U2795B

U2795B TEMIC | Alldatasheet

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Technical content

Features

/C0068Supply voltage range: 2.7 to 5.5 V /C0068Single-ended output, no balun required /C0068Single-ended input for RF and LO /C0068Exellent isolation characteristics /C0068Power down mode /C0068IP3 and compression point programmable /C00682.5-GHz operating frequency /C0068SO-8 package Benefits /C0068Reduced system costs due to few external component (no balun) requirements /C0068Standard independent product /C00683-V operation reduces the battery count and saves space Block Diagram V oltage regulator VH RV VS RF P VH 7LO 6GND VS 1 IF PD 93 7811 e i i S o o

TELEFUNKEN SemiconductorsU2795B Rev. A2: 08.06.19952 (13) Pin Description 4 5 8V S RF I P SO IFO LO i PD 94 7890 e GND Pin Symbol Function

1 V S Supply voltage

2 RF i RF input

3 P Progamming port IP3, CP

4 SO Output symmetry

5 IFO IF output

6 GND Ground

7 LO i LO input

8 PD Power down

The IC is designed for a supply voltage of 2.7 to 5.5 V . As the IC is internally stabilized, the performance of the circuit is nearly independent of the supply voltage. Input Impedance Input impedance, ZRFi, is about 700 /C0087 with an additional capacitive component. This condition provides the best noise figure in combination with a matching network. 3. Order Intercept Point (IP3) V oltage divider, RP / R1, determinates both the input and output intercept point, IIP3 and OIP3. If RP is infinity the IIP3 has the maximum of about –4 dBm. The IP3/RP characteristics are shown in figure 1 and 2. Output Impedance and Intercept Point Output impedance is shown in figure 9. Both low output impedance and a high intercept point are with reference to a high value of R Current Consumption, IS Depending on the chosen input and output conditions of the IC, the current consumption, I S, is between 4 mA and 10 mA. The current consumption in dependence of Rp is shown in figure 4. Power Down This feature provides an extension of battery life. If this function is not used, Pin 8 has to be connected to V S (Pin 1). Output Symmetry The symmetry of the load current can be matched and so be optimized for a given load impedance.

TELEFUNKEN Semiconductors U2795B Rev. A2: 08.06.1995 3 (13) Absolute Maximum Ratings Parameters Symbol Value Unit Supply voltage Pin 1 V S 6 V Input voltage Pins 2, 3, 7 and 8 V I 0 to VS V Junction temperature Tj 125 °C Storage temperature range Tstg –40 to +125 °C Thermal Resistance Parameters Symbol Value Unit Junction ambient SO 8 R thja 175 K/W Operating Range Parameters Symbol Value Unit Supply voltage range Pin 1 V S 2.7 to 5.5 V Ambient temperature range Tamb –40 to +85 °C

TELEFUNKEN SemiconductorsU2795B Rev. A2: 08.06.19954 (13)

Electrical Characteristics

V S = 3 V , fLOi = 1 GHz, IF = 900 MHz, RF = 100 MHz, RP =/C0082, system impedance Zo = 50 /C0087, Tamb = 25/C0176C, RT = 56 /C0087 reference point Pin 6, unless otherwise specified Parameters Test Conditions / Pin Symbol Min. Typ. Max. Unit Supply voltage range Pin 1 V S 2.7 5.5 V Typical supply current range Pin 1 IS 4 11 mA Maximum supply current Pin 1 IS 13 mA Conversion power gain R L = 50 /C0087, RT = /C0082 R L = 50 /C0087, RT = 56 /C0087 PG C PG C dB dB Operating frequencies RF i frequency Pin 2 RF i 10 2500 MHz LO i frequency Pin 7 fLOi 50 2500 MHz IFo frequency Pin 5 fIFo 50 2500 MHz Isolation LO spurious at RFi Pin 7 to 2 P iLO = –10 to 0 dBm ISLO-RF –30 dBm RF i to LOi Pin 2 to 7 P iRF = –25 dBm ISRF-LO 35 dB LO spurious at IFo Pin 7 to 5, P iLO = –10 to 0 dBm ISLO-IF –25 dBm IFo to LOi Pin 5 to 7 ISIF-LO 30 dB Output (IF) Output compression pointPin 5 CP o –10 dBm Input (RF) Input impedance Pin 2 ZRFi 700/C0087/C01070.8pF /C0087 Input compression point Pin 2 CP i –14 dBm Third order input intercept point Pin 2 IIP3 –4 dBm Input (LO) LO level Pin 7 PiLO –6 dBm Voltage standing wave ratio (VSWR) Input LO Pin 7 VSWR LOi <2 Output IF Pin 4 VSWR IFo <2 Noise performance Noise figure PiLO = 0 dBm, RT = /C0082NF 10 dB Power down mode Supply current Pin 1 VPD < 0.5 V Pin 1 VPD = 0 V ISPD 30 /C0109A Power down voltage “Power ON” Pin 8 VS = 3.5 to 5.5 V V S = 2.7 to 3.5 V V PON V S –0.5 V S V S +0.5 V S +0.5 V V “Power DOWN” Pin 8 V PDN 1 V Power down current Pin 8 Power ON Power DOWN IPON IPDN 0.15 < 5 mA /C0109A Settling time Pin 8 to 5 tsPD <30 /C0109s Note 1: Depending on R P

Figure 9. Typical Impedance of the output versus RP at frequency fIFo = 900 MHz

Figure 10. Typical S11 frequency response of the IF output, RP = /C0082,

Figure 11. Typical S11 frequency response of the RF intput, RP = /C0082, RT = /C0082

Figure 12. Typical S11 frequency response of the LO intput, RP = /C0082,

TELEFUNKEN Semiconductors U2795B Rev. A2: 08.06.1995 11 (13) Application Circuit (Evaluation Board) 94 8512 Application 94 8511 U2795 B V S 8 R P PD RT R SOC3 RF LO IF R I

TELEFUNKEN SemiconductorsU2795B Rev. A2: 08.06.199512 (13) Part List C 1 10 nF C2, C3, C4, C5, C6, C7 100 pF *R P 50-/C0087 Microstrip *R SO 68 /C0087 optional RT 56 /C0087 With the part list values, the PD settling time is /C011620 /C0109s. Using other values, time requirements in burst-mode appli- cations have to be considered. Values of R SO and RP depending on the input and output condition requirements. For RSO 68 /C0087 is recommended. With the optional RI the intercept and compression point can be slightly increased; values between 500 /C0087 and 1 k/C0087 are suitable. Please note that such modification will also increase the supply current. Application Board 95 9697

Ordering Information

Extended Type Number Package U2795B-FP SO 8 Dimensions in mm Package: SO 8 94 8862

TELEFUNKEN Semiconductors U2795B Rev. A2: 08.06.1995 13 (13) Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423