TLE5009

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Rev. 1.1, 2012-04 TLE5009 TLE5009-E2000 TLE5009-E1000 TLE5009-E2010 TLE5009-E1010 Angle Sensor GMR-Based Angular Sensor

81726 Munich, Germany

© 2012 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.

Data Sheet 3 Rev. 1.1, 2012-04 Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CI POS™, CIPURSE™, EconoPAC K™, CoolMOS™, CoolSET™, CORECONTROL™, CROSSAVE™, DAVE™, EasyPIM™, EconoBRIDGE™, Econ oDUAL™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, I²RF™, ISOFACE™, IsoPACK™, MIPAQ™, ModSTACK™, my-d™, NovalithIC™, OptiMOS™, OR IGA™, PRIMARION™, Prim ePACK™, PrimeSTACK™, PRO-SIL™, PROFET™, RASIC™, ReverSave™, SatRIC™, SIEGET™, SINDRION™, SIPMOS™, SmartLEWIS™, SOLID FLASH™, TEMPFE T™, thinQ!™, TRENCH STOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Te chnologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ of ARM Limited, UK. AUTOSAR™ is licensed by AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG Inc. CAT-iq™ of DECT Forum. COLOSSUS™, FirstGPS™ of Trimble Navigation Ltd. EMV™ of EMVC o, LLC (Visa Holdings In c.). EPCOS™ of Epcos AG. FLEXGO™ of Microsoft Corp oration. FlexRay™ is licensed by FlexRay Consortium. HYPERTERMINAL™ of Hilgraeve Incorporated. IEC™ of Commission Electrot echnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNATIONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Graphics of MURATA MANUFACTURING CO., MICROWAVE OFFI CE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Technologies, Inc. Open wave™ Openwave Systems Inc. RED HAT™ Red Hat, Inc. RFMD™ RF Micro Devices, Inc. SIRIUS™ of Sirius Sate llite Radio Inc. SOLARIS™ of Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Sy mbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEAKLITE™ of CEVA, Inc. T EKTRONIX™ of Tektroni x Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of Cadence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zetex Limited. Last Trademarks Update 2011-02-24

Revision History

Changes Subjects (changes since revision 1.0) Chapter 3.3 Inserted magnetic field definition Chapter 3.4.3 Updated parameter X,Y amplitude Chapter 3.4.4 Inserted calibration information for definition of overall angle error Chapter 3.4.5 Updated information of overall angle error, product types included: TLE5009-E2010, TLE5009- E1010 Chapter 3.5.2 Inserted information on external safety checks, differential vector length check

Data Sheet 4 Rev. 1.1, 2012-04 Table of Contents

Data Sheet 6 Rev. 1.1, 2012-04 List of Tables

Data Sheet 7 Rev. 1.1, 2012-04

1 Product Description

1.1 Overview

The TLE5009 is an angle sensor with analog outputs. It det ects the orientation of a ma gnetic field by measuring sine and cosine angle components with Giant Magneto Resistance (GMR) elements. It provides analog sine and cosine output voltages that describe the magnet angle in a range of 0 to 360°. The differential GMR bridge signals are temperature compensated and independent of the magnetic field strength to maintain constant output voltage over a wide temper ature and field range. The a nalog output is designed for differential applications. The output voltages are designed to use the dynamic ran ge of an A/D-converter using the same supply as the sensor as voltage reference. Product type TLE5009-E2000 and TLE5009-E2010 are intended for use in circuits with 5 Volts supply. Product types TLE5009-E1000 and TLE5009-E1010 are intended for use in 3.3V applications. Product types TLE5009-E2010 and TLE5009-E1010 have improved angular accuracy achieved by production trimming at two temperatures.

