U2794

U2794B TEMIC | Alldatasheet

Document overview

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Technical content

Features

/C0068Supply voltage 5 V (typ.) /C0068Very low power consumption 125 mW (typ.) /C0068Very good image rejection by means of phase control loop for precise 90° phase shifting /C0068Duty cycle regeneration for single ended LO input signal /C0068Low LO input level –10 dBm (typ.) /C0068LO – frequency from 70 MHz to 1 GHz /C0068Power down mode /C006825 dB gain control /C0068Very low I/Q output dc offset voltage typ. < 5 mV Block Diagram 90°Control loop 90° 0° Frequency doubler Duty cycle regenerator Power down 145,6 V S PD 4 3 10 916,1811 GC GND RFin IIX II OUTPUT IX I LO 13 PC PCX OUTPUT QX Q QQQQX 95 9778

Ordering Information

Extended Type Number Package Remarks U2794B-AFS SSO 20 Rail, MOQ 830 pcs. U2794B-AFSG3 SSO 20 Tape and reel, MOQ 4000 pcs.

TELEFUNKEN SemiconductorsU2794B Rev. A3: 23.08.19952 (11) Pin Description 20IX I II V S V S QQ QQX IIX QX Q GND LO in GND LOX in PD PC PCX GC 95 10711 RFX in RF in Pin Symbol Function

1 IX IX output

2 I I output

3 II II low pass filter I

4 IIX IIX low pass filter I

5 V S Supply voltage

6 V S Supply voltage

7 RF in RF input

8 RFX in RFX input

9 QQ QQ low pass filter Q

10 QQX QQX low pass filter Q

11 GC GC gain control

12 PCX PCX phase control

13 PC PC phase control

14 PD PD power down

15 LOX in LOX input

16 GND Ground

17 LO in LO input

18 GND Ground

19 Q Q output

20 QX QX output

Electrostatic sensitive device, observe precautions for handling! Absolute Maximum Ratings Parameters Symbol Value Unit Supply voltage Pins 5 and 6 V S 6 V Input voltage Pins 7, 8 and 17 V i 0 to VS V Junction temperature Tj 125 °C Storage temperature range Tstg –40 to 125 °C Operating Range Parameters Symbol Value Unit Supply voltage range Pins 5 and 6 V S 4.75 to 5.25 V Ambient temperature range Tamb –40 to 85 °C Thermal Resistance Parameters Symbol Value Unit Junction ambient SSO 20 R thJA 140 K/W

TELEFUNKEN Semiconductors U2794B Rev. A3: 23.08.1995 3 (11)

Electrical Characteristics

Test conditions (unless otherwise specified); VS = 5 V , Tamb = 25°C, referred to test circuit System impedance ZO = 50 /C0087, fiLO = 950 MHz, PiLO = –10 dBm Parameters Test Conditions / Pins Symbol Min. Typ. Max. Unit Supply voltage range Pins 5 and 6 V S 4.75 5.25 V Supply current Pins 5 and 6 IS 30 mA Power down mode, PD “OFF”mode supply current V PD ≤ 0.5 V Pins 5 and 6 V PD = 1.0 V Pin 14 Note 1 IsPD ≤ 1 /C0109/C0065 Switch voltage Pin 14 “Power ON” VPON 4 V “Power DOWN” VPOFF 1 V LO input, LOin Pin 17 Frequency range fiLO 70 1000 MHz Input level Note 2 PiLO –12 –10 –5 dBm Input impedance See figure 6 ZiLO 50 /C0087 V oltage standing wave ratio See figure 2 VSWRLO 1.2 2 Duty cycle range LODCR 0.4 0.6 RF input, RFin Noise figure (DSB) symmetrical output @ 950 MHz Note 3 @ 100 MHz Pins 7 and 8 NF 12 dB Frequency range Pins 7 and 8 fiRF >fiLO –1 dB input compression point Pins 7 and 8 High gain Low gain ICPHG ICPLG +3.5 dBm Second order IIP Note 4 Pins 7 and 8 IIP2HG 35 dBm Third order IIP Pins 7 and 8 High gain Low gain IIP3HG IIP3LG +13 dBm LO leakage Pins 7 and 8 Symmetric input Asymmetric input LOL ≤ –60 ≤ –55 dBm Input impedance Pins 7 and 8 see figure 6 ZiRF 500/C0087/C0248 0.8pF Note 1: During power down status a load circuitry with dc-isolation to GND is assumed otherwise a current of I /C0025 (VS –0.8 V) /RI has to be added to the above power down current for each output I, IX, Q, QX. Note 2: The required LO-Level is a function of the LO-frequency (see figure 3). Note 3: Measured with input matching. For 950 MHz the optional transmission line T3 at the RF input may be used for this purpose. Noise figure measurements without using the differential output signal result in a worse noise figure. Note 4: Using Pins 7 and 8 as a symmetric RF input, the second order IIP can be improved.

