250SHB100FC1LE

SH-SERIES EXXELIA | Alldatasheet

Document overview

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Technical content

147 info@exxelia.comwww.exxelia.com General characteristics RF CAPACITORS Page revised 06/20

FEATURES

• Lowest ESR in class, High Self-Resonant Frequencies, RF c ap a ci t or s
• Highest working voltage in class: 1,500V
• Standard EIA sizes: 0402 - 1111
• Capacitance range: 0.1 pF - 1,000pF
• NPO, RoHS & REACH compliant
• Operating temperature up to 125°C*
• Laser Marked (optional)

APPLICATIONS

• Cellular Base Station Equipments
• Broadband Wireless Service
• Point to Point / Multipoint Radios
• RF Generators (NMR…) CIRCUIT APPLICATIONS
• Filter Networks
• Matching Networks
• Tuning, Coupling and DC Blocking PHYSICAL CHARACTERISTICS
• Chip capacitors for surface mounting with: - Copper barrier and tinning or Silver/Palladium (non magnetic) - Nickel barrier and tinning
• Ribbon leads for surface mounting ELECTRICAL AND ENVIRONMENTAL SPECIFICATIONS Electrical specifications Parameter Value Capacitance 0.2pF - 1,000pF Tolerances A, B, C, D below 10pF F , G, J, K above 10pF Working voltage (WV DC ) See capacitance range chart Temperature coefficient 0 ±30ppm/°C, –55°C to +125°C For SHF and SHS: 0 ±30ppm/°C, –55°C to +150°C Insulation Resistance 10 5 MΩ min. Dielectric Withstanding (test voltage applied for 5 seconds) 2.5 x WV DC for WV DC ≤ 500V 1.8 x WV DC for extended range values ≥ 820pF 1.5 x WV DC for WV DC > 500V Aging none Piezo Effect none Environmental specifications Parameter Value Life Test 2,000 hours, +125°C at 2 x WV DC (standard WV DC range) And SHB up to 100pF: 1,000 hours, 175°C at 500V Moisture Resistance Test 1 240 hours, 85% relative humidity at 85°C (ESA/SCC n°3009) Moisture Resistance Test 2 56 days, 93% relative humidity at 40°C 0V, 5V, WV DC * The temperature range for the SHB up to 100pF is upgrated from +125°C to +175°C. The temperature withstanding for SHF and SHS is 150°C for the whole capacitance range. HOW TO ORDER

501 SH B 100 J S - L E -RoHS

Voltage code Dielectric Size code Capacitance code Tolerance code Termination code Ribbon code Marking code Tape and reel 250 = 25V 500 = 50V 101 = 100V 201 = 200V 251 = 250V 301 = 300V 501 = 500V 601 = 600V 102 = 1,000V 152 = 1,500V Please refer to voltage given in capacitance range chart SH = NPO: (0±30) ppm/°C L = 0402 S = 0603 A = 0505 F = 0805 N = 1206 T = 12 10 B = 1111 Please refer to Cap. Code given in capacitance range chart. A = ±0.05pF B = ±0.1pF C = ±0.25pF D = ±0.5pF F = ±1% G = ±2% J = ±5% K = ±10% See note 1 S = Standard: tin-plated nickel Available on sizes 0505, 0603 and 1111: C = Non-magnetic: tin-plated copper Available on sizes 0505, 0805 (from 0.5pF to 150pF , consult us for higher cap. value), 1206 and 12 10: A = Non-magnetic: silver/palladium See note 2 -: no lead or ribbon Available on size 1111: 1 = Micro-strip ribbons 6 = Radial Wires See note 3 -: no marking Available on sizes 0505 and 1111: L = laser marking -: no tape and reel E = Tape and reel packaging Number of compo- nents per reel: SHL: 10,000 SHA: 3,000 SHS: 4,000 SHF: 4,000 SHN: 3,000 SHT: 3,000 SHB: 1,000 The RoHS tag is not part of the reference Tag added at the end of P/N for information Note 2: All terminations are backward compatible and lead-free. The non-magnetic terminations are all Magnetism-free Rated. Not e 3: When coding ribbons for the description of the part, the termination has to be mentioned for MR certified types to ensure that only non-magnetic materials are used. Note 4: Ribbon lead styles capacitors are not available in Tape and Reel. Examples: 501 SHB 470 J1L any termination material could be used. 501 SHB 470 JC1L only non-magnetic termination materials could be used. Please consult us for specific requirements. Capacitance Breakdown voltage Vpeak (V) 15 pF 2700 39 pF 2000 100 pF 1400 Typical Breakdown Voltage SHB 45 MHz DC = 1% Super HiQ SH Series

