U2891B

U2891B TEMIC | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 6

Technical content

Features

/C0068Low power consumption: 25 mA / 3 V (typical at –8 dBm output level) /C00682.5 GHz output frequency /C0068Excellent sideband suppression by means of duty cycle regeneration and 90° phase control /C0068Separate power-down mode for modulator and mixer /C0068Low LO input level: –10 dBm (typical) /C0068LO and RF port 50-/C0087 single-ended Benefits /C0068Extended talk time due to increased battery life /C0068Few external components results in cost and board space saving /C0068Adjustment free, hence saves time and cost /C0068One TX Platform for different systems /C0068Reduced costs and space for battery (3-V operation) Case: SSO-24 package Ordering Information: U2891B-AFS, U2891B-AFSG3 (see page 5) Block Diagram PD RF LO 1 Lo - Reg. f / 2 f 90° /C0246 Control V oltage regulator GND PD IFSIF LP 1 LP 2 IFiIFO LO2 RF O BB Ai 94 8141 e BB Ai BB Bi BB Bi /C0525 SRF 710,17 136 8, 21, 20 19 15 V S LO 1 5 24 1 GND GND IFi

TELEFUNKEN SemiconductorsU2891B Advanced Information Rev. A2: 04.10.19952 (6) Pin Description 1312 PD RF GND RF O V S SRF BB Ai LO 1 LO 2 IFO IFi LP 2 LP 1 GND GND BB Ai BB Bi BB Bi 94 8581 e LO 1 IFi V S V S SIF GND PD IF Pin Symbol Function

1 GND Ground

2 BB Ai Baseband input B inverse

3 BB Ai Baseband input B

4 LO 1 LO 1 input

5 LO 1 LO 1 input inverse

6 SIF Output symmetry IF

7 IFO IF output

8 V S Supply voltage

9 LO 2 LO 2 input

10 GND Ground

11 IFi IF input

12 IFi IF input inverse

13 PD RF Power-down RF

14 PD IF Power-down IF

15 SRF Output symmetry RF

16 RF O RF output

17 GND Ground

18 LP 2 Filter and IF level

19 LP 1 Filter and IF level

20 V S Supply voltage

21 V S Supply voltage

22 BB Bi Baseband input B

23 BB Bi Baseband input B inverse

24 GND Ground

Parameters Symbol Value Unit Supply voltage Pins 8, 20 and 21 V S, VSRF 6 V Input voltage Pins 2, 3, 4, 5, 9, 11, 12, 22 and 23V i 0 to VS V Junction temperature Tj 125 °C Storage temperature range Tstg –40 to +125 °C Operating Range Parameters Symbol Value Unit Supply voltage Pins 8, 20 and 21 V S, VSRF 2.7 to 5.5 V Ambient temperature range Tamb –40 to +85 °C Thermal Resistance Parameters Symbol Value Unit Junction ambient SSO-24 R thja 140 K/W

TELEFUNKEN Semiconductors U2891B Advanced Information Rev. A2: 04.10.1995 3 (6) Electrical Characteristics: General Data Parameters Test Conditions / Pin Symbol Min. Typ. Max. Unit Power supply Supply voltage range Pin 8, 20 and 21 V S,V SRF 2.7 5.5 V Supply current Pin 8, 20 and 21, VS = 3 V IS, ISRF 25 mA Electrical Characteristics: I/Q Modulator Test conditions (unless otherwise specified): VS = 3 V , Tamb = 25°C, referred to test circuit. System impedance Zo = 50 /C0087, fLO1 = 100 MHz, PLO1 = –10 dBm. Parameters Test Conditions / Pin Symbol Min. Typ. Max. Unit IF output Pin 7 Output level R LP = /C0082 PIFo – 8 dBm LO1 suppression LO RFo 40 dB V oltage standing wave ratio VSWR IFo 1.4 2 Sideband suppression SBS IFo 45 dB Baseband inputs Pins 2, 3, 22 and 23 Input voltage range (differential) V BBi 500 900 mVpp Input impedance ZBBi 150 k/C0087 Input frequency fBBi 200 MHz LO1 input Pins 4 and 5 Frequency range fLOi 30 500 MHz Input level 1) PLOi –10 –2 dBm Input impedance ZiLO tbd. /C0087 Duty cycle range DCR LO1 0.4 0.6 Power-down mode Supply current V PD /C0118 0.5 V Pin 14 IPD <5 /C0109A Settling time C SPD 100 pF, C LO = 100 pF, CRFo = 1 nF tS 10 /C0109s Power down voltage Pin 14 “Power on” V S = 3.5 to 5.5 V V S = 2.7 to 3.5 V V PON V S – 0.5 V S V S +0.5 V S +0.5 V V “Power down” V PDN 1 V Power down current Power on Power down IPON IPDN 0.15 < 1 mA /C0109A Note: 1) Required LO level is a function of the LO frequency

TELEFUNKEN SemiconductorsU2891B Advanced Information Rev. A2: 04.10.19954 (6) Electrical Characteristics: Mixer V S = 3 V , fLO2 = 800 MHz, fIF = 100 MHz, PLO2 = – 10dBm, system impedance Zo = 50 /C0087, Tamb = 25 /C0176C, reference point Pin 10, unless otherwise specified Parameters Test Conditions / Pin Symbol Min. Typ. Max. Unit Operating frequencies RF O frequency Pin 16 RF O 50 2500 MHz LO2 frequency Pin 9 fLO2 50 2500 MHz Isolation LO2 spurious at RFo Pin 9–16 P iLO = –10 to 0 dBm ISLO2 -RFo –30 dBm RF o to LO2 Pin 16–9 ISRFo-LO2 tbd. dB Output level Output compression point Pin 16 RPo = /C0082 CP o – 1 dB –7 dBm Input level Input compression point 1) Pins 11 and 12 CP i – 1dB –15 dBm Input LO2 Pin 9 PLO2 –10 dBm Third order input intercept point 1) Pins 11 and 12 PiIIP3 –6 dBm Voltage standing wave ratio (VSWR) Input IF Pins 11 and 12 VSWR IFi tbd. Input LO2 Pin 9 VSWR LO2 tbd. Output RF Pin 16 VSWR RF tbd. Conversion power gain R L = 50 /C0087 PG C 9 dB Noise Figure (SSB) 2) PiLO = – 6 dBm NF50 13 dB Power-down mode Supply current V PD /C0118 0.5 V Pin 13 IPD <5 /C0109A Settling time C SPD 100 pF, C LO = 100 pF, CRFo = 1 nF tS 10 /C0109s Power down voltage Pin 13 “Power on” V S = 3.5 to 5.5 V V S = 2.7 to 3.5 V V PON V S – 0.5 V S V S +0.5 V S +0.5 V V “Power down” V PDN 1 V Power down current Power on Power down IPON IPDN 0.15 < 1 mA /C0109A Note: 1) with 50 /C0087 termination resistor at Pin 11 2) without termination resistor

TELEFUNKEN Semiconductors U2891B Advanced Information Rev. A2: 04.10.1995 5 (6)

Ordering Information

Extended Type Number Package Remarks U2891B-AFS SSO24 Rail, MOQ 690 pcs. U2891B-AFSG3 SSO24 Tape & reel, MOQ 4000 pcs. Dimensions in mm Package: SSO-24 95 9943

TELEFUNKEN SemiconductorsU2891B Advanced Information Rev. A2: 04.10.19956 (6) Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423