268B 2. Pin Configuration Figure 2-1. Pinning SO16 VS OUT1 OUT2 SC RETURN2 GND GND RETURN1 CLL1 OCM1 OCM2 CLL2 ENABLE2 GND GND ENABLE1 Table 2-1. Pin Description Pin Symbol Function

1 GND Ground and reference pin

2 RETURN1 Return line of the external unit, internally connected to GND via a line-protection transistor

3 OUT1 Voltage-stabilized supply output and current-modulation input

4 VS Supply voltage of the IC

5 OUT2 Voltage-stabilized supply output and current-modulation input

6 SC Smooth time constant for slow voltage change at both OUT pins

7 RETURN2 Return line of the external unit, internally connected to GND via a line-protection transistor 8, 9 GND Ground and reference pin

10 ENABLE2 Controls OUT1 voltage

ENABLE1 High = OUT1 active, ENABLE1 Low or open = OUT1 switched off

11 CLL2 Current logic level output (low at high OUT2 current, monitoring via OCM2)

12 OCM2 Analog current output, repr esenting 1/10 current of OUT2

13 OCM1 Analog current output, repr esenting 1/10 current of OUT1

14 CLL1 Current logic level output (low at high OUT1 current, monitoring via OCM1)

15 ENABLE1 Controls OUT2 voltage

ENABLE2 High = OUT2 active, ENABLE1 Low or open = OUT2 switched off

16 GND Ground and reference pin

4808B–AUTO–09/05 U6268B Figure 2-2. Functional Block Diagram Voltage Regulator ISC-dis ISC-ch Current mirror ratio IOCMx/IOUTx IOUT Over current limi- tationVOUT ON OFF Temperature protection high T > 165°C low T < 145°C If ENABLE x = 9 V then Temp = high High = ENABLE OUTx Test mode Temp Reset Set Latch +-+- VOCM-det VOCM-lim Temp IOCM-sink VCLL-x IOUT-sink 4.2 V Iret-low 3 Ω OCMx GND SC ENABLEx CLLx OUTx-

5 V/ms at VS rising

10 V/ms at VS falling

Vret_x Current limitation VSC VS VSCVS

4808B–AUTO–09/05 U6268B 3. Functional Description

3.1 V S

The IC and the external units are powered via the V S pin 4. This pin is connected to the battery via a reverse battery protection diode. An electrol ythic capacitor of 22 µF smoothes the voltage and absorbs positive and negative transients.

3.2 OUT1, OUT2

OUTx provides a smoothed, very slowly changing supply voltage for the external units and mon- itors the output current. During normal operating conditions, the OUTx vo ltage is typically 3V below VS, and changes very slowly with a varying battery voltage in order to suppress distur- bances in the data transmission. At low V S (5.7V to 8.5V), the OUTx voltage is typically 0.5V below VS. This voltage difference is reduced in to ens ure sufficient supply voltage for the exter- nal unit between OUTx and RETURNx. The output current capability is 50 mA. The internal pull- down current at OUTx is typically 3 mA. Figure 3-1. Output Voltage with Tolerances versus Supply Voltage The data transmission from the external unit to the interface IC is carried out on the same line by varying the current level. The quiescent current consumption of the external unit is about 5 to 15 mA. This current level is interpreted as logi c high level at the CLL pin. The external unit can switch on an additional current of 30 mA, interpret ed by the interface as logic low. The slope time of the current pulse is approximately 1 µs which is suitable for a transmission rate up to 60 kBaud. The necessary transmission bandwidth of greater than 500 kHz between OUTx and OCMx is guaranteed (see “Application Circuit” on page 12). To achieve good current transmis- sion behavior, the dynamic resistance of OUTx may not exceed 12 Ω within the bandwidth range (total of 15Ω for OUTx and RETURN). The OUTx voltage can be switched off by ENABLEx = LOW to reset the external unit and to reduce power dissipation during fault conditions. The OUT pins are protected against overtemperature and short circuits. A reverse polarity diode at pin V S (pin 4) ensures that no current is fed back to the V Batt system in the case of a short between OUTx and VBatt. A minimum capacity of 33 nF is required at the pins OUTx. 0 5 10 15 20 25 30 35 40 VS (V) Vout (V) Voutmax Voutmin 32.628.612.0 11.38.55.7 22.4 21.4 9.48.2 7.7 5.4 4.9