148www.exxelia.com info@exxelia.com Taping : dimensions Page revised 06/20 SHA (SIZE 0505): TYPICAL ESR VERSUS FREQUENCY SHS (SIZE 0603): TYPICAL ESR VERSUS FREQUENCY SHF (SIZE 0805): TYPICAL ESR VERSUS FREQUENCY 0.01 0.10 100 1,000 E S R (Ω ) Frequency (MHz) 10 pF 56 pF 68 pF 0.01 0.10 0 500 1,000 1,500 2,000 2,500 E S R (Ω ) Frequency (MHz) 3.3 pF 10 pF 47 pF 0.05 0.1 0.15 0.2 500 1,000 1,500 2,000 E S R (Ω ) Frequency (MHz) 1 pF 10 pF 100 pF SHB (SIZE 1111): TYPICAL ESR VERSUS FREQUENCY SHS (SIZE 0603): TYPICAL Q FACTOR VERSUS FREQUENCY SHF (SIZE 0805): TYPICAL Q FACTOR VERSUS FREQUENCY 0.01 0.10 100 1,000 E S R (Ω ) Frequency (MHz) 10 pF 27 pF 33 pF 1 0 100 1,000 10,000 500 1,000 1,500 2,000 Q factor Frequency (MHz) 1 0 100 1,000 10,000 500 1,000 1,500 2,000 Q factor Frequency (MHz) DIMENSIONS in inches (mm) Chips Micro-strip ribbon leads (Type 1) Radial leads: available on all sizes (Type 6) TYPICAL PERFORMANCE DATA S-Parameters available with ABC software. SH Series Super HiQ

info@exxelia.comwww.exxelia.com General characteristics RF CAPACITORS Page revised 01/11 Super HiQ SH Series STANDARD RATINGS Size 0402 0603 0505 0805 1206 1210 1111 Size code L S A F N T B Dimensions inches (mm) L 0.039 ± 0.006 (1 ± 0.15) 0.063 ± 0.01 (1.6 ± 0.25) 0.055 ± 0.01 (1.4 ± 0.25) 0.08 ± 0.01 (2.03 ± 0.25) 0.125 ± 0.01 (3.18 ± 0.25) 0.125 ± 0.01 (3.18 ± 0.25) 0.110 ± 0.016 (2.80 ± 0.40) W 0.02 ± 0.006 (0.5 ± 0.15) 0.032 ± 0.01 (0.8 ± 0.25) 0.055 ± 0.01 (1.4 ± 0.25) 0.05 ± 0.01 (1.27 ± 0.25) 0.062 ± 0.01 (1.58 ± 0.25) 0.095 ± 0.01 (2.41 ± 0.25) 0.110 ± 0.016 (2.80 ± 0.40) T 0.02 max (0.51 max) 0.036 max (0.9 max) 0.056 max (1.4 max) 0.05 max (1.27 max) 0.05 max (1.27 max) 0.06 max (1.52 max) 0.103 max (2.60 max) e 0.01 ± 0.006 (0.25 ± 0.15) 0.014 ± 0.008 (0.35 ± 0.2) 0.01 ± 0.006 (0.25 ± 0.15) 0.02 ± 0.012 (0.5 ± 0.3) 0.02 ± 0.01 (0.5 ± 0.25) 0.02 ± 0.01 (0.5 ± 0.25) 0.016 ± 0.010 (0.40 ± 0.25) Value (pF) Cap. Code Standard Standard Standard Standard Standard Standard Standard Extended 0.1 0R1 0.2 0R2 50 - 250V 250V 250V 0.3 0R3 250V 500V 1,500V 0.4 0R4 0.5 0R5 500V 0.6 0R6 0.7 0R7 0.8 0R8 0.9 0R9 1.0 1R0 500V 1.1 1R1 1.2 1R2 1.3 1R3 1.4 1R4 1.5 1R5 1.6 1R6 1.7 1R7 1.8 1R8 1.9 1R9 2.0 2R0 2.1 2R1 2.2 2R2 2.4 2R4 2.7 2R7 3.0 3R0 3.3 3R3 3.6 3R6 50 - 200V 3.9 3R9 4.3 4R3 4.7 4R7 5.1 5R1 5.6 5R6 6.2 6R2 6.8 6R8 7. 5 7R5 8.2 8R2 9.1 9R1 10 100 11 110 12 120 15 150 16 160 18 180 20 200 22 220 24 240 27 270 30 300 25 - 50V33 330 36 360 39 390 43 430 47 470 51 510 200V 200V 56 560 62 620 68 680 75 750 82 820 91 910 100 101 110 111 150V R12N Series (See page 26) 100V 200V 120 121 300V 1,000V 130 131 150 151 160 161 180 181 200 201 220 2 21 240 241 100V 200V 600V 270 271 300 301 330 331 360 361 390 391 430 431 470 471 510 511 100V 300V 560 5 61 620 621 50V R12N Series (See page 26) 680 681 50V 750 751 820 821 910 911 1,000 102 Special values, tolerances, higher WVDC and matching available, please consult factory.

