TCS3200 OSRAM | Alldatasheet
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[v1-01] 2018-Mar-14 Document Feedback TCS3200 Programmable Color Light-to-Frequency Converter The TCS3200 programmable color light-to-frequency converter combines configurable silicon photodiodes and a current-to-frequency converter on a single monolithic CMOS integrated circuit. The output is a square wave (50% duty cycle) with frequency directly prop ortional to light intensity (irradiance). The full-scale output frequency can be scaled by one of three preset values via two control input pins. Digital inputs and digital output allow direct interface to a microcontroller or other logic circuitry. Output enable (OE ) places the output in the high-impedance state for multiple-unit sharing of a microcontroller input line. In the TCS3200, the light-to-frequency converter reads an 8 × 8 array of photodiodes. Sixteen photodiodes have blue filters, 16 photodiodes have green filters, 16 photodiodes have red filters, and 16 photodiodes are clear with no filters. The four types (colors) of photodiodes are interdigitated to minimize the effect of non-uniformity of incident irradiance. All photodiodes of the same color are connected in parallel. Pins S2 and S3 are used to select which group of photodiodes (red, green, blue, clear) are active. Photodiodes are 110μm × 110μm in size and are on 134μm centers. Ordering Information and Content Guide appear at end of datasheet. Key Benefits & Features The benefits and features of TCS3200 Programmable Color Light-to-Frequency Converter are listed below: Figure 1: Added Value of Using TCS3200 Benefits Features
- Enables High-Resolution Conversion of Light Intensity to Frequency • Programmable Color Light-to-Frequency Converter
- Disables the Output into a Hi-Impedance State when OE Input Pin is Low • Output Enable (OE) Pin
- Enables Output Range to be Optimized for a Variety of Low-Cost Measurement Techniques • Output Frequency Scaling
- Reduces Board Space Requirements while Simplifying Designs • Available in 5mm x 6.2mm SOIC (D) Package General Description
Document Feedback [v1-01] 2018-Mar-14 TCS3200 − General Description
- Programmable Color and Full-Scale Output Frequency
- Communicates Directly with a Microcontroller
- Single-Supply Operation (2.7V to 5.5V)
- Power Down Feature
- Nonlinearity Error Typically 0.2% at 50kHz
- Stable 200ppm/°C Temperature Coefficient
- Low-Profile Lead (Pb) Free and RoHS Compliant Surface-Mount Package Block Diagram The functional blocks of this device are shown below: Figure 2: TCS3200 Block Diagram Light Current-to-Frequency ConverterPhotodiode Array S2 S3 S0 S1 OE Output
[v1-01] 2018-Mar-14 Document Feedback TCS3200 − Pin Assignments The TCS3200 pin assignments are described below: Figure 3: Pin Diagram of TCS3200 Pin Assignments 8 S3 7 S2
6 OUT
5 VDD
(TOP VIEW) S0 1 S1 2 OE 3 GND 4 TCS3200
[v1-01] 2018-Mar-14 Document Feedback TCS3200 − Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only. Functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Figure 6: Absolute Maximum Ratings Over Operating Free-Air Temperature Range (unless otherwise noted) Note(s): 1. All voltages are with respect to GND. 2. Long-term storage or operation above 70°C could cause packag e yellowing that will lower the sensitivity to wavelengths < 500 nm. 3. The device may be hand soldered provided that heat is applied only to the solder pad and no contact is made between the tip of the solder iron and the device lead. The maximum time heat should be applied to the device is 5 seconds. Symbol Parameter Min Max Unit VDD Supply voltage (1) 6V VI Input voltage range, all inputs -0.3 VDD + 0.3 V TA Operating free-air temperature range (2) -40 85 °C TSTRG Storage temperature range (2) -40 85 V Solder conditions in accordance with JEDEC J−STD−020A, maximum temperature (3) 260 °C Absolute Maximum Ratings
