TLP4590AF | DigiCamel IC Datasheet

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TLP4590A TOSHIBA | Alldatasheet

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TLP4590A,TLP4590AF Photocouplers Photorelay TLP4590A,TLP4590AF Start of commercial production 2021-03 1. Applications

Heating, ventilation and air conditioning (HVAC)
Security Systems
Factory Automation (FA)
Power supplies
Measuring Instruments
Mechanical relay replacements 2. General The TLP4590A and TLP4590AF photorelay consists of a photo MOSFET optically coupled to an infrared light emitting diode. It is housed in a 6-pin DIP package. The TLP4590A and TLP4590AF are suitable for replacement of mechanical relays in many applications which require space savings. 3. Features (1) Normally closed (1-Form-B) (2) OFF-state output terminal voltage: 60 V (min) (3) Trigger LED current: 2 mA (max) (4) ON-state current: 1.2 A (max) (Ta = 25 ) (5) ON-state resistance: 0.6 Ω (max) (6) Isolation voltage: 5000 Vrms (min) UL-recognized: UL 1577, File No.E67349 cUL-recognized: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN 60747-5-5, EN 62368-1 (Note 1) (Note 1):When a VDE approved type is needed, please designate the Option (D4) . 4. Mechanical Parameters Characteristics Creepage distances Clearance distances Internal isolation thickness 7.62-mm pitch TLP4590A 7.0 (min) 7.0 (min) 0.3 (min) 10.16-mm pitch TLP4590AF 8.0 (min) 8.0 (min) 0.3 (min) Unit mm 2022-10-28 Rev.8.0 ©2020-2022 Toshiba Electronic Devices & Storage Corporation

TLP4590A,TLP4590AF 5. Packaging (Note) TLP4590A 11-7A8S TLP4590A(LF1,TP1) 11-7A801S TLP4590A(LF5,TP5) 11-7A805S TLP4590AF 11-7A802S TLP4590AF(LF4,TP4) 11-7A804S Note: Through-hole type: TLP4590A, TLP4590AF : Lead forming option: (LF1), (LF4), (LF5) : Taping option: (TP1), (TP4), (TP5) 6. Pin Assignment 2022-10-28 Rev.8.0 ©2020-2022 Toshiba Electronic Devices & Storage Corporation

TLP4590A,TLP4590AF 7. Internal Circuit 8. Absolute Maximum Ratings (Note) (Unless otherwise specified, T a = 25 ) LED Detector Common Characteristics Input forward current Input forward current derating Input forward current (pulsed) Input reverse voltage Input power dissipation Input power dissipation derating Junction temperature OFF-state output terminal voltage ON-state current(A connection) ON-state current(B connection) ON-state current(C connection) ON-state current derating(A connection) ON-state current derating(B connection) ON-state current derating(C connection) ON-state current (pulsed) Output power dissipation Output power dissipation derating Junction temperature Storage temperature Operating temperature Lead soldering temperature Isolation voltage (Ta ≥ 58 ) (100 µs pulse, 100 pps) (Ta ≥ 25 ) (Ta ≥ 25 ) (Ta ≥ 25 ) (Ta ≥ 25 ) (t = 100 ms, duty = 1/10) (Ta ≥ 25 ) (10 s) Symbol IF ∆IF/∆Ta IFP VR PD ∆PD/∆Ta Tj VOFF ION ∆ION/∆Ta IONP PO ∆PO/∆Ta Tj Tstg Topr Tsol BVS Note (Note 1) (Note 1) (Note 2) Rating -0.3 -0.5 125 1200 1200 2400 -12.0 -12.0 -24.0 750 -7.50 125 -55 to 125 -40 to 110 260 5000 Unit mA mA/ A V mW mW/ V mA mA/ A mW mW/ Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note 1: For an application circuit example, see Chapter 15. Note 2: This device is considered as a two-terminal device: All pins on the LED side are shorted together, and all pin on the photodetector side are shorted together. 2022-10-28 Rev.8.0 ©2020-2022 Toshiba Electronic Devices & Storage Corporation

