TLD5045EJ_15 INFINEON | Alldatasheet

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Infineon® LITIX™ Power 700mA High Integration - DC/DC Step-Down Converter TLD5045EJ Infineon® LITIX™ Power 700mA High Integration - DC/DC Step-Down Converter Automotive Power Data Sheet Revision 1.0 2015-05-28

Infineon® LITIX™ Power TLD5045EJ Table of Contents Data Sheet 2 Revision 1.0 2015-05-28 Not for Customers Table of Contents

Device1 PG-DSO-8 EP PG-DSO-8 EP Data Sheet 3 Revision 1.0, 2015-05-28 TLD5045EJ Infineon® LITIX™ Power

1 Overview

  • Constant Current Generation
  • Wide Input Voltage Range from 5V to 40V
  • Peak Current Regulation
  • Very low current consumption (<2uA) in Sleep Mode
  • Integrated power transistor with low saturation voltage
  • Integrated fast freewheeling diode
  • Integrated load current sense resistor
  • Integrated status pull down transistor
  • Overtemperature Protection
  • Switching frequency (typ. 200kHz) adjustable via external RC network
  • External PWM Dimming Input
  • Integrated PWM Dimming Engine
  • Analog Dimming (output current adjustable via externa l low power resistor and possibility to connect PTC resistor for LED protection during overtemperature conditions)
  • Stable switching frequency due to fix OFF-time concept with VREC (supply voltage) feedforward
  • Under- and Overvoltage shutdown with hysteresis
  • Small thermally enhanced ex posed heatslug SMD package
  • Automotive AEC Qualified
  • Green Product (RoHS) Compliant

Description

The TLD5045EJ is a highly integrated smart LED buck controller with built in protection functions. The main function of this device is to drive single or multiple series connected LEDs efficiently from a voltage source higher than the LED forward voltage by regulating a constant LED current. The constant current regulation is especially beneficial for LED color accuracy and lo ng LED lifetime. The built in freewheeling diode and switching transistor with current se nse requires less external components and saves system costs. High flexibility is achieved by placing low power resistors to adjust output currents up to 700mA and the regulator switching frequency (typ. 200kHz). An integrated PWM dimming engine pr ovides a LED dimming function by placing a simple RC network to GND. This feature is dedicated for decentralized light modules without micro controller involvement. In addition to that an integrated status pull down transistor can be used to simulate a minimum current flow for decentralized modules to avoid a wrong open load detection by a highside switch located in the body control module (BCM). Application

  • Automotive LED driven Exterior Li ghting: Brake, Tail, CHMSL, Daytime Running Light, Position Light
  • Automotive LED driven Interior Lighting: Read ing Light, Dome Light, Display Backlighting

Data Sheet 4 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Block Diagram

2 Block Diagram

The TLD5045 regulates the LED current by monitoring the load current (Peak Current Measurement) through the internal switch cycle by cycle. When the current through the switch reaches the threshold Ipeak the switch is shut- OFF and it is kept OFF for a time equal to tOFF. Both Ipeak and tOFF can be fixed through few external components. The peak current Ipeak is fixed by a resistor connected to the SET pin while the tOFF is fixed by RC network. As tOFF is fixed and the duty cycle depends on VREC, the frequency depends on VREC as well. Refer to Chapter 8.2 for the evaluation of the switching frequency. Figure 2-1 Block Diagram TLD5045EJ GND VREC Logic Power Switch FREQ SW Internal Supply EN Thermal Protection UV+OV Lockout SET PWMI ST Power- Switch Driver Open Load Detection Peak Current Measurement ON/OFF Logic Peak Current Adjustment OFF-Time Control internal PWM Generation

Data Sheet 5 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Pin Configuration

3 Pin Configuration

3.1 Pin Assignment

Figure 3-1 Pin Configuration TLD5045EJ

3.2 Pin Definitions and Functions

Table 3-1 sec_bias_prereg pin definition and function # Name Direction Type Function 1V R E C Voltage Recirculation Output and Internal Supply Input; This pin is the supply pin of the IC (see block diagram). Furthermore the cathode of the integrated fast free- wheeling diode is connected to this pin as well. 2S T Status Output; Open collector diagnostic output to indicate an open load failure. Refer to Chapter 7 for more details. 3E N Enable; Apply logic HIGH signal to enable the device 4S E T SET Input; Connect a low power resistor to adjust the output current. ST GND EN FREQ SW 2 7 1 8 SET TLD5045VREC PWMI EP