[v1-01] 2018-Mar-14 Document Feedback TCS3200 − Electrical Characteristics Figure 9: Operating Characteristics at V DD = 5V, TA = 25°C, S0 = H, S1 = H (unless otherwise noted) (1), (2), (3), (4) Symbol Parameter Test Conditions Clear Photodiode S2 = H, S3 = L Blue Photodiode S2 = L, S3 = H Green Photodiode S2 = H, S3 = H Red Photodiode S2 = L, S3 = L Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max fO Output frequency (5) Ee = 47.2μW/cm2 λp = 470nm 12.5 15.6 18.7 61% 84% 22% 43% 0% 6% kHzEe = 40.4μW/cm2 λp = 524nm 12.5 15.6 18.7 8% 28% 57% 80% 9% 27% Ee = 34.6μW/cm2 λp = 640nm 13.1 16.4 19.7 5% 21% 0% 12% 84% 105% Re Irradiance responsivity (6) λp = 470nm 331 61% 84% 22% 43% 0% 6% Hz/ (μW/ cm2) λp = 524nm 386 8% 28% 57% 80% 9% 27% λp = 640nm 474 5% 21% 0% 12% 84% 105% Saturation irradiance (7) μW/ fD Dark frequency Ee = 0 21 0 21 0 21 0 21 0H z
Document Feedback [v1-01] 2018-Mar-14 TCS3200 − Electrical Characteristics Note(s): 1. Optical measurements are made using small-angle incident radiation from a light-emitting diode (LED) optical source. 2. The 470nm input irradiance is supp lied by an InGaN light-emitting diode with the following characteristics: peak wavelength λ p = 470nm, spectral halfwidth Δλ½ = 35nm, and luminous efficacy = 75lm/W. 3. The 524nm input irradiance is supp lied by an InGaN light-emitting diode with the following characteristics: peak wavelength λ p = 524nm, spectral halfwidth Δλ½ = 47nm, and luminous efficacy = 520lm/W. 4. The 640nm input irradiance is supp lied by a AlInGaP light-emitting diode with the following characteristics: peak wavelength λ p = 640nm, spectral halfwidth Δλ½ = 17nm, and luminous efficacy = 155lm/W. 5. Output frequency Blue, Green, Red percentage represents the ra tio of the respective color to the Clear channel absolute valu e. 6. Irradiance responsivity R e is characterized over the range from zero to 5kHz. 7. Saturation irradiance = (full-sc ale frequency)/(irradiance responsivity) for the Clear reference channel. 8. Nonlinearity is defined as the deviation of f O from a straight line between zero and full scale, expressed as a percent of full scale. Nonlinearity (8) fO = 0 to 500kHz ±0.5 ±0.5 ±0.5 ±0.5 Recovery from power down 100 100 100 100 μs Response time to output enable (OE 100 100 100 100 ns Symbol Parameter Test Conditions Clear Photodiode S2 = H, S3 = L Blue Photodiode S2 = L, S3 = H Green Photodiode S2 = H, S3 = H Red Photodiode S2 = L, S3 = L Unit Min Typ Max Min Typ Max Min Typ Max Min Typ Max
[v1-01] 2018-Mar-14 Document Feedback TCS3200 − Typical Operating Characteristics Figure 14: Photodiode Responsivity Temperature Coefficient vs. Wavelength Of Incident Light λ − Wavelength of Incident Light − nm Temperature Coefficient — ppm/deg C 600 650 700 750 800 850 900 950 1000
Document Feedback [v1-01] 2018-Mar-14 TCS3200 − Application Information Power Supply Considerations Power supply lines must be decoupled by a 0.01μF to 0.1μF capacitor with short leads mounted close to the device package. Input Interface A low-impedance electrical connection between the device OE pin and the device GND pin is required for improved noise immunity. All input pins must be either driven by a logic signal or connected to VDD or GND - they should not be left unconnected (floating). Output Interface The output of the device is desi gned to drive a standard TTL or CMOS logic input over short distances. If lines greater than 12 inches are