SMBD7000_07 INFINEON | Alldatasheet
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Technical content
SMBD7000/MMBD7000... Silicon Switching Diode Array
- For high-speed switching applications
- Pb-free (RoHS compliant) package1)
- Qualified according AEC Q101 SMBD7000/MMBD7000 /G33 /G31 /G44 /G32 /G32 /G44 /G31 Type Package Configuration Marking SMBD7000/MMBD7000 SOT23 series s5C Maximum Ratings at TA = 25°C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage VR 100 V Peak reverse voltage VRM 100 Forward current IF 200 mA Non-repetitive peak surge forward current t = 1 µs t = 1 s IFSM 4.5 0.5 A Total power dissipation TS ≤ 28°C Ptot 330 mW Junction temperature Tj 150 °C Storage temperature Tstg -65 ... 150 Thermal Resistance Parameter Symbol Value Unit Junction - soldering point2) SMBD7000/MMBD7000 RthJS ≤ 360 K/W 1Pb-containing package may be available upon special request 2For calculation of RthJA please refer to Application Note Thermal Resistance
SMBD7000/MMBD7000... Electrical Characteristics at TA = 25°C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Breakdown voltage I(BR) = 100 µA V(BR) 100 - - V Reverse current V R = 50 V VR = 100 V VR = 50 V, TA = 150 °C IR 0.3 0.5 100 µA Forward voltage I F = 1 mA IF = 10 mA IF = 50 mA IF = 100 mA IF = 150 mA VF 550 670 750 700 820 1000 1100 1250 mV AC Characteristics Diode capacitance VR = 0 V, f = 1 MHz CT - - 2 pF Reverse recovery time IF = 10 mA, IR = 10 mA, measured at IR = 1mA, RL = 100 Ω trr - - 4 ns Test circuit for reverse recovery time EHN00019 ΙF D.U.T. Oscillograph Pulse generator: tp = 100ns, D = 0.05, tr = 0.6ns, Ri = 50Ω Oscillograph: R = 50Ω , tr = 0.35ns, C ≤ 1pF
SMBD7000/MMBD7000... Reverse current IR = ƒ (TA) VR = Parameter 0 25 50 75 100 °C 150 TA 1 10 2 10 3 10 4 10 5 10 nA IR 70 V 25 V Forward Voltage VF = ƒ (TA) IF = Parameter 0.5 1.0 0 50 100 150 SMBD 7000 EHB00139 V TA VF ΙF = 100 mA 10 mA 1 mA 0.1 mA Forward current IF = ƒ (VF) TA = 25°C EHB00137SMBD 7000 Ι 0.5 1.0 V 1.5 100 mA 150 F FV maxtyp Forward current IF = ƒ (TS) SMBD7000/MMBD7000 0 15 30 45 60 75 90 105 120 °C 150 TS 100 125 150 175 200 mA 250 IF
SMBD7000/MMBD7000... Permissible Puls Load RthJS = ƒ (tp) 10 -7 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s TP -1 10 0 10 1 10 2 10 3 10 RthJS D = 0,5 0,2 0,1 0,05 0,02 0,01 0,005 Permissible Pulse Load IFmax/ IFDC = ƒ (tp) 10 -6 10 -5 10 -4 10 -3 10 -2 10 0 s TP 0 10 1 10 2 10 IFmax/IFDC D = 0 0.005 0.01 0.02 0.05 0.1 0.2 0.5
SMBD7000/MMBD7000...Package SOT23 Package Outline Foot Print Marking Layout (Example) Standard Packing Reel ø180 mm = 3.000 Pieces/Reel Reel ø330 mm = 10.000 Pieces/Reel EH s BCW66 Type code Pin 1 0.8 0.9 0.91.3 0.8 1.2
0.25 M BC
1.9 -0.05 +0.10.4 ±0.12.9 0.95 C B 0...8˚ 0.2 A 0.1 MAX. 1.3 ±0.1 10˚ MAX. M 2.4 ±0.15 ±0.11 A 0.15 MIN. 1) Lead width can be 0.6 max. in dambar area 3.15 2.65 2.13 0.9 0.2 1.15Pin 1 Manufacturer 2005, June Date code (YM)
SMBD7000/MMBD7000... Edition 2006-02-01 Published by Infineon Technologies AG
81726 München, Germany
© Infineon Technologies AG 2007. All Rights Reserved. Attention please! The information given in this dokument shall in no event be regarded as a guarantee of conditions or characteristics (“Beschaffenheitsgarantie”). With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in life-support devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.