TLREI100T11

TLGE1100 TOSHIBA | Alldatasheet

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TOSHIBA TL(RE,SE,OE,YE,GE,PGE)1100(T11) TOSHIBA LED LAMP TLRE1100 (T11), TLSE1100 (T11), TLOE1100 (T11) TLYE1100 (T11), TLGE1100 (T11), TLPGE1100 (T11) PANEL CIRCUIT INDICATOR Unit in mm euectnove Spp-3 . Lp cup rosmon e Surface Mount Device 3.2 7 @ = 3.2(L) X 2.8(W) X 1.9 (H) mm Size | eS wel ia sls e = Flat-top Type Ul yy \\ caTHooe noex e InGaA¢P LED ! si @ Available of Automounting Machine Use 3 f= # a ¢ Low Drive Current, High Intensity Light Emission ast e Applications : Automotive use, Message Signboard, Backlight, ny etc. = i © Standard embossed taping : T11 (2000 pes/ reel) ' ae ~? 8mm tape reel 1. ANODE TOLERANCE : +0.2 LINE-UP 2. CATHODE foenm PRODUCT APABEES COLOR MATERIAL JEDEC _ reset aes TOSHIBA 1100 ; e Weight : 35mg TLYE1100 InGaAeP TLGEIi00 TnGaAeP TLPGE1100 InGaA€P MAXIMUM RATINGS (Ta = 25°C) PRODUCT FORWARD REVERSE POWER OPERATING STORAGE NAME CURRENT VOLTAGE | DISSIPATION | TEMPERATURE | TEMPERATURE Ip (mA) VR (V) Pp (mW) Topr (°C) Tstg (°C) TLOEI100 —40~100 —40~100 TLGEI100 TLPGE1100 00707Eac2 @ TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage 20 property In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc. @ The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury ("Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. @ Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. @ The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. @ The information contained herein is subject to change without notice. 2000-08-28 1/12

TOSHIBA TL(RE,SE,OE, YE,GE,PGE)1100(T 11) ELECTRICAL CHARACTERISTICS (Ta = 25°C) REVERSE PRODUCT FORWARD vourace CURRENT NAME JR MIN | TYP. | MAX MAX [mrenioo[ — [is [24 [20 | 3 | 4 OPTICAL CHARACTERISTICS-1 (Ta = 25°C) PRODUCT LUMINOUS INTENSITY Iy [Toreii00 | 476 | 100 | — | 0 | a OPTICAL CHARACTERISTICS-2 (Ta = 25°C) k vs EMISSION SPECTRUM . MIN | TYP. | MAX | TYP. | MIN | TYP. | MAX [mario | _— [orm [— [an [— [sm [| — [20] [unr [mt om | nm id mA (Note) : This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light. 2000-08-28 2/12

TOSHIBA TL(RE,SE,OE,YE,GE,PGE)1100(T11) TLRE1100 Ip - Vp ly - Ir 50 000 = ——— S222 s Try > HH Eat : Aye Y (SSS: 2SSSSccce ieee pe ell Zale 5 | z —— a 2 rT TATE ET Tye ey a 50 a YA z 9 § Joe

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TOSHIBA TL(RE,SE,OE,YE,GE,PGE)1100(T11) TLSE1100 ‘00 Ip — Ve ly - IF > EEE > city P ERARADAAAA oe eee NAM ee 2 o§— a 2 i S lA LIAL ET ETT co 16 1.7 18 19 2.0 21 2.2 FORWARD CURRENT Ip (mA) FORWARD VOLTAGE Vp (V) RELATIVE LUMINOUS INTENSITY — So to WAVELENGTH a ee 7 HHH esa | Bp | pot tt Tt | Dpesceceecee ee Waseisusensz 2 etl] || 2 OCC A SS SSS eo tit TTT BEEP) atAF RACE a TTT TET Tt ZEON 25 0 25 50 15 100 580 600 620 640 660 680 700 CASE TEMPERATURE Te (°C) WAVELENGTH A (nm) RADIATION PATTERN 2 +0 Ip — Ta Ta= 25°C » LLELETT TTT Te a ye 010° ‘e g ATOR oe E KEINE, og fH TEN KS PAA TEAR s TiTiTT TENT ALK PSAP 60° $ Y TLE LP SON PEEP IA EE THORP, 2 “OCCT wol_LLCDUSSNZer «6 § VLEET EE NY TT 0 02 04 06 08 10 < 0 20 40 60 80 100 120 AMBIENT TEMPERATURE Ta (°C) 2000-08-28 4/12

