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Technical content

Features

 Offset Voltage: 50 μV (max)  Low Noise: 13nV/√Hz(f= 1kHz)  Supply Current: 190μA/ch  Low THD+N: 0.0005%  Supply Range: 2.2V to 5.5V  Low Input Bias Current: 0.3pA Typical  Slew Rate: 0.9 V/μs  EMIRR IN+: 85 dB( under 2.4GHz)  Gain-bandwidth Product: 1.6MHz  Rail-to-Rail I/O  High Output Current: 70mA (1.0V Drop)  –40°C to 125°C Operation Range  Robust 7kV – HBM and 2kV – CDM ESD Rating

Applications

 Photodiode detection  High Impedance Sensor Amplifier  Microvolt Accuracy Threshold Detection  Instrumentation Amplifiers  Communications  Security  Battery Powered Applications Pin Configuration (Top View) TP2332 8-Pin SOP/MSOP (-S and -V Suffixes) Out A ﹢In A ﹣In A ﹢In B ﹣In B Out BA B ﹣Vs ﹢Vs TP2334 14-Pin SOP/TSSOP (-S and -T Suffixes) Out A ﹢In A ﹣In A DA CB Out D ﹢In D ﹣In D Out B ﹢In B ﹣In B Out C ﹢In C ﹣In C ﹣Vs﹢Vs TP2331 8-Pin SOP (-S Suffix) Out TP2331 5-Pin SOT23 (-T Suffix) NC ﹢In ﹣In ﹣Vs ﹢Vs NC NC 1Out +In -In ﹣Vs ﹢Vs

Description

The TP2331/TP2332/TP2334 are single/dual/quad, low offset, low noise operational amplifiers with low power consumption and rail-to-rail input/output swing. Input offset voltage is trimmed to less than 50μV and the CMOS inputs draw less than 0.3pA of bias current. The low offset drift, excellent CMRR, and high voltage gain make it a good choice for precision signal conditioning. Each amplifier draws only 190μA current on a 3V supply. The micro power, rail-to-ra il operation of the TP233x series is well suited for portable instruments and single supply applications. The TP2331 is single channel version available in 8-pin SOP and 5-pin SOT23 packages. The TP2332 is dual channel version available in 8-pin SOP and MSOP packages. The TP2334 is quad channel version available in 14-pin SOP and TSSOP packages. 3PEAK and the 3PEAK logo are registered trademarks of 3PEAK INCORPORATED. All other tr ademarks are the property of their respective owners. Offset Voltage Production Distribution 500 1000 1500 2000 2500 ‐50 ‐40 ‐30 ‐20 ‐1 00 1 02 03 04 05 0 Population Offset Voltage Number = 53158 pcs

2 R e v . A w w w . 3 p e a k i c . c o m TP2331 / TP2332 / TP2334 1.6MHz Bandwidth, Low Noise Precision Op‐amps Order Information Model Name Order Number Package Transport Media, Quantity Marking Information TP2331 TP2331-SR 8-Pin SOP Tape and Reel, 4,000 TP2331 TP2331-TR 5-Pin SOT23 Tape and Reel, 3,000 331 TP2332 TP2332-SR 8-Pin SOP Tape and Reel, 4,000 TP2332 TP2332-VR 8-Pin MSOP Tape and Reel, 3,000 TP2332 TP2334 TP2334-SR 14-Pin SOP Tape and Reel, 2,500 TP2334 TP2334-TR 14-Pin TSSOP Tape and Reel, 3,000 TP2334 Absolute Maximum Ratings Note 1 Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: The op amp supplies must be established simultaneously, with, or before, the application of any input signals. Note 3: The inputs are protected by ESD protection diodes to each power supply. If the input extends more than 500mV beyond the power s upply, the input current should be limited to less than 10mA. Note 4: A heat sink may be required to keep the junction temperature below the absolute maximum. This depends on the power supply vol tage and how many amplifiers are shorted. Thermal resistance varies with the amount of PC board metal connected to the package. The specified val ues are for short traces connected to the leads. ESD, Electrostatic Discharge Protection Symbol Parameter Condition Minimum Level Unit HBM Human Body Model ESD MIL-STD-883H Method 3015.8 7 kV CDM Charged Device Model ESD JEDEC-EIA/JESD22-C101E 2 kV Thermal Resistance Package Type θJA θJC Unit 5-Pin SOT23 250 81 °C/W 8-Pin SOP 158 43 °C/W 8-Pin MSOP 210 45 °C/W 8-Pin SOT23 196 70 °C/W 14-Pin SOP 120 36 °C/W 14-Pin TSSOP 180 35 °C/W

1.6MHz Bandwidth, Low Noise Precision Op‐amps w w w . 3 p e a k i c . c o m R e v . A

