TSPC603R

TSPC603R ATMEL | Alldatasheet

Document overview

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Technical content

Features

• Superscalar (3 Instructions per Clock Peak)  Dual 16 KB Caches  Selectable Bus Clock  32-bit Compatibility PowerPC Implementation  On-chip Debug Support  Nap, Doze and Sleep Power Saving Modes  Device Offered in Cerquad, CBGA 255, HiTCE CBGA 255 and CI-CGA 255 Features Specific to CBGA 255, HiTCE CBGA 255 and CI-CGA 255  7.4 SPECint95, 6.1 SPECfp95 at 300 MHz (Estimated)  PD Typically = 3.5W (266 MHz), Full Operating Conditions  Branch Folding  64-bit Data Bus (32-bit Data Bus Option)  4-Gbytes Direct Addressing Range  Pipelined Single/Double Precision Float Unit  IEEE 754 Compatible FPU  IEEE P 1149-1 Test Mode (JTAG/C0P)  fINT Max = 300 MHz  fBUS Max = 75 MHz  Compatible CMOS Input/TTL Output Features Specific to Cerquad  5.6 SPECint95, 4 SPECfp95 and 200 MHz (Estimated)  PD Typically = 2.5W (200 MHz), Full Operating Conditions 1. Description The PID7t-603e implementation of the PowerPC 603e (renamed after the 603R) is a low-power implementation of the Reduced Instruction Set Computer (RISC) micropro- cessor PowerPC family. The 603R is pin- to-pin compatible with the PowerPC 603e and 603P in a Cerquad package. The 603R implements 32-bit effective addresses, integer data types of 8, 16 and 32 bits, and floating-point data types of 32 and 64 bits. The 603R is a low-power 2.5/3.3V design and provides four software controllable power-saving modes. This device is a super scalar processor capable of issuing and retiring as many as three instructions per clock. Instructions can be executed in any order for increased performance, but, the 603R makes completion appear sequential. It integrates five execution units and is able to execute five instructions in parallel. The 603R provides independent on-chip, 16-Kbyte, four-way set-associative, physi- cally addressed caches for instructions and data, as well as on-chip instructions, and data Memory Management Units (MMUs). The MMUs contain 64-entry, two-way set-associative, data and instruction translation look aside buffers that provide support for demand-paged virtual memory address translation and variable-sized block trans- lation. The 603R has a selectable 32- or 64-bit data bus and a 32-bit address bus. The interface protocol allows multiple masters to compete for system resources through a central external arbiter. The device supports single-beat and burst data transfers for memory accesses, and supports memory-mapped I/Os. PowerPC® 603e RISC Microprocessor Family PID7t-603e TSPC603R Rev. 5410B–HIREL–09/05

5410B–HIREL–09/05 TSPC603R The 603R uses an advanced, 2.5/3.3V CMOS process technology and maintains full interface compatibility with TTL devices. It also integrates in-system testability and debugging features through JTAG boundary-scan capabilities. 2. Screening/Quality/Packaging This product is manufactured in full compliance with:  HiTCE CBGA according to Atmel Standards  CI-CGA 255 and Cerquad: MIL-PRF-38535 class Q or according to Atmel standards  CBGA 255: Upscreenings based upon Atmel standards  CBGA, CI-CGA, HiTCE packages: – Full military temperature range (T – Industrial temperature range (T C = -40°C, Tj = +110°C)  Cerquad: – Full military temperature range (T C = -55°C, Tc = +125°C) – Industrial temperature range (T C = -40°C, Tc = +110°C) – Commercial temperature ranges ( TC = 0°C, TC = +70°C)  Internal I/O Power Supply = 2.5 ±5% // 3.3V ±5% G suffix CBGA 255 Ceramic Ball Grid Array GS suffix CI-CGA 255 Ceramic Ball Grid Array with Solder Column Interposer (SCI) CERQUAD 240 GH suffix HiTCE 255 Ceramic Ball Grid Array A suffix CERQUAD 240 Ceramic Leaded Chip Carrier Cavity up

5410B–HIREL–09/05 TSPC603R 3. Block Diagram Figure 3-1. Block Diagram 4. Overview The 603R is a low-power implementation of t he PowerPC microprocessor family of Reduced Instruction Set Computing (RISC) microprocessors. The 603R implements the 32-bit portion of the PowerPC architecture, which provides 32-bit effective addresses, integer data types of 8, 16 and 32 bits, and floating-point data types of 32 and 64 bits. For 64-bit PowerPC microproces- sors, the PowerPC architecture provides 64-bit integer data types, 64-bit addressing, and other features required to complete the 64-bit architecture. The 603R provides four software controllable power-saving modes. Three of the modes (nap, doze, and sleep) are static in nature, and progressively reduce the amount of power dissipated by the processor. The fourth is a dynamic pow er management mode that causes the functional units in the 603R to automatically enter a low-power mode when the functional units are idle without affecting operational performance, software execution, or any external hardware. The 603R is a superscalar processor capable of issuing and retiring as many as three instruc- tions per clock. Instructions can be executed in any order for increased performance, but, the 603R makes completion appear sequential. The 603e integrates five execution units:  an Integer Unit (IU)  a Floating-point Unit (FPU)  a Branch Processing Unit (BPU) Completion Unit Fetch Unit Dispatch Unit Branch Unit Integer Unit Gen Reg Unit Gen Re- name Load/ Store Unit FP Re- name FP Reg File Float Unit D MMU 16K Data Cache I MMU 16K Inst. Cache Bus Interface Unit System Bus 32b Address 64b Data

5410B–HIREL–09/05 TSPC603R  a Load/Store Unit (LSU)  a System Register Unit (SRU) The ability to execute five instructions in paralle l and the use of simple instructions with rapid execution times yield high efficiency and thro ughput for 603R-based systems. Most integer instructions execute in one clock cycle. The FPU is pipelined so a single-precision multiply-add instruction can be issued every clock cycle. The 603R provides independent on-chip, 16 Kbyte, four-way set-associative, physically addressed caches for instructions and data, as well as on-chip instruction and data Memory Management Units (MMUs). The MMUs contain 64-entry, two-way set-associative, Data and Instruction Translation Lookaside Buffers (DTLB and ITLB) that provide support for demand-paged virtual memory address translation and variable-sized block translation. The TLBs and caches use a Least Recently Used (LRU) replacement algorithm. The 603R also sup- ports block address translation through the use of two independent Instruction and Data Block Address Translation (IBAT and DBAT) arrays of four entries each. Effective addresses are com- pared simultaneously with all four entries in the BAT array during block translation. In accordance with the PowerPC architecture, if an effective address hits in both the TLB and BAT array, the BAT translation has priority. The 603R has a selectable 32- or 64-bit data bus and a 32-bit address bus. The 603R interface protocol allows multiple masters to compete for system resources thro ugh a central external arbiter. The 603R provides a three-state coherency protocol that supports the exclusive, modi- fied, and invalid cache states. This protocol is a compatible subset of the MESI (Modified/Exclusive/Shared/Invalid) four-state protocol and operates coherently in systems that contain four-state caches. The 603R supports single-beat and burst data transfers for memory accesses, and supports memory-mapped I/Os. The 603R uses an advanced, 0.29 µm 5-metal-layer CMOS process technology and maintains full interface compatibility with TTL devices. 5. Signal Description Figure 5-1 on page 5 , Table 10-5 and Table 10-6 on page 20 describe the signals on the TSPC603R and indicate signal functions. The test signals, TRST , TMS, TCK, TDI and TDO, comply with the subset P-1149.1 of the IEEE testability bus standard. The three signals LSSD_MODE , LI_TSTCLK and L2_TSTCLK are test signals for factory use only and must be pulled up to VDD for normal machine operations.

5410B–HIREL–09/05 TSPC603R Figure 5-1. Functional Signal Groups 6. Detailed Specifications This specification describes th e specific requirements for the microprocessor TSPC603R, in compliance with MIL-STD-883 class B or Atmel standard screening. 7. Applicable Documents 1. MIL-STD-883: Test methods and procedures for electronics 2. MIL-PRF-38535: General specifications for microcircuits The microcircuits are in accordance with the applicable documents and as specified herein. BR BG ABB TS TT[0-4] AP[0-3] APE TBST TSIZ[0-2] GBL CI WT CSE[0-1] TC[0-1] AACK ARTRY SYSCLK CLK_OUT PLL_CFG[0-3] DBG DBWO DBB DPE DP[0-7] DH[0-31], DL[0-31] A[0-31] DBDIS TA DR TR Y TEA INT, SMI MCP HRESET, SRESET CKSTP_IN, CKSTP_OUT RSRV QREQ, QACK TBEN TLBISYNC TRST, TCK, TMS, TDI, TD05 LSSD_MODE L1_TSTCLK, L2_TSTCLK3 VDD OVDD GND AVDD ADDRESS ARBITRATION ADDRESS START ADDRESS BUS TRANSFER ATTRIBUTE ADDRESS TERMINATION CLOCKS PROCESSOR STATUS LSSD TEST CONTROL POWER SUPPLY 603r VOLTDETGND 1POWER SUPPLY INDICATOR DATA ATTRIBUTION DATA TRANSFER DATA TERMINATION INTERRUPTS CHECKSTOPS RESET JTAG/COP INTERFACE

5410B–HIREL–09/05 TSPC603R

7.1 Design and Construction

7.1.1 Terminal Connections

Depending on the package, the termin al connections are as shown in Table 10-2 on page 15 , Table 10-4 on page 18, ”Recommended Operating Conditions” on page 6, Figure 15-2 on page 49, Figure 15-4 on page 52 and Figure 5-1 on page 5.

7.1.2 Lead Material and Finish

Lead material and finish shall be as specified in MIL-STD-1835. ( See “Package Mechanical Data” on page 47.)

7.2 Absolute Maximum Ratings

Absolute maximum ratings are stress ratings only and functional operation at the maximum is not guaranteed. Stresses beyond those listed may affect devi ce reliability or cause permanent damage to the device. Notes: 1. Caution: The input voltage must not be greater than OVDD by more than 2.5V at any time, including during power-on reset. 2. Caution: The OVDD voltage must not be greater than VDD/AVDD by more than 1.2V at any time, including during power-on reset. 3. Caution: The VDD/AVDD voltage must not be greater than OVDD by more than 0.4V at any time, including during power-on reset. Functional operating conditions are given in AC and DC electrical specifications. Stresses beyond the absolute maximums listed may affect device reliab ility or cause permanent damage to the device.

7.2.2 Recommended Operating Conditions

The following are the recommended and tested operating conditions. Proper device operation outside of these ranges is not guaranteed.

7.2.1 Absolute Maximum Ratings for the 603R (1)(2)(3)

Parameter Symbol Min Max Unit Core supply voltage V DD -0.3 2.75 V PLL supply voltage AV DD -0.3 2.75 V I/O supply voltage OV DD -0.3 3.6 V Input voltage V IN -0.3 5.5 V Storage temperature range T STG -55 +150 °C

7.2.3 Recommended Operating Conditions

Parameter Symbol Min Max Unit Core supply voltage V DD 2.375 2.625 V PLL supply voltage AV DD 2.375 2.625 V I/O supply voltage OV DD 3.135 3.465 V Input voltage V IN GND 5.5 V Operating temperature T c -55 +125 °C Junction operating temperature specific to Cerquad T j –+ 1 3 5 °C

5410B–HIREL–09/05 TSPC603R 8. Thermal Characteristics

8.1 CBGA 255 and CI-C GA 255 Packages

The data found in this section concerns 603R devices packaged in the 255-lead 21 mm multi-layer ceramic (MLC) and ceramic BGA package. Data is included for use with a Thermal- loy #2328B heat sink. The internal thermal resistance for this package is negligible due to the exposed die design. A thermal interface material is recommended at the package lid to heat sink interface to minimize the thermal contact resistance. Additionally, the CBGA package offers an excell ent thermal connection to the card and power planes. Heat generated at the chip is dissipated through the package, the heat sink (when used) and the card. The parallel heat flow paths result in the lowest overall thermal resistance as well as offer significantly better power dissipation capability if a heat sink is not used. The thermal characteristics for the flip-chip CBGA and CI-CGA packages are as follows: Thermal resistance (junction-to-case) = R jc or θjc = 0.095°C/Watt for the 2 packages. Thermal resistance (junction-to-ball) = Rjb or θjb = 3.5°C/Watt for the CBGA package. Thermal resistance (junction-to-bottom SCI) = Rjs or θjs = 3.7°C/Watt for the CI-CGA package. The junction temperature can be calculated from the junction to ambient thermal resistance, as follow: Junction temperature: Tj = Ta + (Rjc + Rcs + Rsa) × P where: T a is the ambient temperature in the vicinity of the device Rjc is the die junction to case thermal resistance of the device Rcs is the case to heat sink thermal resistance of the interface material Rsa is the heat sink to ambient thermal resistance P is the power dissipated by the device During operation, the die-junction temperatures (T j) should be maintained at a lower value than the value specified in ”Recommended Operating Conditions” on page 6. The thermal resistance of the thermal interface material (Rcs) is typically about 1°C/Watt. Assuming a T a of 85°C and a consumption (P) of 3.6 Watts, the junction temperature of the device would be as follow: Tj = 85°C + (0.095°C/Watt + 1°C/Watt + Rsa) × 3.5 Watts. For the Thermalloy heat sink #2328B, the heat sink-to-ambient thermal resistance (R sa) versus airflow velocity is shown in Figure 8-1.

