TCMT1100 ISOCOM | Alldatasheet

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Technical content

DESCRIPTION

The IS3H7 series optocoupler consists of an infrared emitting diode optically coupled to an NPN silicon photo transistor. This device belongs to Isocom Compact Range of Optocouplers.

FEATURES

  • Half Pitch 1.27mm
  • High AC Isolation voltage 3750VRMS
  • CTR Selections Available
  • Wide Operating Temperature Range -55°C to 110°C
  • Pb Free and RoHS Compliant
  • UL Approval E91231, Model THP

APPLICATIONS

  • Switching Mode Power Supply
  • Industrial System Controllers
  • Measuring Instruments
  • Signal Transmission between Systems of Different Potentials and Impedances ORDER INFORMATION
  • Available in Tape and Reel with 1000pcs per reel ISOCOM COMPONENTS 2004 LTD Unit 25B, Park View Road West, Park View Industrial Estate Hartlepool, Cleveland, TS25 1UD, United Kingdom Tel: +44 (0)1429 863 609 Fax : +44 (0)1429 863 581 e-mail: sales@isocom.co.uk http://www.isocom.com ISOCOM COMPONENTS ASIA LTD Hong Kong Office, Block A, 8/F, Wah Hing Industrial mansion, 36 Tai Yau Street, San Po Kong, Kowloon, Hong Kong. Tel: +852 2995 9217 Fax : +852 8161 6292 e-mail: sales@isocom.com.hk All dimensions in mm. ABSOLUTE MAXIMUM RATINGS (TA = 25°C) Input Diode Forward Current 50mA Reverse Voltage Power dissipation 70mW Output Transistor Collector to Emitter Voltage BVCEO 80V Emitter to Collector Voltage BVECO 7V Collector Current 50mA Power Dissipation 150mW Total Package Isolation Voltage 3750V RMS Total Power Dissipation 200mW Operating Temperature -55 to 110 °C Storage Temperature -55 to 125 °C Lead Soldering Temperature (10s) 260°C

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) INPUT OUTPUT Parameter Symbol Test Condition Min Typ. Max Unit Forward Voltage V F IF = 20mA 1.2 1.4 V Input Capacitance C IN V F = 0V, f = 1KHz 30 250 pF Reverse Current IR VR = 4V 10 μA Parameter Symbol Test Condition Min Max Unit Collector-Emitter breakdown Voltage BVCEO IC = 0.1mA, IF = 0mA 80 V Emitter-Collector breakdown Voltage BV ECO I E = 0.1mA, IF = 0mA 7 V Collector-Emitter Dark Current I CEO V CE = 20V, IF = 0mA 100 nA Typ.

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise specified) COUPLED Note 1 : Measured with input leads shorted together and output leads shorted together, R.H 40% to 60% Parameter Symbol Test Condition Min Typ. Max Unit Current transfer ratio CTR I F = 5mA, VCE = 5V % IS3H& 50 600 IS3H&A 80 160 IS3H&B 130 260 IS3H&C 200 400 IS3H&D 300 600 IS3H&E 100 200 IS3H&F 150 300 IF = 10mA, VCE = 5V IS3H&H 40 80 IS3H&I 63 125 IS3H&J 100 200 IS3H&K 160 320 IS3H&GR 100 300 IS3H&GB 100 600 Collector-Emitter Saturation Voltage VCE(sat) I F = 10mA, IC = 1mA 0.1 0.2 V Input to Output Isolation Voltage V ISO See note 1 3750 V RMS Input to Output Isolation Resistance R ISO V IO= 500V See note 1 5x1010 Ω Floating Capacitance C f V F = 0V, f = 1MHz 0.3 pF Output Rise Time t r V CE = 2V, Ic = 2mA, RL = 100Ω 6 18 µs Output Fall Time tf V CE = 2V, Ic = 2mA, RL = 100Ω 6 18 µs

Fig 1 Forward Current vs Ambient Temperature Fig 2 Collector Power Dissipation vs TA Fig 3 Forward Current vs Forward Voltage Fig 4 Normalized Collector Current vs Forward Current Fig 5 Collector Current vs Collector-Emitter Voltage (1) Fig 6 Collector Current vs Collector-Emitter Voltage (2)

Fig 7 Normalized Collector Current vs Ambient Temperature Fig 8 Normalized CTR vs Ambient Temperature Fig 9 Collector-Emitter Voltage vs Ambient Temperature Fig 10 Switching Time vs Load Resistance Switching Time Test Circuit

THP_ denotes Device Part Number where “_” denoted CTR Grade I denotes Isocom Y denotes 1 digit Year code WW denotes 2 digit Week code THP_ IYWW IS3H& After PN PN Description Packing quantity None IS3H& Surface Mount Tape & Reel 1000 pcs per reel Any CTR Grade IS3H&A, IS3H&B, IS3H&C, IS3H&D, IS3H&E, IS3H&F, IS3H&H, IS3H&I, IS3H&J, IS3H&K, IS3H&GR, IS3H&GB Surface Mount Tape & Reel 1000 pcs per reel

PACKAGE DIMENSIONS (mm) RECOMMENDED SOLDER PAD LAYOUT (mm)

IR REFLOW SOLDERING TEMPERATURE PROFILE (One Time Reflow Soldering is Recommended) Profile Details Conditions Preheat - Min Temperature (TSMIN) - Max Temperature (TSMAX) - Time TSMIN to TSMAX (ts) 150°C 200°C 60s ̶ 120s Soldering Zone - Peak Temperature (T - Liquidous Temperature (TL) - Time within 5°C of Actual Peak Temperature (TP ̶ 5°C) - Time maintained above TL (tL) - Ramp Up Rate (TL to TP) - Ramp Down Rate (TP to TL) 260°C 217°C 30s 60s ̶ 100s 3°C/s max 6°C/s max Average Ramp Up Rate (T smax to TP) 3°C/s max Time 25°C to Peak Temperature 8 minutes max TIME (s) TEMP (°C) 25°C ts Preheat 60s – 120s Tsmin Tsmax 260°C TL 217°C Time 25°C to Peak Temperature tP TP - 5°C TP Max Ramp Up Rate 3°C/s Max Ramp Down Rate 6°C/s tL 200°C 150°C

Notes: - Isocom is continually improving the quality, reliability, function or design and Isocom reserves the right to make changes without further notices. - The products shown in this publication are designed for the general use in electronic applications such as office automation equipment, communications devices, audio/visual equipment, electrical application and instrumentation. - For equipment/application where high reliability or safety is required, such as space applica- tions, nuclear power control equipment, medical equipment, etc., please contact our sales representatives. - When requiring a device for any ”specific” application, please contact our sales for advice. - The contents described herein are subject to change without prior notice. - Do not immerse device body in solder paste.