used on the output, a buffer or line driver is recommended. A high state on Output Enable (OE) places the output in a high-impedance state for multiple-unit sharing of a microcontroller input line. Power Down Powering down the sensor using S0/S1 (L/L) will cause the output to be held in a high-imped ance state. This is similar to the behavior of the output enable pin, however powering down the sensor saves significantly more power than disabling the sensor with the output enable pin. Photodiode Type (Color) Selection The type of photodiode (blue, green, red, or clear) used by the device is controlled by two logic inputs, S2 and S3 (see Figure 5 ). Output Frequency Scaling Output-frequency scaling is c ontrolled by two logic inputs, S0 and S1. The internal light-to-frequency converter generates a fixed-pulsewidth pulse train. Scaling is accomplished by internally connecting the pulse-train output of the converter to a series of frequency divider s. Divided outputs are 50%-duty cycle square waves with relative frequency values of 100%, 20%, and 2%. Because division of the output frequency is accomplished by counting pulses of the principal internal frequency, the final-output period represents an average of the multiple periods of the principle frequency. The output-scaling counter registers are cleared upon the next pulse of the principal frequenc y after any transition of the S0, S1, S2, S3, and OE lines.
Application Information
[v1-01] 2018-Mar-14 Document Feedback TCS3200 − Application Information The output goes high upon the next subsequent pulse of the principal frequency, beginning a new valid period. This minimizes the time delay betwee n a change on the input lines and the resulting new output peri od. The response time to an input programming change or to an irradiance step change is one period of new frequency plus 1μs. The scaled output changes both the full-scale frequency and the dark frequency by the selected scale factor. The frequency-scaling function allows the output range to be optimized for a variety of measurement techniques. The scaled-down outputs may be used where only a slower frequency counter is available, such as low-cost microcontroller, or where period measurement techniques are used. Measuring the Frequency The choice of interface and measurement technique depends on the desired resolution an d data acquisition rate. For maximum data-acquisition rate, period-measurement techniques are used. Output data can be collected at a rate of twice the output frequency or one data point every microsecond for full-scale output. Period measurement requires the use of a fast reference clock with available resolution directly related to reference clock rate. Output scaling can be used to increase the resolution for a given clock rate or to maximize resolution as the light input changes. Period measurement is used to measure rapidly varying light levels or to make a very fast measurement of a constant light source. Maximum resolution and accuracy may be obtained using frequency-measurement, pulse-accumulation, or integration techniques. Frequency measurements provide the added benefit of averaging out random- or high-frequency variations (jitter) resulting from noise in the light signal. Resolution is limited mainly by available counter registers and allowable measurement time. Frequency measurement is well suited for slowly varying or constant light levels and for reading average light levels over short periods of time. Integration (the accumulation of pulses over a very long period of time) can be used to measure exposure, the amount of light present in an area over a given time period.
