TLRU1002A

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TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 1 TOSHIBA LED Lamps TLRU1002A(T02),TLSU1002A(T02),TLOU1002A(T02) TLAU1002A(T02),TLYU1002A(T02),TLGU1002A(T02) TLPGU1002A(T02) Panel Circuit Indicator

• Surface-mount devices
• InGaAℓP LEDs
• Replacing standard-intensity LE Ds with high-intensity ones helps increase the brightness or reduce the power consumption of end products.
• Colors: red, orange, amber, yellow, green, pure green
• Applications: Backlighting source for battery-powered equipment Pilot lamps for mobile handsets Low-power electronic equipment, etc.
• Standard embossed tape packing: T02 (3000 pcs / reel) 8-mm tape reel Color and Material Unit: mm JEDEC ― JEITA ― TOSHIBA 4-1D1 Weight: 0.002 g (typ.) Part Number Color Material TLRU1002A Red TLSU1002A Red TLOU1002A Orange TLAU1002A Amber TLYU1002A Yellow TLGU1002A Green TLPGU1002A Pure Green InGaAℓP

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 2 Absolute Maximum Ratings (Ta = 25°C) Part Number Forward Current IF (mA) Please see Note 1 Reverse Voltage VR (V) Power Dissipation PD (mW) Operation Temperature Topr (°C) Storage Temperature Tstg (°C) TLRU1002A TLSU1002A TLOU1002A TLAU1002A TLYU1002A TLGU1002A TLPGU1002A 25 4 62.5 −40 to 85 − 40 to 100 Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook (“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: Forward current derating Electrical Characteristics (Ta = 25°C) Forward Voltage VF Reverse Current IR Part Number Min Typ. Min I F Max V R TLRU1002A 1.6 2.0 2.4 TLSU1002A 1.6 2.0 2.4 TLOU1002A 1.6 2.1 2.5 TLAU1002A 1.6 2.1 2.5 TLYU1002A 1.6 2.1 2.5 TLGU1002A 1.6 2.1 2.5 TLPGU1002A 1.6 2.1 2.5 20 50 4 Unit V mA μA V 0 80 6020 100 Ambient temperature Ta (°C) IF – Ta Allowable forward current I F ( m A )

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 3 Optical Characteristics–1 (Ta = 25°C) Luminous Intensity IV Part Number Min Typ. Max I F Available Iv rank Please see Note 2 TLRU1002A 4.76 45 ⎯ 20 H / J / K / L TLSU1002A 27.2 60 ⎯ 20 L / M / N / P TLOU1002A 27.2 78 ⎯ 20 L / M / N / P TLAU1002A 8.5 30 ⎯ 20 J / K / L / M TLYU1002A 8.5 30 ⎯ 20 J / K / L / M TLGU1002A 8.5 30 ⎯ 20 J / K / L / M TLPGU1002A 1.53 6 ⎯ 20 F / G / H / J Unit mcd mcd mcd mA Note 2: The specification on the above table is used for Iv classification of LEDs in Toshiba facility. Each reel includes the same rank LEDs. Let the delivery ratio of each rank be unquestioned. Luminous Intensity IV Rank Min Min F 1.53 4.14 G 2.72 7.36 H 4.76 12.9 J 8.5 23 K 15.3 41.4 L 27.2 73.6 M 47.6 129 N 85 230 P 153 414 Unit mcd mcd Optical Characteristics–2 (Ta = 25°C) Emission Spectrum Peak Emission Wavelength λp Δλ Dominant Wavelength λdPart Number Min Typ. Max Typ. Min Typ. Max IF TLRU1002A ⎯ 644 ⎯ 15 624 630 638 TLSU1002A ⎯ 636 ⎯ 17 617 623 631 TLOU1002A ⎯ 612 ⎯ 15 599 605 613 TLAU1002A ⎯ 596 ⎯ 13 585 592 599 TLYU1002A ⎯ 590 ⎯ 15 580 587 595 TLGU1002A ⎯ 574 ⎯ 13 565 571 576 TLPGU1002A ⎯ 562 ⎯ 13 ⎯ 557 564 Unit nm nm nm mA Cautions

• This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by the IR light.
• This product is designed as a general display light source usage, and it has applied the measurement standard that matched with the sensitivity of human's eyes. Therefore, it is not intended for usage of functional application (ex. Light source for sensor, optical communication and etc) except general display light source.

