TE0706-02 | DigiCamel IC Datasheet

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Technical content

Online version of this document: https://wiki.trenz-electronic.de/display/PD/TE0706+TRM TE0706 TRM Revision v.67 Exported on 2019-04-11

1 Table of Contents

2 Table of Figures

3 Table of Tables

4 Overview

The Trenz Electronic TE0706 Carrier Board provides functionalities for testing, evaluation and development purposes of company's 4 x 5 cm SoMs. The Carrier Board is equipped with various components and connectors for different configuration setups and needs. The interfaces of the SoM's functional units and PL I/O-banks are connected via board-to-board connectors to the Carrier Board's components and connectors for easy user access. See "4 x 5 SoM Carriers1" page for more information about supported 4 x 5 cm SoMs.Refer to http://trenz.org/ te0706-info for the current online version of this manual and other available documentation.

4.1 Key Features

3 x Samtec LSHM Series Board to Board Connectors
VG96 connector (mounting holes and solder pads, J6) and 50-pin IDC male connector socket (J5) for access to PL I/O-bank pins
Micro SD card socket
SDIO port expander with voltage-level translation
USB2.0 type A connector, optionally Micro USB 2.0 connector
1 x user-push button S2, by default configured as system reset button
1 x RJ45 GbE MagJack J3, connected via MDI to B2B connector JB1
1 x Marvell Alaska 88E1512 GbE PHY, providing Ethernet interface in conjunction with RJ45 GbE MagJack J2
5V power supply barrel jack
4 A High-Efficiency Power SoC DC-DC Step-Down Converter (Enpirion EN6347) for 3.3V power supply
XMOD JTAG- / UART-header JX1
DIP-switch S1 to set Som's System Controller CPLD control signals
3 x VCCIO selection jumper J10, J11 and J12 to set SoM's PL I/O-bank voltages Additional assembly options are available for cost or performance optimization upon request.

4.2 Block Diagram

Figure 1: TE0706-02 block diagram.

4.3 Main Components

Figure 2: TE0706-02 Carrier Board 1. 5V power connector jack, J1 2. Reset switch, S2 3. USB2.0 type A receptacle, J7 4. Micro SD card socket with Card Detect, J4 5. 50 pin IDC male connector, J5 6. 1000Base-T Gigabit RJ45 Ethernet MagJack, J3 7. 1000Base-T Gigabit RJ45 Ethernet MagJack, J2 8. XMOD JTAG- / UART-header, JX1 9. User DIP-switch, S1 10. VCCIO selection jumper block, J10 - J12 11. External connector (VG96) placeholder, J6 12. Samtec Razor Beam™ LSHM-150 B2B connector, JB1 13. Samtec Razor Beam™ LSHM-150 B2B connector, JB2 14. Samtec Razor Beam™ LSHM-130 B2B connector, JB3

4.4 Initial Delivery State

Board is shipped in following configuration:

VCCIO voltage selection jumpers are all set to 1.8 V.
S2 switch configured as reset button.
One VG96 connector (not soldered to the board, but included in the package as separate component) Different delivery configurations are available upon request.

5 Signals, Interfaces and Pins

5.1 B2B Connector

With the TE0706 Carrier Board's Board-to-Board Connectors (B2B) the MIO- and PL I/O-bank's pins and further interfaces of the mounted SoM can be accessed. A large quantity of these I/O's are also usable as LVDS-pairs. The connectors provide also VCCIO voltages to operate the I/O's properly. Following table gives a summary of the available I/O's, interfaces and LVDS-pairs of the B2B connectors JB1, JB2 and JB3: B2B Connector Interfaces Count of I/O's Notes JB1 User I/O 48 single ended or 24 differential 8 single ended MIO with Zynq Modules GbE MagJack J3 MDI 8 - SD IO 6 - SoM control signals 5 EN1, PGOOD, MODE, NOSEQ, PRPGMODE JB3 GbE PHY U6 RGMII 18 - USB2.0 (OTG, device and host mode) 5 - JB2 User I/O 18 single ended - 48 single ended or 24 differential JTAG 4 - SoM control signals 1 RESIN GbE MagJack J3 LED's 2 - Table 1: General overview of PL I/O signals and SoM's interfaces connected to the B2B connectors.