5410B–HIREL–09/05 TSPC603R Figure 8-1. CBGA Thermal Management Example Assuming an air velocity of 1 m/sec, the associated overall thermal resistance and junction tem- perature, found in Table 8-1 will result. Vendors such as Aavid, Thermalloy ®, and Wakefield Engineering can supply heat sinks with a wide range of thermal performance.

8.2 HiTCE CBGA Package

Notes: 1. Simulation, no convection air flow. 2. Per JEDEC JESD51-2 with the board horizontal. 3. Per JEDEC JESD51-8 with the board horizontal.

8.3 CERQUAD 240 Package

This section provides thermal management data for the 603R. This information is based on a typical desktop configuration using a 240 lead, 32 mm x 32 mm, wire-bond CERQUAD package with the cavity up (the silicon di e is attached to the bo ttom of the package). This configuration enables dissipation through the PCB. The thermal characteristics for a wire-bond CERQUAD package are as follows:  Thermal resistance (junction to bottom of the case) (typical) = R θjc or θjc = 2.5°C/Watt  Thermal resistance (junction to top of the case) is typically 16 °C/W Table 8-1. Thermal Resistance and Junction Temperature Configuration R ja (°C/W) T j (°C) With 2328B heat sink 5 106 Heat Sink Thermal Resistance Approach Air Velocity (m/sec) Rsa (°C/W) 0123 Table 8-2. HiTCE CBGA Package Characteristic Symbol Value Unit Junction-to-bottom of balls(1) RθJ 7.5 °C/W Junction-to-ambient thermal resistance natural convection, four-layer (2s2p) board RθJMA 22.4(2) °C/W Junction to board thermal resistance R θJB 11.7(3) °C/W

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8.3.1 Thermal Management Example

The junction temperature can be calculated from the junction to ambient thermal resistance, as follows: Junction temperature: Tj = TC + Rθjc × P Tj = Ta + (Rcs + Rsa) × P + Rθjc × P so Tj = Ta + (Rθjc + Rcs + Rsa) × P Where: Ta is the ambient temperature in the vicinity of the device Rθja is the junction to ambient resistance Rθjc is the junction to case thermal resistance of the device Rcs is the case to heat sink thermal resistance of the interface material Rsa is the heat sink to ambient thermal resistance P is the power dissipated by the device Because dissipation is made through the PCB, R cs and Rsa are user values, and can vary con- siderably depending on the customer’s application. In a typical customer application, if R cs is 0.5 °C/W, R sa is 3 °C/W and Ta is 110 °C, Tj can be estimated. Note that verification of external thermal resistance and case temperature should be performed for each application. Thermal resistance depends on many factors including the amount of air turbulence and can therefore vary considerably. 9. Power Consideration The PowerPC 603R is a microprocessor specifica lly designed for low-power operation. Like the 603e microprocessor version, the 603R prov ides both automatic and program-controllable power reduction modes for progressive reduction of power consumption. This section describes the hardware support provided by the 603R for power management.

9.1 Dynamic Power Management

Dynamic power management automatically powers up and down the individual execution units of the 603R, based upon the contents of the instruction stream. For example, if no floating-point instructions are being executed, the floating-point unit is automatically powered down. Power is not actually removed from the execution unit; instead, each execution unit has an independent clock input, which is automatically controlled on a clock-by-clock basis. Since CMOS circuits consume negligible power when they are not switch ing, stopping the clock to an execution unit effectively eliminates its power consumption. The operation of DPM is completely transparent to software or any external hardware. Dynamic pow er management is enabled by setting bit 11 in HID0 on power-up, following HRESET

5410B–HIREL–09/05 TSPC603R

9.2 Programmable Power Modes

The 603R provides four programmable power states, full power, doze, nap and sleep. The soft- ware selects these modes by setting one (and only one) of the three power saving mode bits. The hardware can enable a power management state through external asynchronous interrupts. The hardware interrupt causes the transfer of program flow to interrupt the handler code. The appropriate mode is then set by the software. The 603R provides a separate interrupt and inter- rupt vector for power management, the System Management Interrupt (SMI). The 603R also contains a decrement timer which allows it to enter the nap or doze mode for a predetermined amount of time and then return to full power operation through the Decrementer Interrupt (DI). Note that the 603R cannot switch from power-on management mode to another without first returning to full on mode. The nap and sleep modes disable bus snooping; therefore, a hardware handshake is provided to ensure coherency before the 603R enters these power management modes. Table 9-1 summarizes the four power states. Note: 1. Exceptions are referred to as interr upts in the architecture specification.

9.3 Power Management Modes

The following describes the characteristi cs of the 603R’s power management modes, the requirements for entering and exiting the various modes, an d the system capabilities provided by the 603R while the power management modes are active. Full Power Mode with DPM Disabled Full power mode with DPM disabled; power mode is selected when the DPM enable bit (bit 11) in HID0 is cleared  Default state following power-up and HRESET  All functional units are operating at full processor speed at all times Full Power Mode with DPM Enabled Full power mode with DPM enabled (HID0[11] = 1); provides on-chip power management with- out affecting the functionality or performance of the 603R  Required functional units are operating at full processor speed Table 9-1. Power PC 603R Microprocessor Programmable Power Modes PM Mode Functioning Units Activatio n Method Full-power Wake-up Method Full Power All units active – – Full Power (with DPM) Requested logic by demand By instruction dispatch – Doze - Bus snooping - Data cache as needed - Decrementer timer Controlled by SW External asynchronous exceptions(1) Decrementer interrupt Reset Nap Decrementer timer Controlled by hardware and software External asynchronous exceptions Decrementer interrupt Reset Sleep None Controlled by hardware and software External asynchronous exceptions Reset

5410B–HIREL–09/05 TSPC603R  Functional units are clocked only when needed  No software or hardware intervention required after mode is set  Software/hardware and performance are transparent Doze Mode The doze mode disables most functional unit s but maintains cache coherency by enabling the bus interface unit and snooping. A snoop hit will cause the 603R to enable the data cache, copy the data back to the memory, disable the cache, and fully return to the doze state. In this mode:  Most functional units are disabled  Bus snooping and time base /decrementer are still enabled  Dose mode sequence: – Set doze bit (HID0[8) = 1) – 603R enters doze mode after several processor clocks  There are several methods for returning to full-power mode – Assert INT, SMI, MCP or decrementer interrupts – Assert hard reset or soft reset  The Transition to full-power state takes no more than a few processor cycles  Phase Locked Loop (PLL) running and locked to SYSCLK Nap Mode The nap mode disables the 603R but still main tains the phase locked loop (PLL) and the time base/decrementer. The time base can be used to re store the 603R to full-on state after a pro- grammed amount of time. Because bus snooping is disabled for nap and sleep modes, a hardware handshake using the quiesce request (QREQ ) and quiesce acknowledge (QACK) sig- nals is required to main tain data coherency. T he 603R will assert the QREQ signal to indicate that it is ready to disable bus snooping. When the system has ensured that snooping is no longer necessary, it will assert QACK and the 603R will enter the sleep or nap mode. In this mode:  The time base/decrementer is still enabled  Most functional units are disabled (including bus snooping)  All non-essential input receivers are disabled  Nap mode sequence: – Set nap bit (HID0[9] = 1) – 603R asserts quiesce request (QREQ ) signal – System asserts quiesce acknowledge (QACK ) signal – 603R enters sleep mode after several processor clocks  There are several methods for returning to full-power mode: – Assert INT, SPI, MCP or decrementer interrupts – Assert hard reset or soft reset  Transition to full-power takes no more than a few processor cycles  The PLL is running and locked to SYSCLK

5410B–HIREL–09/05 TSPC603R Sleep Mode Sleep mode consumes the least amount of power of the four modes since all functional units are disabled. To conserve the maximum amount of power, the PLL may be disabled and the SYSCLK may be removed. Due to the fully static design of t he 603R, the inte rnal processor state is preserved when no internal clock is present. Because the time base and decrementer are disabled while the 603R is in sleep mode, t he 603R’s time base contents will have to be updated from an external time base following sleep mode if accurate time-of-day maintenance is required. Before the 603R enters the sleep mode, the 603R will assert the QREQ signal to indi- cate that it is ready to disable bus snooping. When the system has ensured that snooping is no longer necessary, it will assert QACK and the 603R will enter the sleep mode. In this mode:  All functional units are disabled (including bus snooping and time base)  All non-essential input receivers are disabled – Internal clock regenerators are disabled – The PLL is still running (see below)  Sleep mode sequence – Set sleep bit (HID0[10] = 1) – 603R asserts quiesce request (QREQ ) – System asserts quiesce acknowledge (QACK ) – 603R enters sleep mode after several processor clocks  There are several methods for returning to full-power mode – Assert INT, SMI, or MCP interrupts – Assert hard reset or soft reset  The PLL may be disabled and SYSCLK may be removed while in sleep mode  Return to full-power mode after P LL and SYSCLK disabled in sleep mode – Enable SYSCLK – Reconfigure PLL into the desired processor clock mode – System logic waits for PLL startup and relock time (100 µs) – System logic asserts one of the sleep recovery signals (for example, INT or SMI)

9.4 Power Management Software Considerations

Since the 603R is a dual issue processor with out-of-order exec ution capabilities, care must be taken with the way the power management mode is entered. Furthermore, nap and sleep modes require all outstanding bus operations to be completed before the power management mode is entered. Normally, during the system configuration time, one of the power management modes would be selected by setting the appropriate HID0 mode bit. Later on, the power management mode is invoked by setting the MSR[POW] bit. To provide a clean transition into and out of the power management mode, the stmsr[POW] should be preceded by a sync instruction and fol- lowed by an isync instruction.

5410B–HIREL–09/05 TSPC603R

9.5 Power Dissipation

Notes: 1. These values apply for all valid PLL_CFG[0-3] settings and do not include output driver power (OV DD) or analog supply power (AVDD). OVDD power is system dependent but is typically ≤ 10% of VDD. Worst case AVDD = 15 mW. 2. Typical power is an average value measured at V DD = AVDD = 2.5V, OVDD = 3.3V, in a system executing typical applications and benchmark sequences. 3. Maximum power is measured at V DD = 2.625V using a worst-case instruction mix. 4. To calculate the power consumption at low temperature (-55°C), use a factor of 1.25.