120www.exxelia.com info@exxelia.com Taping : dimensions Page revised 06/20 CAPACITOR TERMINATIONS AND SOLDERING RECOMMENDATIONS I. TERMINATION TYPES Our capacitors are delivered with one of the following terminations (for technical reasons, only a limited number of termination types are available in certain cases). All our terminations are backward compatible. NB:

• terminations type C recommended for non magnetic applications.
• termination type A available for non magnetic applications (for historical reason, we have also another code, the code “P”, for the same type of termination. The parts that were designed-in before 2005 might still have a code “P” instead of “A” in the part numbering. But both codes correspond to the same type of termination). II. SPECIFICATIONS Care must be taken when using particular terminations: if the terminations are heated up above a particular temperature and/or for too long a period of time, there is a risk of leaching (dissolution of the termination revealing the inner electrodes). The chart below gives the resistance to soldering heat per termination type, based on a SAC387 solder bath at 260°C. Dielectric Type A C S CHA / SHA 10 ±1s (3) 120 ±5s CHB / SHB 30 ±2s 120 ±5s CPX / CLX / CPE / CLE 30 ±2s 120 ±5s CLF 10 ±2s (1) On request 120 ±5s SHL 120 ±5s SHS 10 ±1s (4) 120 ±5s SHF / SHN / SHT 5 ±1s (2) 120 ±5s (1): results extrapolated from 30±2s data obtained with Sn62/Pb36/Ag2 solder bath. (2): data obtained with Sn62/Pb36/Ag2 solder bath. (3): termination only available on CHA series. (4): preliminary data. III. STANDARD SMD REQUIREMENTS III.1. Soldering Recommendations Regarding the soldering attachments, three methods are generally used: the vapor phase soldering, the infrared reflow soldering and the wave soldering. Unless particular skill about the use of the wave soldering, this method is not recommended since the melted solder is directly in contact with the ceramic. This can potentially crack the capacitor because the ceramic is sensible to the thermal shocks. Moreover, this method needs to maintain the components with an insulating resin which increases the thermo-mechanical strains between the ceramic and the board both on soldering phase and operating condition. The vapor phase and IR reflow soldering are less aggressive, inducing more restricted thermal shocks. This is the reason why they are preferred to the wave soldering method for reliable applications. In all cases, proper pre-heating is essential. The circuit should be pre-heated at a typical rate of 1°C/s within 65°C to 100°C of the maximum soldering temperature. While multilayer ceramic capacitors can withstand the peak soldering temperatures for short durations, they should be minimized whenever possible. Above precaution given for SMD types are applicable for the implementation of large bare chips (1515 and above). But in general, large bare chips above 2225 are not recommended to be mounted on epoxy printed board due to the thermal expansion mismatch between ceramic capacitor body and epoxy. This is the reason why leaded components will be preferred especially for reliable applications. For information, the typical thermal profiles of these three soldering processes are given hereafter. These typical diagrams are only given as an aid to SMD users in determining specific processes linked to their instrumentations and to their own experience. NB: reference documents are IEC 6 1760-1, CECC30000 and IEC68 standards. Please, refer to this standard for more information. III.1.1. Vapour Phase Soldering 0°C 0s 20s 40s 60s 80s 100s 120s 140s 160s 180s 200s 220s 240s 250°C 230°C 20s ... 40s ca. 60s ... 130s >2 17°C 2 17°C Ramp down rate <6K/s Ramp up rate <3K/s 200°C 150°C 100°C 50°C Lead free SnAgCu solders - Vapour Phase 0°C 0s 20s 40s 60s 80s 100s 120s 140s 160s 180s 200s 220s 240s 250°C 2 10°C 20s ... 40s ca. 60s ... 150s <180°C 180°C Ramp down rate <6K/s Ramp up rate <3K/s 200°C 150°C 100°C 50°C SnPb solders – Infrared Soldering NB: the lines indicate the upper and lower limits of typical process (terminal temperature). Parameter Value Comment Termination Materials A C S non-magnetic (silver-palladium) non-magnetic (pure tin over copper barrier) lead-free (pure tin over nickel barrier) General Information

