TLE4263-2ES INFINEON | Alldatasheet

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5-V Low Dropout Voltage Regulator Data Sheet, Rev. 1.0, April 2008 Automotive Power

TLE4263-2ES PG-DSO-8 exposed pad 4263-2 Data Sheet 2 Rev. 1.0, 2008-04-21 5-V Low Dropout Voltage Regulator TLE4263-2ES 1O v e r v i e w

Features

  • Exposed Pad Package with Excellent Thermal Behaviour
  • Output Voltage Tolerance ≤ ±2%
  • Output Current up to 180 mA
  • Very Low Standby Current Consumption
  • Watchdog for Monitoring a Microprocessor
  • Power-on and Undervoltage Reset with Programmable Delay Time
  • Reset Low down to VQ = 1 V
  • Adjustable Reset Threshold
  • Very Low Dropout Voltage
  • Output Current Limitation
  • Reverse Polarity Protection
  • Overtemperature Protection
  • Wide Temperature Range from -40 °C up to 150 °C
  • Input Voltage Range from -42 V to 45 V
  • Suitable for Use in Automotive Electronics
  • Green Product (RoHS compliant)
  • AEC Qualified

Description

TLE4263-2ES is a monolithic integrated very low dropout voltage regulator in a SMD package PG-DSO-8 exposed pad, especially designed for automotive applications. An input voltage up to 45 V is regulated to an output voltage of 5.0 V. The component is able to drive loads up to 180 mA. The IC is short-circ uit proof by the implemented current limitation and has an integrated overtemperature shutdown. It additionally provides features like power-on and undervoltage reset with adjustable reset threshold, a watchdog circuit for monitoring a connected microcontroller and an inhibit input for enabling or disabling the component. The reset output RO is set to “low” in case the output voltage falls below the reset switching threshold VQ,rt. This threshold can be decreased down to 3.5 V by an external resistor divider. The power-on reset delay time can be programmed by the external delay capacitor CD. The watchdog circuit provides a monitoring function fo r microcontrollers: At missing pulses on the watchdog’s input W the reset output RO is set to “low”. The trigger time for the watchdog pulses can be set by the external capacitor CD. The IC can be switched off by the inhibit input, reducing the current consumption to typically 0 µA.

Data Sheet 3 Rev. 1.0, 2008-04-21 TLE4263-2ES Overview Dimensioning Information on External Components The input capacitor CI is recommended for compensation of line influences. The output capacitor CQ is necessary for the stability of the control loop . Stability is guara nteed at values ≥ 22 µF and an ESR of ≤ 3 Ω within the operating temperature range. For small tolerances of the reset delay the capacitance’s spread of the delay capacitor CD and its temperature coefficient should be taken into consideration. Circuit Description The control amplifier compares a reference voltage to a voltage that is proportional to the output voltage and drives the base of the series transistor via a buffer. Saturation control as a function of the load current prevents any oversaturation of the power element. The component also has a number of internal circuits for protection against:

  • Overload
  • Overtemperature
  • Reverse polarity In case the externally scaled down output voltage at the reset adjust input falls below 1.35 V, the external reset delay capacitor CD is discharged by the reset generator. When the voltage of the capacitor reaches the lower threshold VDRL, a reset signal occurs at the reset output and is held until the upper threshold VDU is exceeded. If the reset threshold input is connected to GND, reset is triggered at an output voltage of typically 4.65 V.

Data Sheet 4 Rev. 1.0, 2008-04-21

2 Block Diagram

D RO RADJ Reset Delay Reset Output Reset Threshold Watchdog W Temperature Sensor Generator ResetReference Bandgap Buffer Control Amplifier Saturation Control and Protection Circuit Inhibit Ι Q GND

Data Sheet 5 Rev. 1.0, 2008-04-21 TLE4263-2ES Pin Configuration

3 Pin Configuration

3.1 Pin Assignment

Figure 2 Pin Configuration

3.2 Pin Definitions and Functions

for compensating line influences, a capacitor to GND close to the IC terminals is recommended 2I N H Inhibit enables/disables the device; connect to I if the this function is not needed 3R O Reset Output open-collector output connected to the output via an internal 30kΩ pull-up resistor; leave open if the this function is not needed 4G N D Ground 5D Reset Delay Timing connect a ceramic capacitor to GND for adjusting the reset delay time / watchdog trigger time; leave open if this function is not needed 6R A D J Reset Threshold Adjust connect an external voltage divider to adjust the reset switching threshold; connect to GND for using internal threshold 7W Watchdog rising edge triggered input for monitoring a microcontroller; connect to GND if this function is not needed 8Q Output block to ground with a capacitor close to the IC terminals with a capacitance value C ≥ 22 µF, and an ESR ≤ 3 Ω PAD – Exposed Pad attach the exposed pad on package bottom to the heatsink area on circuit board; connect to GND 5$'- ,1+ *1'