9.6 Marking

Each microcircuit is legible and permanently marked with at least the following information:  Atmel logo  Manufacturer’s part number  Class B identification if applicable  Date code of inspection lot  ESD identifier if available  Country of manufacture 10. Pin Assignments

10.1 CBGA 255 and CI-C GA 255 Packages

Figure 10-1 (pin matrix) shows the pinout as viewed from the top of the CBGA and CI-CGA packages. The direction of the top surface view is shown by the side profile of the packages. Table 9-2. Power Dissipation(1)(2)(3)(4) with VDD/AVDD = 2.5 ±5%V, OVDD = 3.3 ±5%V, GND = 0V, 0°C ≤ TC ≤ 125°C CPU Clock Frequency Cerquad 240 Package CBGA 255, HiTCE CBGA 255 and CI-CGA 255 Units166 MHz 200 MHz 166 MHz 200 MHz 233 MHz 266 MHz 300 MHz Full-on Mode (DPM Enabled) Max 3.2 4 3.2 4 4.6 5.3 6 W Doze Mode Nap Mode Typical 100 120 100 120 140 160 180 mW Sleep Mode Typical 96 110 96 110 123 135 150 mW Sleep Mode-PLL Disabled T y p i c a l 6 0 6 0 6 0 6 0 6 06 06 0 m W Sleep Mode-PLL and SYSCLK Disabled T y p i c a l 2 5 2 5 2 5 2 5 2 52 52 5 m W Maximum 60 60 60 60 60 80 100 mW

5410B–HIREL–09/05 TSPC603R Figure 10-1. CBGA 255, HiTCE CBGA 255 and CI–CGA 255 Top View T B C D E F G H J K L R M N P 01 16 1514131211100908070605040302 A Pin matrix top view Not to scale View Encapsulant Substrate Assembly Die CBGA 255, CBGA HiTCE 255 CI-CGA 255

5410B–HIREL–09/05 TSPC603R

10.1.1 Pinout Listing

Notes: 1. OV DD inputs apply power to the I/O drivers and VDD inputs supply power to the processor core. Table 10-1. Power and Ground Pins CBGA, HiTCE CBGA and CI-CGA Pin Number VDD GND PLL (AVDD)A 1 0 Internal Logic(1) (VDD) F06, F08, F09, F11, G07, G10, H06, H08, H09, H11, J06, J08, J09, J11, K07, K10, L06, L08, L09, L11 C05, C12, E03, E06, E08, E09, E11, E14, F05, F07, F10, F12, G06, G08, G09, G11, H05, H07, H10, H12, J05, J07, J10, J12, K06, K08, K09, K11, L05, L07, L10, L12, M03, M06, M08, M09, M11, M14, P05, P12 I/O Drivers(1) (OVDD) C07, E05, E07, E10, E12, G03, G05, G12, G14, K03, K05, K12, K14, M05, M07, M10, M12, P07, P10 Table 10-2. Signal Pinout Listing Signal Name CBGA, HiTCE CBGA an d CI-CGA Pin Number Active I/O A[0-31] C16, E04, D13, F02, D14, G01, D15, E02, D16, D04, E13, G02, E15, H01, E16, H02, F13, J01, F14, J02, F15, H03, F16, F04, G13, K01, G15, K02, H16, M01, J15, P01 High I/O AACK L02 Low Input ABB K04 Low I/O AP[0-3] C01, B04, B03, B02 High I/O APE A04 Low Output ARTRY J04 Low I/O BG L01 Low Input BR B06 Low Output CI E01 Low Output CKSTP_IN D08 Low Input CKSTP_OUT A06 Low Output CLK_OUT D07 - Output CSE[0-1] B01, B05 High Output DBB J14 Low I/O DBG N01 Low Input DBDIS H15 Low Input DBWO G04 Low Input DH[0-31] P14, T16, R15, T15, R13, R12, P11, N11, R11, T12, T11, R10, P09, N09, T10, R09, T09, P08, N08, R08, T08, N07, R07, T07, P06, N06, R06, T06, R05, N05, T05, T04 High I/O DL[0-31] K13, K15, K16, L16, L15, L13, L14, M16, M15, M13, N16, N15, N13, N14, P16, P15, R16, R14, T14, N10, P13, N12, T13, P03, N03, N04, R03, T01, T02, P04, T03, R04 High I/O DP[0-7] M02, L03, N02, L04, R0 1, P02, M04, R02 High I/O DPE A05 Low Output DRTRY G16 Low Input

5410B–HIREL–09/05 TSPC603R Notes: 1. These are test signals for factory use only and must be pulled up to OV DD for normal machine operation. 2. NC (not connected) in the 603e BGA package; internally tied to GND in the 603R BGA package to indicate to the power sup- ply that a low-voltage processor is present. GBL F01 Low I/O HRESET A07 Low Input INT B15 Low Input L1_TSTCLK(1) D11 - Input L2_TSTCLK(1) D12 - Input LSSD_MODE(1) B10 Low Input MCP C13 Low Input PLL_CFG[0-3] A08, B09, A09, D09 High Input QACK D03 Low Input QREQ J03 Low Output RSRV D01 Low Output SMI A16 Low Input SRESET B14 Low Input SYSCLK C09 - Input TA H14 Low Input TBEN C02 High Input TBST A14 Low I/O TC[0-1] A02, A03 High Output TCK C11 - Input TDI A11 High Input TDO A12 High Output TEA H13 Low Input TLBISYNC C04 Low Input TMS B11 High Input TRST C10 Low Input TS J13 Low I/O TSIZ[0-2] A13, D10, B12 High I/O TT[0-4] B13, A15, B1 6, C14, C15 High I/O WT D02 Low Output NC B07, B08, C03, C06, C08, D 05, D06, F03, H04, J16 Low Input VOLTDETGND(2) F03 Low Output Table 10-2. Signal Pinout Listing (Continued) Signal Name CBGA, HiTCE CBGA an d CI-CGA Pin Number Active I/O

5410B–HIREL–09/05 TSPC603R

10.2 CERQUAD 240 Package

Figure 10-2. CERQUAD 240: Top View GBL VDD OGND GND OVDD A11 A13 A15 VDD A17 A19 A21 OGND GND OVDD A23 A25 A27 VDD DBWO DBG BG AACK GND A29 QREQ ARTRY OGND VDD OVDD ABB A31 DP0 GND DP1 DP2 DP3 OGND VDD OVDD DP4 DP5 DP6 GND DP7 DL23 DL24 OGND OVDD DL25 DL26 DL27 DL28 VDD OGND 180 179 178 177 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121 TT4 VDD OVDD GND OGND A10 A12 A14 VDD A16 A18 A20 OVDD GND OGND A22 A24 A26 VDD DRTR TA TEA DBDIS GND A28 CSE1 TS OVDD VDD OGND DBB A30 DL0 GND DL1 DL2 DL3 OVDD VDD OGND DL4 DL5 DL6 GND DL7 DL8 DL9 OVDD OGND DL10 DL11 DL12 DL13 VDD OVDD 100 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 240 239 238 237 236 235 234 233 232 231 230 229 228 227 226 225 224 223 222 221 220 219 218 217 216 215 214 213 212 211 210 209 208 207 206 205 204 203 202 201 200 199 198 197 196 195 194 193 192 191 190 189 188 187 186 185 184 183 182 181 OVDD GND OGND CI WT QACK TBEN TLBISYNC RSRV AP0 AP1 OVDD OGND AP2 AP3 CSE0 TC0 TC1 OVDD CLK_OUT OGND BR APE DPE CKSTP_OUT CKSTP_IN HRESET PLL_CFG0 SYSCLK PLL_CFG1 PLL_CFG2 AVDD PLL_CFG3 VDD GND LSSD_MODE L1_TSTCLK L2_TSTCLK TRST TCK TMS TDI TDO TSIZ0 TSIZ1 TSIZ2 OVDD OGND TBST TT0 TT1 SRESET INT SMI MCP TT2 TT3 OVDD GND OGND OVDD DL29 DL30 DL31 GND DH31 DH30 DH29 OGND OVDD DH28 DH27 DH26 DH25 DH24 DH23 OGND DH22 OVDD DH21 DH20 DH19 DH18 DH17 DH16 OGND DH15 OVDD DH14 DH13 DH12 DH11 DH10 DH9 OGND OVDD DH8 DH7 DH6 DL22 DL21 DL20 OGND OVDD DL19 DL18 DL17 DH5 DH4 DH3 OGND OVDD DH2 DH1 DH0 GND DL16 DL15 DL14 OGND TOP VIEW

5410B–HIREL–09/05 TSPC603R

10.2.1 Pinout Listing

Table 10-3. Power and Ground Pins CERQUAD Pin Number VCC GND PLL (AVDD) 209 Internal Logic 4, 14, 24, 34, 44, 59, 122, 137, 147, 157, 167, 177, 207 9, 19,29, 39, 49, 65, 116, 132, 142, 152, 162, 172, 182, 206, 239 Output Drivers 10, 20, 35, 45, 54, 61, 70, 79, 88, 96, 104, 112, 121, 128, 138, 148, 163, 173, 183, 194, 222, 229, 240 8, 18, 33, 43, 53, 60, 69, 77, 86, 95, 103, 111, 120, 127, 136, 146, 161, 171, 181, 193, 220, 228, 238 Table 10-4. Signal Pinout Listing Signal Name CERQUAD Pin Number A[0-31] 179, 2, 178, 3, 176, 5, 175, 6, 174, 7, 170, 11, 169, 12, 168, 13, 166, 15, 165, 16, 164, 17, 160, 21, 159, 22, 158, 23, 151, 30, 144, 37 AACK 28 ABB 36 APE 218 ARTRY 32 BG 27 BR 219 CI 237 CKSTP_IN 215 CKSTP_OUT 216 CLK_OUT 221 CSE[0-1] 225,150 DBB 145 DBG 26 DBDIS 153 DBWO 25 DH[0-31] 115, 114, 113, 110, 109, 108, 99, 98, 97, 94, 93, 92, 91, 90, 89, 87, 85, 84, 83, 82, 81, 80, 78, 76, 75, 74, 73, 72, 71, 68, 67, 66 DL[0-31] 143, 141, 140, 139, 135, 134, 133, 131, 130, 129, 126, 125, 124, 123, 119, 118, 117, 107, 106, 105, 102, 101, 100, 51, 52, 55, 56, 57, 58, 62, 63, 64 DPE 217 DRTRY 156 GBL 1 HRESET 214

5410B–HIREL–09/05 TSPC603R Notes: 1. These are test signals for factory use only and must be pulled up to V DD for normal machine operation. 2. OV DD inputs supply power to the I/O drivers and VDD inputs supply power to the processor core. Future members of the 603 family may use different OVDD and VDD input levels. INT 188 L1_TSTCLK(1) 204 L2_TSTCLK(1) 203 LSSD_MODE(1) 205 MCP 186 PLL_CFG[0-3] 213, 211, 210, 208 QACK 235 QREQ 31 RSRV 232 SMI 187 SRESET 189 SYSCLK 212 TA 155 TBEN 234 TBST 192 TC[0-1] 224, 223 TCK 201 TDI 199 TDO 198 TEA 154 TLBISYNC 233 TMS 200 TRST 202 TS 149 TSIZ[0-2] 197, 196, 195 TT[0-4] 191, 190, 185, 184, 180 WT 236 NC Table 10-4. Signal Pinout Listing (Continued) Signal Name CERQUAD Pin Number

5410B–HIREL–09/05 TSPC603R Table 10-5. Address and Data Bus Signal Index for Cerquad, CBGA 255 and CI-CGA 255 Packages Signal Name Abbreviation Signal Function Signal Type Address Bus A[0-31] If output, physical address of data to be transferred If input, represents the physical address of a snoop operation I/O Data Bus DH[0-31] Represents the state of data, during a data write operation if output, or during a data read operation if input I/O Data Bus DL[0-31] Represents the state of data, during a data write operation if output, or during a data read operation if input I/O Table 10-6. Signal Index for Cerquad, CBGA 255, HiTCE CBGA 255 and CI-CGA 255 Packages Signal Name Abbreviation Signal Function Signal Type Address Acknowledge AACK The address phase of a transaction is complete Input Address Bus Busy ABB If output, the 603R is the address bus master If input, the address bus is in use I/O Address Bus Parity AP[0-3] If output, represents odd parity for each of 4 bytes of the physical address for a transaction If input, represents odd parity for each of 4 bytes of the physical address for snooping operations I/O Address Parity Error APE Incorrect address bus parity detected on a snoop Output Address Retry ARTRY If output, detects a condition in which a snooped address tenure must be retried If input, must retry the preceding address tenure I/O Bus Grant BG May, with the proper qualification, assume mastership of the address bus Input Bus Request BR Request mastership of the address bus Output Cache Inhibit Cl A single-beat transfer will not be cached Output Checkstop Input CKSTP_IN Must terminate operation by internally gating off all clocks, and release all outputs Input Checkstop Output CKSTP_OUT Has detected a checkstop condition and has ceased operation Output Cache Set Entry CSE[0-1] Cache replacement set element for the current transaction reloading into or writing out of the cache Output Data Bus Busy DBB If output, the 603R is the data bus master If input, another device is bus master I/O Data Bus Disable DBDIS (For a write transaction) must release data bus and the data bus parity to high impedance during the following cycle Input Data Bus Grant DBG May, with the proper qualification, assume mastership of the data bus Input Data Bus Write Only DBW0 May run the data bus tenure Input Data Bus Parity DP[0-7] If output, odd parity for each of 8 bytes of data write transactions If input, odd parity for each byte of read data I/O Data Parity Error DPE Incorrect data bus parity Output Data Retry DRTRY Must invalidate the data from the previous read operation Input