4808B–AUTO–09/05 U6268B

3.3 ENABLE1, ENABLE2

ENABLEx is a microcontroller-compatible input which switches the related output on or off.  A low or open circuit applied to ENABLEx switches off the related OUTx and RETURNx (high impedance). A sink current at pin OUTx discharges the capacitive load.  A high applied to ENABLEx switches on th e related OUTx and RETURNx to supply the external unit.

3.4 OCM1, OCM2

The output current of OUTx is monitored with a transmission factor of 0.1 to the OCMx. With a resistor from OCM to GND, the current is conver ted to a voltage. The electrical characteristics are specified by R OCM = 750Ω. The CLL-current threshold, the OUT-current limitation and the OUT-current detection can be changed by varying ROCM in a range of 500Ω to 1 kΩ. Current monitoring enables the device to detect ov ercurrent conditions at OUTx (short-circuit to GND or RETURNx) and low current conditions at OUTx (short-circuit to VBatt or open load). The internal pull-down current at OUTx crea tes no OCMx-current. During ENABLE, the mini- mum voltage at OCMx is the saturation voltage of an internal NPN-transistor with typically 0.1V. The maximum voltage at OCM is limited by an internal clamping diode to 5.3V.

3.5 CLL1, CLL2

The current at pin OUTx is evaluated logically and ready to use for a microcontroller input. With this stage, the logic data transmission from the external unit to the interface is completed. CLLx is the output stage of a comparator with an internal threshold and with the OCMx input. A OCMx voltage higher than 2.4V creates a logic low at CLLx, and a OCMx voltage lower than 1.43V creates a logic high at CLLx. The comparator has an internal hysteresis of typically 0.4V. With the pull-down resistor R OCMx = 750Ω at OCMx, the correct OUTx-current threshold related to the logical output CLLx is ensured. The CLLx is low if the OUTx-current is higher than 27.3 mA, and the CLLx is “high”, if the OUTx-current is lower than 19.1 mA. The comparator has an internal hysteresis of typically 5 mA. The to lerance of the ROCM resistor is assumed to be 0%. The CLL pin is an open-collector output and needs a pull-up resistor of typically 2 k Ω to the 5-V supply. For ESD protection, a 7-V Zener diode is implemented.

3.6 RETURN 1, RETURN 2

The RETURNx pin provides a low-ohmic connection to GND via a switched open-collector NPN- transistor. If ENABLEx is high, RETURNx is swit ched on with a saturation voltage of less than 0.5V at IRETURNx ≤ 50 mA. If ENABLEx is low or op en, RETURNx is a current sink with ≤ 2 mA. RETURNx is current-limited at typically 150 mA. 3.7 SC The smooth capacitor is designed to realize the long-time constant for the slow voltage change at OUTx for both interface channels. The capacit y is typically 22 nF. At the rising edge of V Batt, the maximum slew rate is VOUTx = 5 V/ms, and at the falling edge of VBatt, the maximum slew rate is VOUTx = 10 V/ms.

4808B–AUTO–09/05 U6268B

3.8 GND Pins

A GND bond from the chip to pin 1 and pin 8 provides high ground breakage security and the lowest voltage drop and ground shift between the IC and circuit ground. The four GND pins and the die pad are directly connected to the copper leadframe, resulting in a very low thermal resis- tance, RthJC. To also achieve a low am bient thermal resistance (R thJA) it is recommended metal parts of the housing be connected in a proper way with the GND pins.

