TCL

TCL EXXELIA | Alldatasheet

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Technical content

59www.exxelia.com General characteristics HIGH VOLTAGE Page revised 02/2 1 HOW TO ORDER TCL 1 82 W F 680pF 10% 4,000 V B Series Dielectric code Exxelia size code RoHS compliant Quality level Capacitance Tolerance Rated voltage Reliability level TCL = Varnished radial leaded capacitor 1 = NPO 2 = X7R 4 = C4xx - = No RoHS W = RoHS compliant - = standard quality level F = Hi-Rel quality: screening in accordance with Exxelia specifi cation Capacitance value in clear NPO dielectric: ±1% ±2% ±5% ±10% ±20% C4xx dielectric: ±2% ±5% ±10% ±20% X7R dielectric: ±10% ±20% 200 V 500 V 1,000 V 1,500 V 2,000 V 3,000 V 4,000 V 5,000 V 7 ,500 V 10,000 V Intermediary and higher voltages avai lable: contact your sales representative. For F parts only. Acc. to Exxelia spec. See page 15

FEATURES

• Multilayer chip ceramic capacitors
• NPO, C4xx and X7R dielectrics
• Capacitance range: 10pf to 39 µF
• Voltage range: 200 V DC to 10,000 V DC PHYSICAL CHARACTERISTICS CONSTRUCTION Varnished radial leaded chip capacitors for through-hole circuits. Models suited to applications for reduced size is required with minimum exposure to external constraint, or to assemblies potted by the user. MARKING Series, capacitance value, tolerance, rated voltage clear, date code. High Voltage Varnished Leaded Capacitors TCL Series ELECTRICAL SPECIFICATIONS DIELECTRIC NPO C4xx X7R Dielectric code 1 4 2 Maximum ∆C/°C over temperature range without voltage NA NA ±15% Temperature coeffi cient (0±30) ppm/°C (–2,200±500) ppm/°C NA Aging None None ≤ 2.5% per decade hour Operating temperature –55°C to +125°C Rated voltage (U RC ) 200 V DC to 10,000 V DC

200 V DC to

5,000 V DC 10,000 V DC Dielectric withstanding voltage 2.5 U RC for U RC ≤ 500 V DC

1.6 U RC for U RC ≥ 1,000 V DC

Extended range:

2 U RC for U RC ≤ 500 V DC

1.3 U RC for U RC ≥ 1,000 V DC

2.5 U RC for U RC = 200 V DC

2 U RC for U RC = 500 V DC

1.5 U RC for U RC = 1,000 V DC

1.4 U RC for U RC > 1,000 V DC

Extended range:

1.5 U RC for U RC ≤ 500 V DC

1.2 U RC for U RC ≥ 1,000 V DC

1.2 U RC for U RC > 1,000 V DC

Extended range: Capacitance at 1MHz for C ≤ 1,000pf at 1kHz for C > 1,000pf at 1kHz at 1kHz Dissipation factor ≤ 0.015 (150/C + 7)% at 1MHz for C ≤ 50pf ≤ 0.10% at 1kHz ≤ 2.5% at 1kHz≤ 0.15% at 1MHz for 50pf < C ≤ 1,000pf ≤ 0.15% at 1kHz for C > 1,000pf Insulation resistance at 25°C under U RC for U RC ≤ 500 V under 500 V DC for U RC > 500 V ≥ 100,000 MΩ for C ≤ 10nf ≥ 1,000 MΩ. µF for C > 10nf ≥ 20,000 MΩ for C ≤ 25nf ≥ 500 MΩ. µF for C > 25nf