Data Sheet 6 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Pin Configuration 5P W M I PWM Input; PWM signal for dimming LEDs. Connect external R and C combination to achieve an auto PWM-dimming function with defined frequency and duty cycle. 1) internal PWM dimming function (external RC connected to GND) 2) external PWM dimming function (µC is controlling this pin) Refer to Chapter 6 for more details. 6F R E Q FREQuency Select Input; Connect external Resistor and Capacitor to GND to set the OFF-time of the switching frequency. 7G N D Ground; Connect to system ground. SW Integrated Power-Switch Output; Collector of the integrated NPN-power transistor. EP Exposed Pad; Connect to external heatspreading copper area with electrically GND (e.g. inner GND layer of the PCB via thermal vias) Table 3-1 sec_bias_prereg pin definition and function (continued) # Name Direction Type Function

Data Sheet 7 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ General Product Characteristics

4 General Product Characteristics

4.1 Absolute Maximum Ratings

Tj = -40°C to +150°C; all voltages with respect to ground (unless otherwise specified) Table 4-1 Absolute Maximum Ratings 1) Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. Voltages VREC (Pin 1) Recirculation and Supply Input VREC -0.3 45 V P_4.1.1 VREC (Pin 1) Maximum current flowing continuously through the freewheeling diode and the power switch V FW,SW 1.2 A – Maximum ambient temperature must be calculated with given Rthja of the application P_4.1.2 ST (Pin 2) Diagnostic Status Output Voltage V ST -0.3 45 V P_4.1.3 ST (Pin 2) Diagnostic Status Current IST 150 mA –no short circuit protection and no current limitation implemented P_4.1.4 EN (Pin 3) Enable Input Voltage V EN -0.3 45 V P_4.1.5 SET (Pin 4) Peak Current Adjust Input Voltage VSET -0.3 6 V P_4.1.6 PWMI (Pin 5) PWM Input Voltage VPWMI -0.3 6 V P_4.1.7 FREQ (Pin 6) OFF-time Adjustment Input VFREQ -0.3 6 V P_4.1.8 SW (Pin 8) Switch Output VSW -0.3 45 V P_4.1.9 Temperatures Junction Temperature Tj -40 150 °C P_4.1.10 Storage Temperature T SW -55 150 °C P_4.1.11

Data Sheet 8 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ General Product Characteristics Note: 1. Stresses above the ones listed he re may cause permanent damage to the device. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Integrated protection functions are designed to preven t IC destruction under fault conditions described in the data sheet. Fault conditions are considered as “outside” normal operating range. Protection functions are not designed for continuous repetitive operation.

4.2 Functional Range

Note: Within the functional range the IC operates as described in the circuit description. The electrical characteristics are specified within the conditions given in the related electrical characteristics table. ESD Susceptibility ESD Resistivity all Pins to GND VESD, HBM -2 2 kV HBM 2) ESD Results available? P_4.1.12 ESD Resistivity to GND VESD -500 500 V CDM 3) P_4.1.13 ESD Resistivity corner pins to GND VESD -750 750 V CDM P_4.1.14 1) Not subject to production test, specified by design. 2) ESD susceptibility HBM according to EIA/JESD 22-A 114B 3) ESD susceptibility, Charged Device Mode l “CDM” EIA/JESD22-C101 or ESDA STM5.3.1 Table 4-2 Functional Range Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. Voltages Extended Supply Voltage V REC 54 0 1) 1) Not subject to production test, specified by design V Parameter deviations possible P_4.2.1 Nominal Supply Voltage Range VFW,SWREC 83 6 V P_4.2.2 External Inductor L SW 220 560 µH max.560µH to avoid OL P_4.2.3 Output current range IOUT 100 700 mA P_4.2.4 Switching Frequency f SW 50 300 kHz T j = 25°C to 150°C P_4.2.5 Junction Temperature Tj -40 150 °C P_4.2.6 Table 4-1 Absolute Maximum Ratings 1) Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max.