Document Feedback [v1-01] 2018-Mar-14 TCS3200 − Application Information PCB Pad Layout Suggested PCB pad layout guidelines for the D package are shown in Figure 15 . Figure 15: Suggested D Package PCB Layout Note(s): 1. All linear dimensio ns are in millimeters. 2. This drawing is subject to change without notice. 2.25 6.904.65 1.27 0.50
[v1-01] 2018-Mar-14 Document Feedback TCS3200 − Packaging Mechanical Data This SOIC package consists of an integrated circuit mounted on a lead frame and encapsulated with an electrically nonconductive clear plastic compound. The TCS3200 has an 8 × 8 array of photodiodes with a total size of 1mm by 1mm. The photodiodes are 110μm × 110μ m in size and are positioned on 134μm centers. Figure 16: Note(s): 1. All linear dimensions are in millimeters. 2. The center of the 1mm by 1mm photo-act ive area is referenced to the upper left corner tip of the lead frame (Pin 1). 3. Package is molded with an electrically nonconductive clea r plastic compound having an index of refraction of 1.55. 4. This drawing is subject to change without notice. Packaging Mechanical Data PACKAGE D PLASTIC SMALL-OUTLINE A 1.75 1.35 0.50 0.25 4.00 3.80 6.20 5.80 45/C0053
0.88 TYP TOP OF
5.00 4.80 5.3 MAX 1.27 0.41 0.25 0.10 0.25 0.19 DETAIL A PIN 1 6 /C0121 1.27 0.510 0.330 8 /C0121 /C0106 2.8 TYP CLEAR WINDOW 2.12 /C0043 0.250 3.00 /C0043 0.250 NOTE B Pb PIN 1 TOP VIEW BOTTOM VIEW SIDE VIEW END VIEW GreenRoHS
Document Feedback [v1-01] 2018-Mar-14 TCS3200 − Packaging Mechanical Data Figure 17: Package D Carrier Tape Note(s): 1. All linear dimensions are in millimeters [inches]. 2. The dimensions on this drawing are for illustrative purpos es only. Dimensions of an actual carrier may vary slightly. 3. Symbols on drawing A o, Bo, and K o are defined in ANSI EIA Standard 481-B 2001. 4. Each reel is 178 millimeters in diameter and contains 1000 parts. 5. ams packaging tape and reel conform to th e requirements of EIA Standard 481-B. 6. This drawing is subject to change without notice. 0.292 /C0043 0.013 [0.0115 /C0043 0.0005] 2.11 /C0043 0.10 [0.083 /C0043 0.004] 2 /C0043 0.05 [0.079 /C0043 0.002] 4 /C0043 0.1 [0.157 /C0043 0.004] 1.75 /C0043 0.10 [0.069 /C0043 0.004] 12 + 0.3 − 0.1 SIDE VIEW TOP VIEW END VIEW DETAIL B 5.50 /C0043 0.05 [0.217 /C0043 0.002] 8 /C0043 0.1 [0.315 /C0043 0.004] /C0106 1.50 B BAA 6.45 /C0043 0.10 [0.254 /C0043 0.004] 5.13 /C0043 0.10 [0.202 /C0043 0.004] DETAIL A Ao Bo Ko
Document Feedback [v1-01] 2018-Mar-14 TCS3200 − Manufacturing Information Moisture Sensitivity Optical characteristics of the device can be adversely affected during the soldering process by the release and vaporization of moisture that has been previous ly absorbed into the package. To ensure the package contains the smallest amount of absorbed moisture possible, each device is baked prior to being dry packed for shipping. Devices are dry packed in a sealed aluminized envelope called a moisture-barrier bag with silica gel to protect them from ambient moisture during shipping, handling, and storage before use. Shelf Life The calculated shelf life of the device in an unopened moisture barrier bag is 12 months from the date code on the bag when stored under the following conditions:
- Shelf Life: 12 months
- Ambient Temperature: < 40°C
- Relative Humidity: < 90% Rebaking of the devices will be required if the devices exceed the 12-month shelf li fe or the Humidity Indicator Card shows that the devices were exposed to conditions beyond the allowable moisture region. Floor Life The D package has been assigned a moisture sensitivity level of MSL 5a. As a result, the floor life of devices removed from the moisture barrier bag is 24 ho urs from the time the bag was opened, provided that the devices are stored under the following conditions:
- Floor Life: 24 hours
- Ambient Temperature: < 30°C
- Relative Humidity: < 60% If the floor life or the temperature/humidity conditions have been exceeded, the devices must be rebaked prior to solder reflow or dry packing. Rebaking Instructions When the shelf life or floor life limits have been exceeded, rebake at 60°C for 24 hours.