60www.exxelia.com Taping : dimensions Page revised 02/2 1 TCL Series High Voltage Varnished Leaded Capacitors DIMENSIONS in inches (mm) STANDARD RATINGS Exxelia size code 79 90 80 91 81 82 Dimensions inches (mm) L max. 0.237 (6) 0.237 (6) 0.276 (7) 0.276 (7) 0.355 (9) 0.394 (10) W max. 0.197 (5) 0.296 (7 .5) 0.276 (7) 0.296 (7 .5) 0.296 (7 .5) 0.394 (10) 0.2kV up to 3kV: 0.158 (4) 4kV-5kV: 0.197 (5) 0.2kV up to 3kV: 0.158 (4) 4kV: 0.197 (5) 5kV: 0.237 (6) 0.2kV up to 3kV: 0.158 (4) 4kV: 0.197 (5) 5kV: 0.237 (6) Ø ± 10% 0.024 (0.6) 0.024 (0.6) 0.024 (0.6) 0.024 (0.6) 0.031 (0.8) 0.031 (0.8) X 0.2 ± 0.020 (5.08 ± 0.5) 0.2 ± 0.020 (5.08 ± 0.5) 0.2 ± 0.020 (5.08 ± 0.5) 0.2 ± 0.020 (5.08 ± 0.5) 0.3 ± 0.020 (7 .62 ± 0.5) 0.4 ± 0.020 (10.16 ± 0.5) Dielectric NPO C4xx X7R NPO C4xx X7R NPO C4xx X7R NPO C4xx X7R NPO C4xx X7R NPO C4xx X7R Exxelia ceramic code 142142142142142142 Min. Capacitance value 10pF 27pF 100pF 10pF 33pF 150pF 10pF 33pF 150pF 15pF 47pF 150pF 18pF 56pF 150pF 33pF 82pF 330pF Rated voltage (U RC ) 0.2kV Standard 5.6nF 120nF 220nF 12nF 220nF 470nF 12nF 220nF 390nF 15nF 330nF 560nF 18nF 390nF 820nF 33nF 680nF 1.5 µF Extended 18nF - 470nF 27nF - - 22nF - 1 µF 39nF - - 56nF - 1.8 µF 100nF - 2.7 µF 0.5kV Extended 10nF 39nF 150nF 18nF 68nF - 18nF 68nF 270nF 22nF 100nF - 27nF 120nF 560nF 68nF 220nF 1 µF 1kV Extended 5.6nF 10nF 27nF 8.2nF 15nF - 6.8nF 15nF 56nF 10nF 22nF - 12nF 27nF 120nF 33nF 56nF 220nF 1.5kV 2kV 3kV 4kV 5kV Standard - - - - - - 100pF 560pF 820pF 150pF 820pF 1nF 270pF 1nF 1.8nF 470pF 2.2nF 3.3nF L1 T1 (≥12) ≥0.472 W 1 X Ø L T W Ø (≥12) ≥ 0.472 X TCL Series TCK Series

61www.exxelia.com General characteristics HIGH VOLTAGE Page revised 02/2 1 STANDARD RATINGS Exxelia size code 83 84 89 85 87 88 Dimensions inches (mm) L max. 0.473 (12) 0.63 (16) 0.642 (16.3) 0.729 (18.5) 1.182 (30) 1.674 (42.5) W max. 0.493 (12.5) 0.493 (12.5) 0.6 19 (15.7) 0.689 (17 .5) 0.886 (22.5) 0.827 (2 1) T max. 0.2kV up to 3kV: 0.158 (4) 4kV: 0.197 (5) 5kV up to 10kV: 0.237 (6) 0.2kV up to 3kV: 0.158 (4) 4kV: 0.197 (5) 5kV up to 10kV: 0.237 (6) 0.2kV up to 3kV: 0.158 (4) 4kV: 0.197 (5) 5kV up to 10kV: 0.237 (6) 0.2kV up to 3kV: 0.158 (4) 4kV: 0.197 (5) 5kV up to 10kV: 0.237 (6) 0.2kV up to 3kV: 0.158 (4) 4kV: 0.197 (5) 5kV: 0.237 (6) 7 .5kV up to 10kV: 0.256 (6.5) 0.2kV up to 3kV: 0.158 (4) 4kV: 0.197 (5) 5kV: 0.237 (6) 7 .5kV up to 10kV: 0.256 (6.5) Ø ± 10% 0.031 (0.8) 0.039 (1) 0.039 (1) 0.039 (1) 0.039 (1) 0.039 (1) X 0.5 ± 0.020 (12.7 ± 0.5) 0.6 ± 0.020 (15.24 ± 0.5) 0.6 ± 0.020 (15.24 ± 0.5) 0.7 ± 0.020 (17 .8 ± 0.5) 1.1 ± 0.020 (27 .94 ± 0.5) 1.6 ± 0.020 (40.64 ± 0.5) Dielectric NPO C4xx X7R NPO C4xx X7R NPO C4xx X7R NPO C4xx X7R NPO C4xx X7R NPO C4xx X7R Exxelia ceramic code 1 4 2 1 4 2 1 4 2 1 4 2 1 4 2 1 4 2 Min. Capacitance value 10pF 180pF 270pF 22pF 270pF 390pF 27pF 390pF 560pF 47pF 470pF 1nF 120pF 1nF 2.2nF 150pF 1.8nF 2.7nF Rated voltage (U RC ) 0.2kV Extended 180nF - 5.6 µF 270nF - 6.8 µF 220nF - 8.2 µF 560nF - 12 µF1 µF- 33 µF 1.2 µF- 39 µF 0.5kV 1kV Standard 15nF 82nF 150nF 22nF 82nF 220nF 33nF 120nF 270nF 39nF 220nF 390nF 82nF 560nF 1 µF 150nF 680nF 1.2 µF Extended 47nF 120nF 390nF 68nF 120nF 560nF 82nF 220nF 560nF 120nF 330nF 1 µF 270nF 680nF 2.7 µF 470nF 1 µF 3.3 µF 1.5kV Standard 8.2nF 39nF 82nF 12nF 39nF 100nF 15nF 68nF 150nF 22nF 100nF 180nF 47nF 220nF 470nF 68nF 330nF 560nF Extended 18nF 56nF 180nF 22nF 56nF 220nF 33nF 100nF 330nF 47nF 150nF 470nF 100nF 330nF 1.2 µF 150nF 470nF 1.5 µF 2kV Standard 4.7nF 18nF 33nF 6.8nF 22nF 68nF 8.2nF 39nF 68nF 12nF 56nF 100nF 27nF 120nF 220nF 39nF 180nF 330nF Extended 10nF 27nF 100nF 15nF 33nF 150nF 18nF 56nF 150nF 27nF 82nF 220nF 56nF 180nF 560nF 82nF 270nF 820nF 3kV Extended 3.3nF 12nF 39nF 5.6nF 15nF 56nF 10nF 22nF 68nF 10nF 39nF 100nF 27nF 82nF 270nF 33nF 100nF 330nF 4kV Extended 2.7nF 10nF 18nF 4.7nF 10nF 27nF 6.8nF 18nF 39nF 8.2nF 27nF 47nF 22nF 56nF 120nF 27nF 82nF 150nF 5kV 7 .5kV 10kV Available capacitance values: NPO, C4xx dielectrics: E6, E12, E24 (see page 14). Specific values upon request. X7R dielectric: E6, E12 in standard (see page 14). Specific values upon request. The above table defines the standard products, other components may be built upon request. High Voltage Varnished Leaded Capacitors TCL Series