Data Sheet 9 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ General Product Characteristics

4.3 Thermal Resistance

Note: This thermal data was generated in accordance with JEDEC JESD51 standards. For more information, go to www.jedec.org. Table 4-3 Thermal Resistance Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. Voltages Junction to Case RthJ-case 10 K/W 1)2) 1) Not subject to production test, specified by design. 2) Specified RthJ-case value is simulated at natural convection on a cold plate setup (all pins and the exposed Pad are fixed to ambient temperature). Ta=25°C, Power Switch and freewheeling diode are dissipating 1W. P_4.3.1 Junction to Ambient (2s2p) RthJA 40 K/W 1)3) 3) Specified RthJA value is according to Jedec JESD51-2,-7 at natural convection on FR4 2s2p board; The Product (Chip+Package) was simulated on a 76.2 x 114.3 x 1.5 mm board with 2 inner copper layers (2 x 70µm Cu, 2 x 35µm Cu). According to JESD51-5 a thermal via array under the exposed pad contacted the first inner copper layer. Ta=25°C, Power Switch and freewheeling diode are dissipating 1W. P_4.3.2

Data Sheet 10 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ

Electrical Characteristics

5 Electrical Characteristics

Tj = -40°C to +150°C, all voltages with respect to ground (unless otherwise specified)

5.1 General Parameters

Table 5-1 Electrical Characteristics Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. Voltage Drop over Power Transistor VDrop,100 – 0.8 – V Ipeak=100mA P_5.1.1 Voltage Drop over Power Transistor VDrop,700 – 1.4 – V Ipeak=700mA P_5.1.2 Freewheeling diode forward voltage Vfw,100 – 0.8 – V Ipeak=100mA P_5.1.3 Freewheeling diode forward voltage Vfw,700 – 1.4 – V Ipeak=700mA P_5.1.4 Peak over current limit Ipeak_lim –1 . 4 –A P_5.1.5 Peak current accuracy Ipeak_acc 450 500 550 mA VREC = 12V VEN = 5V VLED = 7.2V RSET = 14k Ω LSW = 220µH fSW = 200kHz P_5.1.6 Input under voltage shutdown threshold V REC,UVOFF – – 5 V VEN = 5V VREC decreasing; see Figure 5-1 P_5.1.7 Input voltage startup threshold V REC,UVON – – 6 V VEN = 5V VREC increasing; see Figure 5-1 P_5.1.8 Input under voltage shutdown hysteresis VREC,UVhyst –1 –V P_5.1.9 Input over voltage shutdown threshold VREC,OVOFF 40.5 – – V VEN = 5V VREC increasing; see Figure 5-1 P_5.1.10 Input over voltage startup threshold VREC,OV 40 – – V VEN = 5V VREC decreasing; see Figure 5-1 P_5.1.11 Input over voltage shutdown hysteresis V REC,OVhyst –0 . 5 –V P_5.1.12 Switch ON delay t dON – 400 600 ns 1)– P_5.1.13 Switch OFF delay t dOFF – 500 850 ns 1)– P_5.1.14

Data Sheet 11 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ

5.2 Power Supply Monitoring

Over- and Undervoltage Shutdown If the supply voltage VREC drops below the input under voltagae threshold voltage V REC,UVOFF, the power stage is switched OFF and the device is in normal consumption mode (Iq,ON). If VREC rises again and reaches the input undervoltage startup threshold VREC,UVON the power stage is restarted and the device is back to normal operation mode. Same behaviour applies to overvoltage. The internal status transistor switches off during an overvoltage or undervoltage event on VREC. A detailed description of the under and overvoltage behaviour is displayed in Figure 5-1 below. Reference Voltage at SET pin Pull up current for FREQ pin IFREQ 5 – – mA VFREQ=0V P_5.1.16 Oscillator switch off threshold VFREQ,HIGH –3 . 2 –V P_5.1.17 Oscillator switch on threshold VFREQ,LOW –1 . 2 –V P_5.1.18 1) The minimum switching ON time tON must be greater than tdON + tdOFF Table 5-1 Electrical Characteristics Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max.

Data Sheet 12 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Figure 5-1 Over- and Undervoltage Protection VSW VREC,UVoff VREC,UVon VREC,UVhyst t t ILED t VREC VREC,OVhyst VREC,OVon VREC, OVoff Iset ST t ST pull- down ON ST pull-down transistor OFFST pull-down transistor OFF ST pull- down ON ST pull- down ON

Data Sheet 13 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Enable, Dimming Function and Thermal Protection