5410B–HIREL–09/05 TSPC603R Global GBL If output, a transaction is global If input, a transaction must be snooped by the 603R I/O Hard Reset HRESET Initiates a complete hard reset operation Input Interrupt INT Initiates an interrupt if bit EE of MSR register is set Input Factory Test LSSD_MODE LSSD test control signal for factory use only Input L1_TSTCLK LSSD test control signal for factory use only Input L2_TSTCLK LSSD test control signal for factory use only Input Machine Check Interrupt MCP Initiates a machine check interrupt operation if the bit ME of MSR register and bit EMCP of HID0 register are set Input PLL Configuration PLL_CFG[0-3] Configures the operation of the PLL and the internal processor clock frequency Input Power supply indicator VOLTDETGND Available only on BGA package Indicates to the power supply that a low-voltage processor is present. Output Quiescent Acknowledge QACK All bus activity has terminated and the 603R may enter a quiescent (or low power) state Input Quiescent Request QREQ Is requesting all bus activity normally to enter a quiescent (low power) state Output Reservation RSRV Represents the state of the reservation coherency bit in the reservation address register Output System Management Interrupt SMI Initiates a system management interrupt operation if the bit EE of MSR register is set Input Soft Reset SRESET Initiates processing for a reset exception Input System Clock SYSCLK Represents the primary clock input for the 603R, and the bus clock frequency for 603R bus operation Input Test Clock CLK_OUT Provides PLL clock output for PLL testing and monitoring Output Transfer Acknowledge TA A single-beat data transfer completed successfully or a data beat in a burst transfer completed successfully Input Timebase Enable TBEN The timebase should continue clocking Input Transfer Burst TBST If output, a burst transfer is in progress If input, when snooping for single-beat reads I/O Transfer Code TC[0-1] Special encoding for the transfer in progress Output Test Clock TCK Clock signal for the IEEE P1149.1 test access port (TAP) Input Test Data Input TDI Serial data input for the TAP Input Test Data Output TDO Serial data output for the TAP Output Transfer Error Acknowledge TEA A bus error occurred Input TLBI Sync TLBISYNC Instruction execution should stop after execution of a tlbsync instruction Input Test Mode Select TMS Selects the principal operations of the test-support circuitry Input Test Reset TRST Provides an asynchronous reset of the TAP controller Input Transfer Size TSIZ[0-2] For memory accesses, these signals along with TBST indicate the data transfer size for the current bus operation I/O Table 10-6. Signal Index for Cerquad, CBGA 255, HiTCE CBGA 255 and CI-CGA 255 Packages (Continued) Signal Name Abbreviation Signal Function Signal Type

5410B–HIREL–09/05 TSPC603R 11. Electrical Characteristics

11.1 General Requirements

All static and dynamic electrical characteristics specified for inspection purposes and the rele- vant measurement conditions are given below:  Table 11-1: Static electrical characteristics for the electrical variants  Table 11-2: Dynamic electrical characteristics for the 603R The processor core frequency is determined by the bus (SYSCLK) frequency and the settings of the PLL_CFG0 to PLL_CFG3 signals. All timings ar e respectively specified to the rising edge of SYSCLK. These specifications are for 166 MHz to 300 MHz processor core frequencies for CBGA 255, HiTCE CBGA 255 and CI-CGA 255 packages and 166 MHz to 200 MHz processor core frequen- cies for the Cerquad 240 package.

11.2 Static Characteristics

Notes: 1. Excludes test signals (LSSD_MODE, L1_TSTCLK, L2_TSTCLK, and JTAG signals). 2. Capacitance is periodically sampled rather than 100% tested. Transfer Start TS If output, begun a memory bus transaction and the address bus and transfer attribute signals are valid If input, another master has begun a bus transaction and the address bus and transfer attribute signals are valid for snooping (see GBL) I/O Transfer Type TT[0-4] Type of transfer in progress I/O Write-through WT A single-beat transaction is write-through Output Table 10-6. Signal Index for Cerquad, CBGA 255, HiTCE CBGA 255 and CI-CGA 255 Packages (Continued) Signal Name Abbreviation Signal Function Signal Type Table 11-1. Electrical Characteristics with VDD = AVDD = 2.5V ±5%; OVDD = 3.3 ±5%V, GND = 0V, -55°C ≤ TC ≤ 125°C Characteristics Symbol Min Max Unit Input High Voltage (all inputs except SYSCLK) V IH 25 . 5 V Input Low Voltage (all inputs except SYSCLK) V IL GND 0.8 V SYSCLK Input High Voltage CV IH 2.4 5.5 V SYSCLK Input Low Voltage CV IL GND 0.4 V Input Leakage Current VIN = 3.465V(1)(3) IIN -3 0µ A VIN = 5.5V(1)(3) IIN - 300 µA Hi-Z (off-state) Leakage Current VIN = 3.465V(1)(3) ITSI -3 0µ A VIN = 5.5V(1)(3) ITSI - 300 µA Output High Voltage I OH = -7 mA V OH 2.4 - V Output Low Voltage I OL = +7 mA V OL -0 . 4 V Capacitance, VIN = 0V, f = 1 MHz(2) (excludes TS, ABB, DBB, and ARTRY)C IN -1 0p F Capacitance, VIN = 0V, f = 1 MHz(2) (for TS, ABB, DBB, and ARTRY)C IN -1 5p F

5410B–HIREL–09/05 TSPC603R 3. Leakage currents are measured for nominal OV DD and VDD or both OVDD and VDD. Same variation (for example, both VDD and OVDD vary by either +5% or -5%)

11.3 Dynamic Characteristics

11.3.1 Clock AC Specifications

Table 11-2 provides the clock AC timing specifications as defined in Figure 11-1. Notes: 1. Rise and fall times for the SYSCLK input are measured from 0.4V to 2.4V. 2. Cycle-to-cycle jitter is guaranteed by design. 3. Timing is guaranteed by design and characterization and is not tested. 4. The PLL relock time is the maximum amount of time required for PLL lock after a stable V DD, OVDD, AVDD and SYSCLK are reached during the power-on reset sequence. This specification also applies when the PLL has been disabled and subse- quently re-enabled during sleep mode. Also note that HRESET must be held asserted for a minimum of 255 bus clocks after the PLL relock time (100 µs) during the power-on reset sequence. 5. Caution: The SYSCLK frequency and PLL_CFG[0-3] settings must be chosen so that the resulting SYSCLK (bus) fre- quency, CPU (core) frequency, and PLL (VCO) frequency do not exceed their respective maximum or minimum operating frequencies. Refer to the PLL_CFG[0-3] signal description for valid PLL_CFG[0-3] settings. Figure 11-1. SYSCLK Input Timing Diagram Table 11-2. Clock AC Timing Specifications(1)(2)(3)(4) with VDD = AVDD = 2.5V ±5%; OVDD = 3.3 ±5%V, GND = 0V, -55°C ≤ TC ≤ 125°C Figure Number Characteristics CBGA 255, HiTCE CBGA 255, CI-CGA 255 and CERQUAD CBGA 255, HiTCE CBG A 255 and CI-CGA 255

166 MHz 200 MHz 233 MHz 266 MHz 300 MHz

Unit NoteMin Max Min Max Min Max Min Max Min Max Processor Frequency 150 166 150 200 180 233 180 266 180 300 MHz (5) VCO Frequency 300 332 300 400 360 466 360 532 360 600 MHz (5) SYSCLK (bus) 1 SYSCLK Cycle Time 15 30 13.3 30 13.3 30 13.3 30 13.3 30 ns 2,3 SYSCLK Rise and Fall Time –2–2–2–2–2 n s (1)

4 SYSCLK Duty Cycle

(1.4V measured) 40 60 40 60 40 60 40 60 40 60 % (3) SYSCLK Jitter – ±150 – ±150 – ±150 – ±150 – ±150 ps (2) 603R Internal PLL Relock Time – 100 – 100 – 100 – 100 – 100 µs (3)(4) VM CVil CVih SYSCLK 2 3 VM = Midpoint Voltage (1.4V) VM VM

5410B–HIREL–09/05 TSPC603R

11.3.2 Input AC Specifications

Table 11-3 provides the input AC timing specifications for the 603R as defined in Figure 11-2 and Figure 11-3. Notes: 1. All input specifications are measured from the TTL level (0.8 or 2V) of the signal in question to the 1.4V of the rising edge of the input SYSCLK. Both input and output timings are measured at the pin. See Figure 11-3. 2. Address/data/transfer attribute input signals are composed of the following: A[0-31], AP[0-3], TT[0-4], TC[0-1], TBST, TSIZ[0-2], GBL, DH[0-31], DL[0-31], DP[9-7]. 3. All other input signals are composed of the following: TS , ABB, DBB, ARTRY, BG, AACK, DBG, DBWO, TA, DRTRY, TEA, DBDIS, HRESET, SRESET, INT, SMI, MCP, TBEN, QACK, TLBISYNC. 4. The setup and hold time is with respect to the rising edge of HRESET. See Figure 11-3. 5. t sysclk is the period of the external clock (SYSCLK) in nanoseconds (ns). The numbers given in the table must be multiplied by the period of SYSCLK to compute the actual time duration (in nanoseconds) of the parameter in question. 6. These values are guaranteed by design, and are not tested. 7. This specification is for configur ation mode only. Also note that HRESET must be held asserted for a minimum of 255 bus clocks after the PLL relock time (100 µs) during the power-on reset sequence. Figure 11-2. Input Timing Diagram Table 11-3. Input AC Timing Specifications(1) with VDD = AVDD = 2.5V ±5%; OVDD = 3.3 ±5%V, GND = 0V, -55°C ≤ TC ≤ 125°C Figure Number Characteristics CBGA 255, HiTCE CBGA 255, CI-CGA 255 and Cerquad

240 Packages

CBGA 255, HiTCE CBGA 255 and CI-CGA 255 Unit Note 166, 200 MHz 233, 266 MHz 300 MHz Min Max Min Max Min Max 10a Address/data/transfer attribute inputs valid to SYSCLK (input setup) 2.5 – 2.5 – 2.5 – ns (2) 10b All other inputs valid to SYSCLK (input setup) 4 – 3.5 – 3.5 – ns (3) 10c Mode select inputs valid to HRESET (input setup) (for DRTRY, QACK and TLBISYNC) 8– 8 – 8 – tsyscl k (4)(5)(6 )(7) 11a SYSCLK to address/data/transfer attribute inputs invalid (input hold) 1– 1 – 1 – n s (2) 11b SYSCLK to all other inputs invalid (input hold) 1 – 1 – 1 – ns (3) 11c HRESET to mode select inputs invalid (input hold) (for DRTRY, QACK, and TLBISYNC) 0– 0 – 0 – n s (4)(6) (7) VM SYSCLK All inputs VM = Midpoint Voltage (1.4V) 10a 10b 11a 11b

5410B–HIREL–09/05 TSPC603R Figure 11-3. Mode Select Input Timing Diagram

11.3.3 Output AC Specifications

Table 11-4 provides the output AC timing specifications for the 603R (shown in Figure 11-4). MODE PINS HRESET 10c 11c VM = Midpoint Voltage (1.4V) VM Table 11-4. Output AC Timing Specifications(1)(2) with VDD = AVDD = 2.5V ±5%; OVDD = 3.3 ±5%V, GND = 0V, CL = 50 pF, 55°C ≤ TC ≤ 125°C Number Characteristics CBGA 255, HiTCE CBGA 255, CI-CGA 255 and Cerquad CBGA 255, HiTCE CBGA 255 and CI-CGA 255 Unit Note 166, 200 MHz 233, 266 MHz 300 MHz Min Max Min Max Min Max

12 SYSCLK to output driven (output

enable time) 1– 1 – 1 – n s 13a SYSCLK to output valid (5.5V to 0.8V – TS, ABB, ARTRY, DBB) –9 – 9 – 9 n s (4) 13b SYSCLK to output valid (TS, ABB, ARTRY, DBB) –8 – 8 – 8 n s (6) 14a SYSCLK to output valid (5.5V to 0.8V – all except TS, ABB, ARTRY, DBB) –1 1 – 1 1 – 1 1 n s (4) 14b SYSCLK to output valid (all except TS, ABB, ARTRY, DBB) –9 – 9 – 9 n s (6)

15 SYSCLK to output invalid (output hold) 1 – 1 – 1 – ns (3)

16 SYSCLK to output high impedance

(all except ARTRY, ABB, DBB) –8 . 5 – 8 – 8 n s

17 SYSCLK to ABB, DBB, high impedance

after precharge –1 – 1 – 1 t SYSCLK (5)(7)

18 SYSCLK to ARTRY high impedance

before precharge –8 – 7 . 5 – 7 . 5 n s

19 SYSCLK to ARTRY precharge enable

0.2 × tSYSCLK + 1 0.2 × tSYSCLK + 1 – 0.2 × tSYSCLK –n s (3)(5) (8)

20 Maximum delay to ARTRY precharge – 1 – 1 – 1 t SYSCLK

(5)(8)

21 SYSCLK to ARTRY high impedance

after precharge –2 – 2 – 2 t SYSCLK (6)(8)