46www.exxelia.com Taping : dimensions Page revised 02/2 1 High voltage multilayer ceramic capacitors designed by EXXELIA are adapt- ed to applications in electronics such as high voltage power supplies and high circuits. Their multilayer construction offers significant size and space sav- ing advantages. They are available in class 1 (NPO), class 2 (X7R) and C4xx (–2,200 ppm/°C) dielectrics versions complying with the main requirements of applicable standards. They are suited for use in commercial, industrial and High-Rel military and space circuits. As standard products can’t meet all the specificities of all applications, special applications may require specific features (higher voltage, burn-in, dimensions, coating, leading, marking…) not described in this catalogue. Based on our state-of-the-art technologies and our expertise, our Engineers may study at your request all special components to meet your application. Please, consult us for more information. NPO/COG DIELECTRICS (CLASS 1) Made of titanium oxide and other various selected oxides, they feature unique stability of all parameters under such constraints as operating time, tempera- ture, voltage applied. For example, the quality factor remains very high over an extremely wide frequency range. As example, loss angle tangent value at 1MHz is typically in the order of 3.10 -4 . These characteristics make them compatible with steep-edge impulse mode without noticeable temperature rise. The differ- ent parameters and related variations are illustrated in figures below: NPO: RELATIVE CAPACITANCE CHANGE VS TEMPERATURE –0,4 –55 –35 –15 5 25 45 65 85 105 125 –0.3 –0.2 –0.1 0.1 0.2 0.3 0.4 ∆C/C (%) V (°C) Nominal Limit General Information 10 3 10 2 510 25 10 2 25 10 3 25 10 4 25 10 5 10 62 C R (pF) F R (MHz) Chips Molded 10 4 10 3 10 2 –5 5– 40 02 08 51 25 15 5 IR (G/uni03A9) (°C) 0,1 –5 5– 40 02 08 51 25 15 5 10 0 Tg d (x10 –4 ) (°C)V 10 3 10 2 10 310 2 10 4 10 710 5 10 6 N (kHz) 10 4 10 nF 10 0 nF 1 nF 10 0 pF 10 pF Z (m/uni03A9) NPO: IMPEDANCE VS FREQUENCY NPO: INSULATION RESISTANCE VS TEMPERATURE NPO: LOSS TANGENT VS TEMPERATURE NPO, X7R, C4xx: SELF-RESONANCE FREQUENCE VS CAPACITANCE

47www.exxelia.com General characteristics HIGH VOLTAGE Page revised 02/2 1 X7R DIELECTRICS (CLASS 2) They are mainly made of barium titanate modified by various oxides to achieve the electrical properties required. A specific ceramic dielectric is used to achieve an excellent dielectric strength. High dielectric constant enables to achieve high capacitance values. For optimum use, the specific properties of barium titanate in function of the different parameters must be taken into account. See the variations illustrated in figures below: –20 –10 –40 –30 +30 +20 +10 –5 5– 40 02 08 51 25 15 5 (°C) ∆C/C (%) 11 0 210 10 355 22 255 –10 + 5 N (kHz) ∆C/C (%) –80 0 20 40 60 80 100 –60 –40 –20 ∆C/C (%) Percentage of rated voltage (%) Standard range Extended range General Information X7R: CAPACITANCE CHANGE VS TEMPERATURE X7R: CAPACITANCE CHANGE VS FREQUENCY CHANGE VS PERCENTAGE OF RATED VOLTAGE APPLIED 10 3 10 2 –5 5– 40 02 08 51 25 15 5 IR (G/uni03A9) (°C) X7R: INSULATION RESISTANCE VS TEMPERATURE