3.9 Power Dissipation

Worst case calculation of the supply current IS: IS = 1.278 × (IOUT1 + IOUT2) + 18 mA Worst case calculation of the IC's power dissipation PV: PV = (VS × IS) – [(VS – Vdiff – Vret-sat) × (IOUT1 + IOUT2) + ROCM × ((IOUT1 2 + IOUT2 2)/81)] VS = Supply voltage (5.7 to 25V) Vdiff = VS to VOUTx voltage difference Vdiff = 3.6 V at 12 V ≤ VS ≤ 25V Vdiff = 0.8 V at 5.7 V ≤ VS ≤ 8.5V Vret-sat = 0.5 V saturation voltage return IOUTx = output current at pin OUTx = 0 to 60 mA ROCM = resistor at pin OCMx An integrated overtemperature protection generates a switch-off signal at a chip temperature of typically Tj = 160°C and a switch-on signal at typically Tj = 150°C. If overtemperature is detected, only the corresponding channel will be disabled. The other chan- nel stays enabled. The RETURNx is switched off if the voltage at RETURNx exceeds 2V (short-circuit comparator threshold) and overtemperature is detected. The OUTx is switched off if the voltage at OCMx is higher than 4.6V (overcurrent detection level) and overtemperature is detected. The OCM voltage monitors the output current at OUTx via the current ratio of 0.1. The overcurrent-detection level of OUTx can be varied by changing the OCMx resistor. If OUTx is switched off by over temperature and overcurrent detection, the CLLx output remains a logic low (overcurrent). As the IC is only overtemperature-protected against short-circ uit conditions at RETURNx or OUTx, it has to be checked in each applicati on that the chip temperature does not exceed Tjmax = 150°C in normal operation.

3.10 Test Hint

The overtemperature signal can be activat ed by connecting ENABLE1 or ENABLE2 to 9V/10 mA.

4808B–AUTO–09/05 U6268B Note: 1. A good ambient thermal resistance junction (R thJA = 65 K/W) can be achieved by using a big pad size for ground connection near a metal component (see section “GND Pins” on page 6) 4. Absolute Maximum Ratings Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Parameters Symbol Min. Max. Unit Supply voltage V S –0.6 40 V Voltage at pins CLL1, CLL2, ENABLE1, ENABLE2 –0.3 6 V Voltage at SC V SC –0.3 30 V Voltage at OCM1, OCM2 V OCMx –0.3 6.8 V Voltage at RETURN1, RETURN2 V RETURNx –1 27 V Voltage at OUT1, OUT2 V OUTx –1 40 V Current at supply (both channels OUTx and RETURNx shorted) IS 240 mA Current at logical pins: CLL1, CLL2 ENABLE1, ENABLE2 ICCLx IENABLEx 0.1 mA mA Current at SC (SC related to GND or VBatt)I SC –110 220 µA Current at pins to external unit OUT1, OUT2, RETURN1, RETURN2 Internally limited ESD classification Human body model (100 pF , 1.5 kΩ) Machine model (200 pF , 0.0Ω) All pins ±2000 ±200 V V Ambient temperature range T amb –40 95 °C Junction temperature range T j –40 150 °C Storage temperature range T stg –55 125 °C 5. Thermal Resistance (1) Parameters Symbol Value Unit Junction case R thJC 36 K/W