6 Enable, Dimming Function and Thermal Protection

6.1 Description

A logic high signal on the EN pin turns the device on. A logic low signal on enable pin EN brings the device in sleep mode. The current consumption is typ. 0.1 µA in this ca se. The EN pin has an internal pull down resistor which ensures that the IC is in sleep mode and the power stage is switched off in case the pin EN is externally not connected. Dimming Function The PWMI pin combines two functions: 1. PWM dimmming via a µC (3.3V and 5V µC) 2. Integrated PWM dimming engine for standalone solu tions in decentralized light module (frequency and duty cycle adjustable via external R,C network) A detailed description of the PWMI pin is displayed in below. Figure 6-1 PWMI Pin Description PWMI ON Æ DC=100% VPWMI PWMI OFF Æ DC=0% tSW- ON SW - OFF SW- ON SW - OFF SW- ON SW - OFF SW- ON SW - OFF Internal PWM VPWMI,OFF VPWMI,ON

Data Sheet 14 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Enable, Dimming Function and Thermal Protection

6.2 Electrical Characteristics Enable, Bias, Dimming Function and Thermal

VREC = 4.5 V to 18 V, Tj = -40°C to +150°C, all voltages with respect to ground (unless otherwise specified) Table 6-1 Electrical Characteristics: Enable , Bias, Dimming Function and Thermal Protection Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. Current Consumption, sleep mode I q,OFF –0 . 1 2µ A VEN = 0V; VREC = 16V P_6.2.1 Current Consumption, active mode (Open Load) Iq,ON –– 5m A VEN = 5.0V; Ipeak = 0mA (open load); VREC = 16V P_6.2.2 Current Consumption, active mode I q,ON –– 1 0 m A VEN = 5.0V; Ipeak = 700mA VREC = 16V P_6.2.3 EN Turn On Threshold VEN,ON 2.8 – – V – P_6.2.4 EN Turn Off Threshold VEN,OFF –– 0 . 8 V P_6.2.5 EN high input current IEN,hi – 100 – µA VEN = 5V P_6.2.6 EN low input current IEN,lo 0– 2 0 µ A VEN = 0.5V P_6.2.7 PWMI Turn On Threshold VPWMI,ON –1 –V s e e Figure 6-1 P_6.2.8 PWMI Turn Off Threshold VPWMI,OFF –2 –V see Figure 6-1 P_6.2.9 PWMI source current IPWMI – 250 – µA R set = 10kΩ VPWMI = 0.5V; P_6.2.10 Over temperature shutdown Tj,sd 150 175 – °C 1) 1) Specified by design. Not subject to production test. P_6.2.11 Over temperature shutdown hysteresis Tj,sd_hyst –1 5 –K 1) P_6.2.12

Data Sheet 15 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Enable, Dimming Function and Thermal Protection

6.2.1 PWM Dimming with µC connected to TLD5045EJ PWMI pin

The PWMI pin can be used for PWM dimming. It is a commonly practiced dimming method to prevent color shift in LED light applications. Figure 6-2 Timing Diagram for LED Dimming with µC VPWMI VPWMI,OFF Ipeak VPWMI,ON t t TPWMI tOFF SW - ONSW - OFF SW - OFF SW - ON SW - OFF

Data Sheet 16 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Enable, Dimming Function and Thermal Protection

6.2.2 Internal PWM dimming Function

The TLD5045EJ has an integrated PWM dimmi ng engine. Via an external R PWM and CPWM network it is possible to achieve a PWM LED current waveform. The duty cycle and dimming frequency is depending on the size of the external components (see formula in Figure 6-4). This feature is specially designed to achieve a stand alone PWM dimming function without the usage of micro controllers or external logic. This allows a flexible and cost effective usage of the device in a decentralized light module application (refer to application drawing ). The advantage of a PWM dimming (to reduce the LED load current) is the change of light intensity only, at constant light color. With an external RC network a PWM programming betw een 100Hz and 1200Hz and Duty Cycles between 4% and max. 20%. is possible. Figure 6-3 displays the external components corresponding to the desired PWM frequency and duty cycle. The following setup applies for the table displayed in Figure 6-3: VREC=12V, VLED=7.2V, LSW=220µH, RSET=14kΩ. Figure 6-3 RPWMI and CPWMI versus fPWMI and DC RPWMI CPWMI fPWMI DC 216kΩ 64nF 100Hz 4% 216kΩ 32nF 200Hz 4% 216kΩ 21nF 300Hz 4% 216kΩ 16nF 400Hz 4% 87kΩ 150nF 100Hz 10% 87kΩ 75nF 200Hz 10% 87kΩ 50nF 300Hz 10% 87kΩ 37nF 400Hz 10% 44kΩ 265nF 100Hz 20% 44kΩ 132nF 200Hz 20% 44kΩ 88nF 300Hz 20% 44kΩ 66nF 400Hz 20%