48www.exxelia.com Taping : dimensions Page revised 02/2 1 10 0 20 0 50 0 –5 5– 40 0 20 85 12 51 55 Tg d (x10 –4 ) V (°C) 10 0 20 0 50 0 11 0 210 10 355 22 255 N (kHz) Tg d (x10 –4 ) X7R: LOSS TANGENT CHANGE VS TEMPERATURE X7R: LOSS TANGENT CHANGE VS FREQUENCY These typical curves are examples of admissible currents for one family of chip capacitors (size 3333). For other curves and products or for further informa- tion, please contact us. Note: for the calculations, we have considered that the terminations are directly connected to an in- finite heat sink. In other words, the thermal resistance of the circuit itself which depends on its type and design has not been taken into account. Moreover, the ambient temperature taken is 25°C. The ESR (Equivalent Serial Resistance) typical curves are given, here for SMD (chip) capacitors. Regarding the curves for the leaded capacitors, they are rath- er the same. Indeed, due to the resistivity of the raw material used and the wire diameters, the resistance of the wires is much lower than the ESR of the chips. So, in a first approach, their influence can be considered as negligible. 0.01 0.01 0.1 1 10 100 0.1 100 IRMS (A) Frequency (MHz) 10nF 3.3nF 1nF 10nF 0.1nF 33nF 0.01 0.01 0.1 1 10 100 0.1 100 1000 10000 ESR (/uni03A9) Frequency (MHz) 0.33nF 1nF 3.3nF 10nF 33nF 0.1nF X7R: MAXIMUM ADMISSIBLE CURRENT VS FREQUENCY X7R: ESR VS FREQUENCY General Information

49www.exxelia.com General characteristics HIGH VOLTAGE Page revised 11/22 C4xx DIELECTRIC This ceramic is a negative temperature coefficient dielectric (–2,200 ppm/°C). Its advantage is that it combines the high dielectric constant of an X7R dielectric with the stability of an NPO dielectric. As the C4xx ceramic features low dissi- pation factor it is recommended for AC line filtering from 110 Vrms to 230 Vrms, 20 to 400 Hz, for high power RF at high voltage up to 5,000 V and for pulse ap- plications. C4xx: TEMPERATURE COEFFICIENT C4xx: VOLTAGE COEFFICIENT COMPARISON OF CAPACITANCE VALUE UNDER RATED VOLTAGE AT 125°C COMPARISON OF SELF-HEATING AT 400 Hz BETWEEN C4xx AND X7R DIELECTRICS –30 –55 –35 –15 5 25 45 65 85 105 125 –25 –20 –15 –10 ∆C/C (%) V (°C) Nominal Limit Temperature (°C) Voltage Un 2 Un 3 Un X7R C4xx ∆C/C (%) –16 0 20 40 60 80 100 –14 –12 –10 Percentage of rated voltage (%) Standard Extended General Information 0.1 100 1000 Capacitance value (in nF) Size 1812 Size 4040 Size 16080 NPO C4xx X7R NPO NPO C4xx C4xx X7R X7R

50www.exxelia.com Taping : dimensions Page revised 02/2 1 DIMENSIONS in inches (mm) Exxelia size code Lead shape C max inches (mm) Leads per side d inches (mm) b inches (mm) C 1 inches (mm) W 1 inches (mm) I 1 inches (mm) I 2 inches (mm) I 3 inches (mm) * For PL and PLS, add 0.098 in (2.5 mm) to d and I2 and 0.197 in (5 mm) to C1. bd T 0.01 2 max. (0.3 max.) 0.059±0.01 2 (1.5±0.3) 0.098±0.02 (2.5±0.5) T 0.1 (2.54) 0.02 (0.5) 0.01 2 max. (0.3 max.) 0.098±0.02 (2.5±0.5) C R d T 0.02 (0.5) 0.01 2 max. (0.3 max.) 0.059±0.01 2 (1.5 ±0.3 )P* Model R Model L Model d d d I2 W1W1W1 0.1 (2.54) 0.1 (2.54) 0.1 (2.54) RECOMMENDED FOOTPRINTS General Information

