TLRE1008A TOSHIBA | Alldatasheet

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TOSHIBA TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04) TOSHIBA LED LAMP TLRE1008A(TO04), TLSE1008A(T04), TLOE1008A(T04), TLYE1008A(T04), TLPYE1008A(T04), TLGE1008A(T04), TLFGE1008A(T04), TLPGE1008A(T04) PANEL CIRCUIT INDICATOR Unit in mm @ 16 X 0.8 X 0.6mm (L x W x H) pouaniry b—e2 TLUE1008A (T04) Series LED CHIP POSITION e = InGaAeP LED ee -{ e = It can be manufactured high-luminosity of equipment or 16 reduce of electric power consumption by change in the high- ot luminosity LED from general-luminosity one. FA 3 © Colors : Red, Orange, Yellow, Pure Yellow, Green, Pure Green : e Since the products are only 0.6mm thick, they are suitable - - @ Can be mounted using surface mounter. CATHODE INDEX | e Reflow soldering is possible. 1. CATHODE OLERANCE : £0. e Standard embossed taping 2, ANODE rowenance inn 4mm pitch : T04 (4000 pes/reel) e Applications : As backlighting source for battery-powered As pilot light for compact equipment Weight : 0.0013 g In low-power electronic equipment, etc. LINE-UP PRODUCT [FEREI008A | Red | __InGaAeP_| TLSE1008A InGaA¢P TLOE1008A InGaAeP TLYE1008A InGaAeP TLPYE1008A Pure Yellow InGaA€P TLGE1008A 1 2001-09-28

TOSHIBA TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04) MAXIMUM RATINGS (Ta = 25°C) NAME CURRENT VOLTAGE DISSIPATION |TEMPERATURE|TEMPERATURE Ip (mA) VR (V) Pp (mW) Topr (°C) Tstg CC) 25 —40~85 —40~100 ELECTRICAL CHARACTERISTICS (Ta = 25°C) MIN | TYP. | MAX MAX [risei00sA | — [19 | 24 _| Priveioosa | — [20 [24], | . [riaEio0sa | — | 20 | 24 | [ripceio08A | — | 2.1 | 24 | OPTICAL CHARACTERISTICS (Ta = 25°C) LUMINOUS INTENSITY _ EMISSION SPECTRUM PRODUCT Iv Peak Emission |.) Dominant NAME Wavelength Ap Wavelength Aq Min | Typ. | MAX MIN | TYP. | MAX | TYP. | MIN | TYP. | MAX Priveioosa [272 [105 [— | ,, [= [sof — [as [= [ser[— | PrupaEiosA [a7e[ is [— | [— [s2[— [im |—| ssl — | [ounir [med [mA] »m [am] am | mA | (Note) : This visible LED lamp also emits some IR light. If a photodetector is located near the LED lamp, please ensure that it will not be affected by this IR light. 2 2001-09-28

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PALE 2 (ACH > CULT TI | 1 3 5 10 30 50 ©1100 FORWARD VOLTAGE Vp (V) FORWARD CURRENT Ip (mA) Iv - Te RELATIVE a OS AN TENSITY - 3 1.0) = [TT TTT TTT ety yy PTT TTT AY [ese] i | Ta = 25°C PRA) ob cee e TP PDS] 2 ott tty TTT ee gs LTE TIAN TT a z ae a ey ee cay 2 eee e Lit Ty 2 > \\ Oe eee ee i CCC] "EEBPEEER ESE oa tlre Tilt t i N | 20 0 20 40 60 80 100 580 600 620 640 660 680 700 CASE TEMPERATURE Te (°C) WAVELENGTH A (nm) Ip - Ta 40, » LITT TTT TTT I 2 4 ttt Titty = 30) Ss LEE TTT Tt ey 2. SN 2} | PNET TT TT f& 11 T PT NI TTT

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= SS FEE 20 40 60 80 100 AMBIENT TEMPERATURE Ta (°C) 200-0928