General Product Characteristics Data Sheet 6 Rev. 1.0, 2008-04-21

4 General Product Characteristics

4.1 Absolute Maximum Ratings

Note: Stresses above the ones listed here may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Note: Integrated protection functions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. Absolute Maximum Ratings 1) Tj = -40 °C to +150 °C; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) 1) not subject to production test, specified by design Pos. Parameter Symbol Limit Values Unit Conditions Min. Max. Input I, Input INH

4.1.1 Input Voltage VI, VINH -42 45 V –

Reset Output RO, Reset Delay D

4.1.2 Voltage

VR, VD -0.3 42 V – Reset Threshold RADJ 4.1.3 Voltage VRADJ -0.3 6 V – Output Q 4.1.4 Voltage VQ -0.3 7 V – Watchdog W 4.1.5 Voltage VW -0.3 6 V – Temperature

4.1.6 Junction Temperature

Tj –1 5 0 °C–

4.1.7 Storage Temperature Tstg -50 150 °C–

4.1.8 Human Body Model (HBM)

2) ESD HBM Test according JEDEC JESD22-A114 Voltage - 2 kV –

4.1.9 Charged Device Model (CDM) 3)

3) ESD CDM Test according AEC/ESDA ESD-STM5.3.1-1999 Voltage - 1 kV –

Data Sheet 7 Rev. 1.0, 2008-04-21 TLE4263-2ES General Product Characteristics

4.2 Functional Range

Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table.

4.3 Thermal Resistance

Pos. Parameter Symbol Limit Values Unit Conditions Min. Max. 4.2.1 Input Voltage VI 5.5 45 V –

4.2.2 Junction Temperature Tj -40 150 °C–

Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max.

4.3.1 Junction to Case 1)

1) Not subject to production test, specified by design. RthJC – 10 – K/W measured to exposed pad

4.3.2 Junction to Ambient 1) RthJA –4 5 –K / W 2)

2) Specified RthJA value is according to Jedec JESD51-2,-5,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm³ board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). Where applicable a thermal via array under the exposed pad contacted the first inner copper layer.

4.3.3 RthJA – 153 – K/W footprint only 3)

4.3.4 RthJA – 64 – K/W 300 mm² heatsink

area3) 3) Specified RthJA value is according to Jedec JESD 51-3 at natural convection on FR4 1s0p board; The Product (Chip+Package) was simulated on a 76.2 × 114.3 × 1.5 mm3 board with 1 copper layer (1 x 70µm Cu).

4.3.5 RthJA – 55 – K/W 600 mm² heatsink

area3)

Electrical Characteristics

Data Sheet 8 Rev. 1.0, 2008-04-21

5 Electrical Characteristics

5.1 Voltage Regulator

Electrical Characteristics Voltage Regulator VI = 13.5 V, -40 °C ≤ Tj ≤150 °C, VINH > 3.6 V; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max.

6 V ≤ VI ≤ 28 V

IQ = 100 mA; Tj = 100 °C 5.1.3 Output Current Limitation IQ,max 180 250 400 mA VQ =4 . 8V 5.1.4 Dropout voltage Vdr –0 . 3 5 0 . 6 0 V IQ = 150 mA1) 1) Drop voltage = Vi - VQ (measured when the output voltage has dropped 100 mV from the nominal value obtained at 6 V input).

5.1.5 Load regulation ∆VQ,lo ––2 5 m V IQ = 5 mA to 150 mA

5.1.6 Line regulation ∆VQ.li –32 5 m V VI = 6 V to 28 V; IQ = 150 mA

5.1.7 Power Supply Ripple

Rejection2) 2) Not subject to production test, specified by design. PSRR –5 4 –d B fr = 100 Hz; Vr = 0.5 Vpp

Data Sheet 9 Rev. 1.0, 2008-04-21 TLE4263-2ES

5.2 Typical Performance Characteristics Voltage Regulator

Power Supply Ripple Rejection PSRR versus ripple frequency fr Output Capacitor Series Resistor ESR(CQ) versus Output Current IQ AED01090 -40 04 0 8 0 120 ˚C1604.6 jT QV VI = 13.5 V 4.7 4.8 4.9 5.0 5.1 V 5.2 T 100 100 250 300 QΙ mA 200 150 V 4030 V Ι = 25 Cj AED01091 I>+]@ N 3655 >G%@ B3655B)69* N N 9ULSSOH 9 9, 9 &4 —)WDQWDOXP 7M ƒ& ,4 P$ ,4 P$ ,4 P$ 2_ESR - IQ.VSD 0.1 0.01 ESRCQ [Ω] IQ [mA] 100 100 Stable Region 50 150 CQ = 22 µF Tj = -40...150 °C