[v1-01] 2018-Mar-14 Document Feedback TCS3200 − Ordering & Contact Information Figure 20:
Ordering Information
Buy our products or get free samples online at: www.ams.com/ICdirect Technical Support is available at: www.ams.com/Technical-Support Provide feedback about this document at: www.ams.com/Document-Feedback For further information and requests, e-mail us at: ams_sales@ams.com For sales offices, distributors and representatives, please visit: www.ams.com/contact Headquarters ams AG Tobelbader Strasse 30
8141 Premstaetten
Austria, Europe Tel: +43 (0) 3136 500 0 Website: www.ams.com Ordering Code Device TA Package - Leads Package Designator TCS3200D-TR TCS3200 -40°C to 85°C SOIC - 8 D Ordering & Contact Information
Document Feedback [v1-01] 2018-Mar-14 TCS3200 − RoHS Compliant & ams Green Statement RoHS: The term RoHS compliant means that ams AG products fully comply with current RoHS directives. Our semiconductor products do not contain any chemicals for all 6 substance categories, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, RoHS compliant products are suitable for use in specif ied lead-free processes. ams Green (RoHS compliant and no Sb/Br): ams Green defines that in addition to RoHS compliance, our products are free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material). Important Information: The information provided in this statement represents ams AG knowledge and belief as of the date that it is provided. ams AG bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are unde rway to better integrate information from third parties. ams AG has taken and continues to take reasonable steps to prov ide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. ams AG and ams AG suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. RoHS Compliant & ams Green Statement
[v1-01] 2018-Mar-14 Document Feedback TCS3200 − Copyrights & Disclaimer Copyright ams AG, Tobelbader St rasse 30, 8141 Premstaetten, Austria-Europe. Trademarks Registered. All rights reserved. The material herein may not be reproduced, adapted, merged, translated, stored, or used with out the prior written consent of the copyright owner. Devices sold by ams AG are covered by the warranty and patent indemnification provisions appe aring in its General Terms of Trade. ams AG makes no warranty, express, statutory, implied, or by description regarding th e information set forth herein. ams AG reserves the right to ch ange specifications and prices at any time and without notice. Therefore, prior to designing this product into a system, it is necessary to check with ams AG for current information. This product is intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications , such as military, medical life-support or life-sustaining equipment are specifically not recommended without additional processing by ams AG for each application. This product is provided by ams AG “AS IS” and any express or implied wa rranties, including, but not limited to the implied warranties of merchantability and fitness for a particular purpose are disclaimed. ams AG shall not be liable to recipient or any third party for any damages, including but not limited to personal injury, property damage, loss of profits, loss of use, interruption of business or indirect, special, incidental or consequential damages, of any kind, in connection with or arising out of the furnishing, performance or use of the technical data herein. No obligation or liability to recipient or any th ird party shall arise or flow out of ams AG rendering of technical or other services. Copyrights & Disclaimer
Document Feedback [v1-01] 2018-Mar-14 TCS3200 − Document Status Document Status Product Status Definition Product Preview Pre-Development Information in this datasheet is based on product ideas in the planning phase of development. All specifications are design goals without any warranty and are subject to change without notice Preliminary Datasheet Pre-Production Information in this datasheet is based on products in the design, validation or qualification phase of development. The performance and parameters shown in this document are preliminary without any warranty and are subject to change without notice Datasheet Production Information in this datasheet is based on products in ramp-up to full production or full production which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade Datasheet (discontinued) Discontinued Information in this datasheet is based on products which conform to specifications in accordance with the terms of ams AG standard warranty as given in the General Terms of Trade, but these products have been superseded and should not be used for new designs Document Status
[v1-01] 2018-Mar-14 Document Feedback TCS3200 − Revision Information Note(s): 1. Page and figure numbers for the previous version may diff er from page and figure numbers in the current revision. 2. Correction of typographical er rors is not explicitly mentioned. Changes from 1-00 (2016-Jul-13) to current revision 1-01 (2018-Mar-14) Page Removed all instances of TCS3210 Revision Information
Document Feedback [v1-01] 2018-Mar-14 TCS3200 − Content Guide
1 General Description
1 Key Benefits & Features
2 Block Diagram
3 Pin Assignments
5A b s o l u t e M a x i m u m R a t i n g s