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 4 TLRU1002A −20 80 60 0 100 20 40 Relative luminous intensity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic 100 1 50 3 5 10 30 100 Ta = 25°C Ta = 25°C 100 1.8 1.9 0.1 0.3 0.5 IF = 20 mA Ta = 25°C 640 0.4 1.0 0.8 580 680 660 620600 700 0.6 0.2 (typ.) (typ.) (typ.) (typ.)

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 5 TLSU1002A IF = 20 mA Ta = 25°C 640 0.4 1.0 0.8 580 680 660 620600 700 0.6 0.2 −20 80 60 0 100 20 40 Relative luminous intensity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic 100 1 50 3 5 10 30 100 Ta = 25°C Ta = 25°C 100 1.8 1.9 0.1 0.3 0.5 (typ.) (typ.) (typ.) (typ.)

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 6 TLOU1002A 100 1 50 3 5 10 30 100 300 Ta = 25°C IF = 20 mA Ta = 25°C 600 0.4 1.0 0.8 540 640 620 580560 660 0.6 0.2 Ta = 25°C 100 1.8 1.9 Relative luminous intensity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic 0.1 80 60 100 0.3 0.5 −20 0 40 (typ.) (typ.) (typ.) (typ.)

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 7 TLAU1002A 0.1 80 60 100 0.3 0.5 −20 0 40 IF = 20 mA Ta = 25°C 580 0.4 1.0 0.8 660620 600 560540 640 0.6 0.2 Relative luminous intensity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic 1 50 3 5 10 30 100 Ta = 25°C 100 1.8 1.9 100 (typ.) (typ.) (typ.) (typ.)

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 8 TLYU1002A IF = 20 mA Ta = 25°C 600 0.4 1.0 0.8 540 640 620 580560 660 0.6 0.2 0.1 80 60 100 0.3 0.5 −20 0 40 Ta = 25°C 100 1.9 2.0 Relative luminous intensity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic 100 1 50 3 5 10 30 100 Ta = 25°C (typ.) (typ.) (typ.) (typ.)

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 9 TLGU1002A 0.1 80 60 100 0.3 0.5 −20 0 40 IF = 20 mA Ta = 25°C 0.4 1.0 0.8 540 0.6 0.2 620600 580 560 Ta = 25°C 100 1.9 2.0 Relative luminous intensity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic 1 50 3 5 10 30 100 Ta = 25°C 100 (typ.) (typ.) (typ.) (typ.)

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 10 TLPGU1002A IF = 20 mA Ta = 25°C 0.4 1.0 0.8 520 0.6 0.2 600580 560 540 0.1 80 60 100 0.3 0.5 −20 0 40 Ta = 25°C 100 1.9 2.0 Relative luminous intensity Forward voltage V F (V) IF – VF Forward current I F ( m A ) Forward current I F ( m A ) IV – IF Luminous intensity I V (mcd) Case temperature Tc (°C) IV – Tc Relative luminous intensity I V Wavelength λ (nm) Wavelength characteristic 1 50 3 5 10 30 100 Ta = 25°C 0.1 0.3 0.5 (typ.) (typ.) (typ.) (typ.)

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 11 Radiation Pattern Vertical to polarity Horizontal to polarity (typ.) (typ.)

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 12 Packaging These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions: 1. This moisture proof bag may be stored unopene d within 12 months at the following conditions. Temperature: 5°C to 30°C Humidity: 90% (max) 2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5°C to 30°C/70% RH or below. When performing lead(Pb)-free soldering, the devices should be assembled within 72 hours in an environment of 5°C to 30°C/70% RH or below. 3. If upon opening, the moisture in dicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel. After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions: 60±5°C, for 12 to 24 hours. Expiration date: 12 months from sealing date, which is imprinted on the same side as this label affixed. 4. Repeated baking can cause the pee ling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken , the air tightness would deteriorate. Therefore, do not throw or drop the packed devices. Mounting Method Soldering