1.2 Features

• 3V to 5.5V operating supply voltage
• Low current consumption and very quick start up
• Overvoltage detection
• 360° contactless angle measurement
• Output amplitude optimized for circuits with 3.3V or 5V supply voltage (type -E10x0 or -E20x0 respectively)
• Immune to airgap variations due to GMR based sensing principle
• Output amplitude constant over a wide temperature range: -40°C to 150°C (junction temperature)
• High accuracy typically 0.6° overall angle error
• AEC-Q100 automotive qualified
• Green package with lead-free (Pb-free) plating

1.3 Target Applications

The TLE5009 GMR angle sensor is designed for angular position sensing in automotive applications. Its high accuracy combined with short propagation delay makes it suitable for systems with high speeds and high accuracy demands such as rotor position measurement for electric motor commutation. At the sa me time its fast start-up time and low overall power consumption enables the device to be employed in low-power applications. Extremely low power consumption can be achieved with power cycling, where the device excells with fastest power on time.

• Rotor position sensing for electric motor commutation
• Rotary switches
• Steering angle sensing
• Valve or flap position sensing Product Type Marking Ordering Code Package TLE5009-E2000 0092000 SP000912760 PG-DSO-8 TLE5009-E1000 0091000 SP000912764 PG-DSO-8 TLE5009-E2010 0092010 SP000912770 PG-DSO-8 TLE5009-E1010 0091010 SP000912774 PG-DSO-8

Data Sheet 8 Rev. 1.1, 2012-04

2 Functional Description

2.1 General

The GMR sensor is implemented using vertical integr ation. This means that the GMR sensitive areas are integrated above the analog portion of the TLE500 9 chip. These GMR elements change their resistance depending on the direction of the magnetic field. Four individual GMR elements are connected in a Wheatstone bridge arrangement. Each GMR element senses one of two components of the applied magnetic field:

• X component, V x (cosine) or the
• Y component, V y (sine) The advantage of a full-bridge structure is that the amplitude of the GMR signal is doubled and temperature effects cancel out. Figure 1 Sensitive bridges of the GMR sensor Note: In Figure 1, the arrows in the resistors symbolize the direction of the reference layer. Size of the sensitive areas is greatly exagerated for better visualisation. The output signal of each bridge is unambiguous in a range of 180°. Therefor e two bridges are oriented orthogonally to each other to measure 360°. With the trigonometric function ARCTAN, the true 360° angle value that is represented by the relation of X and Y signals can be calculated according to Equation (1). (1) VDDGNDADCX+ GMR Resistors ADCX-A D C Y+A D C Y- VX VY NS 90°

Data Sheet 9 Rev. 1.1, 2012-04 Figure 2 Ideal output of the GMR sensor bridges V Angle α 90° 180° 270° 360°0° VX (COS_P) Y Component (SIN) VY (SIN_P) VY VX X Component (COS) VY (SIN_N) VX (COS_N) 90°

Data Sheet 10 Rev. 1.1, 2012-04

2.2 Pin Configuration

The sensitive area is located at the center of the chip. Figure 3 Pin configuration (top view)

2.3 Pin Description

Pin No. Symbol In/Out Function

1 COS_P O Analog positive cosine output

2 COS_N O Analog negative cosine output

3 GND2 Ground

4 GND1 Ground

GMR O GMR bridge voltage proportional to temperature. Diagnostic function. 6V DD Supply voltage

7 SIN_N O Analog negative sine output

8 SIN_P O Analog positive sine output

5678 Center of

Data Sheet 11 Rev. 1.1, 2012-04

2.4 Block Diagram

Figure 4 TLE5009 block diagram Y-GMR X-GMR Amplifier Amplifier DC-Offset & Fuses COS_P VDD COS_N SIN_P SIN_N GND1 VGMR GND2 PMU & Temperature Compensation

Data Sheet 12 Rev. 1.1, 2012-04

3 Specification

3.1 Application Circuit

Figure 5 shows a typical 5V application circuit. The sensor is supplied by the same supply as the microcontroller. The microcontroller comprises 5 A/D inputs used to read in the sensor output sig nals. For reasons of EMC and output filtering, the following RC low pass arrangement is recommended. Figure 5 Application ci rcuit for the TLE5009