5.2 On-board Connector

The TE0706 Carrier Board has and a 50-pin IDC male connector J5 and soldering pads as place-holder to mount a VG96 connectors J6 to get access the PL I/O-bank's pins and further interfaces of the mounted SoM. With these connectors, SoM's PL-I/O's are available to the user, a large quantity of these I/O's are also usable as differential pairs. Following table gives a summary of the pin-assignment, available interfaces and functional I/O's of the connectors J5 and J6: On-board Connector Control Signals and Interfaces Count of I/O's Notes J5 User I/O 18 single ended - 14 single ended or 7 differential MIO 8 - GbE MagJack J2 LED's 2 - J6 User I/O 82 single ended or 41 differential SoM control signals 2 'PGOOD', 'NOSEQ' Table 2: General overview of PL I/O signals, SoM's interfaces and control signals connected to the on-board connectors.

5.3 JTAG Interface

JTAG access to the mounted SoM is provided through B2B connector JB2 and is also routed to the XMOD header JX1. With the TE0790 XMOD USB2.0 to JTAG adapter, the device of the mounted SoM can be programed via USB2.0 interface. JTAG Signal B2B Connector Pin XMOD Header JX1 Note TCK JB2-100 JX1-4 - TDI JB2-96 JX1-10 - TDO JB2-98 JX1-8 - TMS JB2-94 JX1-12 - Table 3: JTAG interface signals.

5.4 UART Interface

UART interface is available on B2B connector JB1 and is usually established by MIO-pins of the PS-bank of the mounted SoM's Zynq device. With the TE0790 XMOD USB2.0 adapter, the UART signals can be converted to USB2.0 interface signals: UART Signal Schematic Name B2B XMOD Header JB3 Note MIO14 JB1-91 JX1-7 UART-RX (receive line) MIO15 JB1-86 JX1-3 UART-TX (transmit line) Table 4: UART interface signals.

5.5 I²C Interface

One of the SoM's I²C interface is routed to the on-board connector J5 and is available to the user for general purposes: I²C Signal Schematic Name B2B On-board Connector Note MIO11 JB1-94 J5-27 I²C data line MIO10 JB1-96 J5-28 I²C clock line Table 5: I²C interface signals.

5.6 SD IO Interface

The SD IO interface of the mounted SoM is routed to the on-board Texas Instruments TXS02612 SDIO port expander U4. This IC provides a necessary VDD/VCCIO translation between the MicroSD Card socket J4 (3.3V) and the SoM's Zynq device MIO-bank (1.8V): SD IO Signal Schematic Name B2B Connected to Note SD_DAT0 JB1-24 U4-6 SD IO data SD_DAT1 JB1-22 U4-7 SD IO data SD_DAT2 JB1-20 U4-1 SD IO data SD_DAT3 JB1-18 U4-3 SD IO data SD_CLK JB1-28 U4-9 SD IO clock SD_CMD JB1-26 U4-4 SD IO command

Copyright © 2019 Trenz Electronic GmbH 12 of 32 http://www.trenz-electronic.de SD IO Signal Schematic Name B2B Connected to Note MIO0 JB1-88 J4-9 Card Detect signal Table 6: SD IO interface signals. 5.7 USB2.0 Interface TE0706-02 board has one physical USB2.0 type A socket J7, the differential data signals of the USB2.0 socket are routed to the B2B connector JB3, where they can be accessed by the corresponding USB2.0 PHY transceiver of the mounted SoM. There is also the option to equip the board with a Micro USB 2.0 type B (receptacle) socket (J8) to the board as alternative fitting option. With this fitting option (Micro USB2.0 type B), the USB2.0 interface can also be used for Device mode, OTG and Host Modes. For USB2.0 Host mode, the Carrier Board is additionally equipped with a power distribution switch U5 to provide the USB2.0 interface with the USB supply voltage USB-VBUS with nominal value of 5V. OTG mode is not available with USB2.0 Type A socket. Following table gives an overview of the USB2.0 interface signals: USB2.0 Signal Schematic Name B2B Connected to Note OTG-D_N JB2-48 J11-2, (J10-2) USB2.0 data OTG-D_P JB2-50 J11-3, (J10-3) USB2.0 data OTG-ID JB2-52 J11-4 Ground this pin for A-Device (host), left floating this pin for B-Device (peripheral). VBUS_V_EN JB2-54 U3, pin 4 Enable USB-VBUS. USB-VBUS JB2-56 J11-1, (J10-1) USB supply voltage in Host mode. Table 7: USB2.0 interface signals and connections.