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TOSHIBA TL(RE,SE,OE,YE,PYE,GE,FGE,PGE) 1008A(T04) TLYE1008A Ip - Vp ly - Ip .i.---—_-—— ee TFT] = a e a Sse eee eee e CCP eS g PPI KEE Ef I 2 ott tiAti jij i 2 | LAU TT | fe =aa> SaaS eee lll ll g sory yee 3 A z Bs ett LIVE EEE LETTE yy sie Fir 4 7 18 19 2.0 21 22 2.3 ' 8 we 5059100 . ° ° : “ . . FORWARD CURRENT Ip (mA) FORWARD VOLTAGE Vy (V) RELATIVE LUMINOUS INTENSITY — 10 me 1.0) WAVELENGTH ee ee eee eee BRERA Cnc a g . | FREESE fd og a 4 e LET YPN TTT Ty * LETT TT EEE SE -20 0 20 40 60 80 100 540 560 580 600 620 640 660 CASE TEMPERATURE Te (°C) WAVELENGTH A (nm)

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TOSHIBA TL(RE,SE,OE, YE,PYE,GE,FGE,PGE) 1008A(T04) TLPYE1008A Ip - Vp ly - Ir 100, TT 200) = ASS el

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TOSHIBA TL(RE,SE,OE, YE,PYE,GE,FGE,PGE) 1008A(T04) TLFGE1008A Ip - VF ly - IF [peer Fee sme lili TUM | a B00 ee FH 30 2 ee ee Se th g BEEZ Eo} TIE A 2 wetttiiAi ||} |i 2 L_LIYw Ye E yi any eeeeeeee et LU TTT 2 } E HAA? Se LIVE EEE LETT yy sZt 1 1 3 5 10 30 «50 100 “7 18 19 2.0 21 22 23 FORWARD VOLTAGE Vp (V) FORWARD CURRENT Ip (mA) RELATIVE LUMINOUS INTENSITY —

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TOSHIBA TL(RE,SE,OE, YE,PYE,GE,FGE,PGE) 1008A(T04) TLPGE1008A Ip - Vy - 100; ao 30) 7 wv Ip J see ERP EEE . tmeel TTT PTT! ase = TTT PA Te] == s eel oe See E 20 TT = | L gg I Cel 2 Al eee eee All| | PILI VEL EEE] eT | Pitiviririiiy See te oe oe | Z : “ osL-—_) FORWARD VOLTAGE Vp (V) 1 36 10 3050100 FORWARD CURRENT Ip (mA) 7 ee oe oe RELATIVE WAVELENGIN - SSS Oe | oe ot re ee e | [| | TeV TT | Z 5 BREET ae IE ~ 2 0.6 Coe cei Sd Oa eG | 2 | | | Yt \\ ft | z 2 oa

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TOSHIBA __TL(RE,SE,OE, YE,PYE,GE,FGE,PGE)1008A(T04) TLUE1008A SERIES [RADIATION PATTERN] PARALLEL TO POLARITY VERTICAL TO POLARITY Ta = 25°C - tor 10° age 1 In wR 30° 302 FO_| PSS 30° PEER Ki SX

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TOSHIBA TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04) PACKAGING These LED devices are packed in an aluminum envelope with a silica gel and a moisture indicator to avoid moisture absorption. The optical characteristics of the devices may be affected by exposure to moisture in the air before soldering and they should therefore be stored under the following conditions : 1. This moisture proof bag may be stored unopened within 6 months at the following conditions. Temperature : 5~30°C Humidity : 90% (max) 2. After opening the moisture proof bag, the devices should be assembled within 168 hours in an environment of 5°C to 30°C /60% RH or below. 3. If upon opening, the moisture indicator card shows humidity 30% or above (Color of indication changes to pink) or the expiration date has passed, the devices should be baked in taping with reel, After baking, use the baked devices within 72 hours, but perform baking only once. Baking conditions : 60 + 5°C, for 12 to 24 hours. Expiration date : 6 months from sealing date, which is imprinted on the same side as this label affixed. 4, Repeated baking can cause the peeling strength of the taping to change, then leads to trouble in mounting. Furthermore, prevent the devices from being destructed against static electricity for baking of it. 5. If the packing material of laminate would be broken, the airtightness would deteriorate. Therefore, do not throw or drop the packed devices. MOUNTING METHOD SOLDERING © Reflow soldering Temperature profile tot 5 tot € , | 140-160°C | a5 ~~ sS 28 f 1 4C/s a Ai acjs | max 26 | max! 60-1208 Time (s) — @ Please perform the first reflow soldering within 168h after opening the package with reference to the above temperature profile. 12 2001-09-28