4808B–AUTO–09/05 U6268B 6. Electrical Characteristics Tamb = –40°C to +95°C and Tj = –40°C to +150°C, Operation supply-voltage range VS = 5.7V to 18V continuously, VS ≤ 25V for maximum 25 min, VS ≤ 40V for up to 500 ms. The current values are based on R = 750Ω, 0%-resistor at OCM1/OCM2 pins. Parameters Test Conditions Symbol Min. Typ. Max. Unit Supply Current Tj ≥ 125°C Outputs disabled, VS ≤ 18V I S 8m A Outputs disabled, VS ≤ 40V I S 14 mA One output enabled, VS ≤ 18V I S 13 mA Both outputs enabled, VS ≤ 18V I S 18 mA Output load 2 × 15 mA, VS ≤ 18V I S 56 mA Output load 2 × 28 mA, VS ≤ 18V I S 90 mA Output load 2 × 50 mA, VS ≤ 18V I S 146 mA Output load 2 × 60 mA, VS ≤ 18V (Tj > 125°C) IS 171 mA Both channels OUTx and RETURNx shorted, VS ≤ 18V IS 200 mA Function SC Voltage at SC V S = 5.7V V SC 5.1 5.3 V Voltage at SC V S = 12.5V V SC 99 . 4 V Maximal voltage at SC V S = 40V V SCmax 30 V SC-discharge current Voltage SC = VSC – 3V 5.7V ≤ VS ≤ 40V ISC_dis 33 82 µA SC-charge current Voltage SC = VSC – 3V 5.7V ≤ VS ≤ 40V ISC_ch –58 –20 µA Function OUT1 and OUT2 (See Figure 3-1 on page 4) Voltage difference, VS to VOUTx IOUTx = 5 to 50 mA 5.7V ≤ VS ≤ 8.5V 12V ≤ VS ≤ 25V Vdiff_low Vdiff_high 0.3 2.6 0.8 3.6 V V Output voltage OUTx 8.5V ≤ VS ≤ 11.3V V OUT_med 7.7 V Maximal voltage at OUTx V S = 40V V OUT_max 25 30 V Current mirror ratio, IOCMx/IOUTx VS ≤ 40V, IOUTx = 5 to 15 mA VS ≤ 25V, IOUTx = 15 to 50 mA VS ≤ 40V, IOUTx = 15 to 50 mA IOUT_ratio 0.09 0.10 0.097 0.12 0.11 0.11 Linearity of mirror ratio IOCMx/IOUTx Ratio_lin –5 5 % Dynamic resistance OUTx VS ≤ 40V IOUT = 15 to 50 mA ROUT 21 2 Ω Dynamic resistance OUTx + RETURNx VS ≤ 40V IOUT = 15 to 50 mA RDyn 41 5 Ω OUTx current limitation (OUTx short to GND) VS ≤ 18V VS ≤ 40V IOUT_lim –80 –105 –60 –60 mA mA Overcurrent detection level Tj < 125°C I OUT_det –70 –51 mA Tj ≥ 125°C Always valid: current limitation is higher than overcurrent detection IOUT_det –60 –51 mA Maximum OUTx current (OUTx short to GND) VS = 14V, OCMx shorted to GND I OUT_max –140 –85 mA

4808B–AUTO–09/05 U6268B Leakage current at disabled OUTx OUTx short to GND, VS ≤ 25V OUTx short to GND, VS ≤ 38.5V IOUT_leak –0.02 –12 mA mA Leakage voltage at disabled OUTx OUTx open, V S ≤ 38.5V V OUT_leak 4.3 V Internal pull-down current VS ≤ 18V VS ≤ 40V IOUT_sink 1.8 2.5 4.5 mA mA Supply rejection ratio V SC = 7.6V V rej_mV 80 mV Supply rejection ratio Variation of VS = 8.4V to 40V in 10 ms Vrej_dB 51.9 dB Minimum capacity at OUTx for phase margin COUT_min 33 nF Delay time with Cout = 47 nF Switching on ENABLE = 1 to 90% VOUT reached Switching off ENABLE = 0 to 10% VOUT reached Enable_on Enable_off 100 µs µs Function OCM1, OCM2 Voltage threshold CLL-comparator CLLx low-level voltage threshold CLLx high-level voltage threshold Voltage hysteresis VCLL_L VCLL_H VCLL_hys 1.75 1.43 0.26 2.4 1.9 0.6 V V V Minimum voltage at OCMx I OUT = 0 to 5 mA V OCM_min 0.5 V Current-limitation level V S ≤ 40V, OUTx short to GND V OCM_lim 4.3 5.3 V Overcurrent-detection level V S ≤ 40V V OCM_det 4.2 4.9 V Current limitation minus overcurrent detection VOCM_lim – VOCM_over ∆_lim_OCM 0.15 0.5 V Internal pull-down current I OCM_sink 0.1 0.45 mA Function RETURN1, RETURN2 Enable high saturation voltage I RETURN = 50 mA V ret_sat 0.5 V Dynamic resistance dI ≥ 10 mA R ret 28 Ω Current limitation RETURNx is always higher than current limitation OUTx Enable high, VRETURNx = 2V Enable high, VRETURNx ≤ 18V Enable low, VRETURNx ≤ 18V Iret_lim Iret_lim Iret_low 0.8 150 200 mA mA mA Overcurrent-detection level Threshold comparator, switch-off return Threshold comparator, switch-on return Hysteresis Vret_low Vret_high Vret_hys 1.4 1.1 0.2 1.5 0.7 V V V Delay time CRETURN = 47 nF Switching on IRETURN at 50 mA Switching off IRETURN at 1 mA tdRet_on tdRet_off µs µs Function CLL1, CLL2 (CLLx with 2 kΩ to 5V) IOUT threshold CLL comparator ROCM = 750Ω CLL low-level threshold CLL high-level threshold Hysteresis ICLL_L ICLL_H ICLL_hys 23.3 19.1 3.5 27.3 22.3 8.2 mA mA mA CLL saturation voltage I CLL ≤ 2.5 mA V CLL_sat 0.4 V CLL leakage current V CLL ≤ 6.5V I CLL_leak 1µ A 6. Electrical Characteristics (Continued) Tamb = –40°C to +95°C and Tj = –40°C to +150°C, Operation supply-voltage range VS = 5.7V to 18V continuously, VS ≤ 25V for maximum 25 min, VS ≤ 40V for up to 500 ms. The current values are based on R = 750Ω, 0%-resistor at OCM1/OCM2 pins. Parameters Test Conditions Symbol Min. Typ. Max. Unit

