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Technical content
Rev. 1.4, 2016-02-02 TLE4208G Quad Half-Bridge Driver IC
Data Sheet 2 Rev. 1.4, 2016-02-02 TLE4208G Table of Contents Table of Contents
TLE4208G PG-DSO-28 TLE4208G Data Sheet 3 Rev. 1.4, 2016-02-02 1-A Quad Half-Bridge Driver IC TLE4208G 1O v e r v i e w
Features
- Driver for up to 3 motors
- Delivers up to 0.8 A continuous
- Optimized for DC motor management applications
- Very low current consumption in stand-by (Inhibit) mode
- Low saturation voltage; ty p.1.2 V total @ 25 °C; 0.4 A
- Output protected against short circuit
- Error flag diagnosis
- Overvoltage lockout and diagnosis
- Undervoltage lockout
- CMOS/TTL compatible inputs with hysteresis
- No crossover current
- Internal clamp diodes
- Overtemperature protection with hysteresis and diagnosis
- Enhanced power DSO-Package
- Green Product (RoHS compliant)
- AEC Qualified
Description
The TLE4208G is a protected Quad-Half-Bridge-Driver de signed specially for automotive and industrial motion control applications. The part is built using Infineons bipolar high voltage power technology DOPL. In a cascade configuration up to three actuators (DC motors) can be connected between the four half-bridges. These four half-bridges are configured as 2 dual-hal f-bridges, which are supplied and controlled separately. Operation modes forward (cw), reverse (ccw), brake and high impedance are invoked from a standard interface. The standard enhanced power PG-DSO-28 package meets the application requirements and saves PCB-board space and costs. Moreover the package is RoHS compliant. Furthermore the built-in features like diagnosis, over- and undervoltage-locko ut, short-circuit protection, over- temperature protection and the very low quiescent current in stand-by mode will open a wide range of automotive and industrial applications.
Data Sheet 4 Rev. 1.4, 2016-02-02
2 Block Diagram
Note: Half-Bridge 1 and 2 connected to a full-bridge Table 1 Functional Truth Table of Halfbridge 1 and 2 INH12 IN1 IN2 OUT1 OUT2 MODE
0 X X Z Z Stand-by
Fault-Detection 1,2 IN1 IN2 OUT1 OUT2 ZXZ X L0 L0 H0 L1 L1 H0 H1 H11 Inhibit 1,2 OUT4 Inhibit 3,4 Fault-Detection 3,4 X IN3 OUT3 X IN4 LH H H H L L Z L Z TLE 4208 G 9,14, 20,21, DRV1 DRV2 DRV3 DRV4 OUT4 OUT3 OUT2 OUT1 GND IN1 IN2 IN3 IN4 V S12 S34V INH AEB02350 22,23 EF 12 INH EF 34 1,6,7,8, 34INH INH12
Data Sheet 5 Rev. 1.4, 2016-02-02 IN: 0 = Logic LOW 1 = Logic HIGH X = Don’t Care OUT: Z = Output in tristate condition L = Output in sink condition X = Output in source condition Note: Half-Bridge 3 and 4 connected to a full-bridge Table 2 Functinal Truth Table of Halfbridge 3 and 4 INH
34 IN3 IN4 OUT3 OUT4 MODE
12 EF34 Error
0 1 over temperature of half-bridge 1 and 2 OR 0 1 over voltage of half-bridge 1 and 2 1 0 over temperature of half-bridge 3 and 4 OR 1 0 over voltage of half-bridge 3 and 4 0 0 over temperature of all half-bridges OR 0 0 over voltage of all half-bridge
Data Sheet 6 Rev. 1.4, 2016-02-02
3 Pin Configuration
3.1 Pin Assignment
Figure 2 Pin Configuration
3.2 Pin Definitions and Functions
1, 6, 7, 8, 9, 14, 20, 21, 22, 23 GND Ground; negative reference potential for blocking capacitor 2E F