8www.exxelia.com Page revised 02/2 1 Taping : dimensions MLCC STRUCTURE Terminations Ceramic Tin Tin / Lead Gold (Solderable layer) Electrodes Margins Silver or Silver / Palladium (electrodes contact layer) Polymer (crack protection layer) Nickel or Copper barrier (leaching protection layer) EQUIVALENT CIRCUIT Capacitor is a complex component combining resistive, inductive and capaci- tive phenomena. A simplifi ed schematic for the equivalent circuit is: Ls Rs C IR DIELECTRIC CHARACTERISTICS Insulation Resistance (IR) is the resistance measured under DC voltage across the terminals of the capacitor and consists principally of the parallel resistance shown in the equivalent circuit. As capacitance values and hence the area of dielectric increases, the IR decreases and hence the product (C x IR) is often specifi ed in Ω.F or MΩ. µF. The Equivalent Series Resistance (ESR) is the sum of the resistive terms which generate heating when capacitor is used under AC voltage at a given frequency (f). Dissipation factor (DF) is the ration of the apparent power input will turn to heat in the capacitor: DF = 2π f C ESR When a capacitor works under AC voltage, heat power loss (P), expressed in Watt, is equal to: P = 2π f C Vrms 2 DF The series inductance (Ls) is due to the currents running through the elec- trodes. It can distort the operation of the capacitor at high frequency where the impedance (Z) is given as: Z = Rs + j (Ls.q - 1⁄(C.q)) with q = 2πf When frequency rises, the capacitive component of capacitors is gradually canceled up to the resonance frequency, where : Z = Rs and LsC.q 2 = 1 Above this frequency the capacitor behaves like an inductor. P100 NPO N2200 (C4xx) BX 2C1 X7R Dielectric material Porcelain Magnesium titanate or Neodynium baryum titanate Barium zirconate titanate Baryum titanate (BaTiO 3 ) Dielectric constant 15 – 18 20 – 85 450 2,000 – 5,000 Electrode technology PME (Precious Metal Electrodes): Ag/Pd Capacitance variation between –55°C and +125/°C without DC voltage (100±30)ppm/°C (0±30)ppm/°C (–2,200±500) Capacitance variation between –55°C and +125/°C with DC rated voltage 0 -15% 15% –25% 20% –30% Not applicable Piezo-electric effect None None Yes Dielectric absorption None Few % Few % Thermal shock sensitive + + ++ Ceramic Capacitors Technology

9www.exxelia.com Page revised 02/2 1 General characteristics GENERAL INFORMATION Ceramic Capacitors Technology MANUFACTURING STEPS SLIP CASTING ELECTRODE SCREEN PRINTING STACKING A slurry, a mix of ceramic powder, binder and solvents, is poured onto conveyor belt inside a drying oven, resulting in a dry ceramic sheet. The electrode ink, made from a metal powder mixed with solvents, is printed onto the ceramic sheets using a screen printing process. The sheets with electrode printed are stacked to create a multilayer structure. TERMINATIONS SINTERING PRESSING Each terminal of the capacitor is dipped in the termination ink, mix of metal powder, solvents and glass frit and the parts are fi red in an oven. The parts are sintered in an oven with a precise temperature profi le which is very important to the characteristics of the capacitors. Pressure is applied to the stack to fuse all the separate layers, this created a monolithic structure. TERMINATIONS PLATING FINAL TESTING PACKAGING Stacking + leads soldering + encapsulation (see pages 10-11)

10www.exxelia.com Page revised 02/2 1 Taping : dimensions SMD TERMINATIONS NON RoHS COMPLIANT Code RoHS COMPLIANT Code Magnetic Recommended mounting process Storage (months)*Epoxy bonding Iron soldering Wave soldering Vapor phase soldering Infrared soldering Wire bonding Ag Q Ag QW / P No •••• 18 Ag/Pd/Pt - Ag/Pd/Pt W / A No ••• 24 Ag + Ni + dipped Sn/Pb Ag/Pd/Pt + dipped Sn/Pb 60/40 H Ag/Pd/Pt + dipped Sn HW No • 24 Ag + Ni + electrolytic Sn/Pb 95/5 C Ag + Ni + electrolytic Sn CW / S Yes •••• 18 Ag + Ni + electrolytic Sn/Pb 60/40 D - - Yes •••• 18 - - Ag + Cu + electrolytic Sn Ag + Ni + dipped Sn/Pb 60/40 E Ag + Ni + electrolytic Sn EW Yes •• 24 Ag + Ni + Au G Ag + Ni + Au GW Yes •••••• 36 Ag + Polymer + Ni + Sn/Pb YC Ag + Polymer + Ni + Sn YCW Yes •••• 18 Ag + Polymer + Ni + Sn/Pb YD - - Yes •••• 18 Ag + Polymer + Ni + Au YG Ag + Polymer Nickel (Ni) or Copper (Cu) barriers amplify thermal shock and are not recommended for chip sizes larger than 3030. * Storage must be in a dry environment at a temperature of 20°C with a relative humidity below 50%, or preferably in a package enclosing a desiccant. Maintenance only. * Non magnetic chips series only. SMD ENVIRONMENTAL TESTS Ceramic chip capacitors for SMD are designed to meet test requirements of CECC 32100 and NF C 93133 standards as specified below in compliance with NF C 20700 and IEC 68 standards:

• Solderability: NF C 20758, 260°C, bath 62/36/2.
• Adherence: 5N force.
• Vibration fatigue test: NF C 20706, 20 g, 10 Hz to 2,000 Hz, 12 cycles of 20 minutes each.
• Rapid temperature change: NF C 20714, –55°C to + 125°C, 5 cycles.
• Combined climatic test: IEC 68-2-38.
• Damp heat: NF C 20703, 93 %, H.R., 40°C.
• Endurance test: 1,000 hours, 1.5 U RC , 125°C. STORAGE OF CHIP CAPACITORS TINNED OR NON TINNED CHIP CAPACITORS Storage must be in a dry environment at a temperature of 20°C with a relative humidity below 50 %, or preferably in a packaging enclosing a desiccant. STORAGE IN INDUSTRIAL ENVIRONMENT:
• 2 years for tin dipped chip capacitors,
• 18 months for tin electroplated chip capacitors,
• 2 years for non tinned chip capacitors,
• 3 years for gold plated chip capacitors. STORAGE IN CONTROLLED NEUTRAL NITROGEN ENVIRONMENT:
• 4 years for tin dipped or electroplated chip capacitors,
• 4 years for non tinned chip capacitors,
• 5 years for gold plated chip capacitors. Storage duration should be considered from delivery date and not from batch manufacture date. The tests carried out at final acceptance stage (solderabili- ty, susceptibility to solder heat) enable to assess the compatibility to surface mounting of the chips. User Guide

11www.exxelia.com Page revised 02/2 1 General characteristics GENERAL INFORMATION User Guide SURFACE MOUNTING DIL LEADS P style PL style L style J style RIBBON LEADS Micro-strip (type 1) Short Micro-strip (type 1S) Axial (Type 2) Radial (Type 3) R style RX style RJ style Please contact Exxelia sales for any lead confi guration not shown. TROUGH-HOLE MOUNTING AXIAL AND RADIAL Radial leads (Type 6) Radial leads (4 leads) Axial leads (Type 7) DIL leads: N style ENCAPSULATION STYLES Ceramic encapsulation (selfprotected) Varnish Conformal coating Molding LEAD STYLES

12www.exxelia.com Page revised 02/2 1 Taping : dimensions SOLDERING ADVICES FOR REFLOW SOLDERING Dimensions in inches (in mm) Reflow soldering Wave soldering I 1 I 2 I 3 I 1 I 2 I 3 User Guide Large chips above size 2225 are not recommended to be mounted on epoxy board due to thermal ex- pansion coefficient mismatch between ceramic ca- pacitor and epoxy. Where larger sizes are required, it is recommended to use components with ribbon or other adapted leads so as to absorb thermo-me- chanical strains. RECOMMENDED FOOTPRINT FOR SMD CAPACITORS Ceramic is by nature a material which is sensitive both thermally and mechan- ically. Stresses caused by the physical and thermal properties of the capaci- tors, substrates and solders are attenuated by the leads. Wave soldering is unsuitable for sizes larger than 2220 and for the higher ends of capacitance ranges due to possible thermal shock (capacitance values giv- en upon request). Infrared and vapor phase reflow, are preferred for high reliability applications as inherent thermo-mechanical strains are lower than those inherent to wave soldering. Whatever the soldering process is, it is highly recommended to apply a thermal cycle, see hereafter our recommended soldering profile: Preheat zone 100 150 200 250 0 12 3 4 5 Time (min) Temperature (°C) 215°C 250°C 20°C >50°C/s Natural cool down RoHS No RoHS 0 100 150 200 250Temperature (°C) 0 12 3 4 5 Time (min) 20°C 215°C-225°C 245°C-255°C Natural cool down RoHS No RoHS 100 150 200 250 0 12 3 4 Time (min) Temperature (°C) 20°C 300 250°C 280°C Natural cool down RoHS No RoHS RECOMMENDED VAPOR PHASE REFLOW PROFILE RECOMMENDED IR REFLOW PROFIL RECOMMENDED WAVE SOLDERING PROFILE SOLDERING ADVICES FOR IRON SOLDERING Attachment with a soldering iron is discouraged due to ceramic brittleness and the process control limitations. In the event that a soldering iron must be used, the following precautions should be observed:

• Use a substrate with chip footprints big enough to allow putting side by side one end of the capacitor and the iron tip without any contact between this tip and the component,
• place the capacitor on this footprint,
• heat the substrate until the capacitor’s temperature reaches 150°C minimum (preheating step, maximum 1°C per second),
• place the hot iron tip (a flat tip is preferred) on the footprint without touching the capacitor. Use a regulated iron with a 30 watts maximum power. The recommended temperature of the iron is 270 ±10°C. The tem- perature gap between the capacitor and the iron tip must not exceed 120°C,

13www.exxelia.com Page revised 02/2 1 General characteristics GENERAL INFORMATION