4808B–AUTO–09/05 U6268B Response time to current change IOUT to CLL rise IOUT to CLL fall Maximum difference between rise and fall time t Cll_rise tCll_fall t∆-rise-fall 0.1 0.1 µs µs µs CLL output switching speed Rise Fall tCLL_rise tCLL-fall µs µs Current transmission rate 60 kHz Current transmission 3 dB bandwidth 500 kHz Function ENABLE1, ENABLE2 Enable high-level threshold V Enable_on 26 . 5 V Enable low-level threshold V Enable_off –0.3 +0.8 V Enable input pull-down current (to ensure output disabled during power-off and reset of microcontroller) I Enable 10 100 µA Power Dissipation Power dissipation 1 Tj ≥ 125°C VS = 18V, IOUT1 = 28 mA, IOUT2 at overcurrent detection level Pdis1 1W or IOUT2 = 28 mA, IOUT1 at overcurrent detection level Power dissipation 2 Tj ≥ 125°C VS = 18V, IOUT1 = IOUT2 = 28 mA Pdis2 0.75 W Selective Overtemperature Protection Logic AND connected with overcurrent detection (RETURNx, OUTx) Switch off Switch on Hysteresis Temp_off Temp_on Temp_hys 155 145 165 155 Time delay until overtemperature shut-down VS = 25V, Tamb = 125°C OUT1 = OUT2 = GND tdel 100 ms 6. Electrical Characteristics (Continued) Tamb = –40°C to +95°C and Tj = –40°C to +150°C, Operation supply-voltage range VS = 5.7V to 18V continuously, VS ≤ 25V for maximum 25 min, VS ≤ 40V for up to 500 ms. The current values are based on R = 750Ω, 0%-resistor at OCM1/OCM2 pins. Parameters Test Conditions Symbol Min. Typ. Max. Unit

4808B–AUTO–09/05 U6268B 9. Package Information 10. Revision History 8. Ordering Information Extended Type Number Package Remarks U6268B-MFPG3Y SO16 Taped and reeled, Pb-free technical drawings according to DIN specifications Dimensions in mm 10.0 9.85 8.89 0.4 1.27 1.4 0.25 0.10 5.2 4.8 3.7 3.8 6.15 5.85 0.2 16 9 Please note that the following page numbers referred to in this section refer to the specific revision mentioned, not to this document. Revision No. History 4808B-AUTO-09/05

• Put datasheet in a new template
• Pb-free logo on page 1 added
• Table “Ordering Information” on page 13 changed

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