5.8 Gigabit Ethernet Interface

The TE0706 Carrier Board is equipped with a Marvell Alaska 88E1512 Gigabit Ethernet PHY (U6), which provides in conjunction with the Gigabit Ethernet MagJack J2 a 1000Base-T Ethernet (GbE) interface. The I/O Voltage is fixed at 1.8V. The reference clock input of the PHY is supplied by on-board 25MHz oscillator (U7). The GbE MegJack J2 has two integrated LEDs (both green), its signals are routed as MDI (Media Dependent Interface) to the GbE PHY. PHY U6 pins B2B-pin Notes ETH-MDC/ETH-MDIO JB3-49, JB3-51 -

Copyright © 2019 Trenz Electronic GmbH 13 of 32 http://www.trenz-electronic.de PHY U6 pins B2B-pin Notes PHY_LED0 - Connected to GbE MagJack J2 LED0 (green). Also connected to J5-24 (PHY_LED0_CON). PHY_LED1 - Connected to GbE MagJack J2 LED1 (green). Also connected to J5-23 (PHY_LED1_CON). PHY_INT JB3-33 - CONFIG JB3-60 - CLK125 JB3-32 PHY Clock (125 MHz) output. ETH-RST JB3-53 - RGMII JB3-37 - JB-44, JB3-47, JB3-57 - JB-59 Reduced Gigabit Media Independent Interface. 12 pins. SGMII - Serial Gigabit Media Independent Interface. Not connected. MDI - Media Dependent Interface. Connected to Gigabit Ethernet MagJack J2. Table 8: GbE interface signals and connections.

5.9 RJ45 Gigabit Ethernet MagJack J3

The TE0706-02 carrier board is also equipped with a second Gigabit-Ethernet MagJack J3, which is connected via MDI to the B2B connector JB1. There is usually a corresponding Gigabit Ethernet PHY on 4 x 5 SoMs (e.g. TE0715 or TE0720), which can be used in conjunction with the baseboard MagJack J3. GbE PHY Signal Schematic Name B2B Connected to Notes PHY_MDI0_P JB1-3 J3-2 - PHY_MDI0_N JB1-5 J3-3 -

Copyright © 2019 Trenz Electronic GmbH 14 of 32 http://www.trenz-electronic.de 2 https://shop.trenz-electronic.de/de/Produkte/Trenz-Electronic/Open-Hardware/Xmod-FTDI-JTAG-Adapter/ GbE PHY Signal Schematic Name B2B Connected to Notes PHY_MDI1_P JB1-9 J3-4 - PHY_MDI1_N JB1-11 J3-5 - PHY_MDI2_P JB1-15 J3-6 - PHY_MDI2_N JB1-17 J3-7 - PHY_MDI3_P JB1-21 J3-8 - PHY_MDI3_N JB1-23 J3-9 - ETH_LED1 JB2-90 Green MegJack J3 LED - ETH_LED2 JB2-99 Green MegJack J3 LED - Table 9: RJ45 GbE MagJack signals and connections.

5.10 XMOD FTDI JTAG-Adapter Header

The JTAG interface of the mounted SoM can be accessed via XMOD header JX1, which has a 'XMOD FTDI JTAG Adapter'-compatible pin-assignment. So in use with the XMOD-FT2232H adapter-board TE07902 the mounted SoM can be programmed via USB2.0 interface. The TE0790 board provides also an UART interface to the SoM's Zynq device which can be accessed by the USB2.0 interface of the adapter-board while the signals between these serial interfaces will be converted. Following table describes the signals and interfaces of the XMOD header JX1: JX1 pin Signal Schematic Net Name B2B Note C (pin 4) TCK JB2-100 - D (pin 8) TDO JB2-98 - F (pin 10) TDI JB2-96 - H (pin 12) TMS JB2-94 - A (pin 3) MIO15 JB1-86 UART-TX (transmit line) B (pin 7) MIO14 JB1-91 UART-RX (receive line) E (pin 9) - - not used

Copyright © 2019 Trenz Electronic GmbH 15 of 32 http://www.trenz-electronic.de 3 https://wiki.trenz-electronic.de/display/PD/TE0790+Resources JX1 pin Signal Schematic Net Name B2B Note G (pin 11) - - not used Table 10: XMOD header signals and connections. When using XMOD FTDI JTAG Adapter TE0790, the adapter-board's VCC and VCCIO will be sourced by the mounted SoM's 'VCCJTAG' (pin JB2-92). Set the DIP-switch with the setting: XMOD DIP-switches Position Switch 1 ON Switch 2 OFF Switch 3 OFF Switch 4 ON Table 11: XMOD adapter board DIP-switch positions for voltage configuration. Use Xilinx compatible TE0790 adapter board (designation TE-0790-xx with out 'L') to program the Xilinx Zynq devices. The TE0790 adapter board's CPLD have to be configured with the Standard variant of the firmware. Refer to the TE0790 Resources Site3 for further information and firmware download.

6 On-board Peripherals

6.1 4-bit DIP-switch Table below describes DIP-switch S1 settings for configuration of the mounted SoM: Switch Signal Name ON OFF Notes S1-1 - - - Not connected. S1-2 PROGMOD E JTAG enabled for programing mounted SoM's Zynq-SoC. JTAG enabled for programing mounte d SoM's SC-CPLD. S1-3 MODE Drive SoM SC CPLD pin 'MODE' low. (SD- Boot) Leave SoM SC CPLD pin 'MODE' open. (QSPI-Boot) Boot mode configuration, if supported by SoM. (Depends also on SoM's SC-CPLD firmware). S1-4 EN1 Drive SoM SC CPLD pin 'EN1' low. Drive SoM SC CPLD pin 'EN1' high. Usually used to enable/disable FPGA core-voltage supply. (Depends also on SoM's SC CPLD firmware). Note: Power-on sequence will be intermitted if S1-4 is set to OFF and if functionality is supported by SoM. Table 12: DIP-switch S1 SoM configuration settings.

6.2 VCCIO Selection Jumper

The Carrier Board VCCIO for the PL I/O-banks of the mounted SoM are selectable by the jumpers J10, J11 and J12. Following table describes how to configure the VCCIO of the SoM's PL I/O-banks with jumpers: Supply Voltage by Jumper Supply Voltage by 0-Ohm Resistor Supply Voltage by Connector J6 Voltage Level 1.8V 3.3V 1.8V 3.3V Variable VCCIOA J10: 1-2, J10: 1, 2-3 - R20 J6 pin B32 VCCIOB J11: 1-2, J11: 1, 2-3 R29 R21 - VCCIOC J12: 1-2, J12: 1, 2-3 R30 R22 J6 pin B1 Table 13: VCCIO jumper settings. Note: The corresponding PL I/O-bank supply-voltages of the 4 x 5 SoM to the selectable base-board voltages VCCIOA, VCCIOB and VCCIOC are depending on the mounted 4 x 5 SoM and varying in order of the used model. Refer to the SoM's schematic for information about the specific pin assignments on module's B2B- connectors regarding the PL I/O-bank supply-voltages and to the 4 x 5 Module integration Guide4 for VCCIO voltage options.

Copyright © 2019 Trenz Electronic GmbH 18 of 32 http://www.trenz-electronic.de 5 http://www.ti.com/product/txs02612 Figure 4: Base-board supply-voltages (VCCIOA, VCCIOB, VCCIOC) selection jumpers. Only one supply-source is allowed to configure the base-board supply-voltages, either by jumper, by 0-Ohm- resistor or by connector J6. If a supply-voltage is configured by 0-Ohm-resistor or connector J6, then the corresponding configuration-jumper has to be removed. There aren't 0-Ohm-resistors and supply-voltages by connector J6 allowed if the corresponding base-board supply-voltage is configured by jumper. Vice versa jumpers and 0-Ohm-resistors have to be removed if supplying corresponding base-board supply-voltage by connector J6. Note: If supplying base-board supply-voltages by connector J6, the module's internal 3.3V voltage-level on pins 9 and 11 of B2B-connector JB2 has to be reached stable state.

6.3 RTC Buffer Voltage Supply Header

The buffer voltage of the SoM's RTC can be supplied through the header J9 (VBAT-pin). Refer to the SoM's TRM for recommended voltage range and absolute maximum ratings.

6.4 Push Button

The Carrier Board's push button S2 is connected to the 'RESIN' signal, the function of the button is to trigger a reset of the mounted SoM by driving the reset-signal 'RESIN' to ground.

6.5 Gigabit Ethernet PHY

On-board Gigabit Ethernet PHY (U6) is provided with Marvell Alaska 88E1512. The Ethernet PHY RGMII interface is connected to the B2B connector JB3, where they can be accessed by the mounted SoM's PS bank. Reference clock input of the PHY is supplied from the on-board 25.000000 MHz oscillator (U7), the 125MHz output clock signal *CLK125' is connected to the B2B connector pin JB3-32.

6.6 SDIO Port Expander

The TE0706 Carrier Board is equipped with a Texas Instruments TXS026125 SDIO Port Expander, which is needed for voltage translation due to different voltage levels of the Micro SD Card and the PS MIO-bank of the Zynq device of Take care of the VCCO voltage ranges of the particular PL IO-banks (HR, HP) of the mounted SoM, otherwise damages may occur to the FPGA. Therefore, refer to the TRM of the mounted SoM to get the specific information of the voltage ranges. It is recommended to set and measure the PL IO-bank supply-voltages before mounting of TE 4 x 5 module to avoid failures and damages to the functionality of the mounted SoM.

Copyright © 2019 Trenz Electronic GmbH 19 of 32 http://www.trenz-electronic.de the mounted SoM. The Micro SD Card has 3.3V signal voltage level, but the PS MIO-bank on the Xilinx Zynq module has VCCIO of 1.8V.

7 Power and Power-On Sequence

7.1 Power Consumption

The maximum power consumption of the Carrier Board depends mainly on the mounted SoM's FPGA design running on the Zynq device. Xilinx provide a power estimator excel sheets to calculate power consumption. It's also possible to evaluate the power consumption of the developed design with Vivado. See also Trenz Electronic Wiki FAQ6. Power Input Typical Current 5VIN TBD* Table 14: Typical power consumption. * TBD - To Be Determined soon with reference design setup. Power supply with minimum current capability of 3A for system startup is recommended.

7.2 Power Distribution Dependencies

The Carrier Board needs one single power supply voltage with a nominal value of 5V. Following diagram shows the distribution of the input voltage '5VIN' to the on-board components on the mounted SoM: Figure 5: Board power distribution diagram. To avoid any damage to the module, check for stabilized on-board voltages and VCCIO's before put voltages on PL I/O-banks and interfaces. All I/Os should be tri-stated during power-on sequence.

7.3 Power Rails

The voltage direction of the power rails is directed at on-board connectors' view: Module Connector (B2B) Designator VCC / VCCIO Direction Pins Notes JB1 3.3V Out 2, 4, 6, 14, 16 3.3V module supply voltage VCCIOA Out 10, 12 PL IO-bank VCCIO M1.8VOUT In 40 1.8V module output voltage VBAT Out 80 RTC buffer voltage JB2 1.8V Out 2, 4 1.8V module supply voltage VCCIOB Out 6 PL IO-bank VCCIO VCCIOC Out 8, 10 PL IO-bank VCCIO M3.3VOUT In 9, 11 3.3V module output voltage VCCJTAG In 92 3.3V JTAG VCCIO JB3 USB-VBUS Out 56 USB Host supply voltage Table 15: Power pin description of B2B module connector. On-board Connector Designator VCC / VCCIO Direction Pins Notes J5 3.3V Out 6, 45 3.3V module supply voltage M3.3VOUT Out 5, 46 3.3V module output voltage

Copyright © 2019 Trenz Electronic GmbH 22 of 32 http://www.trenz-electronic.de On-board Connector Designator VCC / VCCIO Direction Pins Notes J6 VCCIOA Out / In B32 PL IO-bank VCCIO, depends on Jumper settings VCCIOC Out / In B1 PL IO-bank VCCIO, depends on Jumper settings M3.3VOUT Out C32 3.3V module output voltage 3.3V Out C31 3.3V module supply voltage 5VIN Out A1, A2 Carrier Board supply power Table 16: Power Pin description of on-board connector. Jumper / Header Designator VCC / VCCIO Direction Pins Notes J10 VCCIOA In 2 - 1.8V Out 1 - M3.3VOUT Out 3 - J11 VCCIOB In 2 - 1.8V Out 1 - M3.3VOUT Out 3 - J12 VCCIOC In 2 - 1.8V Out 1 - M3.3VOUT Out 3 - Table 17: Power Pin description of VCCIO selection jumper pin header.

Copyright © 2019 Trenz Electronic GmbH 23 of 32 http://www.trenz-electronic.de Main Power Jack and Pins Designator VCC / VCCIO Direction Pins Notes J1 5VIN In 1 Power Jack 2.1mm 90° SMD J9 VBAT In 1 Attention: Pin 2 connected to ground. VBAT voltage connected on this pin cause short-circuit. Table 18: Main Power jack and pins description. Peripheral Socket Designator VCC / VCCIO Direction Pins Notes J7 / J8 USB-VBUS In / Out 1 Direction depends on USB mode J4 M3.3VOUT Out 4 MikroSD Card socket VDD Table 19: Power pin description of peripheral connector. XMOD Header Designator VCC / VCCIO Direction Pins Notes JX1 3.3V - 5 not connected VIO Out 6 connected to 'VCCJTAG' (pin JB2-92) Table 20: Power pin description of XMOD/JTAG Connector.

8 Board to Board Connectors

4 x 5 modules use two or three Samtec Razor Beam LSHM connectors7 on the bottom side.

2 x REF-189016-02 (compatible to LSHM-150-04.0-L-DV-A-S-K-TR), (100 pins, "50" per row)
1 x REF-189017-02 (compatible to LSHM-130-04.0-L-DV-A-S-K-TR), (60 pins, "30" per row) (depending on module)

8.1 Connector Mating height

When using the same type on baseboard, the mating height is 8mm. Other mating heights are possible by using connectors with a different height Order number Connector on baseboard compatible to Mating height 23836 REF-189016-01 LSHM-150-02.5-L-DV-A-S-K- TR 6.5 mm LSHM-150-03.0-L-DV-A-S-K- TR LSHM-150-03.0-L-DV-A-S-K- TR 7.0 mm 23838 REF-189016-02 LSHM-150-04.0-L-DV-A-S-K- TR 8.0 mm LSHM-150-06.0-L-DV-A-S-K- TR LSHM-150-06.0-L-DV-A-S-K- TR 10.0mm 26125 REF-189017-01 LSHM-130-02.5-L-DV-A-S-K- TR 6.5 mm LSHM-130-03.0-L-DV-A-S-K- TR LSHM-130-03.0-L-DV-A-S-K- TR 7.0 mm 24903 REF-189017-02 LSHM-130-04.0-L-DV-A-S-K- TR 8.0 mm LSHM-130-06.0-L-DV-A-S-K- TR LSHM-130-06.0-L-DV-A-S-K- TR 10.0mm Table 1: Connectors. The module can be manufactured using other connectors upon request. These connectors are hermaphroditic. Odd pin numbers on the module are connected to even pin numbers on the baseboard and vice versa.

8.2 Connector Speed Ratings

The LSHM connector speed rating depends on the stacking height; please see the following table: Stacking height Speed rating 12 mm, Single-Ended 7.5 GHz / 15 Gbps 12 mm, Differential 6.5 GHz / 13 Gbps 5 mm, Single-Ended 11.5 GHz / 23 Gbps 5 mm, Differential 7.0 GHz / 14 Gbps Table 2: Speed rating.

8.3 Current Rating

Current rating of Samtec Razor Beam™ LSHM B2B connectors is 2.0A per pin (2 adjacent pins powered).

8.4 Connector Mechanical Ratings

Shock: 100G, 6 ms Sine
Vibration: 7.5G random, 2 hours per axis, 3 axes total

9 Variants Currently In Production

USB2.0 Socket Temperature Range TE0706-02 -40°C to +85°C USB2.0 Type A socket fitted Industrial TE0706-D-02 -40°C to +85°C Micro USB2.0 Type B socket fitted Industrial Table 21: Board variants.

10 Technical Specifications

10.1 Absolute Maximum Ratings

x Units Reference Document 5VIN supply voltage -0.3 7 V MP5010A, EN6347QI, EN5311QI data sheet Storage temperature -55 +85 °C Marvell 88E1512 data sheet Table 22: Module absolute maximum ratings.

10.2 Recommended Operating Conditions

Parameter Min Max Units Reference Document 5VIN supply voltage 4.75 5.25 V USB2.0 specification concerning 'VBUS' voltage Operating temperature -40 +85 °C - Table 23: Module recommended operating conditions.

10.3 Operating Temperature Ranges

Industrial grade: -40°C to +85°C. The TE0706 Carrier Board itself is capable to be operated at industrial grade temperature range. Please check the operating temperature range of the mounted SoM, which determine the relevant operating temperature range of the overall system.

10.4 Physical Dimensions

Board size: PCB 100mm × 64.5mm. Notice that the USB type A socket on the left and the Ethernet RJ-45 jacks on the right are hanging slightly over the edge of the PCB making the total width of the longer side approximately 106mm. Please download the assembly diagram for exact numbers.
Mating height of the module with standard connectors: 8mm
PCB thickness: 1.65mm
Highest parts on the PCB are USB type A socket and the Ethernet RJ-45 jacks, approximately 15mm. Please download the step model for exact numbers.

Copyright © 2019 Trenz Electronic GmbH 29 of 32 http://www.trenz-electronic.de 8 https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/ REV01 9 https://shop.trenz-electronic.de/Download/?path=Trenz_Electronic/Modules_and_Module_Carriers/4x5/4x5_Carriers/TE0706/ REV02

11.1 Hardware Revision History

N Documentati on Link 2016-06-28 01 • Prototypes - TE0706-018 - 02 • First Production Release

Refer to Changes list in Schematic for further details in changes to REV01 - TE0706-029 Table 24: Module hardware revision history. Hardware revision number can be found on the PCB board together with the module model number separated by the dash. Figure 7: Board hardware revision number.

11.2 Document Change History

Date Revision Contributors Description 2018-06-13 v.67 John Hartfiel • Add note to DIP settings 2017-11-10 v.64 John Hartfiel • Replace B2B connector section

Copyright © 2019 Trenz Electronic GmbH 30 of 32 http://www.trenz-electronic.de Date Revision Contributors Description 2017-11-09 v.60 Ali Naseri • TRM revision to new common style 2017-07-06 v.52 Ali Naseri, Jan Kumann • Hardware revision 02 specific changes. 2017-01-06 v.1 Ali Naseri • initial document to board revision 02 Table 25: Document change history.