Data Sheet 17 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Enable, Dimming Function and Thermal Protection

6.3 Overtemperature Protection of the Device

A temperature sensor at the power stage causes the ov erheated device to switch OFF to prevent destruction. During over temperature condition the internal ST transist or is switched OFF. Due to the autorestart function of the device the status signal will toggle accordingly. The timing of this pattern is dependant on the thermal capability of the application and can be used to distinguish between open load error and overtemperature condition. More details on the overtemperature behavior is displayed in Figure 6-4 below. Figure 6-4 RPWMI and CPWMI versus fPWMI and DC VSW t ILED t ΔΤ VEN t H L Tj tTa TjSD TjSO Ipeak ST t ST pull-down transistor ONST pull- down OFF ST OFF ST ON ST OFF ST ON ST OFF ST ON ST OFF

Data Sheet 18 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Open Load Diagnosis

7 Open Load Diagnosis

7.1 Description

The TLD5045EJ has an integrated open load during ON diagnosis. During normal operation the ST pin (open collector output) is pulled to GND (internal transistor is ON). The open load detection is realized by monitoring the switching behavior at the SW pin. Du ring an open load event the integrated power stage at the SW pin will be statically turned ON. If the output stage is turned ON for more than the open load diagnosis delay time (t OL) an open load condition is detected. An open load event will switch OFF the internal transistor. If a µC is connected to the ST pin an external pull up resistor should be plac ed to achieve a logic HIGH level for the proper open load error signalling repo rting. For a timing diagram on the functionality of the open load diagnosis please refer to Figure 7-1 and Figure 7-2.

7.2 Electrical Characteristics: Open Load Diagnosis

VREC = 4.5 V to 18 V, Tj = -40°C to +150°C, all voltages with respect to ground (unless otherwise specified) Table 7-1 Functional Range Parameter Symbol Values Unit Note or Test Condition Number Min. Typ. Max. Voltages Open Load diagnosis DelayTime tOL 20 – – µs P_7.2.1 Open Load diagnosis current IOL –5 0 –m A P_7.2.2 Voltage Drop over internal ST transistor VDrop,ST –0 . 3 –V IST=150mA P_7.2.3

Data Sheet 19 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Open Load Diagnosis

7.3 Open Load Diagnosis in different Application Conditions

7.3.1 Light module application without µC

Most of the time, the open load diagnosis of the whole lig ht module is done via the current sense of the driver IC (e.g. PROFET) located in the light c ontrol module (or BCM module). See Figure 8-6 for a simplifie d application schematic. The light module needs to sink a specified minimum current (e.g. 100mA) to indicate normal operation. To guarantee this minimum current also under light load conditions (e.g. high efficiency LED bin at high supply voltages = min. load current required) system designers often have to place resistors in parallel to the application circuit (see Resistors connected to supply lines in Figure 8-6). When using such resistors connected between VS and GND, an open LED diagnosis is not possible anymore. To overcome this issue an internal transistor (open collector) is connected to the ST pin of the TLD5045EJ. During normal operation the ST pin is LOW and a minimum module current can be guaranteed. As soon as an open load occurs the internal ST trans istor switches off. Due to this, the current on the V REC pin decreases below the open load detection threshold of the driver IC located in the light control module. Note: Open Load is only detected during the ON cycle of the switching transistor. During the OFF state the ST signal displays what was detected in the previous ON state. Figure 7-1 Open Load Diagnosis using Internal PWM Mode tOL VPWMI Open Load Event ST t t t t Open Load VSW ST pull-down transistor OFFST pull -down transistor ON VPWMI,OFF VPWMI,ON High - z

Data Sheet 20 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Open Load Diagnosis

7.4 Application with µC connected to TLD5045EJ IC

The ST pin can be connected directly to a µC input. Duri ng an open load condition t he ST transistor is OFF. An external pull up resistor connected to V DD is required to signal a logic high signal on the ST pin during an open load error. Please consider that this diagnosis functionalit y is only active if the device is in active mode (HIGH potential at the EN pin). Refer to application drawing Figure 8-5. Figure 7-2 Open Load diagnosis via µC connected to ST pin Open Load Event VSW ST tOL Open Load t t t t TPWMI VEN t High Low SW - ONSW - OFF SW - OFF SW - ON SW - OFF VPWMI,OFF VPWMI,ON ST pull-down transistor ON ST pull-down transistor OFF VPWMI High - z

Data Sheet 21 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ

Application Information

8 Application Information

Note: The following information is given as a hint for the implementation of the device only and shall not be regarded as a description or warranty of a certain functionality, condition or quality of the device.