• leave the tip on the footprint for a few seconds in order to increase locally the footprint’s temperature,
• use a cored wire solder and put it down on the iron tip. In a preferred way use Sn/Pb/Ag 62/36/2 alloy,
• wait until the solder fi llet is formed on the capacitor’s termination,
• take away iron and wire solder,
• wait a few minutes so that the substrate and capacitor come back down to the preheating temperature,
• solder the second termination using the same procedure as the fi rst,
• let the soldered component cool down slowly to avoid any thermal shock. PACKAGING TAPE AND REEL The fi lms used on the reels correspond to standard IEC 60286-3. Films are de- livered on reels in compliance with document IEC 286-3 dated 1991. Minimum quantity is 250 chips. Maximum quantities per reel are as follows:
• Super 8 reel - Ø 180: 2,500 chips.
• Super 8 reel - Ø 330: 10,000 chips.
• Super 12 reel - Ø 180: 1,000 chips. Reel marking complies with CECC 32 100 standard:
• Model.
• Rated capacitance.
• Capacitance tolerance.
• Rated voltage.
• Batch number. User Guide Sizes Nr. of chips/ package Oriented chips Dimensions in inches (in mm) A B C D E DIMENSIONAL CHARACTERISTICS OF CHIPS TRAY PACKAGES HIGH Q CAPACITORS TAPE AND REEL PACKAGING SPECIFICATIONS Chips tray depth: C E E A D D B TRAY PACKAGES Sizes Type (1) W ±0.3 inches (mm) F ±0.05 inches (mm) P1 ±0.1 inches (mm) T max. inches (mm) Reel Size inches (mm) Quantity per Reel (1): Horizontal (H) or Vertical (V) orientation in cavities.

14www.exxelia.com Page revised 02/2 1 Taping : dimensions EIA STANDARD CAPACITANCE VALUES Following EIA standard, the values and multiples that are indicated in the chart below can be ordered. E48, E96 series and intermediary values are available upon request. (± 20%) E12 (± 10%) E24 (± 5%) 10 10 12 12 15 15 18 18 22 22 27 27 33 33 39 39 47 47 56 56 68 68 82 82 EIA CAPACITANCE CODE The capacitance is expressed in three digit codes and in units of pico Farads (pF). The first and second digits are significant figures of the capacitance value and the third digit identifies the multiplier. For capacitance value < 10pF , R designates a decimal point. See examples below: EIA code Capacitance value in pF in nF in µF 2R2 2.2 0.0022 0.0000022 6R8 6.8 0.0068 0.0000068 220 22 0.022 0.000022 470 47 0.047 0.000047 181 180 0.18 0.00018 2 21 220 0.22 0.00022 102 1,000 1 0.001 272 2,700 2.7 0.0027 123 12,000 12 0.012 683 68,000 68 0.068 124 120,000 120 0.12 564 560,000 560 0.56 335 3,300,000 3,300 3.3 825 8,200,000 8,200 8.2 156 15,000,000 15,000 15 686 68,000,000 68,000 68 107 100,000,000 100,000 100 227 220,000,000 220,000 220 PART MARKING VOLTAGE CODES Use the following voltage code chart for part markings: Voltage (V) Code Letter code 25 250 A 40 400 B 50 500 C 63 630 D 100 101 E 200 201 G 250 251 H 400 401 K 500 501 L 1,000 102 M 2,000 202 P 3,000 302 R 4,000 402 S 5,000 502 T 7 ,500 752 U 10,000 103 W PART MARKING TOLERANCE CODES Use the following tolerance code chart for part markings: Tolerance Letter code ±0.25pF CU ±0.5pF DU ±1pF FU ±1% F ±2% G ±5% J ±10% K ±20% M User Guide

15www.exxelia.com Page revised 02/2 1 General characteristics GENERAL INFORMATION RELIABILITY LEVELS Exxelia proposes different reliability levels for the ceramic capacitors for both NPO and X7R ceramics. ÆÆ Æ ÆÆ Æ Æ ¬¬¬¬Æ ¬¬¬Æ ¬¬Æ ÆÆ Æ ÆÆ Æ ÆÆÆÆ CECC EXXELIA TECHNOLOGIES chips capacitors are qualified according to CECC32101-801 100% electrical and visual control

• Voltage proof
• Insulation Resistance
• Capacitance value
• Dissipation factor IN PROCESS control According ESCC n°3009/3001 Documentation: according ESCC n°3009/3001 Chart F2 According ESCC n°3009/3001 Rapid Change of Temperature 5 cycles –55°C +125°C Damp Heat 85°C • 85 % RH 240 h • 1.5 V On 40 parts Standard Only for rated voltage <500V F T5 CoC Standard CoC CoC F CoC ESA ESCC EXXELIA TECHNOLOGIES chips capacitors are qualified (QPL) according to ESCC n°3009 (chips) and ESCC n°3001 (leaded) Level FM Rapid Change of Temperature 10 cycles –55°C +125°C Burn-in (100% control) 168 h, 125°C, 1.5 Un Solderability Test On 10 parts Chart F3 According ESCC n°3009/3001 User Guide