12 Disclaimer

12.1 Data privacy

Please also note our data protection declaration at https://www.trenz-electronic.de/en/Data-protection-Privacy

12.2 Document Warranty

The material contained in this document is provided “as is” and is subject to being changed at any time without notice. Trenz Electronic does not warrant the accuracy and completeness of the materials in this document. Further, to the maximum extent permitted by applicable law, Trenz Electronic disclaims all warranties, either express or implied, with regard to this document and any information contained herein, including but not limited to the implied warranties of merchantability, fitness for a particular purpose or non infringement of intellectual property. Trenz Electronic shall not be liable for errors or for incidental or consequential damages in connection with the furnishing, use, or performance of this document or of any information contained herein.

12.3 Limitation of Liability

In no event will Trenz Electronic, its suppliers, or other third parties mentioned in this document be liable for any damages whatsoever (including, without limitation, those resulting from lost profits, lost data or business interruption) arising out of the use, inability to use, or the results of use of this document, any documents linked to this document, or the materials or information contained at any or all such documents. If your use of the materials or information from this document results in the need for servicing, repair or correction of equipment or data, you assume all costs thereof.

12.4 Copyright Notice

No part of this manual may be reproduced in any form or by any means (including electronic storage and retrieval or translation into a foreign language) without prior agreement and written consent from Trenz Electronic.

12.5 Technology Licenses

The hardware / firmware / software described in this document are furnished under a license and may be used / modified / copied only in accordance with the terms of such license.

12.6 Environmental Protection

To confront directly with the responsibility toward the environment, the global community and eventually also oneself. Such a resolution should be integral part not only of everybody's life. Also enterprises shall be conscious of their social responsibility and contribute to the preservation of our common living space. That is why Trenz Electronic invests in the protection of our Environment.

12.7 REACH, RoHS and WEEE

Copyright © 2019 Trenz Electronic GmbH 32 of 32 http://www.trenz-electronic.de 10 http://guidance.echa.europa.eu/ 11 https://echa.europa.eu/candidate-list-table 12 http://www.echa.europa.eu/ Trenz Electronic is a manufacturer and a distributor of electronic products. It is therefore a so called downstream user in the sense of REACH10. The products we supply to you are solely non-chemical products (goods). Moreover and under normal and reasonably foreseeable circumstances of application, the goods supplied to you shall not release any substance. For that, Trenz Electronic is obliged to neither register nor to provide safety data sheet. According to present knowledge and to best of our knowledge, no SVHC (Substances of Very High Concern) on the Candidate List11 are contained in our products. Furthermore, we will immediately and unsolicited inform our customers in compliance with REACH - Article 33 if any substance present in our goods (above a concentration of 0,1 % weight by weight) will be classified as SVHC by the European Chemicals Agency (ECHA)12. RoHS Trenz Electronic GmbH herewith declares that all its products are developed, manufactured and distributed RoHS compliant. WEEE Information for users within the European Union in accordance with Directive 2002/96/EC of the European Parliament and of the Council of 27 January 2003 on waste electrical and electronic equipment (WEEE). Users of electrical and electronic equipment in private households are required not to dispose of waste electrical and electronic equipment as unsorted municipal waste and to collect such waste electrical and electronic equipment separately. By the 13 August 2005, Member States shall have ensured that systems are set up allowing final holders and distributors to return waste electrical and electronic equipment at least free of charge. Member States shall ensure the availability and accessibility of the necessary collection facilities. Separate collection is the precondition to ensure specific treatment and recycling of waste electrical and electronic equipment and is necessary to achieve the chosen level of protection of human health and the environment in the European Union. Consumers have to actively contribute to the success of such collection and the return of waste electrical and electronic equipment. Presence of hazardous substances in electrical and electronic equipment results in potential effects on the environment and human health. The symbol consisting of the crossed-out wheeled bin indicates separate collection for waste electrical and electronic equipment. Trenz Electronic is registered under WEEE-Reg.-Nr. DE97922676. 2018-09-18

02 Sep 2017

Product Information

TE0706-02 specifications and overview.

Summary

3 x Samtec LSHM Series Board to Board Connectors

Description

3 x Samtec LSHM Series Board to Board Connectors

Source title TE0706-02 Datasheet(PDF) - Trenz Electronic

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