U2309B TEMIC | Alldatasheet

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Technical content

Features

/C00689 V supply voltage /C0068Frequency range from 48 to 860 MHz /C0068Band A: balanced high impedance mixer input and amplitude controlled oscillator /C0068Band B + C: balanced low impedance mixer input and symmetrical oscillator /C0068Balanced L. O.-outputs for prescalers or PLL /C0068SAW filter driver with low impedance output /C0068V oltage regulator for stable operating characteristics /C0068ESD protection on all pins except oscillator pins and RF-inputs Benefits /C0068The integration of 3 bands and the small SSO28 package allows to design very small and economical 3-band tuners with high performance. Block Diagram RF Osc. A Osc. B Osc. C V oltage stabiliser Band switch L.O. Mixer output SAW–filter driver Band A Band B Band C 25 24 23 1 3 4 6 5 7 8 10 9 11 19 2 22 26 21 20 16 15 95 10717 Figure 1. Block diagram

Rev. A2, 29-May-96 2 (8) Pin Description 1712 Osc B, coll. Osc B, base Osc C, base Osc C, coll. Osc C, coll. Osc C, base Osc B, base Osc B, coll. Band sw. Osc A, coll. GND (common) Osc A, base RF in, B RF in, B RF in, C RF in, C V S Mix out RF in, A RF in, A Mix out GND (RF) L.O. out L.O. out 1514 95 10886 SAWF, out SAWF, out SAWF, inp. SAWF, inp. Pin Symbol Function

1 Osc A, baseOscillator band A, base

2 GND

(common) Ground, common 3 Osc A, coll.Oscillator band A, collector 4, 7 Osc B, baseOscillator band B, bases 5, 6 Osc B, coll.Oscillator band B, collectors 8, 11 Osc C, baseOscillator band C, bases 9, 10 Osc C, coll.Oscillator band C, collectors 12 Band sw. Tri-state band switch 13, 14 SAWF, out SAW filter driver outputs 15, 16 SAWF, inp. SAW filter driver inputs 17, 18 Mix out Mixer outputs, open collec- tor

19 V S Supply voltage Vs

20, 21 RF in, C RF inputs, band C 22, 23 RF in, B RF inputs, band B 24, 25 RF in, A RF inputs, band A

26 GND (RF) Ground, RF part

27, 28 L.O. out L.O.-outputs

Ordering Information

Extended Type Number Package Remarks U2309B-FLG3 SO28 Taped and reeled U2309B-FSG3 SSO28 Taped and reeled

Rev. A2, 29-May-96 3 (8) Absolute Maximum Ratings All voltages are referred to GND, Pin 2 Parameters Symbol Min. Typ. Max. Unit Supply voltage Pin 19 V S 10.5 V RF inputs Pin (20-25) 5.0 V IF outputs Pin 17-18 10.5 V Tri-state switch voltage Pin 12 ViTRI 10.5 V Junction temperature Tj 125 °C Storage temperature Tstg –40 125 °C Operating Range All voltages are referred to GND, Pin 2 Parameters Test Conditions / Pins Symbol Min Typ Max Unit Supply voltage Pin 17-19V S 8.1 9 9.9 V Ambient temperature Tamb –25 75 °C Thermal Resistance Parameters Symbol Typ Unit Junction ambient R thJA 70 128 K/W

Electrical Characteristics

Test conditions (unless otherwise specified): Vs = 9 V . Tamb = 25 °C. Reference point Pin 2 Parameters Test Conditions / Pins Symbol Min Typ Max Unit Supply voltage Pin 17-19 V S 8.1 9.0 9.9 V Supply current Pin 17-19 IS 42 50 mA Band switch V oltage band A Pin 12 VSWA 0 0 1.0 V V oltage band B Pin 12 VSWB 1.6 2.0 2.4 V V oltage band C Pin 12 VSWC 3.4 4.0 5.0 V Switching current VSW = 5 V Pin 12 ISW 100 /C0109A L. O .-output L. O. level each output RL = 50 Ohm Pin 27, 28 PLO –25 –17 dBm SAW filter driver fi = 36 MHz Input impedance Pin 15, 16ZiSAW 450 Ohm Output impedance Pin 13, 14ZoSAW 70 Ohm V oltage gain Pin 15, 16 → 13, 14 GvSAW 17 dB

Rev. A2, 29-May-96 4 (8) Electrical Characteristics (continued) Parameters Test Conditions / Pins Symbol Min Typ Max Unit Band A Input frequency range Pin 24 fiA 48 170 MHz Input impedance Figure 3 Pin 24 S11A Gain (note 4) Pin I/P to O/PGA 28 dB Noise figure DSB (note 2) Pin I/P to O/P fiA = 50 MHz fiA = 150 MHz NF NF 11.5 dB dB Input level for (note 3):Each carrier IM3 (interm. of 3rd orderfiA = 71 MHz Pin I/PViA –23 dBm IM2 (interm. of 2nd order)fiA = 71 MHz Pin I/PViA –22 dBm Band B (note 1) Input frequency range Pin 22, 23 fiA 170 470 MHz Input impedance Pin 22, 23 S11B see Fig. 3 Gain (note 4) Pin I/P to O/PGB 32 dB Noise figure DSB (note 2) Pin I/P to O/P fiB = 200 MHz fiB = 450 MHz NF NF 9.5 dB dB Input level for (note 3):Each carrier IM3 (interm. of 3rd order)fiB = 300 MHz Pin I/PViB –28 dBm Band C (note 1) Input frequency range Pin 20, 21 fiC 470 860 MHz Input impedance Figure 3 Pin 20, 21 S11C Gain Pin I/P to O/PGC 32 dB Noise figure DSB (note 2) Pin I/P to O/P fiC = 500 MHZ fiC = 800 MHz NF NF 10.5 11.5 dB dB Input level for IM3 (interm. of 3rd order, note 3) Each carrier fiC = 600 MHz Pin I/P ViC –28 dBm Notes 1) The RF inputs B and C are symmetrical driven by means of a hybrid for 180° phase shifting, consequently the source impedance is 100 /C0087. All other impedance for RF tests is 50 /C0087. 2) The noise figure (NF) is the value for double-side-band measurement. 3) The intermodulation test (2-carrier-method) which is made on IF-centre is in reference to a signal-to-IM ratio of 60 dB. 4) Gain is the ratio of the voltage at the primary coil of L5 to the available voltage at the input.

17 The output–voltage of the

Figure 2. Test and principle application circuit Figure 3. PCB for the RthJA-measurement

45 MHz

245 MHz

445 MHz

645 MHz

845 MHz

1045 MHz

250 MHz

500 MHz

750 MHz

Figure 4. Input impedance mixer band A (S11A), B and C (S11B/C) Normalised to 50 /C0087, measuring range 45 MHz to 750 MHz. Normalised to 50 /C0087, measuring range 45 MHz to 1045 MHz. Both inputs are driven symmetrical. The output impedance of hybrid is 100 /C0087,the measured levels are then calculated in reference to 50 /C0087.

Rev. A2, 29-May-96 7 (8) Dimensions in mm: 95 9932 95 10721

Rev. A2, 29-May-96 8 (8) Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423