5410B–HIREL–09/05 TSPC603R Notes: 1. All output specifications are measur ed from the 1.4V of the rising edge of SYSCLK to the TTL level (0.8V or 2V) of the signal in question. Both input and output timings are measured at the pin. See Figure 11-4. 2. All maximum timing specifications assume C L = 50 pF . 3. This minimum parameter assumes C L = 0 pF . 4. SYSCLK to output valid (5.5V to 0.8V) includes the extra delay associated with discharging the external voltage from 5.5V to 0.8V instead of from VDD to 0.8V (5V CMOS levels instead of 3.3V CMOS levels). 5. t sysclk is the period of the external bus clock (SYSCLK) in nanoseconds (ns). The numbers given in the table must be multi- plied by the period of SYSCLK to compute the actual time duration (ns) of the parameter in question. 6. The output signal transitions from GND to 2V or V DD to 0.8V. 7. The nominal precharge width for ABB and DBB is 0.5 × tsysclk. 8. The nominal precharge width for ARTRY is 1 × tsysclk. Figure 11-4. Output Timing Diagram SYSCLK TS ARTRY ABB, DBB VM VM VM = Midpoint Voltage (1.4V) VM ALL OUTPUTS (Except TS, ABB, DBB, ARTRY)

5410B–HIREL–09/05 TSPC603R

11.4 JTAG AC Timing Specifications

Notes: 1. TRST is an asynchronous signal. The setup time is for test purposes only. 2. Non-test signal input ti ming with respect to TCK. 3. Non-test signal output timing with respect to TCK. Figure 11-5. Clock Input Timing Diagram Figure 11-6. TRST Timing Diagram Table 11-5. JTAG AC Timing Specifications (independent of SYSCLK); VDD = AVDD = 2.5V ±5%; OVDD = 3.3 ±5%V, GND = 0V, CL = 50 pF, -55°C ≤ TC ≤ 125°C Number Characteristi cs Min Max Unit Notes TCK frequency of operation 0 16 MHz 1 TCK cycle time 62.5 – ns 2 TCK clock pulse width measured at 1.4V 25 – ns

3 TCK rise and fall times 0 3 ns

setup time to TCK rising edge 13 – ns (1) 5T R S T assert time 40 – ns

6 Boundary scan input data setup time 6 – ns (2)

7 Boundary scan input data hold time 27 – ns (2)

8 TCK to output data valid 4 25 ns (3)

9 TCK to output high impedance 3 24 ns (3)

10 TMS, TDI data setup time 0 – ns

11 TMS, TDI data hold time 25 – ns

12 TCK to TDO data valid 4 24 ns

13 TCK to TDO high impedance 3 15 ns

VM = Midpoint Voltage (1.4V) TRST TCK VM

5410B–HIREL–09/05 TSPC603R Figure 11-7. Boundary-scan Timing Diagram Figure 11-8. Test Access Port Timing Diagram 12. Functional Description

12.1 PowerPC Registers and Programming Model

The PowerPC architecture defines register-to-register operations for most computational instruc- tions. Source operands for these instructions are accessed from the registers or are provided as immediate values embedded in the instruction opcode. The three-register instruction format allows specification of a target register distinct from the two source operands. Load and store instructions transfer data between registers and memory. PowerPC processors have two levels of privilege—supervisor mode of operation (typically used by the operating system) and user mode of operation (used by the application software). The programming models incorporate 32 GPRs, 32 FPRs, Special-purpose Registers (SPRs) and several miscellaneous registers. Each PowerPC microprocessor also has its own unique set of Hardware Implementation (HID) registers. TCK Data Inputs Data Outputs Data Outputs Data Outputs 6 7 VMVM Output data valid Output data valid Input data valid TCK TDI, TMS TDO TDO TDO VM VM 10 11 Output Data Valid Output Data Valid Input Data Valid

5410B–HIREL–09/05 TSPC603R Having access to privilege instructions, registers, and other resources allows the operating sys- tem to control the application environment (pro viding virtual memory and protecting operating system and critical machine resources). Instructions that control the state of the processor, the address translation mechanism, and supervisor registers can be executed only when the pro- cessor is operating in supervisor mode. The following sections summarize the PowerPC registers that are implemented in the 603R.

12.1.1 General-purpose Registers (GPRs)

The PowerPC architecture defines 32 user-level, General-purpose Registers (GPRs). These registers are either 32 bits wide in 32-bit PowerPC microprocessors or 64 bits wide in 64-bit PowerPC microprocessors. The GPRs serve as the data source or destination for all integer instructions.

12.1.2 Floating-point Registers (FPRs)

The PowerPC architecture also defines 32 user -level, 64-bit Floating-point Registers (FPRs). The FPRs serve as the data source or destination for floating-point instructions. These registers can contain data objects of either single- or double-precision floating-point formats.

12.1.3 Condition Register (CR)

The CR is a 32-bit user-level register that consists of eight four-bit fields that reflect the results of certain operations, such as move, integer and floating-point compare, arithmetic, and logical instructions, and provide a mechanism for testing and branching.

12.1.4 Floating-Point Status and Control Register (FPSCR)

The Floating-point Status and Control Register (FPSCR) is a user-level register that contains all exception signal bits, exception summary bits, exception enable bits, and rounding control bits needed for compliance with the IEEE 754 standard.

12.1.5 Machine State Register (MSR)

The Machine State Register (MSR) is a supervisor-level register that defines the state of the pro- cessor. The contents of this register are saved when an exception is taken and restored when the exception handling is completed. The 603R implements the MSR as a 32-bit register, 64-bit PowerPC processors implement a 64-bit MSR.

12.1.6 Segment Registers (SRs)

For memory management, 32-bit PowerPC microprocessors implement sixteen 32-bit Segment Registers (SRs). To speed access, the 603R implements the segment registers as two arrays; a main array (for data memory accesses) and a shadow array (for instruction memory accesses). Loading a segment entry with the Move to Segm ent Register (STSR) instruction loads both arrays.

5410B–HIREL–09/05 TSPC603R

12.1.7 Special-purpose Registers (SPRs)

The powerPC operating environment architecture defines numerous special-purpose registers that serve a variety of functions, such as providing controls, indicating status, configuring the processor, and performing special operations. Du ring normal execution, a program can access the registers, shown in Figure 12-1 on page 32 , depending on the program’s access privilege (supervisor or user, determined by the privilege-level (PR) bit in the MSR. Note that registers such as the GPRs and FPRs are accessed through operands that are part of the instructions. Access to registers can be explicit (that is, through the use of specific instructions for that pur- pose such as Move to special-purpose register (mtspr) and move from special-purpose register (mfspr) instructions or implicit, as the part of the execution of an instruction. Some registers are accessed both explicitly and implicitly. In the 603R, all SPRs are 32 bits wide.  User-level SPRs: The following 603R SPRs are accessible by user-level software: – Link Register (LR) - The link register can be used to provide the branch target address and to hold the return address after branch and link instructions. The LR is 32 bits wide in 32-bit implementations. – Count Register (CTR) - The CRT is decremented and tested automatically as a result of branch-and-count instructions. The CTR is 32 bits wide in 32-bit implementations. – Integer Exception Register (XER) - The 32-bit XER contains the summary overflow bit, integer carry bit, overflow bit, and a field specifying the number of bytes to be transferred by a Load String Word Indexed (LSWX) or Store String Word Indexed (STSWX) instruction.  Supervisor-level SPRs: The 603R also contains SPRs that can be acce ssed only by supervisor-level software. These registers consist of the following: – The 32-bit DSISR defines the cause of data access and alignment exceptions. – The Data Address Register (DAR) is a 32-bit register that holds the address of an access after an alignment or DSI exception. – Decrementer register (DEC) is a 32-bit decrementing counter that provides a mechanism for causing a decrementer exception after a programmable delay. – The 32-bit SDR1 specifies the page table format used in virtual-to-physical address translation for pages. (Note that physical address is referred to as real address in the architecture specification). – The machine status Save/Restore Register 0 (SRR0) is a 32-bit register that is used by the 603R for saving the address of the instruction that caused the exception, and the address to return to when a Return from Interrupt ( RFI) instruction is executed. – The machine status Save/Restore Register 1 (SRR1) is a 32-bit register used to save machine status on exceptions and to restore machine status when an RFI instruction is executed. – The 32-bit SPRG0-SPRG3 registers are provided for operating system use. – The External Access Register (EAR) is a 32-bit register that controls access to the external control facility through the External Control In Word Indexed (ECIWX) and External Control Out Word Indexed (ECOWX) instructions.

5410B–HIREL–09/05 TSPC603R – The Time Base register (TB) is a 64-bit register that maintains the time of day and operates interval timers. The TB consists of two 32-bit fields - Time Base Upper (TBU) and Time Base Lower (TBL). – The Processor Version Register (PVR) is a 32-bit, read-only register that identifies the version (model) and revision level of the PowerPC processor. – Block Address Translation (BAT) arrays - The PowerPC architecture defines 16 BAT registers, divided into four pairs of Data BATs (DBATs) and four pairs of instruction BATs (IBATs). See Figure 12-1 for a list of the SPR numbers for the BAT arrays. The following supervisor-level SPRs are implementation-specific to the 603R: – The DMISS and IMISS registers are read-only registers that are loaded automatically upon an instruction or data TLB miss. – The HASH1 and HASH2 registers contain the physical addresses of the primary and secondary Page Table Entry Groups (PTEGs). – The ICMP and DCMP registers contain a duplicate of the first word in the Page Table Entry (PTE) for which the table search is looking. – The Required Physical Address (RPA) register is loaded by the processor with the second word of the correct PTE during a page table search. – The hardware implementation (HID0 and HID1) registers provide the means for enabling the 603R’s checkstops and features, and allows software to read the configuration of the PLL configuration signals. – The Instruction Address Breakpoint Register (IABR) is loaded with an instruction address that is compared to instruction addresses in the dispatch queue. When an address match occurs, an instruction address breakpoint exception is generated. Figure 12-1 shows all the 603R registers available at the user and supervisor level. The number to the right of the SPRs indicate the number that is used in the syntax of the instruction operands to access the register.

5410B–HIREL–09/05 TSPC603R Figure 12-1. PowerPC Microprocessor Programming Model – Register USER MODEL General-purpose Registers GPR0 GPR1 GPR31 FPR0 FPR1 CR GPR31 Floating-point Registers Condition Register XER XER LR CTR TBL TBU FPSCR Link Register Count Register Floating-point Status and Control Register SPR1 SPR8 SPR9 Time Base Facility (for reading) TBR 268 TBR 269 SUPERVISOR MODEL Hardware Implementation Registers(1) HID0 HID1 Instruction BAT Registers IBAT0U IBAT0L IBAT1U IBAT1L IBAT2U IBAT2L IBAT3U IBAT3L SPR 528 SPR1 008 SPR1 009 SPR 529 SPR 530 SPR 531 SPR 532 SPR 533 SPR 534 SPR 535 SPR 536 SPR 537 SPR 538 SPR 539 SPR 540 SPR 541 SPR 542 SPR 543 SPR 976 SPR 977 SPR 978 SPR 979 SPR 980 SPR 981 SPR 982 SPR 25 SDR1 SDR1 Miscellaneous Registers Data BAT Registers DBAT0U DBAT0L DBAT1U DBAT2U DBAT1L DBAT2L DBAT3L DBAT3U Software Table Search Registers(1) Segment Registers DMISS DCMP HASH1 HASH2 IMISS ICMP RPA SR0 SR1 SR 15 Data Address Register DSISR DAR SPRGs Save and Restore SPRG0 SPRG1 SPRG2 SPRG3 MSR Machine State Register PVR Processor Version Register Configuration Registers SPR 287 Memory Management Registers Exception Handling Registers SPR 19 DSISR SPR 18 Decrementer DEC SPR 22 SRR0 SPR 26 SRR1 SPR 27 SPR 272 SPR 273 SPR 274 SPR 275 Time Base Facility (for writing) TBL SPR 284 TBU SPR 285 Instruction Address Breakpoint Register(1) IABR SPR 1010 External Address Register (Optional) EAR SPR 282

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12.2 Instruction Set and Addressing Modes

The following subsections describe the PowerPC instruction set and addressing modes in general.