12 Error Flag output of half-bridges 1 and 2;
open collector; low = error 3I N 1 Input channel of half-bridge 1; controls OUT 1 4, 11, 15, 28 N.C. Not Connected 5O U T 1 Power output of half-bridge 1; short circuit protected; with integrated clamp diodes
10 OUT 3 Power output of half-bridge 3; short circuit protected; with integrated clamp
12 IN3 Input channel of half-bridge 3;
13 INH 34 Inhibit input of half-bridges 3 and 4;
low = half-bridges 3 and 4 in stand-by 12 8 AEP02349 TLE 4208 G 21 GND GND GND OUT1 N.C. N.C. OUT3 GND IN1 GND IN3 N.C. IN4 EF OUT4 GND GND GND GND OUT2 IN2 GND VS34 S12V 12INH N.C. 34INH EF12
Data Sheet 7 Rev. 1.4, 2016-02-02
16 EF 34 Error Flag output of half-bridges 3 and 4;
open collector; low = error
17 IN4 Input channel of half-bridge 4;
18 V S34 Power supply voltage of half-bridges 3 and 4;
positive reference potential for blocking capacitor
19 OUT 4 Power output of half-bridge 4; short circuit protected; with integrated clamp diodes
24 OUT 2 Power-output of half-bridge 2;
short circuit protected; with integrated clamp diodes
25 V S12 Power supply voltage of half-bridges 1 and 2;
positive reference potential for blocking capacitor
26 IN4 Input channel of half-bridge 4;
27 INH 12 Inhibit input of half-bridges 1 and 2;
low = half-bridges 1 and 2in stand-by Pin Symbol Function
General Product Characteristics Data Sheet 8 Rev. 1.4, 2016-02-02
4 General Product Characteristics
4.1 Absolute Maximum Ratings
- Stresses above the ones listed here may cause perma nent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Integrated protection func tions are designed to prevent IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation. Table 4 Absolute Maximum Ratings Tj = -40°C to +150°; all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test ConditionMin. Typ. Max. Voltages Supply Voltage VS12, VS34 -0.3 – 45 V – Supply Voltage VS12, VS34 -1 – – V t < 0.5s; IS12, IS34 > -2A Logic input voltages (IN1; IN2; INH12; IN3; IN4; INH34) VI -5 – 20 V 0V < VS12, VS34 < 45V Logic output voltage (EF12; EF34) VEF12, VEF34 –0.3 – 20 V 0V < VS12, VS34 < 45V Currents Output Current (cont.) IOUT1-4 –––A i n t e r n a l l y l i m i t e d Output Current (peak) IOUT1-4 –––A i n t e r n a l l y l i m i t e d Output Current (diode) IOUT1-4 - 1 –1A – Output Current (EF) IEF12-34 - 2 –5m A – Temperatures Junction Temperature Tj -40 – 150 °C – Storage Temperature Tstg -50 – 150 °C – Thermal Resistances Junction pin Rthj-pin – – 25 K/W measured to pin 7 Junction ambient RthjA ––6 5 k V –
General Product Characteristics Data Sheet 9 Rev. 1.4, 2016-02-02
4.2 Functional Range
Note: Within the functional or operating range, the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the Electrical Characteristics table. Table 5 Functional Range Parameter Symbol Values Unit Note / Test ConditionMin. Typ. Max. Supply Voltage VS12,VS34 VUV_OFF – 18 V After VS12,VS34 rising above VUV_ON Extended Supply Voltage Range for Operation VS12,VS34 -0.3 – VUV_ON V Outputs in tristate Supply Voltage transients slew rate VS12,VS34 -0.3 – VUV_OFF V/µs Outputs in tristate Logic input voltages (IN1; IN2; INH12; IN3; IN4; INH34) VI -2 – 18 V – Junction Temperature Tj -40 – 150 °C –