Electrical Characteristics

SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VOS Input Offset Voltage V CM = VDD/2, VDD= 5V -50 ±2 +50 μV VOS TC Input Offset Voltage Drift -40°C to 125°C 1 2 μV/°C IB Input Bias Current TA = 27 °C 0.3 3 pA TA = 85 °C 150 pA TA = 125 °C 300 pA IOS Input Offset Current 0.001 pA Vn Input Voltage Noise f = 0.1Hz to 10Hz 4.1 μVPP en Input Voltage Noise Density f = 1kHz 13 nV/√Hz in Input Current Noise f = 1kHz 2 fA/ √Hz CIN Input Capacitance Differential Common Mode 7.76 6.87 pF CMRR Common Mode Rejection Ratio V CM = 2V to 3V 85 110 dB VCM Common-mode Input Voltage Range V – -0.1 V +-0.1 V PSRR Power Supply Rejection Ratio V CM = 2.5V, VS = 4.8V to 5V 75 100 dB AVOL Open-Loop Large Signal Gain R LOAD = 2kΩ 100 130 dB VOL, VOH Output Swing from Supply Rail R LOAD = 2kΩ 15 45 mV ROUT Closed-Loop Output Impedance G = 1, f =1kHz, I OUT = 0 0.002 Ω RO Open-Loop Output Impedance f = 1kHz, IOUT = 0 125 Ω ISC Output Short-Circuit Current Sink or source current 95 130 mA VDD Supply Voltage 2.2 5.5 V IQ Quiescent Current per Amplifier 190 280 μA PM Phase Margin R LOAD = 1kΩ, CLOAD = 60pF 80 ° GM Gain Margin R LOAD = 1kΩ, CLOAD = 60pF 15 dB GBWP Gain-Bandwidth Product f = 1kHz 1.6 MHz SR Slew Rate AV = 1, VOUT = 1.5V to 3.5V, CLOAD = 60pF, RLOAD = 1kΩ 0.36 0.84 V/ μs FPBW Full Power Bandwidth Note 1 58.6 kHz tS Settling Time, 0.1% Settling Time, 0.01% AV = –1, 1V Step 4.4 4.4 μs THD+N Total Harmonic Distortion and Noise f = 1kHz, AV =1, RL = 2kΩ, VOUT = 1Vp-p 0.0003 % Xtalk Channel Separation f = 1kHz, R L = 2kΩ 110 dB Note 1: Full power bandwidth is calculated from the slew rate FPBW = SR/π • VP-P

4 R e v . A w w w . 3 p e a k i c . c o m TP2331 / TP2332 / TP2334 1.6MHz Bandwidth, Low Noise Precision Op‐amps Typical Performance Characteristics VS = ±2.75V, VCM = 0V, RL = Open, unless otherwise specified. Offset Voltage Production Distribution Unity Gain Bandwidth vs. Temperature O p e n - L o o p G a i n a n d P h a s e Input Voltage Noise Spectral Density Input Bias Current vs. Temperature Input Bias Current vs. Input Common Mode Voltage 500 1000 1500 2000 2500 ‐50 ‐40 ‐30 ‐20 ‐1 00 1 02 03 04 05 0 Population Offset Voltage Number = 53158 pcs 0.5 1.5 2.5 ‐50 0 50 100 150 GBW(MHz) Temperature(℃) ‐250 ‐200 ‐150 ‐100 ‐50 100 150 200 ‐50 ‐30 ‐10 110 130 0.1 10 1k 100k 10M Phase (°) Gain(dB) Frequency (Hz) 100 1000 1 10 100 1k 10k 100k 1M Noise(nV/√Hz) Frequency(Hz) VCC= +5V RL= 1kΩ 1.00E‐21 1.00E‐19 1.00E‐17 1.00E‐15 1.00E‐13 1.00E‐11 ‐10 10 30 50 70 90 110 130 150 Input Bias Current(A) Temperature(℃) 5.00E‐18 5.00E‐17 5.00E‐16 0123456 Input Bias Current(A) Common Mode Voltage(V)

1.6MHz Bandwidth, Low Noise Precision Op‐amps w w w . 3 p e a k i c . c o m R e v . A Typical Performance Characteristics VS = ±2.75V, VCM = 0V, RL = Open, unless otherwise specified. (Continued) Common Mode Rejection Ratio C M R R v s . F r e q u e n c y Quiescent Current vs. Temperature Short Circuit Current vs. Temperature Power-Supply Rejection Ratio Quiescent Current vs. Supply Voltage 100 120 140 01234 CMRR(dB) Common Mode Voltage(V) 100 120 140 1 10 100 1k 10k 100k 1M 10M CMRR(dB) Frequency(Hz) 0.18 0.185 0.19 0.195 0.2 0.205 ‐50 ‐25 0 25 50 75 100 125 150 Supply current(mA) Temperature(℃) 100 120 140 160 180 ‐50 0 50 100 150 Ishort(mA) Temperature(℃) ISINK ISOURCE 100 120 1 10 100 1k 10k 100k 1M 10M PSRR(dB) Frequency(Hz) PSRR+ PSRR- 0.05 0.1 0.15 0.2 0.25 1.5 2.5 3.5 4.5 Supply current (mA) Supply Voltage (V)

6 R e v . A w w w . 3 p e a k i c . c o m TP2331 / TP2332 / TP2334 1.6MHz Bandwidth, Low Noise Precision Op‐amps Typical Performance Characteristics VS = ±2.75V, VCM = 0V, RL = Open, unless otherwise specified. (Continued) Power-Supply Rejection Ratio vs. Temperature CMRR vs. Temperature EMIRR IN+ vs. Frequency Large-Scale Step Response Negative Over-Voltage Recovery Positive Over-Voltage Recovery 100 120 140 ‐50 0 50 100 150 PSRR(-dB) Temperature(℃) 100 120 ‐50 0 50 100 150 CMRR(-dB) Temperature(℃) 100 120 140 10 100 1000 10000 EMIRR IN+ (dB) Frequency (MHz) Output Voltage (2V/div) Time (10ms/div) Gain= +1 RL= 10kΩ Time (5μs/div) 1V/div 2V/div Gain= +10 ±V= ±2.5V Time (5μs/div) 1V/div 2V/div Gain= +10 ±V= ±2.5V

1.6MHz Bandwidth, Low Noise Precision Op‐amps w w w . 3 p e a k i c . c o m R e v . A Typical Performance Characteristics VS = ±2.75V, VCM = 0V, RL = Open, unless otherwise specified. (Continued)

0.1 Hz TO 10 Hz Input Voltage Noise Offset Voltage vs Common-Mode Voltage

Positive Output Swing vs. Load Current Negative Output Swing vs. Load Current Output Voltage (2μV/div) Time (1s/div) ‐1200 ‐1000 ‐800 ‐600 ‐400 ‐200 200 Offset voltage(μV) Common-mode voltage(V) Vcc=±2.5V 100 120 140 012345 Iout(mA) Vout Dropout (V) 25℃ -40℃ +125℃ ‐200 ‐180 ‐160 ‐140 ‐120 ‐100 ‐80 ‐60 ‐40 ‐20 012345 Iout(mA) Vout Dropout (V) +125℃ 25℃ -40℃

-IN: Inverting Input of the Amplifier. +IN: Non-Inverting Input of Amplifier. within mV of each supply rail. between supply pins and ground. supplies. The power supply pin(s) must be bypassed to ground with a 0.1μF capacitor as close to the pin as possible. rail-to-rail output swing and high-gain bandwidth product. voltage without any phase reversal. Figure 1. No Phase Reversal

value should be kept to the minimum in noise-sensitive applications. 400 MHz (–3 dB), with a roll-off of 20 dB per decade. Figure 3. TP2331 EMIRR IN+ vs Frequency

1.6MHz Bandwidth, Low Noise Precision Op‐amps w w w . 3 p e a k i c . c o m R e v . A 1. For Non-Inverting Gain and Unity-Gain Buffer: a) Connect the non-inverting pin (VIN+) to the input with a wire that does not touch the PCB surface. b) Connect the guard ring to the inverting input pin (V IN–). This biases the guard ring to the Common Mode input voltage. 2. For Inverting Gain and Trans-impedance Gain Amplifiers (convert current to voltage, such as photo detectors): a) Connect the guard ring to the non-inverting input pin (V IN+). This biases the guard ring to the same reference voltage as the op-amp (e.g., VDD/2 or ground). b) Connect the inverting pin (V IN–) to the input with a wire that does not touch the PCB surface. Figure 6 The Layout of Guard Ring Power Supply Layout and Bypass The TP2331/2332/2332 OPA’s power supply pin (V DD for single-supply) should have a local bypass capacitor (i.e., within 100mm to provide large, slow currents. This bulk capacitor can be shared with other analog parts. Ground layout improves performance by decreasing the am ount of stray capacitance and noise at the OPA’s inputs and outputs. To decrease stray capacitance, minimize PC board lengths and resistor leads, and place external components as close to the op amps’ pins as possible. Proper Board Layout To ensure optimum performance at the PCB level, care mu st be taken in the design of the board layout. To avoid leakage currents, the surface of the board should be kept cl ean and free of moisture. Coating the surface creates a barrier to moisture accumulation and helps reduce parasitic resistance on the board. Keeping supply traces short and properly bypassing the power supplies minimizes power supply disturbances due to output current variation, such as when driving an ac signal into a heavy load. Bypass capacitors should be connected as closely as possible to the device supply pins. Stray capacitances are a concern at the outputs and the inputs of the amplifier. It is recommended that signal traces be kept at least 5mm from supply lines to minimize coupling. A variation in temperature across the PCB can cause a mism atch in the Seebeck voltages at solder joints and other points where dissimilar metals are in contact, resulting in thermal voltage errors. To minimize these thermocouple effects, orient resistors so heat sources warm both ends equally. Input signal paths should contain matching numbers and types of components, where possible to match the num ber and type of thermocouple junctions. For example, dummy components such as zero value resistors can be us ed to match real resistors in the opposite input path. Matching components should be located in close proximity and should be oriented in the same manner. Ensure leads are of equal length so that thermal conduction is in equilibrium. Keep heat sources on the PCB as far away from amplifier input circuitry as is practical. The use of a ground plane is highly recommended. A ground plane reduces EMI noise and also helps to maintain a constant temperature across the circuit board.