121 info@exxelia.comwww.exxelia.com General characteristics RF CAPACITORS Page revised 06/20 III.1.2. Infrared Soldering 0°C 300°C 250°C 200°C 150°C 100°C 50°C 0s 30s 60s 90s 120s 150s 180s 210 s 240s 270s 300s 330s 360s ca. 45s ... 90s >220°C 220°C Preheating Ramp down rate <6K/s Ramp up rate <3K/s 235°C 245°C Lead free SnAgCu solders – Infrared Soldering 0°C 300°C 250°C 200°C 150°C 100°C 50°C 0s 20s 40s 60s 80s 100s 120s 140s 160s 180s 200s 220s 240s ca. 60s >180°C 215 ° C Preheating Ramp down rate <6K/s Ramp up rate <3K/s 180°C 160°C 130°C 230°C 240°C SnPb solders – Infrared Soldering NB:

• these profiles are given for mid size components.
• continuous lines: typical process (terminal temperature).
• dotted lines: process limits, bottom process limit (terminal temperature), upper process limit (top surface temperature). III.1.3. Wave Soldering 0°C 300°C 250°C 200°C 150°C 100°C 50°C 0s 20s 40s 60s 80s 100s 120s 140s 160s 180s 200s 220s 240s ca. 3.5 K/s typical ca. 2 K/s ca. 5 K/s Preheating First wave SnPb: 235°C - 260°C SnAgCu: 250°C - 260°C ∆T<150K Second wave 10s max., max. contact time 5s per wave Cooling 120°C 130°C SnAgCu and SnPb solders - Double Wave Soldering NB: • continuous lines: typical process.
• dotted lines: process limits. III.2. Moisture Sensitivity Classification Our standard lead-free terminations - S and C types - have been fully tested and are compliant with the requirements mentioned in specification JEDEC STD 020 (level 1: not moisture sensitive). III.3. Whiskers Classification Our standard lead-free terminations - S and C types - have been fully tested and are compliant with the requirements mentioned in specification JEDEC STD 201. Our terminations exhibit a matte finish and receive a special heat treatment to relieve stress inside the tin. III.4. Pad Dimensions The metalized pads on the end user’s substrate must be properly designed. Improper spacing or dimensioning of the pads may result in poor solder joints or a tombstone effect. Pad designs are given below for the most common sizes of multilayer ceramic capacitors for both wave and reflow soldering. W X L D X Case Size W X D L SHL (0402) 0.70mm 0.90mm 0.40mm 2.20mm CHA / SHA (0505) 1.80mm 1.00mm 0.80mm 2.80mm SHS (0603) 1.00mm 1.10mm 0.60mm 2.80mm SHF (0805) 1.50mm 1.30mm 0.60mm 3.20mm CHB / SHB (1111) 3.00mm 1.00mm 1.90mm 3.90mm CPX / CLX (2225) 6.90mm 1.00mm 5.00mm 7 .00mm CPE / CLE (4040) 10.20mm 1.10mm 8.30mm 10.50mm NB: these dimensions are suggested for a reflow soldering process. If a wave soldering process is used, the X dimension has to be increased by 0.50mm (0.40mm for L and A case sizes), thus leading to an increase of 1.00mm to the L dimension (0.80mm for L and A case sizes). General Information