General Product Characteristics Data Sheet 10 Rev. 1.4, 2016-02-02
4.3 General Electri cal Characteristics
4.3.1 Electrical Characteristics
Table 6 Electrical Characteristics VS12 =VS34 =8 V to 18 V, INH12 = INH34 = HIGH; IOUT1-4 = 0A; Tj = -40°C to +150°, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test ConditionMin. Typ. Max. Current Consumption INH12 = INH34 = LOW Quiescent current IS – – 100 µA IS = IS12 + IS34 Quiescent current IS –2 0 4 0 µ A IS = IS12 + IS34; VS12 = VS34 = 13.2V; Tj = 25 °C INH12 = HIGH and INH34 = LOW or INH12 = LOW and INH34 = HIGH Supply current IS12, IS34 –1 0 2 0 m A – Supply current IS12, IS34 ––3 0 m A IOUT1/3 = 0.4A IOUT2/4 = -0.4A Supply current IS12, IS34 ––5 0 m A IOUT1/3 = 0.8A IOUT2/4 = -0.8A Over- and Under Voltage Lockout UV Switch ON voltage VUV ON –6 . 5 7 . 5 V VS12,VS34 increasing UV Switch OFF voltage VUV_OFF 56–V VS12,VS34 decreasing UV ON/ OFF hysteresis VUV_HY –0 . 5 –V VUV ON - VUV OFF OV Switch OFF voltage VOV OFF –2 0 2 4 V VS12,VS34 increasing OV Switch ON voltage VOV_ON 18 19.5 – V VS12,VS34 decreasing OV ON/ OFF hysteresis VOV_HY –0 . 5 –V VOV OFF - VOV ON Outputs OUT1; OUT2; OUT3; OUT4 Saturation Voltages Source (upper) IOUT12, IOUT34 = – 0.2 A VSAT_U –0 . 8 5 1 . 1 5 V Tj= 25°C Source (upper) IOUT12, IOUT34 = – 0.4 A VSAT_U –0 . 9 0 1 . 2 0 V Tj= 25°C Sink (upper) IOUT12, IOUT34 = – 0.8 A VSAT_U –1 . 1 0 1 . 5 0 V Tj= 25°C Sink (lower) IOUT12, IOUT34 = 0.2 A VSAT_L –0 . 1 5 0 . 2 3 V Tj= 25°C Sink (lower) IOUT12, IOUT34 = 0.4 A VSAT_L –0 . 2 5 0 . 4 0 V Tj= 25°C Sink (lower) IOUT12, IOUT34 = 0.8 A VSAT_L –0 . 4 5 0 . 7 5 V Tj= 25°C Total Drop IOUT12, IOUT34 = 0.2 A VSAT –11 . 4 V VSAT = VSAT_U+VSAT_L
General Product Characteristics Data Sheet 11 Rev. 1.4, 2016-02-02 Total Drop IOUT12, IOUT34 = 0.4 A VSAT –1 . 2 1 . 7 V VSAT = VSAT_U+VSAT_L Total Drop IOUT12, IOUT34 = 0.8 A VSAT –1 . 6 2 . 5 V VSAT = VSAT_U+VSAT_L Clamp Diodes Forward voltage; upper VFU –11 . 5 V IF = 0.4A Upper leakage current ILKU ––5m A IF = 0.4A1) Forward voltage; lower VFL –0 . 9 1 . 4 V IF = 0.4A Input Interface Logic Inputs IN1; IN2; IN3; IN4 H-input voltage VIH –2 . 0 3 . 0 V – L-input voltage VIL 1.0 1.5 – V – Hysteresis of input voltage VIHY –0 . 5 –V – H-input current IIH -2 – 10 µA VI = 5V L-input current IIL -100 -20 -5 µA VI = 0V Logic Inputs INH12; INH34 H-input voltage VIH –2 . 7 3 . 5 V – L-input voltage VIL 1.0 2.0 – V – Hysteresis of input voltage VIHY –0 . 7 –V – H-input current IIH – 100 250 µA VINH = 5V L-input current IIL -10 – 10 µA VINH = 0V Error Flags EF12; EF34 L-output voltage level VEFL –0 . 2 0 . 4 V IEF = 2 mA Leakage current IEFLK – – 10 µA 0V < VEF < 7V Thermal Shutdown Thermal shutdown junction temperature TjSD 150 175 200 °C – Thermal switch-on junction temperature TjSO 120 – 170 °C – Temperature hysteresis ∆T –3 0 –K – 1) Not subject to production test, specified by design Table 6 Electrical Characteristics VS12 =VS34 =8 V to 18 V, INH12 = INH34 = HIGH; IOUT1-4 = 0A; Tj = -40°C to +150°, all voltages with respect to ground, positive current flowing into pin (unless otherwise specified) Parameter Symbol Values Unit Note / Test ConditionMin. Typ. Max.