3.2 Absolute Maximum Ratings

Attention: Stresses above the max. values listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Maximum ratings are absolute ratings; exceeding only one of these values may cause irreversible damage to the device. Table 2 Absolute maximum ratings Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Supply voltage V DD -0.5 6.5 V Max 40 h / lifetime Junction temperature T J -40 150 °C

150 For 1000 h not additive

Magnetic field induction B ⏐200⏐ mT Max. 5 min @ T A = 25°C ⏐150⏐ Max. 5 h @ TA = 25°C Storage temperature T ST -40 150 °C Without magnetic field 100 nF SIN_P SIN_N COS _P COS _N ) VGMR GND2 4 .7nF ) ) ) CAN RX CAN TX CAN CAN Tranceiver GND Microcontroller e.g. Infineon XC800 Series *) 68 nF **) 10 kΩ VDD GND1 TLE5009

Data Sheet 13 Rev. 1.1, 2012-04

3.3 Operating Range

The following operating conditions must not be exceeded in order to ensure correct operation of the TLE5009. All parameters specified in the followi ng sections refer to these operating conditions, unless otherwise noticed. Table 3 is valid for -40°C < TJ < 150°C. The magnetic field is defined at room temperature. Depending on the maximum junction temperature the maximum field strength is shown in Figure 6. In case of a maximum junction temperature Tj = 100°C a magnet with up to 60mT at room temperature is ap plicable. The window for magnetic field in Table 3 is valid for the max junction temperature of the device. Figure 6 Magnetic input field strength Note: The thermal resistances listed in Table 10 “Package parameters” on Page 28 must be used to calculate the corresponding ambient temperature. Table 3 Operating range Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Supply voltage1) 1) Supply voltage V DD buffered with 100 nF ceramic capacitor in close proximity to the sensor. VDD 4.5 5.0 5.5 V TLE5009-E2000, TLE5009-E2010 3.0 3.3 3.6 V TLE5009-E1000, TLE5009-E1010 Output current 2) Not subject to production test - ve rified by design/characterization. IQ 0 0.5 mA COS_N; COS_P; SIN_N; SIN_P 00 . 1 m A V GMR Load capacitance2)3) 3) Directly connected to the pin. CL 0 4.7 nF COS_N; COS_P; SIN_N; SIN_P; V GMR Magnetic field2)4) 4) Values refer to an homogenous magnetic field (B XY) without vertical magnetic induction (BZ = 0mT). BXY_25 24 50 mT at room temperature, in X/Y direction Angle range α 03 6 0 ° Rotation speed2)5) 5) Typical angle propagation delay is 1.62° at 30000 rpm. n 30000 rpm 100Magnetic field (mT) -40 Junction Temperature (°C) 25 85 100 150

Data Sheet 14 Rev. 1.1, 2012-04 Calculation of the Junction Temperature The total power dissipation PTOT of the chip increases its temperature above the ambient temperature. The power multiplied by the total thermal resistance RthJA (Junction-to-Ambient) leads to a calculation of the final junction temperature. RthJA is the sum of the addition of the values of the two components Junction-to-Case and Case-to-Ambient. (2) Example (assuming no load on Vout): (3) For molded sensors, the calculation with RthJC is more appropriate. ))(( OUTOUTDDDDDDthJATOTthJA AJ thCAthJCthJA IVVIVRPRT TTT RRR Δ+= [] [] [ ] KVAAVW KT mAI VV DD DD 25.5)0007.05(150 =+××⎥⎦ ⎡=Δ

Data Sheet 15 Rev. 1.1, 2012-04

3.4 Characteristics

3.4.1 Electrical Parameters

The indicated electrical parameters apply to the full operating range, unless otherwise specified. The typical values correspond to a supply voltage V DD = 3.0V - 5.5 V and 25 °C, unless individually specified. All other values correspond to -40°C < TJ < 150°C.

