TSSP4400 TEMIC | Alldatasheet
Document overview
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Technical content
Features
/C0068High radiant power and high radiant intensity /C0068Suitable for high pulse current operation /C0068Low forward voltage /C0068Angle of half intensity ϕ = ± 22/C0176 /C0068Peak wavelength /C0108p = 925 nm /C0068High reliability 94 8491
Applications
High power infrared emitter in light curtains, light barriers, transmissive or reflective sensors in combination with PIN photodiodes or phototransistors. Infrared remote control and free air transmission systems for long transmission distance and medium wide angle requirements in combination with PIN photo diodes or photo modules. Suitable as replacement of CQX47. Absolute Maximum Ratings Tamb = 25/C0095C Parameter Test Conditions Symbol Value Unit Reverse V oltage V R 5 V Forward Current IF 100 mA Peak Forward Current tp/T=0.5, tp=100 /C0109s IFM 200 mA Surge Forward Current tp=100 /C0109s IFSM 2.0 A Power Dissipation PV 170 mW Junction Temperature Tj 100 /C0176C Operating Temperature Range Tamb –55...+100 /C0176C Storage Temperature Range Tstg –55...+100 /C0176C Soldering Temperature t /C0120 5sec, 2 mm from case Tsd 260 /C0176C Thermal Resistance Junction/Ambient R thJA 450 K/W
Rev. A3, 16-Oct-96 5 (5) Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423