TOSHIBA TL(RE,SE,OE,YE,GE,PGE)1100(T11) TLOE1100 Ip - Vp ly - Ir 100) a so 1000) —— TTT ooo [ meee EERE [ meas FR HS]: ES a & p /\\ eS aS a f- fife peer 2 SSS ay < ryt Ty ef] 2 a a OO a 7 CO LIVI TT ETT) * yi ” “ “ = t 3 cy 10 30 50 100 FORWARD VOLTAGE Vp (V) FORWARD CURRENT Ip (mA) RELATIVE LUMINOUS INTENSITY — 10 ee eel 10 WAVELENGTH a ee 7 REHEH ee pESEEESEESS te PRR: EEEEE HARE pe Cee oe 2 eee SSeS 2 | § of 2 “CEERI 2 ft Pt rrr et | - CCELLPLEANL LE g ELT ert SCOTTY TINT oe OPA EEN 25 0 25 50 15 100 540 560 580 600 620 640 660 CASE TEMPERATURE Te (°C) WAVELENGTH A (nm) RADIATION PATTERN 2 +0 Ip — Ta mes EEE g 60) pe ay e LTT TTT Ty | BT wo g wifi tive = JTC INET CPOE 2 al ( wi PCE Se POCA ALK DSP OE e Titty TA [PLR SRR h THERES. COC LETTS” 8 ETT TET TEN TI 0 02 04 06 08 10 < 0 20 40 60 80 100 120 AMBIENT TEMPERATURE Ta (°C) 2000-08-28 5/12

TOSHIBA TL(RE,SE,OE,YE,GE,PGE)1100(T11) TLYE1100 Ip - Vp Ivy - Ir 100, —xkzK*—eE&@e TE) 1000, ToT 2 oo FEEEEEES ae FREE See] : POC = Cea Zz & Peeeeveeeeees| bil iil ee eee g L\\ 3 VA LIVI EI TTI TT Aen alll | ” “ “ = t 3 cy 10 30 50 100 FORWARD VOLTAGE Vp (V) FORWARD CURRENT Ip (mA) . ly -Te 7 RELATIVE TNT TY - SSS oe

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TOSHIBA TL(RE,SE,OE,YE,GE,PGE)1100(T11) TLPGE1100 Ip - VF Iv - IF 100 a | 100 | ~ OO S Cr Ot _] * ceeeene, ane es a | PUA IV 2 eA ee ia eel

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TOSHIBA TL(RE,SE,OE, YE,GE,PGE)1100(T 11) SOLDERING Reflow soldering Temperature profile 10s max t 240°C max — € 140-160°C. e 4Cls 3 4°C/s max mex E 60-1208 é Time (s) —» @ Please perform the first reflow soldering within 168h after opening the package with reference to the above temperature profile. @ Second time reflow soldering In case of second reflow soldering, it should be performed within 168h after first reflow under the above conditions. Storage conditions before second reflow soldering : 30°C, 60% RH or lower Recommended soldering pattern 1.65 115 1.65 (Unit in mm) f \\ \\ Pee | UP —i— 4.45 RECOMMENDATION FOR MANUAL SOLDERING Soldering iron : Less than 25 W Temperature : Lower than 300°C Time : Within 3s POST SOLDERING CLEANING When cleaning after soldering is needed, the following condition must be adhered to. Cleaning solvents : AK225 or Alcohol Temperature : 50°C (max) for 30s (max) or 30°C (max) for 3 minutes (max) Ultrasonic : 800 W max 2000-08-28 9/12

TOSHIBA TL(RE,SE,OE, YE,GE,PGE)1100(T 11) PACKAGING This LED device is packed in an aluminum envelope with silica-gel to avoid moisture absorption. The optical characteristics may be affected by exposure to moisture in the air before soldering and storage at the following condition is recommended. Temperature : 5~380°C Relative Humidity : 60% or lower Baking is required if the device have been stored unopened for more than 6 month or if the aluminum envelope has been opened for more than 168h. Recommended baking condition is 60°C for 12h minimum in the dry atmosphere. PRECAUTION FOR MOUNTING Do not apply force to the plastic part of the LED in high temperature conditions. Do not apply friction using hard materials for avoid injuring the plastic part of the LED. Keep the LED away from any other parts when assembling boards into the set. TAPING SPECIFICATIONS 1. Taping Number (1) Name : Til (2) Example : TLSE1100 (T1L Tape Specifications ‘Device Identifier 2. Dimension of tape (Unit in mm) A | [Bo [37 | #01 (40D Po bal D | Pg u f- r ‘I 4-4) mmm O-4+- u ! 1 F lw L| Le | Di POLARITY Ao 2000-08-28 10/12

TOSHIBA TL(RE,SE,OE, YE,GE,PGE)1100(T11) 3. Dimension of reel (Unit in mm) 9+0.3 t y | g1t.4+1.0 I 22) 1 Ly (| Spe | _. 7 {OYA ae 7 4 ty 1 4, Leading part (Unit in mm) | Boos o oC] [Over 40mm Over 40 mm Leading part 190mm min 2000-08-28 11/12

TOSHIBA TL(RE,SE,OE, YE,GE,PGE)1100(T 11) 6. Packing Form (1) Number of Devices per Reel and Carton 2000 devices 10000 devices (2) Packing : Silica gel and reel are packed into sealed aluminum pack. 7. Notation Method (1) Example : TLRE1100 (T11) P/N: NOTE (rank symbol) Lot Number (2) Label location : Reel Carton Tape Feed Direction NX Q [| abel position Label position Aluminum pack : Attached to center of one side 2000-08-28 12/12