Application Information
Data Sheet 12 Rev. 1.4, 2016-02-02
5 Application Information
Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device. Figure 3 Application Circuit 1 (Device is used as Dual-Full-Bridge-Driver) Note: This is a very simplified example of an application circuit. The function must be verified in the real application. Fault-Detection 1,2 IN1 IN2 OUT1 OUT2 ZXZ X L0 L0 H0 L1 L1 H0 H1 H11 Inhibit 1,2 OUT4 Inhibit 3,4 Fault-Detection 3,4 X IN3 OUT3 X IN4 LH H H H L L Z L Z TLE 4208 G 20,21, DRV1 DRV2 DRV3 OUT4 OUT3 OUT2 OUT1 GND IN1 IN2 IN3 IN4 V S12 S34V EF34 INH34 EF12 INH12 AES02351 Cμ TLE 4278 G 3,4,5,10,11,12 769 Q Reset Out Watchdog Out Watchdog In 13 Watchdog Adjust Input VCCRWDIWDO 1N4001 C 22 F S μ100 nF C Ι 100 k R WA Ω Reset Adjust GNDD 100 nF C D 22 Fμ C Q Ω10 k QBR10 kΩ QAR VS = 12 V DRV4 INH12 INH34 22,23 1,6,7, 8,9,14
Data Sheet 13 Rev. 1.4, 2016-02-02 Diagrams Quiescent current IS over Temperature Saturation Voltage of Sink VSAT L over Temperature Saturation Voltage of Source VSAT U over Temperature Total Drop at outputs VSAT over Temperature -50 0 A 15050 Ι S C AED02352 100 T j SV = 18 V = 13.2 VVS = 8 VVS μ AED02309 -50 mV SAT LV ˚C0 50 100 150 = 800 mAOUTΙ = 14 VSV 250 500 750 1000 = 400 mAOUTΙ = 200 mAOUTΙ Tj AED02308 -50 mV SAT UV Ι OUT = 800 mA ˚C0 50 100 150 250 500 750 1000 1250 1500 = 400 mAOUTΙ = 200 mAOUTΙ = 14 VSV Tj AED02310 -50 mV SAT V ˚C0 50 100 150 = 14 VSV 500 1000 1500 2000 = 800 mAOUTΙ = 400 mAOUTΙ = 200 mAOUTΙ Tj
Data Sheet 14 Rev. 1.4, 2016-02-02
6 Package Outlines
Green Product (RoHS compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb- free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). 0.35 x 45˚ -0.2 Index Marking -0.418.1 141) 0.35 1.27 +0.15 2) 0.2 28x0.2 2.65 MAX. 0.1 2.45 -0.1 -0.2 7.6 1) 10.3 ±0.3 0.23 +0.09 MAX.8˚ +0.80.4 Does not include dambar protrusion of 0.05 max. per side Does not include plastic or metal protrusion of 0.15 max. per side For further information on alternative packages, please visit our website: http://www.infineon.com/packages. Dimensions in mm
Revision History
Data Sheet 15 Rev. 1.4, 2016-02-02
7 Revision History
Rev. 1.4 2016-02-02 Correction of typographical errors Page 10: VOFF_OFF and VOFF_ON are inverted. No change of the device behavior. Page 10,11: VS1, respectively VS2, renamed VS12 and VS34 Rev. 1.3 2014-02-12 Updated package designation and to latest data sheet formatting Rev. 1.2 2011-04-11 Updated package designation to reflect various production sites. Rev. 1.1 2008-02-04 Initial version of RoHS-compliant derivate of TLE4208G Page 1: added AEC certified statement Page 1 and 13: added RoHS compliance statement and Green product feature Page 1 and 3: Editorial change: deleted "fully" (The term "fully protected" often leads to misunderstandings as it is unclear with respect to which parameters). Page 1 and 14: Package changed to RoHS compliant version Page 15: added Revision History, updated Legal Disclaimer
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© 2016 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered.