TFDS3000 TEMIC | Alldatasheet

Document overview

  • Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
  • PDF pages: 10

Technical content

Features

/C0068Compatible to IrDA standard /C0068SMD side view /C0068Low profile (height = 5.6 mm max.) /C0068Microcomputer compatible /C0068No external components /C0068Low power consumption /C0068Wide supply voltage range (3 to 5.5 V) /C0068AGC for EMI immunity Pin description: 1: IRED cathode 2: Rxd (output) 3: V CC (supply voltage) 4: Ground 5: NC 6: **) 7: Txd (input) 8: IRED anode Guide pins internally connected to ground *) optional sensitivity control for OEMs only **) shut-down, not for new development ComparatorAmplifier Control logic Driver Driver V cc SD Txd GND Rxd 95 11227 Figure 1. Block diagram

Rev. A6, 15-Aug-96 Preliminary Information 2 (10) Absolute Maximum Ratings Reference point Pin 4, unless otherwise specified Parameter Test Conditions Symbol Value Unit Supply voltage range V CC –0.5 to 6 V Input currents All pins, exept 8:see IRED 10 mA Output sinking current 25 mA Power dissipation See figure 3 Ptot 200 mW Junction temperature Tj 125 °C Ambient temperature range (operating) Tamb 0 to70 °C Storage temperature range Tstg –25 to +85 °C Soldering temperature See figure 11 introductory text IrDA Design Guide 230 (typ. 215) /C0095C Average IRED current IIRED (DC) 100 mA Repetitive pulsed IRED current < 90 /C0109s, ton < 20% IIRED (RP) 500 mA Peak IRED current < 2 /C0109s, ton < 10% IIRED (PK) 1 A IRED anode voltage V IREDA –0.5 to VCC +0.5 V Transmitter data input voltage V Txd –0.5 to VCC +0.5 V Receiver data output voltage V Rxd –0.5 to VCC +0.5 V Basic Characteristics Tamb = 25/C0095C, VCC = 5 V , unless otherwise specified Parameter Test Conditions Symbol Min. Typ. Max. Unit Transceiver Supported data rates 2.4 115.2 kBit/s Supply voltage range reduced function down to 2.6 V V CC 3 5 5.5 V Supply current IS 1.3 2.5 mA Receiver Min. detection threshold irradiance ) /C0097 = /C003415° Eemin 0.025 0.035 W/m 2 Max. detection threshold irradiance ) /C0097 = /C003490° Eemax 3300 5000 W/m 2 Logic low receiver input irradiance Eemaxlow 0.004 W/m 2 Max. DC irradiance /C0097 = /C003490° Eedcmax 400 W/m 2 Output voltage Rxd Active, C = 15 pF, R = 2.2 k/C0087 V OL 0.5 0.8 V Output voltage Rxd Non-active, C = 15 pF, R = 2.2 k/C0087 V OH V CC –0.5 V Output current V OL < 0.5 V C = 15 pF, R = 2.2 k/C0087 4 mA Rise and fall time C = 15 pF, R = 2.2 k/C0087 tr, tf 20 200 ns Rxd signal, electrical output pulse width 2.4 kB/s 1 20 /C0109s Rxd signal, electrical output pulse width 115.2 kB/s 1 8 /C0109s **) BER = 10 –8 is target of IrDA specification, defined sensitivities not related to BER = 10–8

Rev. A6, 15-Aug-96 3 (10) Parameter Test Conditions Symbol Min. Typ. Max. Unit Output delay time (Rxd) Max. delay of leading edge of output signal related to leading edge of optical input signal Output level = 0.5 /C0032 VCC @ E e = 0.040 W/m2 1 2 /C0109s Jitter, leading edge of output signal Over a period of 10 bit, 115.2 kB/s 2 /C0109s Output delay time (Rxd) Max. delay of trailing edge of output signal related to trailing edge of optical input signal Output level = 0.5 /C0032 VCC 6.5 /C0109s Latency Recovery from last transmitted pulse to 1.1 /C0032 threshold sensitivity tL 100 800 /C0109s Transmitter Supply voltage switching specs only cover 4.5 to 5.5 V V CC 3 5.5 V Driver Current IRED Id can be adjusted by variation of RS Current limiting resistor in series to IRED: R S = 10 /C0087 /C0064 5 V Id 0.3 0.5 A Logic low transmitter input voltage V IL(Txd) 0 0.8 V Logic high transmitter input voltage Max. input current I in < 100 /C0109A V IH(Txd) 2.4 V CC V Output radiant intensity /C0097 = /C003415° Current limiting resistor in series to IRED: RS = 10 /C0087, V CC = 5 V 40 60 200 mW/sr Angle of half intensity /C0097 /C003424 ° Peak wavelength of emission /C0108p 850 870 900 nm Halfwidth of emission spectrum 60 nm Optical rise / fall time115.2 kHz square wave signal (1:1) 200 600 ns Output radiant intensityLogic LOW level 0.4 /C0109W/sr Overshoot, optical 25 % Rising edge peak-to-peak jitter Over a period of 10 bits, independent of information content tj 0.2 /C0109s

Rev. A6, 15-Aug-96 Preliminary Information 6 (10) TFDS3000 Recommended Circuit Diagram IRED Cathode Rxd V CC GND IRED Anode Txd SD NC TFDS3000 C 2 220 nF C 1 4.7 /C0109F 2.2 k/C0087 R 4 C 3 220 nF 100 /C0087 R 2 5 /C0087 R 3V S Rxd Txd GND 95 11800 Figure 8. Txd is recommended to be dc-coupled to the driving circuitry. R4 and C3 are only necessary if the input signal is active for longer periods. This might occur under certain conditions when the circuit is conncted to the NSC or SMC Super I/OsTM. See National Semiconductors application note. R3 is used for controlling the current through the IR emitter. To increase the output power, reduce the value. To reduce the output power, increase the value as described in the TEMIC IrDA Design Guide. The load resistor R1 is optional when longer cables must be driven. Internally, RxD is connected to V CC by a 20 k/C0087 load. C1 and C2 are dependent on the quality of the supply voltage. A combination of 6.8 /C0109F with 100 nF will also work in most cases. Pin Pin Name Description I/O Active

1 IRED cathode IRED cathode, internally connected to driver transistor

2 Rxd Received data O LOW

3 Vcc Supply voltage

4 GND Ground

5 NC No connection

6 NC No connection

7 Txd Data to be transmitted I HIGH

8 IRED anode IRED anode

– 2 guide pins Internally connected to ground

Figure 9. Shape and dimensions of reel

Figure 10. Dimensions of tape TFDS3000

Rev. A6, 15-Aug-96 9 (10) Dimensions in mm 96 11749

Rev. A6, 15-Aug-96 Preliminary Information 10 (10) Ozone Depleting Substances Policy Statement It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements. 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as ozone depleting substances (ODSs). The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of ODSs listed in the following documents. 1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively 2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency (EPA) in the USA 3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively. TEMIC can certify that our semiconductors are not manufactured with ozone depleting substances and do not contain such substances. We reserve the right to make changes to improve technical design and may do so without further notice. Parameters can vary in different applications. All operating parameters must be validated for each customer application by the customer. Should the buyer use TEMIC products for any unintended or unauthorized application, the buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax number: 49 (0)7131 67 2423