8.1 Output Peak current Adjustment via R SET

The external resistor RSET is used to adjust the peak current of t he regulator. Maximum achievable peak current is 700mA and minimum achievable peak current is 100mA. The SET pin provides an internally fixed voltage level at typ.: 1.225V. Out of this considerations the equation is: (8.1) The factor 5710 is derived from following considerations:

  • Ipeak, max = 700mA (R SET = 10kΩ)
  • Ipeak,min = 100mA (R SET = 70kΩ) Internal comparator voltage at SET pin = 1.225V. The circuitry behind the SET pin is adjusting higher peak currents with lower RSET values. The R SET value should be in the range from 10kΩ to 70kΩ to achieve the requested peak current range. The following setup applies for the table displayed in Figure 8-1: VREC=12V, VLED=7.2V, LSW=220µH. Figure 8-1 RSET Resistor Selection 5710225.1 ⋅⎟ SETR VIpeak IPEAK [mA] RSET [kΩ] 100 200 300 400 500 600 700

Data Sheet 22 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ

8.2 Switching Frequency Determination

With the external RFREQ, CFREQ and RCOMP network, it is possible to adjust the switching frequency of the regulator. To ensure a stable frequency over a broad range of input voltage VREC an external resistor RCOMP can be used. The following setup applies for the table displayed in Figure 8-3: VREC=12V, VLED=7.2V, LSW=220µH, RSET=14kΩ. Figure 8-2 Setting tOFF Time of Regulator with External RFREQ, CFREQ Network Figure 8-3 RFREQ, CFREQ versus fSW Table GND 6FREQ TLD5045 RFREQ CFREQ VREC RCOMP Rcomp Rfreq Cfreq fsw toff 255.8kΩ 17.1kΩ 220pF 50kHz 6.47 μs 115.8kΩ 7.7kΩ 220pF 100kHz 3.19 μs 69.7kΩ 4.6kΩ 220pF 150kHz 2.12 μs 46.8kΩ 3.1kΩ 220pF 200kHz 1.59 μs 72.8kΩ 4.9kΩ 100pF 250kHz 1.27 μs 52.7kΩ 3.5kΩ 100pF 300kHz 1.06μs

Data Sheet 23 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Figure 8-4 Theoretical Operating Waveforms VEN tdown t t t t High Low VFREQ ILED VSW VFREQ,high VFREQ,low Iset=Ipeak VREC+Vfw Vdrop Transistor Diode T Diode T Diode T Diode T Diode tup ton toff Imin Iripple

Data Sheet 24 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ

8.3 TLD5045EJ in different LED Applications

8.3.1 TLD5045EJ in a Body Control Module (BCM) with µC Interface

Figure 8-5 provides a simplified application with two high brightness LEDs in series. A µC is controlling the EN pin to put the device into sleep/active mode. Also the PWMI pin can be directly controlled via a µC port if PWM dimming of the LED current is required . The open load ST pin monitors th e load condition of the application and gives feedback to the µC. An ex ternal pull up resistor is recommended to achieve a logic HIGH signal during an open load error (internal status transistor is switched OFF and the ST pin is high ohmic an external pull up resistor ensures a logic HIGH signal). The external low power resistor RSET is used to set the required peak current for the LED load (refer to Figure 8-1 for more details). To set the desired switching frequency of the buck regulator the external R FREQ and C FREQ network must be connected to GND (reference values are given in Figure 8-3). Figure 8-5 Simplified Application Diagram TLD5045EJ Note: This is a very simplified example of an application circuit. The function must be verified in the real application SW GND FREQ PWMI ST EN VREC TLD5045 LSW CFREQRFREQ RSET CREC Vs = 5V to 40V PWM dimming via µC open load status connected to µC ILED SET connect to µC pin VDD RCOMP VREC REMC RST