TOSHIBA TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04) @ Second time reflow soldering In case of second reflow soldering, it should be performed within 168h after first reflow under the above conditions. Storage conditions before second reflow soldering : 30°C, 60% RH or lower @ Do not perform flow soldering. @ Make any necessary soldering corrections manually. (Do not do this more than once for any given pin.) Soldering iron : 25 W Temperature : no more than 300°C Time : within 3s @ Recommended soldering pattern pes OS $708 Unit in mm ~ 45 _ {2 i o i S POST SOLDER CLEANING When cleaning after soldering is needed, the following condition must be adhered to. Cleaning solvents : AK225 or Alcohol Temperature : 50°C (max) for 30s (max) or 30°C (max) for 3 minutes (max) Ultrasonic : 8300 W max PRECAUTION FOR MOUNTING Do not apply force to the plastic part of the LED in high temperature conditions. Do not apply friction using a hard materials for avoid injuring the plastic part of the LED. Keep the LED away from any other parts when assembling boards into the set. TAPING SPECIFICATIONS This specification lays out the 4mm pitch embossed-tape packing requirements for 1.6mm (L) X 0.8mm (W) X 0.6mm (H) size surface-mount LED lamp. 1. Product Naming System The type of package used for shipment is denoted by a symbol suffix after the product number. The method of classification is as below. (this method, however does not apply to products whose electrical characteristics differ from standard Toshiba specifications) (1) Tape Type : T04 (4mm pitch) (2) Example TLRE1008A 1 Tape Type Toshiba Product No. EB 2007-09-28

TOSHIBA TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04) 2. Related Matter (1) Electro-optical Characteristics Please refer to the each technical datasheet for electro-optical characteristics of tape packed products (2) Handling Precautions Tape material protected against static electricity. However, static electricity may occur depending on quantity of charged static electricity and a device may attach to a tape, or a device may be unstable when peeling a tape cover. a) In process, taping materials may sustain an electrostatic charge, use an ionizer to neutralize the ions. b) For transport and temporary storage of devices, use containers (boxes, jigs, bags) that are made of anti-static materials or of materials that dissipate electrostatic electricity. 3. Tape Dimensions (Unit in mm) SYMBOL | DIMENSION | TOLERANCE SYMBOL | DIMENSION | TOLERANCE ee [se [17% [| #0a__ a A | [py [0.60 | £0.05 Po Koy D | Pp t) bt r 1 a E l +--+ -Q--- OF |: ! v F lw i i LH [P| Dy POLARITY Ao 14 2001-09-28

TOSHIBA TL(RE,SE,OE, YE,PYE,GE,FGE,PGE) 1008A(T04) 4. Reel Dimensions +0 Unit in mm $180 "4 W441 | | st03 g21+0.8 $18 + 0.5 i \\ 7

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(a & ¢) ea DS LE \\ 240.5 i EIJA standard : RRM08B { Reel Material : polystyrene 5. Leader and Trailer Fascbbhionessaseusead Roncccnscsst )(—) | _over 40mm _ | “over 40mm eee ™S Leader : 190 mm (min) f rorerecrererererr i$ | - : 15 2001-09-28

TOSHIBA TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04) 6. Packing Form (1) Number of Devices per Reel and Carton 7000 devices 20000 devices (2) Packing : Silica gel and reel are packed into sealed aluminum pack. 7. Notation Method (1) Example : TLRE1008A (T04) P/N: NOTE Lot Number (rank symbol) (2) Label location : @ Reel © Carton Tape Feed Direction i \\ | | ) abel position Label position @ Aluminum pack : Attached to center of one side 16 2001-09-28

TOSHIBA TL(RE,SE,OE,YE,PYE,GE,FGE,PGE)1008A(T04) RESTRICTIONS ON PRODUCT USE ooo7o7eac @ TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of such TOSHIBA products could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability Handbook” etc.. @ The TOSHIBA products listed in this document are intended for usage in general electronics applications (computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances, etc.). These TOSHIBA products are neither intended nor warranted for usage in equipment that requires extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in this document shall be made at the customer's own risk. @ Gallium arsenide (GaAs) is a substance used in the products described in this document. GaAs dust and fumes are toxic. Do not break, cut or pulverize the product, or use chemicals to dissolve them. When disposing of the products, follow the appropriate regulations. Do not dispose of the products with other industrial waste or with domestic garbage. @ The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA CORPORATION for any infringements of intellectual property or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any intellectual property or other rights of TOSHIBA CORPORATION or others. @ The information contained herein is subject to change without notice. 17 2001-09-28