3.4.2 Electrostatic discharge protection

Table 4 Electrical parameters Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Supply current I DD 7 10.5 mA Without resistiv e or capacitive load on output pins POR level V POR 2.4 2.65 2.97 V Power-On Reset POR hysteresis1) 1) Not subject to production test - ve rified by design/characterization VPORhy 50 mV Power-On time t PON 30 40 µs Measured on V GMR pin without external circuit Temperature reference voltage VGMR 0.6 1.052 1.8 V Temperature proportional output voltage; available on pin VGMR Diagnostic function V GMR 00 . 3 9 V Diagnostic for internal errors; available on pin VGMR Temperature coefficient of VGMR TCVGMR 0.4 %/K Table 5 ESD protection Parameter Symbol Values Unit Notes min. max. ESD voltage V HBM ±4.0 kV Human Body Model 1) 1) Human Body Model (HBM) accord ing to: ANSI/ESDA/JEDEC JS-001 VSDM ±0.5 kV Socketed Device Model 2) 2) Socketed Device Model (SDM) accord ing to: ESDA/ANSI/ESD SP5.3.2-2008

Data Sheet 16 Rev. 1.1, 2012-04

3.4.3 Output Parameters

All parameters apply over the full operating range, unless otherwise specified. The parameters in Table 6 refer to single-ended output and Table 7 to differential output. For variable names please refer to Figure 7 “Single-ended output signals” on Page 17 and Figure 8 “Differential output of ideal cosine” on Page 18. The following equations describe various types of errors that combine to the overall angle error. The maximum and zero-crossing of t he SIN and COS signals do not occur at the precise angle of 90°. The difference between the X and Y phases is called the orthogonality error. In Equation (4) the angle at zero crossing of the X cosine output is subtracted from the angle at the maximum of the Y SIN output, which describes the orthogonality of X and Y. (4) The amplitudes of SIN and COS signals are not equal to each other. The amplitude mismatch is defined as syncronism, shown in Equation (5). This value could also be described as amplitude ratio mismatch. (5) Differential signals are centered at the mean output voltage VMVX, VMVY given in Table 6. The differential voltages for X or Y are defined in Equation (6). (6) The maximum amplitudes are defined for X or Y as given in Equation (7): (7) Differential offset is of X or Y is defined in Equation (8). (8) In single-ended mode the offset is defined as the mean output voltage. ][][ 0max XY ααϕ −= Y X A Ak *100= SINNSINPYdiff COSNCOSPXdiff VVV VVV ( ) MINdiffMAXdiff Ydiff MINdiffMAXdiff Xdiff YYA XXA ( ) MINdiffMAXdiff Ydiff MINdiffMAXdiff Xdiff YYO XXO

Data Sheet 17 Rev. 1.1, 2012-04 Figure 7 Single-ended output signals Table 6 Single-ended output parameters Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. X, Y amplitude1) 1) Valid at 0h AX, AY 1.40 1.85 V TLE5009-E2000, TLE5009-E2010 0.90 1.20 V TLE5009-E1000, TLE5009-E1010 X, Y synchronism2) 2) Valid at 25°C, 0h k 95 100 105 % X, Y orthogonality error2) -10 0 10 ° Mean output voltage3) 3) Including X, Y offset VMVX, VMVY 0.48*VDD 0.5*VDD 0.52*VDD VV MV=(Vmax-Vmin)/2 X,Y cut off frequency4) fc 30 kHz -3dB attenuation X,Y delay time4) 4) Not subject to production test - ve rified by design/characterization tadel 9µ s Output noise4) VNoise 1.5 mV RMS

Data Sheet 18 Rev. 1.1, 2012-04 Figure 8 Differential output of ideal cosine Table 7 Differential output parameters Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. X, Y amplitude1) 1) Valid at 0h AXdiff, AYdiff 2.8 3.7 V TLE5009-E2000, TLE5009-E2010 1.8 2.4 V TLE5009-E1000, TLE5009-E1010 X, Y synchronism2) 2) Valid at 25°C, 0h k 95 100 105 % X, Y offset2) OXdiff, OYdiff -50 0 50 mV X, Y orthogonality error2) φ -10 0 10 ° X,Y cut-off frequency3) 3) Not subject to production test - ve rified by design/characterization fc 30 kHz -3dB attenuation X,Y delay time3) tadel 9µ s Output noise3) VNoise 3m V R M S

