U2642B

U2642B TEMIC | Alldatasheet

Document overview

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Technical content

Features

/C0068Relay activation can be controlled by a limit switch of the wiper motor or by a fixed activation period for systems without limit switch /C0068Debounced input stages /C0068Enable/disable of pre-wash delay by program pin /C0068Polarity of WIWA: VBatt /C0068Polarity of INT: V Batt /C0068Relay output is protected with a clamping diode /C0068Relay activation: 0.64 s /C0068Interval pause: 10 s /C0068After wiping: 5.8 s /C0068Pre-wash delay: 0.91 s /C0068Wipe/wash mode with priority /C0068Protected in accordance to ISO/TR 7637–1 /C0068EMC with intergrated filters

Ordering Information

Extended Type Number Package Remarks U2642B DIP8 U2642B–FP SO8 Block Diagram 21 V 21 V 21 V 21 V Input comparator V oltage stabilization and POR Logic Load- dump detection and output control Oscillator 21 V Open-collector relay driver V S OSC INT WIWA LS PP GND REL 13944 Figure 1.

1 INT Intermittent input

2 WIWA Wipe/wash (WIWA) input

3 LS Limit switch (wiper motor) input

4 PP Program pin

5 GND Ground

6 REL Relay output

7 V S Supply voltage

8 OSC RC oscillator input

Figure 2. Pinning expiration of time tD (debounce). interval switch was opened beforehand. results in the relay on-time, tON , after tD . the motor current flows via the relay contact only. tDEL can be selected by programming PP. The after-wiping time, tAW , is re-triggerable in both cases.

relay on-time, tON , of intermittent mode. tor is operable up to 50 Hz. and for buffering in the event of voltage drops. 14-V Zener diode is connected between VS and GND. external protective resistors and integrated Zener diodes. Table 1. Change in times by varying the oscillator frquency

Rev. A2, 02-Dec-97 4 (10) Absolute Maximum Ratings With recommended external circuitry Parameter Test Conditions Symbol Value Unit Supply voltage (static) 5 min V Batt 24 V Supply current pulse 2 ms IS 1.5 A Supply current pulse 300 ms IS 150 mA Relay output current (static) IREL 300 mA Relay output current pulse 300 ms IREL 1.5 A Ambient temperature range Tamb –40 to +95 °C Storage temperature range Tstg –55 to +125 °C Power dissipation DIP8 Ptot 0.45 W Power dissipation SO8 Ptot 0.34 W Thermal Resistance Parameters Symbol Value Unit Junction ambient DIP8 R thJA 120 K/W Junction ambient SO8 R thJA 160 K/W

Electrical Characteristics

Reference point Ground GND, Tamb = 25/C0095C, VBatt = 13.5 V , unless otherwise specified (see figures 11 and 12) Parameters Test Conditions / Pin Symbol Min Typ Max Unit Voltage supply Pin 7 Supply voltage V Batt 6.0 16.0 V Supply current IS 0.5 2.0 3.0 mA Undervoltage threshold (POR) V S 3.0 5.1 V Internal Z-diode V Z 13.5 14.0 16.2 V Internal capacitor C S 15 pF Series resistance RV 510 /C0087 Filter capacitor C V 47 /C0109F Oscillator input OSC Pin 8 Internal discharge resistor R DIS 1.3 2.0 3.2 k/C0087 Lower switching-point voltage V OSC 0.16/C0032V S 0.20/C0032V S 0.24/C0032V S V Upper switching-point voltage V OSC 0.55/C0032V S 0.60/C0032V S 0.65/C0032V S V Input current V OSC = 0 V –IOSC 2 /C0109A Oscillator frequency fOSC 1 200 50 k Hz Input limit switch LS Pin 3 Internal protection-diode voltage ILS = 10 mA V LS 19.5 21.0 25.5 V Internal capacitor C LS 25 pF Switching threshold voltage V LS 0.375/C0032V S 0.5/C0032V S 0.675/C0032V S V Input current V LS = VS ILS 1 /C0109A Internal pull-up resistor R LS 13 20 27 k/C0087 External protection resistor R S 10 k/C0087

Rev. A2, 02-Dec-97 5 (10) UnitMaxTypMinSymbolTest Conditions / PinParameters Inputs INT, WIWA and PP Pins 1, 2 and 4 Internal protection-diode voltage IE = 10 mA V E 19.5 21.0 25.5 V Internal capacitor C E 25 pF Switching threshold voltage V E 0.375/C0032V S 0.5/C0032V S 0.675/C0032V S V Input current V E = 0 V –IE 1 /C0109A Internal pull-down resistor R E 13 20 27 k/C0087 External protection resistor R S 10 k/C0087 Relay Output Pins 6 Saturation voltage I = 100 mA V REL 1.1 V Saturation voltage I = 200 mA V REL 1.5 V Z-diode clamp voltage I = 10 mA V REL 19.5 21.0 25.5 V Leakage current V = 14 V IREL 12 /C0109A Relay coil resistance R REL 60 /C0087 Load-dump protection threshold V Batt 28 33 42 V Internal pulse times Debouncing period inputsINT/WIWA 12 - 16 clocks tD 60 70 80 ms Debouncing period inputsLS 3 – 4 clockstDL 15 17.5 20 ms Relay activation time 96 clockstON 480 ms Intermittent pause tINT 5.92 s After wiping period 1024 /C0034 68 clocks tWIWA 4.78 5.46 s Pre-wash delay reaction time for switch-on delay = t DEL + tD 88 – 96 clockstDEL 440 480 ms Note: All internally generated time sequences are derived from the oscillator frquency. The tolerances refer to a frequency adjusted to fOSC = 200 Hz.

Rev. A2, 02-Dec-97 9 (10)

Package Information

9.8 9.5 Dimensions in mm 1.64 1.44 4.8 max 0.5 min 3.3 0.58 0.48 7.62 2.54 6.4 max 0.36 max 9.8 8.2 7.77 7.47 technical drawings according to DIN specifications 13034 technical drawings according to DIN specifications Dimensions in mm 5.00 4.85 0.4 1.27 3.81 1.4 0.25 0.10 5.2 4.8 3.7 3.8 6.15 5.85 0.2

Rev. A2, 02-Dec-97 10 (10) Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423