Data Sheet 25 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ

8.3.2 Decentralized Light Module Application - DLM (Input configuration 1)

The connection between the Body Control Module (BCM) and the Decentralized Light Module is realized via one supply line and one GND connection. The supply line could change between two different operation modes: 1. Light Function 1 - Daytime Running Light (DRL) mode: If the supply line is permanently ON, the DRL application which requires higher LED current (e.g. 400mA) is active. The proper RSET resistor should be placed to achieve the desired load current (e.g 18kΩ). 2. Light Function 2 - Position Light (PL) mode: During a PWM signal (e.g. 200Hz) on the supply line the mean LED current is reduced to a lower level (e.g. 50mA) and the application is entering into PL mode. The enable pin of the TLD5045EJ is a high voltage pin (max. 45V) and can be directly connected via a resistor REN before the reverse polarity protection diode of the module to achieve a fast capture of the PWM signal. The PWMI pin is connected to GND (inverse logic = ON). To simulate a module current during light load conditions, the ST pin can be connected via a resistor to the supply voltage line. (refer to Chapter 7 for a detailed description of the ST behavior) For a decentralized solution without micro controller involvement the possibility to connect a PTC resistor at the SET pin is a cost effective solution to protect the LED load from thermal destruction. Figure 8-6 Application Diagram of Decentralized Light Module without µC (input config 1) Note: This is a very simplified example of an application circuit. The function must be verified in the real application SW GND FREQ SET ST PWMI VREC TLD5045 CFREQRFREQ RSET IST,PD Vbat BCM - module Wire Harness Inductance Light Function 1 (e.g. DRL) GND IOpen_load ILED Decentralized Light Module EN CREC RPTC RCOMP VREC LSW REN

Data Sheet 26 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ

8.3.3 Decentralized Light Module Application - DLM (Input configuration 2)

In this particular input configuration two supply lines are tied together on the DLM. The following input states must be considered to distinguish between Light Function 1 (DRL mode) and Light Function 2 (PL mode). 1. 1) Condition: DRL = ON, PL = OFF. Desired function: DRL mode (e.g. 400mA LED load current) 2. 2) Condition: DRL = OFF, PL = ON. Desired function: PL mode (e.g. 50mA LED load current) 3. 3) Condition: DRL = ON, PL =ON. Desired fu nction: PL mode (e.g. 50mA LED load current) To achieve a lower mean LED load current during the PL mode the integrated PWM engine is a useful feature. The external RPWM and CPWM circuit predefines a dedicated PWM frequency and duty cycle. (for details refer to Figure 8-2) To simulate a module current during light load conditions the ST pin ca n be connected via resistors to both supply voltage lines. (refer to Chapter 7 for a detailed description of the ST behavior) For a decentralized solution without micro controller involvement the possibility to connect a PTC resistor at the SET pin is a cost effective solution to protect the LED load from thermal destruction. Figure 8-7 Application Diagram of Decentralized Light Module without µC (input config 2) Note: This is a very simplified example of an application circuit. The function must be verified in the real application SW GND FREQ SET ST PWMI VREC TLD5045 CFREQRFREQ RSET IST,PD Vbat Vbat BCM - module Wire Harness Inductance Light Function 1 (e.g. DRL) Light Function 2 (e.g. PL) GND RPWMCPWM IOpen_load ILED Decentralized Light Module EN CREC RPTC RCOMP VREC LSW REN TDIM1 TDIM2 RDIM1

Data Sheet 27 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ

8.3.4 Decentralized Light Module Application - DLM (Input configuration 3)

A permanent supply chooses the Light Function 1 (DRL mode) and a second dedicated PWM supply between 100Hz and 200Hz switches to Light Function 2 (PL mode). For this input configuration it is possible to connect the PWM dimming output of the BCM directly to the PWMI input of the TLD5045EJ. To simulate a module current during light load conditions the ST pin can be connected via a resistor to the permanent supply voltage line. (refer to Chapter 7 for a detailed description of the ST behavior) For a decentralized solution without micro controller involvement the possibility to connect a PTC resistor at the SET pin is a cost effective solution to protect the LED load from thermal destru ction. (for details refer to Figure 8-6) Figure 8-8 Application Diagram of Decentralized Light Module without µC (input config 3) Note: This is a very simplified example of an application circuit. The function must be verified in the real application SW GND FREQ SET ST PWMI VREC TLD5045 LSW CFREQRFREQ RSET IST,PD Vbat BCM - module Wire Harness Inductance GND IOpen_load ILED Decentralized Light Module EN CREC RPTC Vbat Light Function 1 (e.g. DRL) Light Function 2 (e.g. PL) RCOMP VREC REMC REN RLIM DLIM

Data Sheet 28 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ Package Outlines