Data Sheet 19 Rev. 1.1, 2012-04

3.4.4 Calibration of TLE5009

This chapter explains how to dete rmine the Giant MagnetoR esistance (GMR) paramete rs such as amplitude, offset, and the phase of X- and Y-channels. Extraction of these parameters is essential to achieve the angle accuracy given in Table 8 “Angle performance in differential applications” on Page 25. The end-of-line calibration is accomplished using the following sequence (Figure 9): Figure 9 Calibration routine 1. Turn magnetic field 360° left and measure X and Y values 2. Calculate amplitude, offset, phase correction values of left turn 3. Turn further 90° left and 90° back right without measurement 4. Turn magnetic field 360° right and measure X and Y values 5. Calculate amplitude, offset, phase correction values of right turn 6. Calculate mean values of amplitude, offset, phase correction The calibration has to be done at room temperature with a magnet in the specified magnetic field range.

3.4.4.1 Extraction of Parameters

There are two possible methods for extracting these parameters. The methods will be discussed in more detail in the next two sections.

3.4.4.1.1 Min-Max Method

Xmax, Xmin, Ymax and Ymin have to be extracted out of every full-turn measurement (Figure 10). 90° 180° 270° Start End 1.) left turn measurement 3.) right & left turn w/o measurement 4.) right turn measurement

Data Sheet 20 Rev. 1.1, 2012-04 Figure 10 Min-Max method Afterwards, amplitude ( Equation (9), Equation (10)) and offset ( Equation (11), Equation (12)) can be calculated: (9) (10) (11) (12) The corresponding maximum and zero-crossing points of the SIN and COS signals do not occur at the precise distance of 90°. The difference between X and Y phases is called the orthogonality error (Equation (13)): (13) Y X Xmax Ymax Ymin Xmin X(Ymax) Y(Xmax) Y(Xmin) X( Ymin) Sensor- Zeropoint minmax XXAX minmax YYAY minmax XXOX minmax YYOY YX ϕϕϕ −=

Data Sheet 21 Rev. 1.1, 2012-04 Figure 11 Orthogonality error There is another more accurate way to determine the orthogonality error. The orthogonality can be calculated out of the magnitude of two 90° angle shifted components. Possible angle combinations are 45° and 135°, 135° and 225°, 225° and 315° or 315° and 45°. The angle value is given by the angle sensor. No refe rence is necessary. Therefore the final parameters of amplitude and offset (Chapter 3.4.4.2) should be used. At an angle output of 45° the corresponding Y(sin) and X(cos) values can be read out. This has been done also at 135° (Figure 12). Next step is to calculate the length of the magnitudes (Equation (14)): (14) M45, M135.. Magnitude at 45° and 135° X45, X135 .. Cosine values at 45° and 135° Y45, Y135 .. Sine values at 45° and 135° With these magnitudes the orthogonality can be calculated (Equation (15)): (15) 135 135135 4545 YXM YXM )arctan(*2 45135 45135 MM MM −=ϕ