16www.exxelia.com Page revised 02/2 1 Taping : dimensions As the world’s leading manufacturer of specifi c passive components, we stand apart through our ability to quickly evaluate the application specifi c engineering challenges and provide a cost-effective and effi cient solutions. For requirements that cannot be met by catalog products, we offer leading edge solutions in custom confi guration: custom geometries, packaging, characteristics, all is possible thanks to our extensive experience and robust development process, while maintaining the highest level of reliability. Where necessary, special testing is done to verify requirements, such as low dielectric absorption, ultra-high insulation resistance, low dissipation factor, stability under temperature cycling or under specifi ed environmental conditions, etc. HIGH CAPACITANCE

• High energy density
• Specific case sizes
• Specific shape of connections (high resistance to vibrations) HIGH TEMPERATURE
• Up to 250°C
• Specific shape of connections
• 2,000 hours life time
• HMP soldering OTHERS
• Screen printed resistors
• Complex components
• Full functions available HIGH VOLTAGE
• Up to 50 kV
• Specific circular shape

4www.exxelia.com Page revised 02/2 1 Taping : dimensionsGeneral Information MATERIALS EXPERT For 50 years and as a market leader, EXXELIA’s comprehensive knowledge of the materials properties and performances have enabled us to design capaci- tors in Porcelain, NPO, BX, 2C1, BP , X7R and –2200ppm/°C ceramics. CUSTOM DESIGNS Our catalog products don’t meet your application? Based on the valuable experience accumulated over the design of 2,000+ spe- cific ceramic capacitors, you can trust EXXELIA to define a qualitative custom solution in a time effective manner. NO OBSOLESCENCE Choosing a standard or custom EXXELIA product means you won’t have to wor- ry about obsolescence. TYPICAL APPLICATIONS

• Aerospace & Defense: cockpit panels, flight control, radio systems, missile guidance systems…
• Space: military and commercial satellites, launcher…
• Medical: MRI, external defibrillators, implantable devices…
• Telecommunications: base stations…
• Oil and gas: drilling tools, MWD, LWD, wellheads… ISO 9001 AND AS9100C Quality is at the core of Exxelia’s corporate culture. Each sites has its own cer- tifications. CERTIFICATIONS Capacitors manufactured by EXXELIA comply with American and European standards and meet the requirements of many international standards. For Space qualified parts (ESA QPL), please refer to our catalog «Ceramic ca- pacitors for Space applications». QUALITY & RELIABILITY EXXELIA is committed to design and manufacture high quality and reliability products. The test cycles reproducing the most adverse operating conditions over extended periods (up to 10 000 hours) have logged to date well over 5.10 hours/°Component. Failure rate data can be provided upon request. CONFLICT MINERALS EXXELIA is committed to an approach based on «Conflict Minerals Compli- ance». This US SEC rule demands complete traceability and a control mecha- nism for the mineral procurement chain, encouraging importers to buy only «certified» ore. We have discontinued relations with suppliers that procure from the Demo- cratic Republic of the Congo or an adjoining country. ENVIRONMENT EXXELIA is committed to applying a robust environmental policy, from product design through to shipment. To control its environmental footprint and recon- cile this with the company’ functional imperatives, our environmental policy provides for the reduction or elimination of hazardous substances. We also focus on compliance with European Union directives and regulations, notably REACH and RoHS. RoHS COMPLIANCY SMD CAPACITORS The capacitor terminations are generally protected by a nickel barrier formed by electrolytic deposit. This barrier gives chip capacitors leaching performance far exceeding the requirements of all applicable standards. The nickel barrier guarantees a minimum resistance to soldering heat for a period of 1 minute at 260°C in a tin-lead (60/40) or tin-lead-silver (62/36/2) bath without noticeable alteration to the solderability. It also allows repeated soldering-unsoldering and the longer soldering times required by reflow techniques. However nickel barrier amplifies thermal shock and is not recommended for chip sizes equal or greater than CNC Y (30 30) - (C 282 to C 288 - CNC 80 to CNC 94). LEADED COMPONENTS As well as for SMD products, leaded capacitors ranges can also be RoHS. These products, which are characterized by the suffix «W» added to the commercial type, are naturally compatible with the soldering alloys used in RoHS mounting technology. The connections coating is generally an alloy SnAg (with a maxi- mum of 4% Ag). However, on a few products that EXXELIA will precise on re- quest, the coating is pure silver. 10 - 60 µm Metallization Silver-Palladium (or Silver) Nickel barrier Tinning: Tin-Lead No RoHs Pure Tin RoHS (W) CerUflex (polymer) 2 - 3 µm 3 - 8 µm