124www.exxelia.com info@exxelia.com Taping : dimensions Page revised 06/20 II. PARAMETERS OF SUBSTRATES AND CAPACITORS WITCH INFLUENCES THE PRF As the PRF is linked to the parasitic parallel capacitance, when the capacitor is mounted on a PCB, the main parameters witch could influence the PRF are:

• PCB parameters
• Capacitor parameters - Capacitance value - Geometry and size - Electrode orientation (horizontal or vertical) - Internal design For example in the following screen plots, we can see that the first PRF is about 1.8GHz when the capacitor is mounted horizontally and is not visible when it is mounted vertically. GHz 21.81 3 dB Horizontal mounting GHz 21.81 3 dB Vertical mounting Figure 9: Example of PRF measurement (501SHB390JS on a FR4 PCB horizontal and vertical mounting) [Ref. 1] Monolithic Capacitors as Transmission Lines. Marc INGALLS and Gordon KENT IEE Transactions on Microwaves Theory and Techniques, Vol. MTT-35, N°11 november1987 , pp. 964-970. CAPACITOR RELIABILITY DATA MIL-STD CDR STYLES, RF & AMP; MICROWAVE SYSTEMS I. TYPICAL RELIABILITY TESTS
• Adhesive Strength of Termination
• Bending Strength
• Solderability of Termination
• Resistance to Soldering Heat
• Thermal shock –55°C to +125°C
• Humidity Load (240 hours, 85% relative humidity at +85°C)
• High Temperature Load (1000/2000h, 125°C, x U N ) II. RELIABILITY DATA MONITORING II.1. General Manufacturing Process At each step of the manufacturing process, specific checks have been set-up to guarantee the quality level of our products. Statistical Process Controls (also known as SPC) are utilized to monitor key parameters within processes. In addition to all these in-process controls, a sample of capacitors from each lot is micro-sectioned to check the internal structure and the absence of voids, delaminations, cracks or other defects. When manufacturing is completed, the multilayer ceramic capacitors are fully screened for Capacitance, Dissipation Factor, Dielectric Withstanding Voltage, Insulation Resistance and Visual Defects. II.2. Reliability Testing During qualification of new capacitor series or at random intervals, EXXELIA performs life tests – 2,000 hours, +125°C, 2 x WV DC - and uses MIL -PRF-55681 as a guideline. The following parameters best describe our multilayer ceramic capacitors for military applications:
• data from MIL -PRF- 55681 revision F;
• ca pacitor, chip, multiple layer, fixed, ceramic dielectric, established reliability;
• rated temperature: –55°C to +125°C;
• CDR11, CDR12, CDR13 and CDR14 case sizes;
• Failure Rate levels C, M, P , R and S. The data obtained from our continuous life test monitoring are used to calculate an equivalent part failure rate and to compare it to the Failure Rate level as defined in MIL -PRF-55681F . The methods and formulae used are based on MIL -HDBK27 1F and MIL -STD-690D. An acceleration factor of 8:1 is used to relate life test data obtained at 200% rated voltage at maximum rated temperature, to rated voltage at maximum rated temperature (125°C). The following formula is used: AF = ( ) x 2V

3 T–T0

where V 0 is the rated voltage, T 0 the rated temperature, V and T the life test parameters. III. RELIABILITY DATA SUMMARY As stated in MIL -STD- 690D, data are accumulated from sample units selected from a production run and produced with equipment and procedures normally used in production. One of the prerequisites for valid data is that all lots produced during the production period be represented. The data are from the same product in current production, i.e. data from products of preceding designs are not acceptable. General Information

125 info@exxelia.comwww.exxelia.com General characteristics RF CAPACITORS Page revised 06/20 III.1. Failure Rate Level The summary of all collected data gives the following results:

• cumulative unit hours in millions: 9.27;
• cumulative unit hours in millions with acceleration factor: 74.16;
• number of defects: 1. We consider a single sampling plan based on a 90 percent confidence level: FRSP-90. For this FR sampling plan, MIL -STD- 690D gives the following criteria: FR Level Symbol Qualified FR Level (% per 1,000 hours) Number of Failures Permitted C non-ER N/A M 1.0 1 over 0.389M hours P 0.1 1 over 3.89M hours R 0.01 1 over 38.9M hours S 0.001 1 over 389M hours EXXELIA Temex therefore complies with the requirements of C, M, P and R failure rate levels. S failure rate level according to European Space Agency specifications 3009/035 and 3009/036. III.2. Mean Time To Failure MTTF is the basic measure of reliability for non-repairable items. It is analogous to the more familiar MTBF (Mean Time Between Failures) used for systems which can be repaired and placed back in service after failure occurs. FR levels may be converted to mean time to failure (MTTF) as follows: MTTF = , in failure per 106 hours100 000 FR___level III.3. Unit Hour Requirement A complete Poisson distribution table is needed to compute unit hours. To calculate unit hours with a given number “C” of permitted failures (we are considering 1 permitted failure) we first have to determine the probability of acceptance P a by subtracting the FRSP value (0.90 as we have selected a confidence level of 90%) from 1. Example: P From Poisson’s table and for a Failure Rate level M, we find for the parameters “C” and P a equal respectively to 1 and 0.10 the corresponding “m” value of 3.89; this “m” value in the table is the total of failure rate l multiplied by the time (test hours). M = l x t unit hours = m ÷ l (1%/1,000hours as we are working with FR level M) unit hours = 3.89 ÷ 0.00001 = 0.389 million hours (around 45 years) Values for P , R and S levels are found by multiplying the previous level by 10. IV. PART FAILURE RATE The Part Failure Rate as defined by MIL -HDBK- 2 17F is given by the following formula: lp = l b . pCV . pQ . pE where:
• lb is the Base Failure Rate;
• pCV is the Capacitance Factor;
• pQ is Quality Factor;
• pE is the Environment Factor. The Part Failure Rate, considering the capacitor series meet the required FR level, gives the number of failures per 10 6 hours. In MIL -HDBK-2 17F , the values for all these parameters are given under Capacitors, Fixed, Ceramic, Temperature Compensating and Chip paragraph. The CDR style as described by MIL -PRF-55681F is taken into account and corresponds to EXXELIA CHA and CHB sizes. IV.1. Quality Factor The Quality Factor depends on the FR level. If we consider the three FR levels defined previously for EXXELIA multilayer capacitors, the given factors are: Symbol Product Level pQ C non-ER 3.0 M 1.0 % per 1,000 hours 1.0 P 0.1 % per 1,000 hours 0.3 IV.2. Environment Factor All part reliability models include the effects of environmental stresses through the Environmental Factor. The descriptions of these environments are shown below and encompass the major areas of equipment use Environment Description pE G B : Ground, Benign Non-mobile, temperature and humidity controlled envi- ronments readily accessed to maintenance; includes laboratory instruments and test equipment, medical electronic equipment, business and scientific comput- er complexes, and missiles and support equipment in ground silos. 1.0 G F : Ground, Fixed Moderately controlled environments such as installa- tion in permanent racks with adequate cooling air and possible installation in unheated buildings; includes permanent installation of air traffic control radar and communications facilities. 2.0 G M : Ground, Mobile Equipment installed on wheeled or tracked vehicles and equipment manually transported; includes tactical mis- sile ground support equipment, mobile communication equipment, tactical fire direction systems, handheld communications equipment, laser designations and range finders. 10.0 IV.3. Part Failure Rate Calculation The part failure rate calculated as specified in MIL -HDBK-2 17F provides a more accurate result than the standard failure rate given by a particular FR level. The two main parameters are the FR level achieved by the standard process – Quality Factor - and the application where the part will be used – Environment Factor. Specific study could be made on request based on customer’s requirements and equipments. General Information