Data Sheet 22 Rev. 1.1, 2012-04 Figure 12 Correction of orthogonality error

3.4.4.1.2 Exact Method

This method uses the Discrete Fourie r Transform (DFT) to extract the parameters out of the measurements. Therefore an accurate reference system is necessary. This method is done using 2m measurement points at 360° DFT Offset Calculation: The offset is calculated by the summation of the X- or Y- measurements divided by the number of measurement points (Equation (16)): (16) X(n) .. X value at measurement point n Y(n) .. Y value at measurement point n n .. Measurement points DFT Amplitude and Phase Calculation: To determine the amplitude, the real and imaginary parts must be calculated. This has been done with Equation (17) for the X values and Equation (18) for the Y values. ß describes the reference angle (e.g. n = 64; measurement every 360° / 64 = 5.625° step). describes the reference angle (e.g. n = 64; measurement every 360° / 64 = 5.625° step). (17) (18) X (COS) Y (SIN) M45 M135 45°135° ( ) ( ) ( )[ ] () ( ) ( )[] nnYYYO nnXXXO Y x /..21 /..21 +++= +++= () ( ) ( ) ( ) ( ) ( )[] nnSINnXSINXSINXiXDFT nnCOSnXCOSXCOSXrXDFT βββ βββ +++= +++= () ( ) ( ) ( ) ( ) ( )[] nnSINnYSINYSINYiYDFT nnCOSnYCOSYCOSYrYDFT βββ βββ +++= +++=

Data Sheet 23 Rev. 1.1, 2012-04 Now the amplitude and phase can be calculated (Equation (19), Equation (20)) (19) (20)

3.4.4.2 Final Parameters

No matter what calibration method is used, you still have to calculate the symmetrical values of the parameters. This is done using the mean value of the clock-wise (cw) rotation parameters and counterclock-wise (ccw) rotation parameters. This calculation has to be done with X and Y parameters. These parameters have to be used for the signal correction. (21) (A,O,ϕ)M .. Mean parameters (A,O,ϕ)CW .. Parameters of clock-wise rotation (A,O,ϕ)CCW .. Parameters of counterclock-wise rotation )__()__( )__()__( iYDFTrYDFTA iXDFTrXDFTA Y X YX Y X rYDFT iYDFT rXDFT iXDFT ϕϕϕ πϕ ϕ __arctan2 __arctan ccwcw M ccwcw M ccwcw M OOO AAA ϕϕϕ +=

Data Sheet 24 Rev. 1.1, 2012-04

3.4.4.3 Angle Calculation

To get highly accurate angle values, the fo llowing angle calculation must be performed. Figure 13 shows the implementation within a microcontroller. Figure 13 Implementation of angle calculation Offset Correction (Offset_corr) After the X and Y values are read out, the room temperature offset value must be subtracted ( Equation (22)): (22) Amplitude Normalization (Gain_corr) The next step is to normalize the X and Y values by using the mean values determined in the calibration. (23) Non-Orthogonality Correction (Angle_corr) The influence of the non-orthogonalit y can be compensated for by using Equation (24), in which only the Y channel must be corrected. (24) Resulting Angle After correction of all errors, the resulting angle can be calculated using the arctan function1). (25) 1) Microcontroller library function “arctan2(Y 3,X2)” works better to resolve 360° Sensor X Sensor Y Calibrations - Algorithm * Y-Corr atan (Cordic ) X_tmp Y_tmp Offset_ corr Gain_ corr Angle_ corr Y X OYY OXX YM XM A YY A XX )cos( )sin(*22 ϕ ϕ −−= XYY X X Y ϕα −= )arctan(

Data Sheet 25 Rev. 1.1, 2012-04

3.4.5 Angle Performance

The overall angle error represents the relative angular error. This error describes the deviation from the reference line after zero angle definition. The typical value correspond to a supply voltage V DD = 3.0V - 5.5 V and 25 °C, unless individually specified. All other values correspond to -40°C < TJ < 150°C. Calibration of offset, orthogonality, syncronism and phase error at 25°C are required to achieve the overall angle error specified. For the detailed calibration procedure refer to Chapter 3.4.4. Infineon offers temperature compensated versions of the device TLE5009-E2010, TLE5009-E1010. These devices have an improved angular accuracy as can be seen in Table 8. Table 8 Angle performance in differential applications Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Overall angle error1)2)3) 1) Including hysteresis error 2) Valid at 0h 3) Valid for differential applications. The mean output voltage variation in single ended mode is not included in the angle error. Please contact Infineon for information about possible optimization for single ended applications. αERR 0.6 3 ° TLE5009-E2000, TLE5009-E1000 0.6 2.2 ° TLE5009-E2010, TLE5009-E1010