9 Package Outlines

Figure 9-1 Outline PG-DSO-8 EP Green Product (RoHS Compliant) To meet the world-wide customer requirements for environmentally friendly products and to be compliant with government regulations the device is available as a green product. Green products are RoHS-Compliant (i.e Pb-free finish on leads and suitable for Pb-free soldering according to IPC/JEDEC J-STD-020). PG-DSO-8-27-PO V01 8x0.41±0.09 2) M0.2 DC A-B 1.27 C Stand Off -0.10.1 (1.45) 1.7 MAX. 0.08 Seating Plane C A B 3) JEDEC reference MS-012 variation BA 1) Does not include plastic or metal protrusion of 0.15 max. per side 2) Dambar protrusion shall be maximum 0.1 mm total in excess of lead width Bottom View ±0.23 ±0.22.65 0.2±0.2 D 6 M D 8x 0.64±0.25 3.9±0.11) 0.1 0.35 x 45˚ CD2 x +0.06 0.19 8˚ MAX. Index Marking

Data Sheet 29 Revision 1.0 2015-05-28 Infineon® LITIX™ Power TLD5045EJ

Revision History

Revision 1.0, 2015-05-28 Page or Item Subjects (major changes since previous revision) Responsible Date Rev1.0 Initial Data Sheet for TLD5045EJ 2011-05-27

Trademarks of Infineon Technologies AG AURIX™, C166™, CanPAK™, CIPOS™, CoolGaN™, CoolMOS™, CoolSET™, Co olSiC™, CORECONTROL™, CROSSAVE™, DAVE™, DI-POL™, DrBLADE™, Easy PIM™, EconoBRIDGE™, EconoDUAL™, EconoPACK™, EconoPIM™, EiceDRIVER™, eupec™, FCOS™, HITFET™, HybridPACK™, Infineon™, ISOFACE™, IsoPACK ™, i- Wafer™, MIPAQ™, ModSTACK™, my-d™, Novali thIC™, OmniTune™, OPTIGA™, OptiMOS™, OR IGA™, POWERCODE™, PRIMARION™, PrimePACK™, PrimeSTACK™, PROFET™, PRO-SIL™, RASIC™, REAL3™, ReverSave™, SatRIC ™, SIEGET™, SIPMOS™, SmartLEWIS ™, SOLID FLASH™, SPOC™, TEMPFE T™, thinQ!™, TRENCHSTOP™, TriCore™. Other Trademarks Advance Design System™ (ADS) of Agilent Technologies, AMBA™, ARM™, MULTI-ICE™, KEIL™, PRIMECELL™, REALVIEW™, THUMB™, µVision™ o f ARM Limited, UK. ANSI™ of American National Standards In stitute. AUTOSAR™ of AUTOSAR development partnership. Bluetooth™ of Bluetooth SIG In c. CAT-iq™ of DECT FLEXGO™ of Microsoft Corporation. HYPERTERMINAL™ of Hilgraeve Incorporated. MCS™ of Intel Corp. IEC™ of Commission Electrotechnique Internationale. IrDA™ of Infrared Data Association Corporation. ISO™ of INTERNAT IONAL ORGANIZATION FOR STANDARDIZATION. MATLAB™ of MathWorks, Inc. MAXIM™ of Maxim Integrated Products, Inc. MICROTEC™, NUCLEUS™ of Mentor Gr aphics Corporation. MIPI™ of MIPI Alliance, Inc. MIPS™ of MIPS Technologies, Inc., USA. muRata™ of MURATA MANUFACT URING CO., MICROWAVE OFFICE™ (MWO) of Applied Wave Research Inc., OmniVision™ of OmniVision Tech nologies, Sun Microsystems, Inc. SPANSION™ of Spansion LLC Ltd. Symbian™ of Symbian Software Limited. TAIYO YUDEN™ of Taiyo Yuden Co. TEA KLITE™ of CEVA, Inc. TEKTRONIX™ of Tektronix Inc. TOKO™ of TOKO KABUSHIKI KAISHA TA. UNIX™ of X/Open Company Limited. VERILOG™, PALLADIUM™ of C adence Design Systems, Inc. VLYNQ™ of Texas Instruments Incorporated. VXWORKS™, WIND RIVER™ of WIND RIVER SYSTEMS, INC. ZETEX™ of Diodes Zete x Limited. Trademarks Update 2014-11-12 Edition 2015-05-28 Published by Infineon Technologies AG

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