12.2.1 PowerPC Instruction Set and Addressing Modes

All PowerPC instructions are encoded as single-word (32-bit) opcodes. Instruction formats are consistent among all instruction types, permitting efficient decoding to occur in parallel with oper- and accesses. This fixed instruction length and consistent format greatly simplifies instruction pipelining. PowerPC Instruction Set The PowerPC instructions are divided into the following categories:  Integer Instructions – these include computational and logical instructions – Integer arithmetic instructions – Integer compare instructions – Integer logical instructions – Integer rotate and shift instructions  Floating-point Instructions – these include floating-point computational instructions, as well as instructions that affect the FPSCR – Floating-point arit hmetic instructions – Floating-point multiply/add instructions – Floating-point rounding and conversion instructions – Floating-point compare instructions – Floating-point status and control instructions  Load/Store Instructions – these include integer and floating-point load and store instructions – Integer load and store instruction – Integer load and store multiple instructions – Floating-point load and store – Primitives used to construct atomic memory operations ( lwarx and stwcx instructions)  Flow Control Instructions – these include branching instructions, condition register logical instructions, trap instructions, and other instructions that affect the instruction flow – Branch and trap instructions – Condition register logical instructions  Processor Control Instructions – these instructions are used for synchronizing memory accesses and management of caches, TLBs, and the segment registers – Move to/from SPR instructions – Move to/from MSR – Synchronize – Instruction synchronize

5410B–HIREL–09/05 TSPC603R  Memory Control Instructions – these instructions provide control of caches, TLBs, and segment registers – Supervisor-level cache management instructions – User-level cache instructions – Segment register manipulation instructions – Translation lookaside buffer management instructions Note that this grouping of the instructions does not indicate which execution unit executes a par- ticular instruction or group of instructions. Integer instructions operate on byte, half-word, and word operands. Floating-point instructions operate on single-precision (one word) and double-precision (one double word) floating-point operands. The PowerPC architecture uses instructions that are four bytes long and word-aligned. It provides for byte, half-word, and word operand loads and stores between the memory and a set of 32 GPRs. It also provides for word and double-word operand loads and stores between the memory and a set of 32 Floating-point Registers (FPRs). Computational instructions do not modify the memory. To use a memory operand in a computa- tion and then modify the same or another memory location, the memory contents must be loaded into a register, modified, and then written back to the target location with distinct instructions. PowerPC processors follow the program flow when they are in the normal execution state. How- ever, the flow of instructions can be interrupted dire ctly by the execution of an instruction or by an asynchronous event. Either kind of exception may cause one of several components of the system software to be invoked.  Calculating Effective Address The Effective Address (EA) is the 32-bit address computed by the processor when executing a memory access or branch instruction or when fetching the next sequential instruction. The PowerPC architecture supports two simple memory addressing modes: – EA = (RA|0) + offset (including offset = 0) (register indirect with immediate index) – EA = (RA|0) + rB (register indirect with index) These simple addressing modes allow efficient address generation for memory accesses. Cal- culation of the effective address for aligned transfers occurs in a single clock cycle. For a memory access instruction, if the sum of the effective address and the operand length exceeds the maximum effective address, the memory operand is considered to wrap around from the maximum effective address to effective address 0. Effective address computations for both data and instruction accesses use 32-bit unsigned binary arithmetic. A carry over from bit 0 is ignored in 32-bit implementations.

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12.2.2 PowerPC 603R Microprocessor Instruction Set

The 603R instruction set is defined as follows:  The 603R provides hardware support for all 32-bit PowerPC instructions.  The 603R provides two implementation-specific instructions used for software table search operations following TLB misses: – Load Data TLB Entry ( tlbld) – Load Instruction TLB Entry ( tlbli)  The 603R implements the following instructions which are defined as optional by the PowerPC architecture : – External Control in Word Indexed (eciwx) – External Control Out Word Indexed (ecowx) – Floating Select (fsed) – Floating Reciprocal Esti mate Single-Precision (fres) – Floating Reciprocal Square Root Estimate ( frsqrte) – Store Floating-Point as Integer Word (stfiwx)

12.3 Cache Implementation

The following subsections describe the way the PowerPC architecture deals with cache in gen- eral, and the 603R’s specific implementation.

12.3.1 PowerPC Cache Characteristics

The PowerPC architecture does not define har dware aspects of cache implementations. For example, some PowerPC processors, including the 603R, have separate instruction and data caches (harvard architecture). The PowerPC microprocessor controls the following memory access modes on a page or block basis:  Write-back/write-through mode  Cache-inhibited mode  Memory coherency Note that in the 603R, a cache line is defined as eight words. The VEA defines cache manage- ment instructions that provide a means by which the application programmer can affect the cache contents.

12.3.2 PowerPC 603R Microprocessor Cache Implementation

The 603R has two 16-Kbyte, four-way set-associative (instruction and data) caches. The caches are physically addressed, and the data cache can operate in either write-back or write-through modes as specified by the PowerPC architecture. The data cache is configured as 128 sets of four lines each. Each line consists of 32 bytes, two state bits, and an address tag. The two state bits implement the three-state MEI (Modified/Exclu- sive/Invalid) protocol. Each line contains eight 32-bit words. Note that the PowerPC architecture defines the term block as the cacheable unit. For the 603R, the block size is equivalent to a cache line. A block diagram of the data cache organization is shown in Figure 12-2 on page 36.

5410B–HIREL–09/05 TSPC603R The instruction cache also consists of 128 sets of 4 lines, and each line consists of 32 bytes, an address tag, and a valid bit. The instruction cache may not be written to except through a line fill operation. The instruction cache is not snooped, and cache coherency must be maintained by software. A fast hardware invalidation capability is provided to support cache maintenance. The organization of the instruction cache is very similar to the data cache shown in Figure 12-2 on page 36. Each cache line contains eight contiguous words from memory that are loaded from an 8-word boundary (that is, bits A27-A32 of the effectiv e addresses are zero); thus, a cache line never crosses a page boundary. Misaligned accesses across a page boundary can incur a perfor- mance penalty. The 603’s cache lines are loaded in four beats of 64 bits each. The burst load is performed as “critical double word first”. The cache that is be ing loaded is blocked to internal accesses until the load is completed. The critical double word is simultaneously written to the cache and for- warded to the requesting unit, thus minimizing stalls due to load delays. To ensure coherency among caches in a multiprocessor (or multiple caching device) implemen- tation, the 603R implemements the MEI protocol. These three states, modified, exclusive, and invalid, indicate the state of the cache block as follows:  Modified - the cache line is modified with respect to system memory; that is, data for this address is valid only in the cache and not in the system memory  Exclusive - this cache line holds valid data that is identical to the data at this address in- system memory. No other cache has this data  Invalid - this cache line does not hold valid data Cache coherency is enforced by on-chip bus s nooping logic. Since the 603R’s data cache tags are single ported, a simultaneous load or store and snoop access represent a resource conten- tion. The snoop access is granted first access to the tags. The load or store then occurs on the clock following snoop. Figure 12-2. Data Cache Organization Block 0 State State State State Address Tag 0 Address Tag 1 Address Tag 2 Address Tag 3 Block 1 Block 2 Block 3 Words 0-07 Words 0-07 Words 0-07 Words 0-07 8 words/block 128 sets

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12.3.3 Exception Model

The following subsections describe the PowerPC exception model and the 603R implementation.

12.3.4 PowerPC Exception Model

The PowerPC exception mechanism allows the pr ocessor to change to supervisor state as a result of external singles, errors, or unusual co nditions arising in the execution of instructions, and differ from the arithmetic exceptions defined by the IEEE for floating-point operations. When exceptions occur, information about the state of the processor is saved to certain registers and the processor begins execution at an address (exception vector) predetermined for each excep- tion. Processing of exceptions occurs in supervisor mode. Although multiple exception conditions can map to a single exception vect or, a more specific condition may be determined by examining a regi ster associated with the exception - for exam- ple, the DSISR and the FPSCR. Additionally, so me exception conditions can be explicitly enabled or disabled by software. The PowerPC architecture requires that exceptions be handled in program order; therefore, although a particular implementation may recognize exception conditions out of order, they are presented strictly in order. When an instruction-caused exception is recognized, any unexecuted instructions that appear earlier in the instruction stream, including any that have not yet entered the execute state, must be completed before the exception is taken. Any exceptions caused by such instructions are handled first. Likewise, e xceptions that are asynchronous and precise are recognized when they occur, but are not handled until the instruction currently in the completion state successfully completes execution or generates an exception, and the completed store queue is emptied. Unless a catastrophe event causes a system reset or machine check exception, only one excep- tion is handled at a time. If, for example, a single instruction encounters multiple exception conditions, those conditions are encountered sequentially. After the exception handler handles an exception, the instruction execution continues until the next exception condition is encountered. However, in many cases there is no attempt to re-exe- cute the instruction. This method of reco gnizing and handling excepti on conditions sequentially guarantees that exceptions are recoverable. Exception handlers should save the information stored in SRR0 and SRR1 early to prevent the program state from being lost due to a system reset and machine check exception or to an instruction-caused exception in the exception handler, and before enabling external interrupts. The PowerPC architecture supports four types of exceptions:  Synchronous, Precise – these are caused by instructions. All instruction-caused exceptions are handled precisely; that is, the machine state at the time the exception occurs is known and can be completely restored. This means that (excluding the trap and system call exceptions) the address of the faulting instruction is provided to the exception handler and that neither the faulting instruction nor subsequent instructions in the code stream will complete execution before the exception is taken. Once the exception is processed, execution resumes at the address of the faulting instruction (or at an alternate address provided by the exception handler). When an exception is taken due to a trap or system call instruction, execution resumes at an address provided by the handler.

5410B–HIREL–09/05 TSPC603R  Synchronous, Imprecise – the PowerPC architecture defines two imprecise floating-point exception modes, recoverable and nonrecoverable. Even though the 603R provides a means to enable the imprecise modes, it implements these modes identically to the precise mode (That is, all enabled floating-point exceptions are always precise on the 603R).  Asynchronous, Maskable – the external, SMI, and decrementer interrupts are maskable asynchronous exceptions. When these exceptions occur, their handling is postponed until the next instruction, and any exceptions associated with that instruction completes execution. If there are no instructions in the execution units, the exception is taken immediately upon determination of the correct restart address (for loading SRR0).  Asynchronous, Non-maskable – there are two non-maskable asynchronous exceptions: the system reset and machine check exception. These exceptions may not be recoverable, or may provide a limited degree of recoverability. All exceptions report recoverability through the SMR[RI] bit.

12.3.5 PowerPC 603R Microprocessor Exception Model

As specified by the PowerPC architecture, all 603R exceptions can be described as either pre- cise or imprecise and either synchronous or as ynchronous. Asynchronous exceptions (some of which are maskable) are caused by events extern al to the processor’s execution; synchronous exceptions, which are all handled precisely by the 603R, are caused by instructions. The 603R exception classes are shown in Table 12-1. Although exceptions have other characteristics as well, such as whether they are maskable or non-maskable, the distinctions shown in Table 12-1 define categories of exceptions that the 603R handles uniquely. Note that Table 12-1 includes no synchronous imprecise instructions. While the PowerPC architecture supports imprecise handling of floating-point exceptions, the 603R implements these exception modes as precise exceptions. The 603R’s exceptions, and conditions that cause them, are listed in Table 12-2. Exceptions that are specific to the 603R are indicated. Table 12-1. PowerPC 603R Microprocessor Exception Classifications Synchronous/Asynchronous Precise/Imprecise Exception Type Asynchronous, Non Maskable Imprecise Machine check System reset Asynchronous, Maskable Precise External interrupt Decrementer System management interrupt Synchronous Precise Instruction-caused exceptions Table 12-2. Exceptions and Conditions Exception Type Vector Offset (hex) Causing Conditions Reserved 00000 – System reset 00100 A system reset is caused by the assertion of either SRESET or HRESET Machine check 00200 A machine check is caused by the assertion of the TEA signal during a data bus transaction, assertion of MCP , or an address or data parity error

5410B–HIREL–09/05 TSPC603R DSI 00300 The cause of a DSI exception can be determined by the bit settings in the DSISR, listed as follows:

1 Set if the translation of an attempted access is not found in the primary hash table entry

group (HTEG), or in the rehashed secondary HTEG, or in the range of the DBAT register; otherwise cleared

4 Set if a memory access is not permitted by the page or DBAT protection mechanism;

5 Set by an eciwx or ecowx instruction if the access is to an address that is marked as

write-through, or execution of a load/store instruction that accesses a direct-store segment

6 Set for a store operation and cleared for a load operation

11 Set if eciwx or ecowx is used and EAR[E] is cleared

An ISI exception is caused when an instruction fetch cannot be performed for any of the following reasons:  The effective (logical) address cannot be translated. That is, there is a page fault for this portion of the translation, so an ISI exception must be taken to load the PTE (and possibly the page) into memory  The fetch access violates memory protection. If the key bits (Ks and Kp) in the segment register and the PP bits in the PTE are set to prohibit read access, instructions cannot be fetched from this location External interrupt 00500 An external interrupt is caused when MSR[EE] = 1 and the INT signal is asserted Alignment 00600 An alignment exception is caused when the 603e cannot perform a memory access for any of the reasons described below:  The operand of a floating-point load or store instruction is not word-aligned  The operand of lmw, stmw, lwarx, and stwcx, instructions are not aligned  The operand of a single-register load or store operation is not aligned, and the 603e is in little-endian mode  The instruction is lmw, stmw, lswi, lwsx, stswi, stswx and the 603e is in little- endian mode  The operand of dcbz is in storage that is write-through-required, or caching inhibited Table 12-2. Exceptions and Conditions (Continued) Exception Type Vector Offset (hex) Causing Conditions