Data Sheet 26 Rev. 1.1, 2012-04

3.5 Safety Features

3.5.1 Built in error diagnosis

The device sensor provides two functions at the VGMR pin. During normal operation the voltage measured at this pin is temperature dependent. The typical voltage at room temperature and the temperature coefficient are given in Table 4 “Electrical parameters” on Page 15. The second purpose of pin VGMR is the diagnosis functionality. In case the device detects an internal error, the pin is driven to a low level as described in Table 4 “Electrical parameters” on Page 15. The errors that can be detected by monitoring the status of the VGMR pin are:

• Start-up failure
• Overvoltage at VDD (threshold level min. 6V, max. 7V)
• Undervoltage at internal nodes

3.5.2 External Diagnosis

Adressing the demands for functional safety, run time chec ks can be done to increase the diagnostic coverage. Depending on the application specif ics such as the available time an d processing capab ilities, the sensor behaviour is monitored and compared with the specified behaviour of the device.

3.5.2.1 Vector length check differential voltage mode

A comprehensive safety check is to monitor the vector le ngth of Vx and Vy signals. Output signals representing sine and cosine have a fixed 90° phase relationship to each other. To determine if the output signals are valid, the length of the output vector length must be nearly constant independent of the magnet position. The vector length corresponds to the amplitude of the output signals and utilizes the fact that there is a 90° phase shift between sine and cosine output. It is calculated according to Equation (26). As illustrated in Figure 14 “Valid vector length”, the vector describes a circle along one revolution of the magnet. The length of the vector is almost constant, slightly influenced by GMR synchronicit y, orthogonality, offset and temperature. (26) Figure 14 Valid vector length _ DIFFYDIFFXVEC VVV += VX (COS) VY (SIN) VVEC VX VY

Data Sheet 27 Rev. 1.1, 2012-04 The resulting vector length must always be within the range given in Table 9, depending on the supply voltage type of the TLE5009 used. If the vector length is outside this range, then this might indicate malfunction of the TLE5009 or of the reading A/D converter.

3.6 Electro Magnetic Compatibility (EMC)

The TLE5009 is characterized according to the EMC requirements described in the “Generic IC EMC Test Specification” Version 1.2 from November 15, 2007. The classification of the TLE5009 is done for local pins. Table 9 Valid vector length Parameter Symbol Values Unit Note / Test Condition Min. Typ. Max. Vector length differential voltage V VEC 2.6 3.8 V TLE5009-E2000, TLE5009-E2010 1.6 2.7 V TLE5009-E1000, TLE5009-E1010

Package Information

Data Sheet 28 Rev. 1.1, 2012-04

4 Package Information

The TLE5009 comes in a green SMD pa ckage with lead-free plating, the PG-DSO-8. For alternative packaging, such as bare die please contact Infineon.

4.1 Package Parameters

4.2 Package Outline

Figure 15 Package dimensions Table 10 Package parameters Parameter Symbol Limit Values Unit Notes min. typ. max. Thermal Resistance R thJA 150 200 K/W Junction-to-Air 1) 1) According to Jedec JESD51-7 RthJC 75 K/W Junction-to-Case RthJL 85 K/W Junction-to-Lead Soldering Moisture Level MSL 3 260°C Lead Frame Cu Plating Sn 100% > 7 µm

Data Sheet 29 Rev. 1.1, 2012-04 Figure 16 Position of sensing element

4.3 Footprint

4.4 Packing

0.65 1.31 5.69 1.27 6.4 5.2 0.3 ±0.312 2.1 1.75

Data Sheet 30 Rev. 1.1, 2012-04

4.5 Marking

Position Marking Description 1st Line 5009xxx See ordering table on Page 7 2nd Line xxx Lot code 3rd Line GSxxxx G..green, 4-digit..date code

Data Sheet 31 Rev. 1.1, 2012-04 References

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