Data Sheet 10 Rev. 1.0, 2008-04-21 Dropout Voltage Vdr versus Output Current IQ Output Voltage VQ versus Input Voltage VI AED03060_4263 QI 50 100 150 200 300mA 100 200 300 400 500 600 700 800 mVVdr jT = 125 ˚C 25 ˚C R 40 2 QV V 10V68 V Ι AED01097 = 25L Ω

Data Sheet 11 Rev. 1.0, 2008-04-21 TLE4263-2ES

5.3 Current Consumption

5.4 Typical Performance Charac teristics Current Consumption

Electrical Characteristics Voltage Regulator VI = 13.5 V, -40 °C ≤ Tj ≤150 °C, VINH > 3.6 V; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max.

5.3.1 Current Consumption;

Iq = II - IQ Iq –01 0 µA VINH = 0 V; Tj ≤ 115 °C 5.3.2 – 900 1300 µA IQ = 0 mA 5.3.3 – 10 18 mA IQ = 150 mA 5.3.4 – 15 24 mA IQ = 150 mA; VI = 4.5 V Current Consumption Iq versus Input Voltage VI Current Consumption Iq versus Output Current IQ 2001 0 mA qΙ = 25RL 50V30 40 V Ι AED01096 Ω AED03061 QI qI 50 100 150 200 300 IV = 13.5 V mA mA

Data Sheet 12 Rev. 1.0, 2008-04-21

5.5 Inhibit Function

5.6 Typical Performance Characteristics Inhibit

Electrical Characteristics Voltage Regulator VI = 13.5 V, -40 °C ≤ Tj ≤150 °C, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. 5.5.1 Switching Voltage VINH,ON 3.6 – – V IC turned on 5.5.2 Turn-OFF Voltage VINH,OFF – – 0.8 V IC turned off

5.5.3 Inhibit Input Current IINH 51 0 2 7 µA VINH = 5 V

Inhibit Input Current IINH versus Junction Temperature Tj AED03063 VINH = 5 V µA INHI 80-40 400 160˚C120 Tj

Data Sheet 13 Rev. 1.0, 2008-04-21 TLE4263-2ES

5.7 Reset Function

Note: The reset output is low within the range VQ = 1 V to VQ,rt Electrical Characteristics Reset Function VI = 13.5 V, -40 °C ≤ Tj ≤ 150 °C, VINH > 3.6 V; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. Output Undervoltage Reset

5.7.1 Default Output Undervoltage Reset

VQ,rt 4.5 4.65 4.8 V VQ decreasing Output Undervoltage Reset Threshold Adjustment

5.7.2 Reset Adjust

VRADJ,th 1.26 1.36 1.44 V 3.5 V ≤ VQ < 5 V

5.7.3 Reset Adjustment Range 1)

1) VRT is scaled linearly, in case the Reset Switching Threshold is modified VRT,range 3.50 – 4.65 V – Reset Output RO 5.7.4 Reset Outp ut Low Voltage VRO,low –0 . 1 0 . 4 V IRO = 1 mA Reset Delay Timing

5.7.6 Saturation Voltage VD,sat –5 0 1 1 0 m V VQ < VR,th

5.7.7 Upper Delay

VDU 1.40 1.70 2.20 V –

5.7.8 Lower Delay

VDRL 0.20 0.35 0.59 V –

5.7.9 Delay Capacitor

ID,ch 40 60 88 µA– 5.7.10 Reset Reaction Time trr 0.5 1.2 4 µs CD = 100 nF

Data Sheet 14 Rev. 1.0, 2008-04-21

5.8 Typical Performance Characteristics Reset

Undervoltage Reset Adjust Threshold VRT versus Junction Temperature Tj Undervoltage Reset Adjust Threshold VRADJ,th versus Output Voltage VQ Timing Threshold Voltage VDU and VDRL versus Temperature AED01088 -40 04 0 8 0 120 ˚C1600 jT RADJV 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 V 0.8 0.4 0.6 0.2 10 2 1.6 1.2 1.4 1.0 RADJV V V43 5 V Q AED01098_4263 ΙV = 13.5 V AED03062 -400 IV = 13.5 V 0.4 0.8 1.2 1.6 2.0 2.4 2.8 3.2 V 04 0 8 0 120 160˚C V Tj VDRL DUV

Data Sheet 15 Rev. 1.0, 2008-04-21 TLE4263-2ES

5.9 Watchdog Function

5.10 Typical Performance Characteristics Watchdog

Electrical Characteristics Watchdog Function VI = 13.5 V, -40 °C ≤ Tj ≤ 150 °C, VINH > 3.6 V; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Pos. Parameter Symbol Limit Values Unit Conditions Min. Typ. Max. 5.9.4 Watchdog Trigger Time T WI,tr 16 22.5 27 ms CD = 100 nF VQ > VQ,RT 5.9.5 Watchdog Ou tput Low Time T WD,L 12 . 1 3 . 5 m s CD = 100 nF VQ > VQ,RT

5.9.6 Watchdog Period

TWI,p = TWD,L + TWI,tr TWI,p 17 24.6 30.5 ms CD = 100 nF VQ > VQ,RT Charge Current and Discharge Current versus Temperature Watchdog Trigger Time versus Temperature 0-40 40 Ι A C12080 160 T j AED03064 µ = 13.5 V = 1.5 V ΙV V D Ι D, ch D, disΙ 0-40 40 WI,trT C12080 160 T j AED03065_4263 ms V Ι = 13.5 V = 100 nFCD

Application Information

Data Sheet 16 Rev. 1.0, 2008-04-21

6 Application Information

Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. Figure 3 Application Diagram Note: This is a very simplified example of an application circuit. The function must be verified in the real application. AES03070_4263 22 F ΙQ ΙRD VRADJ Ω5.6 k D ROINHEΙ

1000 F 470 nF

ΙΙ VE DC VC GNDΙD, chΙ VRO QVVΙ TLE4263-2 ESµ µ GND WV W RADJ 100 nF Ι Q Vr+ PSRR = 20 log Vr Q, rV∆

Data Sheet 17 Rev. 1.0, 2008-04-21 TLE4263-2ES

6.1 Reset

Figure 4 Reset Timing Diagram Power-On Reset Delay Time If the application needs a power-on reset delay time trd different from the value given in Item 5.7.5, the delay capacitor’s value can be derived from these specified values and the desired power-on delay time: VI t VQ t VQ, rt VRO Tim ingD iagram _R es et.v sd t VRO,l 1 V trd Thermal Shutdown Input Voltage Dip trrtrd trd t < trr trd Under- voltage Spike at output Over- load VDRL VDU t VD CD trd new, trd

Data Sheet 18 Rev. 1.0, 2008-04-21 with

  • CD: capacitance of the delay capacitor to be chosen
  • trd,new: desired power-on reset delay time
  • trd: power-on reset delay time specified in this datasheet For a precise calculation also take the delay capacitor’s tolerance into consideration. Reset Adjust Function The undervoltage reset switching threshold can be adjuste d according to the application’s needs by connecting an external voltage divider ( RADJ1, RADJ2) at pin RADJ. For selecting the de fault threshold connect pin RADJ to GND. When dimensioning the voltage divider, take into consideration that there will be an additional current constantly flowing through the resistors. With a voltage divider connected, the reset switching threshold VRT,new is calculated as follows: (1) with
  • VRT,new: the desired new reset switching threshold
  • RADJ1, RADJ2: resistors of the external voltage divider VRADJ,th: reset adjust switching threshold given in “Reset Function” on Page 13 VRT new, RADJ 1, R+ ADJ 2, RADJ 2,

Data Sheet 19 Rev. 1.0, 2008-04-21 TLE4263-2ES

6.2 Watchdog

Figure 5 Timing of the Watchdog Function Reset Watchdog Timing The period of the watchdog pulses has to be smaller than the minimum watchdog trigger time which is set by the external reset delay capacitor CD. Use the following formula for dimensioning CD: (2) with

  • CD: capacitance of the delay capacitor to be chosen
  • T WI,tr,new: desired watchdog trigger time
  • T WI,tr: watchdog trigger time specified in this data sheet VW t VRO Tim ingD iagram _Watc hdog.v s d t VRO,l tWD, L tWI , t r VDWL VDU t VD tWD, L TWI , p No positive VW edge CD TWI,tr,new TWI,tr

Data Sheet 20 Rev. 1.0, 2008-04-21

7 Package Outlines

Figure 6 PG-DSO-8 exposed pad Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). PG-DSO-8-27-PO V01 8x0.41±0.09 2) M0.2 DC A-B 1.27 C Stand Off -0.10.1 (1.45) 1.7 MAX. 0.08 Seating Plane C A B 3) JEDEC reference MS-012 variation BA 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width Bottom View ±0.23 ±0.22.65 0.2±0.2 D 6 M D 8x 0.64±0.25 3.9±0.11) 0.1 0.35 x 45˚ CD2 x +0.06 0.19 8˚ MAX. Index Marking You can find all of our packages, sorts of packing and others in our Infineon Internet Page “Products”: http://www.infineon.com/products. Dimensions in mm

Data Sheet 21 Rev. 1.0, 2008-04-21 TLE4263-2ES

Revision History

8 Revision History

1.0 2008-04-21 final version data sheet

81726 Munich, Germany

© 2007 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.