TLP4590A,TLP4590AF 9. Electrical Characteristics (Unless otherwise specified, T a = 25 ) LED Detector Characteristics Input forward voltage Input reverse current Input capacitance OFF-state current OFF-state current Output capacitance Symbol VF IR Ct IOFF IOFF COFF Note Test Condition IF = 10 mA VR = 6 V V = 0 V, f = 1 MHz VOFF = 60 V, IF = 5 mA VOFF = 40 V, IF = 2 mA V = 0 V, f = 1 MHz, IF = 5 mA Min 1.1 Typ. 1.27 550 Max 1.4 Unit V µA pF µA µA pF 10. Coupled Electrical Characteristics (Unless otherwise specified, T a = 25 ) Characteristics Trigger LED current Return LED current ON-state resistance(A connection) ON-state resistance(B connection) ON-state resistance(C connection) Symbol IFC IFT RON Note (note 1) Test Condition IOFF = 10 µA ION = 1200 mA ION = 1200 mA ION = 1200 mA ION = 2400 mA Min 0.01 Typ. 0.3 0.3 0.2 0.1 Max 0.6 Unit mA mA Ω note 1: For an application circuit example, see Chapter 15. 11. Isolation Characteristics (Unless otherwise specified, T a = 25 ) Characteristics Total capacitance (input to output) Isolation resistance Isolation voltage Symbol CS RS BVS Note (Note 1) (Note 1) (Note 1) Test Condition VS = 0 V, f = 1 MHz AC, 60 s Min 12 × 1010 5000 Typ. 0.9 1014 Max Unit pF Ω Vrms Note 1: This device is considered as a two-terminal device: Pins 1, 2 and 3 are shorted together, and pins 4, 5 and 6 are shorted together. 12. Switching Characteristics (Unless otherwise specified, T a = 25 ) Characteristics Turn-on time Turn-off time Symbol tON tOFF Note Test Condition See Fig. 12.1. RL = 200 Ω, VDD = 20 V, IF = 5 mA See Fig. 12.1. RL = 200 Ω, VDD = 20 V, IF = 5 mA Min Typ. 0.3 Max Unit ms ms Fig. 12.1 Switching Time Test Circuit and Waveform 2022-10-28 Rev.8.0 ©2020-2022 Toshiba Electronic Devices & Storage Corporation

TLP4590A,TLP4590AF 13. Characteristics Curves (Note) Fig. 13.1 IF - T a Fig. 13.2 ION - T a Fig. 13.3 IF - V F Fig. 13.4 ION - V ON Fig. 13.5 RON - T a Fig. 13.6 IFC - T a 2022-10-28 Rev.8.0 ©2020-2022 Toshiba Electronic Devices & Storage Corporation

TLP4590A,TLP4590AF Fig. 13.7 tON, tOFF - I F Fig. 13.8 tON, tOFF - T a Fig. 13.9 IOFF - T a Fig. 13.10 IOFF - V OFF Fig. 13.11 IOFF - I F Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. 2022-10-28 Rev.8.0 ©2020-2022 Toshiba Electronic Devices & Storage Corporation

TLP4590A,TLP4590AF 15. Soldering and Storage 15.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used.

When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used
When using soldering flow Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once.
When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 15.2. Precautions for General Storage
Avoid storage locations where devices may be exposed to moisture or direct sunlight.
Follow the precautions printed on the packing label of the device for transportation and storage.
Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %, respectively.
Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions.
Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads.
When restoring devices after removal from their packing, use anti-static containers.
Do not allow loads to be applied directly to devices while they are in storage.
If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. 2022-10-28 Rev.8.0 ©2020-2022 Toshiba Electronic Devices & Storage Corporation

TLP4590A,TLP4590AF 16. Marking TLP4590A TLP4590AF 17. Ordering Information (Example of Item Name) Item Name TLP4590A(F TLP4590A(LF1,F TLP4590A(LF5,F TLP4590A(TP1,F TLP4590A(TP5,F TLP4590A(D4,F TLP4590A(D4LF1,F TLP4590A(D4LF5,F TLP4590A(D4TP1,F TLP4590A(D4TP5,F TLP4590AF(F TLP4590AF(LF4,F TLP4590AF(TP4,F TLP4590AF(D4,F TLP4590AF(D4LF4F TLP4590AF(D4TP4F Packaging (Note 1) TH LF1 LF5 LF1 LF5 TH LF1 LF5 LF1 LF5 TH, Wide forming LF4, Wide forming LF4, Wide forming TH, Wide forming LF4, Wide forming LF4, Wide forming VDE Option EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 EN 60747-5-5 Packing (MOQ) Magazine (50 pcs) Magazine (50 pcs) Magazine (50 pcs) Tape and reel (1500 pcs) Tape and reel (1500 pcs) Magazine (50 pcs) Magazine (50 pcs) Magazine (50 pcs) Tape and reel (1500 pcs) Tape and reel (1500 pcs) Magazine (50 pcs) Magazine (50 pcs) Tape and reel (1000 pcs) Magazine (50 pcs) Magazine (50 pcs) Tape and reel (1000 pcs) Note 1: TH: Through-hole, LF: Lead forming for surface mount 2022-10-28 Rev.8.0 ©2020-2022 Toshiba Electronic Devices & Storage Corporation

TLP4590A,TLP4590AF Package Dimensions Unit: mm TLP4590AF(LF4,TP4) Weight: 0.39 g (typ.) Package Name(s) TOSHIBA: 11-7A804S 2022-10-28 Rev.8.0 ©2020-2022 Toshiba Electronic Devices & Storage Corporation

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Product Information

TLP4590AF specifications and overview.

Summary

Photocouplers Photorelay 2022-10-28 Rev.8.0

Description

Photocouplers Photorelay 2022-10-28 Rev.8.0

Source title TLP4590AF Datasheet(PDF) - Toshiba Semiconductor

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