• Reflow soldering (example)
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 168 h of opening the package.
• Second reflow soldering In case of second reflow soldering should be performed within 168 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30°C, 70% RH (max)
• Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron : 25 W Temperature : 300 °C or less Time : within 3 s
• Do not perform wave soldering. 60 to 120 s max 140 to 160°C max 10 s max 240°C max 4°C/s max4°C/s max Time (s) Package surface temperature ( °C) (*) (*) (*) (*) (*) (*) Temperature profile for Pb soldering (example)

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 13

• Reflow soldering (example)
• The products are evaluated using above reflow soldering conditions. No additional test is performed exceed the condition (i.e. the condition more than (*)MAX values) as a evaluation. Please perform reflow soldering under the above conditions.
• Please perform the first reflow soldering with reference to the above temperature profile and within 72 h of opening the package.
• Second reflow soldering In case of second reflow soldering should be performed within 72 h of the first reflow under the above conditions. Storage conditions before the second reflow soldering: 30°C, 70% RH (max)
• Make any necessary soldering corrections manually. (only once at each soldering point) Soldering iron : 25 W Temperature : 300 °C or less Time : within 3 s
• Do not perform wave soldering. Recommended soldering pattern Cleaning When cleaning is required after soldering, Toshiba recommends the following cleaning solvents. It is confirmed that these solvents have no effect on semiconductor devices in our dipping test (under the recommended conditions). In selecting the one for your actual usage, please perform sufficient review on washing condition, using condition and etc. ASAHI CLEAN AK-225AES : (made by ASAHI GLASS) KAO CLEAN THROUGH 750H : (made by KAO) PINE ALPHA ST-100S : (made by ARAKAWA CHEMICAL) Precaution when mounting Do not apply force to the plastic part of the LED under high-temperature conditions. To avoid damaging the LED plastic, do not apply friction using a hard material. When installing the PCB in a product, ensure that the device does not come into contact with other cmponents. 1.2 1.0 1.2 (1.2) Unit: mm Temperature profile for Pb-free soldering (example) Time (s) 150 to 180°C max 4°C/s max 5 s max 260°C max 4°C/s max 30 to 50 s max 230°C 60 to 120 s max (*) (*) (*) (*) (*) (*) (*) Package surface temperature ( °C)

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 14 Tape Specifications 1. Product number format The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (However, this method does not apply to products whose electrical/optical characteristics differ from standard Toshiba specifications) (1) Tape Type: T02 (4-mm pitch) (2) Example 2. Handling precautions Tape material protected against static electricity. However, static electricity may occur depending on quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when peeling a tape cover. (a) Since tape materials may accumulate an electrosta tic charge, use an ionizer to neutralize the ambient air. (b) For transport and temporary storage of devices, use containers (boxes and bags) and jigs that are made of anti-static materials or of materials which dissipate electrostatic charge. 3. Tape dimensions Unit: mm Symbol Value Tolerance Symbol Value Tolerance P0 4.00 ±0.1 P 4.00 ±0.1 t 0.20 ±0.05 A 0 1.45 ±0.1 F 3.50 ±0.05 B 0 2.25 ±0.1 D1 1.10 ±0.1 K 0 1.30 ±0.05 P D1 F E W Polarity t D TLRU1002A (T02) Tape type Toshiba product No.

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 15 4. Reel dimensions Unit: mm 5. Leader and trailer section of tape Note 1: Empty trailer section Note 2: Empty leader section 2 ± 0.5 φ13 ± 0.5 φ21 ± 0.8 11.4 ± 1 9 +1/−0 φ60 φ180 +0 (Note 1) Leading part 190 mm (min) 40 mm or more (Note 2) 40 mm or more

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 16 6. Packing display (1) Packing quantity Reel 3,000 pcs Carton 15,000 pcs (2) Package form: Each reel is sealed in an aluminum pack with silica gel. 7. Label format (1) Example: TLRU1002A (T02) P / N : TOSHIBA TYPE TLRU1002A ADDC (T02) Q’TY 3,000 pcs Lot Number Key code for TSB 32C 3000 (RANK SYMBOL) Use under 5-30degC/70%RH within 72h SEALED [[G]]/RoHS COMPATIBLE DIFFUSED IN ***** *Y380xxxxxxxxxxxxxxxxxx* ASSEMBLED IN ***** (2) Label location Tape reel direction Label position Label position

• Reel • Carton
• The aluminum package in which the reel is supplied also has a copy of the label attached to center of one side.