12 R e v . A w w w . 3 p e a k i c . c o m TP2331 / TP2332 / TP2334 1.6MHz Bandwidth, Low Noise Precision Op‐amps Package Outline Dimensions SOT23-5 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.400 0.012 0.016 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 E1 2.650 2.950 0.104 0.116 e 0.950TYP 0.037TYP e1 1.800 2.000 0.071 0.079 L1 0.300 0.460 0.012 0.024 θ 0° 8° 0° 8°

1.6MHz Bandwidth, Low Noise Precision Op‐amps w w w . 3 p e a k i c . c o m R e v . A Package Outline Dimensions SOT-23-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 1.050 1.250 0.041 0.049 A1 0.000 0.100 0.000 0.004 A2 1.050 1.150 0.041 0.045 b 0.300 0.500 0.012 0.020 c 0.100 0.200 0.004 0.008 D 2.820 3.020 0.111 0.119 E 1.500 1.700 0.059 0.067 e 0.65 (BSC) 0.026(BSC) e1 0.975 (BSC) 0.038(BSC) L 0.300 0.600 0.012 0.024 θ 0 ° 8 ° 0 ° 8 °

14 R e v . A w w w . 3 p e a k i c . c o m TP2331 / TP2332 / TP2334 1.6MHz Bandwidth, Low Noise Precision Op‐amps D b E e θ C Package Outline Dimensions SOP-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A1 0.100 0.250 0.004 0.010 A2 1.350 1.550 0.053 0.061 b 0.330 0.510 0.013 0.020 C 0.190 0.250 0.007 0.010 D 4.780 5.000 0.188 0.197 E 3.800 4.000 0.150 0.157 E1 5.800 6.300 0.228 0.248 e 1.270 TYP 0.050 TYP L1 0.400 1.270 0.016 0.050 θ 0° 8° 0° 8°

1.6MHz Bandwidth, Low Noise Precision Op‐amps w w w . 3 p e a k i c . c o m R e v . A Package Outline Dimensions MSOP-8 Symbol Dimensions In Millimeters Dimensions In Inches Min Max Min Max A 0.800 1.200 0.031 0.047 A1 0.000 0.200 0.000 0.008 A2 0.760 0.970 0.030 0.038 b 0.30 TYP 0.012 TYP C 0.15 TYP 0.006 TYP D 2.900 3.100 0.114 0.122 e 0.65 TYP 0.026 E 2.900 3.100 0.114 0.122 E1 4.700 5.100 0.185 0.201 L1 0.410 0.650 0.016 0.026 θ 0° 6° 0° 6° e E D L1 L2 L R θ b

16 R e v . A w w w . 3 p e a k i c . c o m TP2331 / TP2332 / TP2334 1.6MHz Bandwidth, Low Noise Precision Op‐amps Package Outline Dimensions TSSOP-14 Symbol Dimensions In Millimeters MIN TYP MAX A - - 1.20 A1 0.05 - 0.15 A2 0.90 1.00 1.05 b 0.20 - 0.28 c 0.10 - 0.19 D 4.86 4.96 5.06 E 6.20 6.40 6.60 E1 4.30 4.40 4.50 e 0.65 BSC L 0.45 0.60 0.75 L1 1.00 REF L2 0.25 BSC R 0.09 - - θ 0° - 8° E e A D L1 L2 L R θ c

1.6MHz Bandwidth, Low Noise Precision Op‐amps w w w . 3 p e a k i c . c o m R e v . A Package Outline Dimensions SOP-14 Symbol Dimensions In Millimeters MIN TYP MAX A 1.35 1.60 1.75 A1 0.10 0.15 0.25 A2 1.25 1.45 1.65 b 0.36 0.49 D 8.53 8.63 8.73 E 5.80 6.00 6.20 E1 3.80 3.90 4.00 e 1.27 BSC L 0.45 0.60 0.80 L1 1.04 REF L2 0.25 BSC θ 0° 8°