TELEFUNKEN SemiconductorsU2794B Rev. A3: 23.08.19954 (11) Test conditions (unless otherwise specified); VS = 5 V , Tamb = 25°C, referred to test circuit System impedance ZO = 50 /C0087, fiLO = 950 MHz, PiLO = –10 dBm Parameters Test Conditions / Pins Symbol Min. Typ. Max. Unit I/O outputs Emitter follower I = 0.6 mA I, IX / Q, QX 3 dB-bandwidth w/o external C Note 5 Pins 1, 2, 19 and 20 BWI/Q ≥ 30 MHz I/Q amplitude imbalance Pins 1, 2, 19 and 20 AII/Q ≤± 0.2 dB I/Q quadrature error Pins 1, 2, 19 and 20 QEI/Q ≤± 1.5 Deg I/Q maximum output swing Pins 1, 2, 19 and 20 Symm. output RL > 5 k/C0087 Max I/Q 2 V PP DC output voltage Pins 1, 2, 19 and 20 VOUT 2.8 V DC output offset voltageNote 6 Pins 1, 2, 19 and 20 VOFSI/Q I/IX Q/QX < 5 mV Output impedance Pins 1, 2, 19 and 20 see figure 6 Zout 50 /C0087 Gain control, GC Control range power gain, gain high/gain low Pin 11 Note 7 GCR PGH/GGL 23/–2 dB Switch voltage “Gain high” Pin 11 GCVHigh 1 V “Gain low” Note 8 Pin 11 GCVLow V Settling time, ST Power “OFF” – “ON” STON < 4 /C0109s Power “ON” – “OFF” STOFF < 4 /C0109s Note 5: Due to test board parasitics this bandwidth is reduced and not equal for I, IX, Q, QX. If symmetry and full bandwidth is required the lowpass Pins 3, 4 and 9, 10 should be isolated from the board. The bandwidth of the I/Q outputs can be increased further by using a resistor between the Pins 3, 4, 9 and 10. This resistors shunt the internal loads of RI /C0024 5.4 k/C0087 The decrease in gain here has to be considered. Note 6: Output emitter follower internal acurrent I = 0.6 mA allows only small voltage swing with a 50 /C0087 load. For low signal distortion the load impedance should be RI ≥ 5 k/C0087 Note 7: Referred to the level of the output vector I 2 /C0041Q 2/C0504. Note 8: The low gain status is achieved with an open or high ohmic Pin 11. A recommended application circuit for switching between high and low gain status is shown in figure 1.

TELEFUNKEN Semiconductors U2794B Rev. A3: 23.08.1995 5 (11) Test Circuit 95 9842 * optional for single ended tests (notice 3 dB bandwidth of AD620) T1, T2 = transmission line ZO = 50 /C0087. If no GC function is required, connect pin 11 to GND. For high and low gain status GC’ is to be switched to GND respectively to V Figure 1.

Figure 6. Typical S11 frequency response of the

TELEFUNKEN SemiconductorsU2794B Rev. A3: 23.08.19958 (11) Board Layout 95 9854

TELEFUNKEN Semiconductors U2794B Rev. A3: 23.08.1995 9 (11) Board Layout 95 9853 External Components CUCC100 nF CRFX 1 nF CLO 100 pF CNLO1 nF CRF 100 pF CII, CQQ optional external lowpass filters T3 transmission line for RF–input matching, to connect optionally CI, CIX, optional for ac-coupling at CQ, CQX baseband outputs CPDN 100 pF CGC 100 pF CPC 100 pF CNPC 100 pF GSW gain switch Calibration Part CO, CS, CL 100 pF RL 50 /C0087 Conversion to Single Ended Output OP1, OP2 AD620 RG1, RG2 prog. gain, see datasheet, for 5.6 k/C0087 a gain of 1 at 50 /C0087 is achieved together with RD1 and RD2. RD1, RD2 450 /C0087 CS1, CS2 100 nF CS3, CS4, 100 nF

TELEFUNKEN SemiconductorsU2794B Rev. A3: 23.08.199510 (11) Description of Evaluation Board Board material: epoxy; /C0229r = 4.8, thickness = 0.5 mm transmission lines: ZO = 50 /C0087 The board offers the following functions /C0068The test circuit for the U2794B: – The supply voltage and the control inputs GC, PC and PD are connected via a plug strip. The control input voltages can be generated via external potentiome- ters; then the inputs should be ac–grounded (time requirements in burst–mode for power up have to be considered). – The outputs I, IX, Q, QX are dc coupled via an plug strip or can be ac-connected via SMB plugs for high frequency tests e.g. noise figure or s-parameter mea- surement. The pins II, IIX, QQ, QQX allow user definable filtering with 2 external capacitors CII, CQQ. – Also the offsets of both channels can be adjusted with two potis or resistors. – The LO- and the RF-inputs are ac–coupled and connected via SMB plugs. If transmission line T3 is connected to the RF-input and ac-grounded at the other end, gain and noise performance can be improved (input matching to 50 /C0087). – The complementary RF-input is ac-coupled to GND (CRFX = 1 nF), the same appears to the complemen- tary LO-input (CNLO = 1 nF). /C0068A calibration part, which allows to calibrate an s-parameter analyzer directly to the in- and output- signal ports of the U2794B. /C0068For single-ended measurements at the demodulator outputs, two OP’s (e.g., AD620 or other) can be con- figured with programmable gain; together with an output-divider network RD = 450 /C0087 to RL = 50 /C0087, direct measurements with 50 /C0087 load-impedances are possible at frequencies /C0116 100 kHz. Dimensions in mm Package: SSO 20 94 8872

TELEFUNKEN Semiconductors U2794B Rev. A3: 23.08.1995 11 (11) Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423