5410B–HIREL–09/05 TSPC603R Program 00700 A program exception is caused by one of the following exception conditions, which correspond to bit settings in SRR1 and arise during execution of an instruction:  Floating-point enabled exception – A floating-point enabled exception condition is generated when the following condition is met: (MSR[FE0] | MSR[FE1]) & FPSCR[FEX] is 1 FPSER[FEX] is set by the execution of a floating-point instruction that causes an enabled exception or by the execution of one of the “move to FPSCR” instructions that results in both an exception condition bit and its corresponding enable bit being set in the FPSCR  Illegal instruction – an illegal instruct ion program exception is generated when execution of an instruction is attempted with an illegal opcode or illegal combination of opcode and extended opcode fields (including PowerPC instructions not implemented in the 603e), or when execution of an optional instruction not provided in the 603e is attempted (these do not include those optional instructions that are treated as no-ops)  Privileged instruction – a privileged instruction type program exception is generated when the execution of a privileged instruction is attempted and the MSR register user privilege bit, MSR[PR], is set. In the 603e, this exception is generated for mtspr or mfspr with an invalid SPR field if SPR[0] = 1 and MSR[PR] = 1. This may not be true for all PowerPC processors  Trap – a trap type program exception is generated when any of the conditions specified in a trap instruction is met Floating-point unavailable 00800 A floating-point unavailable exception is caused by an attempt to execute a floating-point instruction (including floating-point load, store, and more instructions) when the floating- point available bit is disabled, (MSR[FP] = 0) Decrementer 00900 The decrementer exception occurs when the most significant bit of the decrementer (DEC) register transitions from 0 to 1. Must also be enabled with the MSR[EE] bit Reserved 00A00–00BFF – System call 00C00 A system call e xception occurs when a System Call (sc) instruction is executed Trace 00D00 A trace execution is taken when MSR[SE] = 1 or when the currently completing instruction is a branch and MSR[BE] = 1 Reserved 00E00 The 603e does not generate an exception to this vector. Other PowerPC processors may use this vector for floating-point assist exceptions Reserved 00E10–00FFF – Instruction translation miss 01000 An instruction translation miss exception is caused when an effective address for an instruction fetch cannot be translated by the ITLB Data load translation miss 01100 A data load translation miss exception is caused when an effective address for a data load operation cannot be translated by the DTLB Data store translation miss 01200 A data store translation miss exception is caused when an effective address for a data store operation cannot be translated by the DTLB; or where a DTLB hit occurs, and the change bit in the PTE must be set due to a data store operation Table 12-2. Exceptions and Conditions (Continued) Exception Type Vector Offset (hex) Causing Conditions

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12.4 Memory Management

The following subsections describe the memory management features of the PowerPC architec- ture, and the 603R implementation, respectively.

12.4.1 PowerPC Memory Management

The primary functions of the MMU are to transla te logical (effective) addresses to physical addresses for memory accesses, and to provide access protection on blocks and pages of memory. There are two types of accesses generated by the 603R that require address translation — instruction accesses, and data accesses to memory generated by load and store instructions. The PowerPC MMU and exception model support demand-paged virtual memory. Virtual mem- ory management permits execution of programs larger than the size of physical memory; demand-paged implies that individual pages are l oaded into physical memory from system memory only when they are first accessed by an executing program. The hashed page table is a variable-sized data st ructure that defines the mapping between vir- tual page numbers and physical page numbers. The page table size is a power of 2, and its starting address is a multiple of its size. The page table contains a number of Page Table Entry Groups (PTEGs). A PTEG contains eight Page Table Entries (PTEs) of eight bytes each; therefore, each PTEG is 64 bytes long. PTEG addresses are entry points for table search operations. Address translations are enabled by setting bits in the MSR-MSR[IR] enables instruction address translations and MSR[DR] enables data address translations.

12.4.2 PowerPC 603R Microprocessor Memory Management

The instruction and data memory management units in the 603R provide 4 Gbytes of logical address space accessible to the supervisor and user programs with a 4 Kbyte page size and 256M byte segment size. Block sizes range from 128 Kbytes to 256 Mbytes and are software selectable. In addition, the 603R uses an inte rim 52-bit virtual address and hashed page tables for generating 32-bit physical addresses. The MMUs in the 603R rely on the exception process- ing mechanism for the implementation of the paged virtual memory environment and for enforcing protection of designated memory areas. Instruction and data TLBs provide address translation in parallel with the on-chip cache access, incurring no additional time penalty in the event of a TLB hit. A TLB is a cache of the most recently used page table entries. The software is responsible for maintaining the consistency of the TLB with memory. Instruction address breakpoint 01300 An instruction address breakpoint exception occurs when the address (bits 0-29) in the IABR matches the next instruction to complete in the completion unit, and the IABR enable bit (bit 30) is set to 1 System management interrupt

01400 A system management interrupt is caused when MSR[EE] = 1 and the SMI

Reserved 01500–02FFF – Table 12-2. Exceptions and Conditions (Continued) Exception Type Vector Offset (hex) Causing Conditions

5410B–HIREL–09/05 TSPC603R The 603R’s TLBs are 64-entry, 2-way set-associat ive caches that contain instruction and data address translations. The 603R provides hardware assistance for software table search opera- tions through the ashed page table on the TLB misses. The supervisor software can invalidate TLB entries selectively. The 603R also provides independent four-entry BAT arrays for instructions and data that main- tain address translations for bl ocks of memory. These entries de fine blocks that can vary from 128 Kbytes to 256 Mbytes. The BAT arrays are maintained by system software. As specified by the PowerPC architecture, the ha shed page table is a variable-sized data struc- ture that defines the mapping between virtual page numbers and physical page numbers. The page table size is a power of 2, and its starting address is a multiple of its size. Also as specified by the PowerPC architecture, the page table contains a number of Page Table Entry Groups (PTEGs). A PTEG contains eight P age Table Entries (PTEs) of eight bytes each; therefore, each PTEG is 64 bytes long. PTEG addresses are entry points for table search operations.

12.4.3 Instruction Timing

The 603R is a pipelined superscalar processor. A pipelined processor is one in which the pro- cessing of an instruction is reduced into di screte stages. Because the processing of an instruction is broken into a series of stages, an instruction does not require the entire resources of an execution unit. For example, after an instruction completes the decode stage, it can pass on to the next stage, while the subsequent instru ction can advance into the decode stage. This improves the throughput of the instruction flow. For example, it may take three cycles for a float- ing-point instruction to complete, but if there are no stalls in the floating-point pipeline, a series of floating-point instructions can have a throughput of one instruction per cycle. The instruction pipeline in the 603R has four major pipeline stages, described as follows:  The fetch pipeline stage primarily involves retrieving instructions from the memory system and determining the location of the next instruction retrieval. Additionally, the BPU decodes branches during the fetch stage and folds out branch instructions before the dispatch stage if possible.  The dispatch pipeline stage is responsible for decoding the instructions supplied by the instruction retrieval stage, and determining which of the instructions are eligible to be dispatched in the current cycle. In addition, the source operands of the instructions are read from the appropriate register file and dispatched with the instruction to the execute pipeline stage. At the end of the dispatch pipeline stage, the dispatched instructions and their operands are latched by the appropriate execution unit.  During the execute pipeline stage each execution unit that has an executable instruction executes the selected instruction (perhaps over multiple cycles), writes the instruction’s result into the appropriate rename register, and notifies the completion stage when the instruction has finished execution. In the case of an internal exception, the execution unit reports the exception to the completion/writeback pipeline stage and discontinues instruction execution until the exception is handled. The exception is not signaled until that instruction is the next to be completed. Execution of most floating-point instructions is pipelined within the FPU allowing up to three instructions to be executing in the FPU concurrently. The pipeline stages for the floating-point unit are multiply, add, and round-convert. Execution of most load/store instructions is also pipelined. The load/store unit has two pipeline stages. The first stage is for effective address calculation and MMU translation and the second stage is for accessing the data in the cache.

5410B–HIREL–09/05 TSPC603R  The complete/writeback pipeline stage maintains the correct architectural machine state and transfers the contents of the rename registers to the GPRs and FPRs as instructions are retired. If the completion logic detects an instruction causing an exception, all following instructions are cancelled, their execution results in rename registers are discarded, and instructions are fetched from the correct instruction stream. A superscalar processor is one that issues multiple independent instructions into multiple pipe- lines allowing instructions to execute in parallel. The 603R has five independent execution units, one each for integer instructions, floating-point instructions, branch instructions, load/store instructions, and system register instructions. The IU and the FPU each have dedicated register files for maintaining operands (GPRs and FPRs, respectively), enabling integer calculations and floating-point calculations to occur simultaneously without interference. Because the PowerPC architecture can be applied to such a wide variety of implementations, instruction timing among various PowerPC processors varies accordingly. 13. Preparation for Delivery

13.1 Packaging

Microcircuits are prepared for delivery in accordance with MIL-PRF-38535.

13.2 Certificate of Compliance

Atmel offers a certificate of compliance with each shipment of parts, affirming the products are in compliance with the MIL-STD-883 standard and guaranteeing the parameters that are not tested at temperature extremes for the entire temperature range.

13.3 Handling

MOS devices must be handled with certain precautions to avoid damage caused by an accumu- lation of static charge. Input protection devices have been designed in the chip to minimize the effect of this static buildup. However, the following handling practices are recommended: 1. The devices should be handled on benches with conductive and grounded surfaces. 2. Ground test equipment and tools should be used. 3. The devices should not be handled by the leads. 4. The devices should be stored in conductive foam or carriers. 5. Use of plastic, rubber, or silk in MOS areas should be avoided. 6. Relative humidity above 50 percent should be maintained if practical.

13.4 Choice of Cl ock Relationships

The 603R microprocessors provide customers wit h numerous clocking options. An internal phase-lock loop synchronizes the processor (CPU) clock to the bus or system clock (SYSCLK) at various ratios. Inside each PowerPC microprocessor is a phase-lock loop circui t. A Voltage Controlled Oscilla- tor (VCO) is precisely controlled in frequenc y and phase by a frequency/phase detector which compares the input bus frequency (SYSCLK frequency) to a submultiple of the VCO. The ratio of CPU to SYSCLK frequencies is often referred to as the bus mode (for example, 2:1 bus mode).

5410B–HIREL–09/05 TSPC603R In Table 13-1 , the horizontal scale represents the bus frequency (SYSCLK) and the vertical scale represents the PLL-CFG[0-3] signals. For a given SYSCLK (bus) frequency, the PLL configuration signals set the internal CPU and VCO frequency of operation. Table 13-1. CPU Frequencies for Common Bus Frequencies and Multipliers PLL_CFG[0-3] CPU Frequency in MHZ (VCO Frequency in MHz) specific to CBGA 255, HiTCE CBGA 255 and CI-CGA 255 Bus-to- Core Multiplier Core-to VCO Multiplier Bus

25 MHz

33.33 MHz

40 MHz

50 MHz

60 MHz

66.67 MHz

75 MHz

0100 2x 2x - - - - - - 150 (300) 0110 2.5x 2x - - - - 150 (300) 166 (333) 187 (375) 1000 3x 2x - - - 150 (300) 180 (360) 200 (400) 225 (450) 1110 3.5x 2x - - - 175 (350) 210 (420) 233 (466) 263 (525) 1010 4x 2x - - 160 (320) 200 (400) 240 (480) 267 (533) 300 (600) 0111 4.5x 2x - 150 (300) 180 (360) 225 (450) 270 (540) 300 (600) - 1011 5x 2x - 166 (333) 200 (400) 250 (500) 300 (600) -- 1001 5.5x 2x - 183 (366) 220 (440) 275 (550) --- 1101 6x 2x 150 (300) 200 (400) 240 (480) 300 (600) ---

0011 PLL bypass

1111 Clock off

PLL_CFG[0-3] CPU Frequency in MHZ (VCO Frequency in MHz) specific to CERQUAD Bus-to-Core Multiplier Core-to VCO Multiplier Bus 0110 2.5x 2x – – – – 150 (300) 166 (333) 1000 3x 2x – – – 150 (300) 180 (360) 200 (400) 1110 3.5x 2x – – – 175 (350) ––

5410B–HIREL–09/05 TSPC603R Notes: 1. Some PLL configurations may select bus, CPU or VCO frequencies which are not supported. 2. In PLL-bypass mode, the SYSCLK input signal clocks the internal processor directly, the PLL is disabled, and the bus mode is set for 1:1 mode operation. This mode is intended for factory use only. The AC timing specifications given in this document do not apply in PLL-bypass mode. 3. In clock-off mode, no clocking occurs inside the 603e regardless of the SYSCLK input. 14. System Design Information