TL(RU,SU,OU,AU,YU,GU,PGU)1002A(T02) 2008-05-22 17 RESTRICTIONS ON PRODUCT USE

• Toshiba Corporation, and its subsidiaries and affiliates (collect ively “TOSHIBA”), reserve the right to make changes to the information in this document, and related hardware, software and systems (collectively “Product”) without notice.
• This document and any information herein may not be reproduc ed without prior written permission from TOSHIBA. Even with TOSHIBA’s written permission, reproduction is permissible only if reproduction is without alteration/omission.
• Though TOSHIBA works continually to improve Product’s quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before creating and producing designs and using, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the “TOSHIBA Semiconductor Reliability Handbook” and (b) the instructions for the application that Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS’ PRODUCT DESIGN OR APPLICATIONS.
• Product is intended for use in general el ectronics applications (e.g., computers, personal equipment, office equipment, measuring equipment, industrial robots and home electronics appliances) or for specific applications as expressly stated in this document. Product is neither intended nor warranted for use in equipment or systems that require extraordinarily high levels of quality and/or reliability and/or a malfunction or failure of which may cause loss of human life, bodily injury, serious property damage or serious public impact (“Unintended Use”). Unintended Use includes, without limitation, equipment used in nuclear facilities, equipment used in the aerospace industry, medical equipment, equipment used for automobiles, trains, ships and other transportation, traffic signaling equipment, equipment used to control combustions or explosions, safety devices, elevators and escalators, devices related to electric power, and equipment used in finance-related fields. Do not use Product for Unintended Use unless specifically permitted in this document.
• Do not disassemble, analyze, reverse-engineer, alter, modify, translate or copy Product, whether in whole or in part.
• Product shall not be used for or incorporated into any products or systems whose manufacture, use, or sale is prohibited under any applicable laws or regulations.
• The information contained herein is pres ented only as guidance for Product use. No responsibility is assumed by TOSHIBA for any infringement of patents or any other intellectual property rights of third parties that may result from the use of Product. No license to any intellectual property right is granted by this document, whether express or implied, by estoppel or otherwise.
• ABSENT A WRITTEN SIGNED AGREEMENT, EXCEPT AS PROVIDED IN THE RELEVANT TERMS AND CONDITIONS OF SALE FO R PRODUCT, AND TO THE MAXIMUM EXTENT ALLOWABLE BY LAW, TOSHIBA (1) ASSUMES NO LIABILITY WHATSOEVER, INCLUDING WITHOUT LIMITATION, INDIRECT, CONSEQUENTIAL, SPECIAL, OR INCIDENTAL DAMAGES OR LOSS, INCLUDING WITHOUT LIMITATION, LOSS OF PROFITS, LOSS OF OPPORTUNITIES, BUSINESS INTERRUPTION AND LOSS OF DATA, AND (2) DISCLAIMS ANY AND ALL EXPRESS OR IMPLIED WARRANTIES AND CONDITIONS RELATED TO SALE, USE OF PRODUCT, OR INFORMATION, INCLUDING WARRANTIES OR CONDITIONS OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, ACCURACY OF INFORMATION, OR NONINFRINGEMENT.
• GaAs (Gallium Arsenide) is used in Product. GaAs is harmful to humans if consumed or absorbed, whether in the form of dust or vapor. Handle with care and do not break, cut, crush, grind, dissolve chemically or otherwise expose GaAs in Product.
• Do not use or otherwise make available Product or related so ftware or technology for any military purposes, including without limitation, for the design, development, use, stockpiling or manufacturing of nuclear, chemical, or biological weapons or missile technology products (mass destruction weapons). Product and related software and technology may be controlled under the Japanese Foreign Exchange and Foreign Trade Law and the U.S. Export Administration Regulations. Export and re-export of Product or related software or technology are strictly prohibited except in compliance with all applicable export laws and regulations.
• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA assumes no liability for damages or losses occurring as a result of noncompliance with applicable laws and regulations.