TCS30DLU

TCS30DLU TOSHIBA | Alldatasheet

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CMOS Digital Integrated Circuits Silicon Monolithic TCS30DLUTCS30DLUTCS30DLUTCS30DLU Start of commercial production 2017-06 1. 1. 1. 1. Functional DescriptionFunctional DescriptionFunctional DescriptionFunctional Description

• Digital-Output Magnetic Sensor 2. 2. 2. 2. FeaturesFeaturesFeaturesFeatures (1) Output configuration: Open-drain (2) Pole detected: South or north pole 3. 3. 3. 3. PackagingPackagingPackagingPackaging UFV 4. 4. 4. 4. Marking and Pin AssignmentMarking and Pin AssignmentMarking and Pin AssignmentMarking and Pin Assignment MarkingMarkingMarkingMarking Pin Assignment (top view)Pin Assignment (top view)Pin Assignment (top view)Pin Assignment (top view) Note 1: A 0.47 µF capacitor should be connected near the device. However, this does not guarantee proper operation. Evaluate the performance of an actual application to determine circuit conditions. 5. 5. 5. 5. Function TableFunction TableFunction TableFunction Table Magnetic Flux Density ≥ BON ≤ BOFF Output L Z (Note 1) Note 1: In the high-impedance state 2017-07-12 Rev.1.0 ©2017 Toshiba Electronic Devices & Storage Corporation

1. 6. 6. 6. Absolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, TAbsolute Maximum Ratings (Note) (Unless otherwise specified, Taaaa = 25 = 25 = 25 = 25  )))) Characteristics Supply voltage Output voltage Output diode current Output current VCC/GND current Power dissipation Storage temperature Symbol VCC VOUT IOK IOUT ICC PD Tstg Rating -0.5 to 6.0 -0.5 to 6.0 -10 ±10 200 -65 to 150 Unit V V mA mA mA mW Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). 7. 7. 7. 7. Operating RangeOperating RangeOperating RangeOperating Range Characteristics Supply voltage Output voltage Output current Operating temperature Symbol VCC VOUT IOL Topr Note (Note 1) Rating 2.3 to 3.6 0 to 5.5 1.0 -40 to 85 Unit V V mA Note 1: When VCC = 0 V or when the output is in the high-impedance state 2017-07-12 Rev.1.0 ©2017 Toshiba Electronic Devices & Storage Corporation

1. 8. 8. 8. Electrical CharacteristicsElectrical CharacteristicsElectrical CharacteristicsElectrical Characteristics Characteristics Low-level output voltage Output leakage current Average current (intermittent) Operating current (intermittent) Operating frequency Symbol VOL ILEAK ICC(AVE) ICC(ON) fopr Note (Note 1) (Note 1) Test Condition IOL = 1.0 mA VOUT = 5.5 V See Fig. 8.1.1. See Fig. 8.1.1. See Fig. 8.1.1. VCC (V) 2.3 to 3.6 2.3 to 2.7 3.0 to 3.6 2.3 to 3.6 2.3 to 3.6 Min Typ. 0.5 8.5 12.4 0.7 Max VCC × 10 % 13.2 18.3 1.3 Unit V µA µA mA Hz Note 1: The supply current is pulsed periodically by internal circuitry. 2017-07-12 Rev.1.0 ©2017 Toshiba Electronic Devices & Storage Corporation

South pole operating magnetic flux density North pole operating magnetic flux density South pole operating magnetic flux density North pole operating magnetic flux density Hysteresis magnetic flux density Symbol BONS BONN BOFFS BOFFN BH Note (Note 1) Test Condition VOUT = VOL VOUT = Z |BON - BOFF| VCC (V) 2.3 to 3.6 2.3 to 3.6 2.3 to 3.6 Min -2.5 0.3 Typ. 1.8 -1.8 0.8 -0.8 1.0 Max 2.5 -0.3 Unit mT mT mT Note: Uniform magnetic field perpendicular to the magnetic sensor. Note 1: In the high-impedance state 9. 9. 9. 9. Magnetic Detector Layout (Note) Magnetic Detector Layout (Note) Magnetic Detector Layout (Note) Magnetic Detector Layout (Note) Note: Dimensional tolerances are ±0.1 mm, unless otherwise specified. 2017-07-12 Rev.1.0 ©2017 Toshiba Electronic Devices & Storage Corporation

Package DimensionsPackage DimensionsPackage DimensionsPackage Dimensions Unit: mm Weight: 7.0 mg (typ.) Package Name(s) Nickname: UFV 2017-07-12 Rev.1.0 ©2017 Toshiba Electronic Devices & Storage Corporation

RESTRICTIONS ON PRODUCT USERESTRICTIONS ON PRODUCT USERESTRICTIONS ON PRODUCT USERESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product".

• TOSHIBA reserves the right to make changes to the information in this document and related Product without notice.
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• Though TOSHIBA works continually to improve Product's quality and reliability, Product can malfunction or fail. Customers are responsible for complying with safety standards and for providing adequate designs and safeguards for their hardware, software and systems which minimize risk and avoid situations in which a malfunction or failure of Product could cause loss of human life, bodily injury or damage to property, including data loss or corruption. Before customers use the Product, create designs including the Product, or incorporate the Product into their own applications, customers must also refer to and comply with (a) the latest versions of all relevant TOSHIBA information, including without limitation, this document, the specifications, the data sheets and application notes for Product and the precautions and conditions set forth in the "TOSHIBA Semiconductor Reliability Handbook" and (b) the instructions for the application with which the Product will be used with or for. Customers are solely responsible for all aspects of their own product design or applications, including but not limited to (a) determining the appropriateness of the use of this Product in such design or applications; (b) evaluating and determining the applicability of any information contained in this document, or in charts, diagrams, programs, algorithms, sample application circuits, or any other referenced documents; and (c) validating all operating parameters for such designs and applications. TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.TOSHIBA ASSUMES NO LIABILITY FOR CUSTOMERS' PRODUCT DESIGN OR APPLICATIONS.
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• Please contact your TOSHIBA sales representative for details as to environmental matters such as the RoHS compatibility of Product. Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS.AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. 2017-07-12 Rev.1.0 ©2017 Toshiba Electronic Devices & Storage Corporation