14.1 PLL Power Supply Filtering

The AVDD power signal is implemented on the 603e to provide power to the clock generation phase-locked loop. To ensure stability of the internal clock, the power supplied to the AVDD input signal should be filtered using a circuit similar to the one shown in Figure 14-1. The circuit should be placed as close as possible to the AVDD pin to ensure it filters out as much noise as possible. The 0.1 µF capacitor should be closest to the A VDD pin, followed by the 10 µF capacitor, and finally the 10Ω resistor to VDD. These traces should be kept short and direct. Figure 14-1. PLL Power Supply Filter Circuit 1010 4x 2x – – 160 (320) 200 (400) –– 0111 4.5x 2x – 150 (300) 180 (360) –– – 1011 5x 2x – 166 (333) 200 (400) –– – 1001 5.5x 2x – 183 (366) ––– – 1101 6x 2x 150 (300) 200 (400) ––– – PLL_CFG[0-3] CPU Frequency in MHZ (VCO Frequency in MHz) specific to CERQUAD Bus-to-Core Multiplier Core-to VCO Multiplier Bus 0.1 µF 10 µF GND 10Ω

5410B–HIREL–09/05 TSPC603R

14.2 Decoupling Recommendations

Due to the 603e’s dynamic power management feature, large address and data buses, and high operating frequencies, the 603e can generate transient power surges and high frequency noise in its power supply, especially while driving large capacitive loads. This noise must be prevented from reaching other components in the 603e system, and the 603e itself requires a clean, tightly regulated source of power. Therefore, it is recommended that the system designer place at least one decoupling capacitor at each VDD and OVDD pin of the 603e. It is also recommended that these decoupling capacitors rece ive their power from separate VDD, OVDD, and GND power planes in the PCB, utilizing short traces to minimize inductance. These capacitors should vary in value from 220 pF to 10 µF to provide both high and low fre- quency filtering, and should be placed as close as possible to their associated VDD or OVDD pin. The suggested values for the VDD pins are 220 pF (ceramic), 0.01 µF (ceramic) and 0.1 µf (ceramic). The suggested values for the OVDD pins are 0.01 µF (ceramic), 0.1 µF (ceramic), and 10 µF (tantalum). Only SMT (Surface Mount Technology) capacitors should be used to minimize lead inductance. In addition, it is recommended that there be several bulk storage capacitors distributed around the PCB, feeding the VDD and OVDD planes, to enable quick recharging of the smaller chip capac- itors. These bulk capacitors should also have a low ESR (equivalent series resistance) rating to ensure the quick response time necessary. They should also be connected to the power and ground planes through two vias to minimize indu ctance. The suggested bulk capacitors are 100 µF (AVX TPS tantalum) or 330 µf (AVX TPS tantalum).

14.3 Connection Recommendations

To ensure reliable operation, it is highly recommended to connect unused inputs to an appropri- ate signal level. Unused active low inputs should be tied to VDD. Unused active high inputs should be connected to GND. All NC (non-connected) signals must remain unconnected. Power and ground connections must be made to all external VDD, OVDD, and GND pins of the 603e.

14.4 Pull-up Resistor Requirements

The 603e requires high-resistive (weak: 10 kΩ) pull-up resistors on several control signals of the bus interface to maintain the control signals in the negated state after they have been actively negated and released by the 603e or other bus master. These signals are: TS , ABB, DBB, and ARTRY. In addition, the 603e has three open-drain style ou tputs that require pull-up resistors (weak or stronger: 4.7 k Ω - 10 kΩ) if they are used by the system. These signals are: APE , DPE, and CKSTP_OUT. During inactive periods on the bus, the address and transfer attributes on the bus are not driven by any master and may float in the high-impedance state for relatively long periods of time. Since the 603e must continually monitor these signals for snooping, this floating condition may cause excessive power to be drawn by the input revivers on the 603e. It is recommended that these signals be pulled up through weak (10 kΩ) pull-up resistors or restored in some manner by the system. The snooped address and transfer attribute inputs are: A[0-3], AP[0-3], TT[0-4], TBST , and GBL. The data bus input receivers are normally turned off when no read operation is in progress and do not require pull-up resistors on the data bus.

5410B–HIREL–09/05 TSPC603R 15. Package Mechanical Data The following sections provide the package par ameters and mechanical dimensions for the CBGA, HiTCE CBGA and the Cerquad packages.

15.1 HiTCE CBGA Package Parameters

The package parameters are as provided in the following list. The package type is 21 mm, 255- lead HiTCE Ceramic Ball Array (HiTCE CBGA). Package outline 21 mm × 21 mm Interconnects 255 Pitch 1.27 mm Maximum module height 3.08 mm

5410B–HIREL–09/05 TSPC603R

15.1.1 Mechanical Dimensions of the HiTCE CBGA Package

Figure 15-1 provides the mechanical dimensions and bottom surface nomenclature of the HiTCE CBGA package. Figure 15-1. Mechanical Dimensions of the HiTCE CBGA Package 0.2 A 0.35 A A D B Ball A1 Index E 0.2 603r C D3 K G K 255X B MIN MAX MIN MAX A B D 2.42 3.08 0.80 1.00 1.14 0.90 0.93 0.90 0.80 0.82

21.00 BASIC

19.05 BASIC

10.8 Typ

D3 8.75 BASIC D4 5.65 E 21.00 BASIC E1 19.05 BASIC E2 12.0 Typ E3 6.15 BASIC E4 7.7 G, K 1.27 BASIC

0.827 BASIC

0.75 BASIC

0.425 Typ

0.344 BASIC

0.222

0.472 Typ

0.242 BASIC

0.303

0.05 BASIC

0.095 0.12 0.031 0.039 0.035 0.031 0.032 0.045 0.035 0.037 T R P N M L K J H G F E D C B A 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 MILLIMETERS INCHES DIM

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15.2 CBGA Package Parameters

The package parameters are as provided in the following list. The package type is 21 mm, 255-lead Ceramic Ball Grid Array (CBGA).

15.2.1 Mechanical Dimensions of the CBGA Package

Figure 15-2 provides the mechanical dimensions and bottom surface nomenclature of the CBGA package. Figure 15-2. Mechanical Dimensions and Bottom Surface Nomenclature of the CBGA Package Package outline 21 mm × 21 mm Interconnects 255 Pitch 1.27 mm Maximum module height 3 mm 0.200 FT 255X A A1 CORNER P N 0.200 - E - 123456789 1 0 1 1 1 2 1 3 1 4 1 5 1 6 A B C D E F G H J K L M N P R T E0.300 T0.150 D C H 0.150 T B - F - K K G S S S S - T - DIM MILLIMETERS INCHES MIN MAX MIN MAX A 21.000 BSC 0.827 BSC B 21.000 BSC 0.827 BSC C 2.450 3.000 0.097 0.118 D 0.820 0.930 0.032 0.036 G 1.270 BSC 0.050 BSC H 0.790 0.990 0.031 0.039 K 0.635 BSC 0.025 BSC N 5.000 16.000 0.197 0.630 P 5.000 16.000 0.197 0.630 Notes: 1. Dimensioning and tolerancing per ASME Y14.5M - 1994 2. controlling dimension: millimeter

5410B–HIREL–09/05 TSPC603R

15.3 CI-CGA Package Parameters

The package parameters are as provided in the following list. The package type is 21 mm, 255-lead ceramic ball grid array (CI-CGA). Package outline 21 mm × 21 mm Interconnects 255 Pitch 1.27 mm Typical module height 3.84 mm

15.3.1 Mechanical Dimensions of the CI-CGA Package

Figure 15-3 provides the mechanical dimensions and bottom surface nomenclature of the CI- CGA package.

5410B–HIREL–09/05 TSPC603R Figure 15-3. Mechanical Dimensions and Bottom Surface Nomenclature of the CI-CGA Package H V R C U Notes: 1. Dimensioning and tolerancing per ASME Y14.5M—1994 2. Controlling dimension: millimeter

0.300 S ST

T0.150 S E SF 123456789 1 0 1 1 1 2 1 3 1 4 1 5 1 6 T R P N M L K J H G F E D C B A G K K 255X D 0.150 T -T- CORNER A 0.200 -E- P N B 0.200 -F- Min Max A B C D 0.790 0.990 G H 1.545 1.695 K N5 . 0 0 0 P7 . 0 0 0 R U V 0.25 0.35 Dim

0.635 BSC

3.02 BSC

0.10 BSC

21.000 BSC

3.84 BSC

1.270 BSC

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15.4 CERQUAD 240 Package

Figure 15-4. Mechanical Dimensions of the Wire-bond CERQUAD Package MILLIMETERS DIM MIN TYP MAX A 30.86 31.00 31.75 B 30.86 31.00 31.75 C 3.67 3.95 4.15 D 0.185 0.220 0.270 E 3.10 3.50 3.90 F 0.175 0.200 0.225 G 0.50 BSC HE 2.025 2.100 2.175 J 0.130 0.147 0.175 K 0.45 0.50 0.55 P 0.25 BSC S 34.41 34.58 34.75 U 17.20 17.30 17.40 V 34.41 34.58 34.75 W 0.45 0.70 0.95 Y 17.20 17.30 17.40 Z 0.122 0.127 0.132 AA 1.80 REF AB 0.95 REF Θ21 ° 4° 7° Wire Bonds Ceramic Body Alloy 42 Leads Die

0.16 TM L-N

S A 4 x 60 tips U V B Y 180 121 801 181 120 240 81 L N VIEW AC

4 Places

M

0.20 M SH L-N SM

X = L, M or N View AC X P G AD AD Section AD

240 Places

W View AE T Seating Plane Datum PlaneH 0.10 H HE K AB

0.08 M ST L-N SM

D F Z J Notes: 1. Dimensioning and tolerancing per ASMEY14.5M-1994 2. Controlling dimension: millimeter 3. Datum plane H is located at bottom of lead and is coincident with the lead where the lead exists the ceramic body at the bottom of the parting line 4. Datum L. M and N to be determined at datum plane H 5. Dimension S and V to be determined at seating plane T. 6. Dimension A and B define maximum ceramic body dimensions including glass protrusion and top and bottom mismatch

5410B–HIREL–09/05 TSPC603R 16. Ordering Information

16.1 Ordering Information of the CB GA, CI-CGA and HiTCE Packages

16.2 Ordering Information of the CERQUAD 240 Package

Note: For availability of the different ve rsions, contact your Atmel sales office. Prefix Temperature range : TC M: Tc = -55, Tj = +125˚C V: Tc = -40, Tj = +110˚C Screening level: Package : G: CBGA GS: CI-CGA GH: HiTCE CBGA TS PC603R M G 12B /Q L Bus divider (to be confirmed) L: any bus at 75 MHz Maximum internal processor speed 6 : 166 MHz 8 : 200 MHz 10: 233 MHz 12: 266 MHz 14: 300 MHz (X) Type Prototype (C) Revision level __ : Standard B/Q: MIL-PRF-38535, class Q U: Upscreening Prefix Temperature range: TC M: -55, +125˚C V: -40, +110˚C C: 0, +70˚C Screening level: Package: A : CERQUAD TS PC603R M A 8B /Q L Maximum internal processor speed 8: 200 MHz (X) Type Prototype (C ) Revision level B/Q : MIL-PRF-38535, class Q __ : Standard Bus divider (to be confirmed) L: any bus ≤ 66 MHz

5410B–HIREL–09/05 TSPC603R

17.1 Life Support Applications

These products are not designed for use in life support applian ces, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Atmel customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Atmel for any damages resulting from such improper use or sale. 18. Document Revision History Table 18-1 provides a revision history for this hardware specification. 17. Definitions Datasheet Status Validity Objective specification This datasheet contains target and goal specifications for discussion with the customer and application validation Before design phase Target specification This datasheet contains target or goal specifications for product development Valid during the design phase Preliminary specification α site This datasheet contains preliminary data. Additional data may be published at a later date and could include simulation results Valid before characterization phase Preliminary specification β site This datasheet also contains characterization results Valid before the industrialization phase Product specification This datasheet contains final product specifications Valid for production purpose Limiting Values Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stresses above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application Information

Where application information is given, it is advisory and does not form part of the specification Table 18-1. Document Revision History Revision Number Date Substantive Change(s) B 07/2005 Added HiTCE package for PowerPC 603R A 10/2004 This document is a merge of TSPC603R in CBGA255/CI-CGA 255 package (ref 2125B) and TSPC603R in Cerquad package (ref 2127A)

i 5410B–HIREL–09/05 TSPC603R Table of Contents Features Specific to CBGA 255, CBGA HiTCE 255 and CI-CGA 255 ... 1

5410B–HIREL–09/05 TSPC603R

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5410B–HIREL–09/05 TSPC603R