126www.exxelia.com info@exxelia.com Taping : dimensions Page revised 06/20 POWER CAPACITOR SOLUTIONS ULTRA-LOW ESR, HIGH RF POWER In the RF world, one trend that continues to gain momentum is the need for higher RF output power in amplifier modules and systems. Associated to a growing demand for reduced unit size, the task for the designers and the component manufacturers is chal- lenging. F irst of all, the systems have to deal with higher RF power. At the component level, this means that a particular function which required only a single component previously has now to evolve to a sub-system made of several components to handle the total amount of power. Example of capacitor Module Example of X-Rays analysis Moreover, the reduction of the unit size led to higher operating temperatures, adding se- vere requirements on the components. They have to survive higher temperatures, be- ing able to dissipate the generated heat – small packages produce much higher power d ensities – maintain their performances among huge operating temperature variations and offer mechanical flexibility to accept significant PCB thermal expansion. Now, when coming to the capacitor world, these new needs will affect the “single-chip” standard model. For instance, when one capacitor was enough to ensure the matching of a 100 W RF transistor, the recent 1’000W transistors need “n” capacitors, even some - times with an increased size. In order to get a better understanding of these new requirements and to study the “n-chip” model, we will first look at the key parameters of high RF power systems. Then, depending on the key parameter(s) considered, we will see which Power Capacitor Solution is best-tailored to the designer needs. I. HIGH RF POWER I.1. Voltage Rating Maximum voltage ratings for ceramic capacitors (WV DC ) are linked to two factors: strength of the dielectric and Paschen’s law. The strength of the dielectric provides a maximum voltage breakdown and the Paschen’s law provides another maximum volt- age above which the air around the chip arcs. Strength of Dielectric Pas chen’s Law The voltage rating of the ceramic capacitor is then defined as the lowest value when considering both limitations. I.1.1. Dielectric Strength The capacitor maximum voltage rating is determined predominantly by the dielectric strength or voltage breakdown characteristics. For instance, porcelain dielectrics ex- hibit a breakdown voltage that typically exceeds 1’000 kV DC /inch of dielectric thickness. Material Dielectric Strength (kV/inch) Vacuum 20 Air 20 to 75 Porcelain 40 to 200 Glass 2'000 to 3'000 Mica 5'000 For multilayer capacitors for instance, this means that one particular layer of standard dielectric – let’s consider a theoretical 5 mils thick layer – will not crack until the voltage exceeds a value around 5’000 V DC . In order to achieve even higher voltage ratings, spe- cific internal electrode designs are used to split the voltage. I.1.2. Paschen’s Law In 1889, F . Paschen published a paper (Wied. Ann., 37 , 69) which set out what has be- come known as Paschen’s Law. The law essentially states that the breakdown charac- teristics of a gap are a function (generally not linear) of the product of the gas pressure and the gap length, usually written as V= f(pd), where p is the pressure (in Torr) and d is the gap distance (in cm): V = 365 x p x d 1.18 + In(p x d) (1) Note: 1 bar = 100’000 Pa = 750 Torr = 14.5 psi. For instance, if we consider an E-type capacitor (CLE series with an EIA chip size of 4040), the length between the two terminations (“L ” as shown below) is around 10.50 mm. This means, using the Paschen’s law (p=750 Torr; d=1.05 cm), that if the voltage across such equivalent air gap exceeds 36’600Vdc, an electric arc would be created. However, when dealing with the gap between the two capacitor terminations, another parameter has to be considered. Actually, as the dielectric material is charged, there is an ioniza - tion of air which influences the Paschen’s law. Therefore, for the capacitor considered in this example, a voltage around 10’000 V DC will probably create a short circuit on the capacitor external surface (carbon residues from the arcing). Moreover, the electric arc itself could damage nearby components. For applications where very high voltages are needed, a specific coating would be ap - plied on the capacitor, thus covering both terminations. In this case, the gap itself disap- pears and no electric arc could occur. I.2. Current Rating The current rating assigned to a capacitor is stated in one of two ways: voltage limited or power dissipation limited. The rating that applies depends on the capacitance value and operating frequency. The voltage limited area is based on the voltage rating. The power dissipation limited area is based on the ability of the capacitor to dissipate the heat. The current rating of the ceramic capacitor is then the lowest value. I.2.1. Voltage Limit The maximum current for the voltage limited operating condition is directly proportional to the capacitor voltage rating and the impedance: IVm = WVDC x √2 / Z (2) (3)Z = √ESR2+(Lq –1/Cq)2 General Information

127 info@exxelia.comwww.exxelia.com General characteristics RF CAPACITORS Page revised 06/20 When the frequency is enough low and ESR negligible: Z ≈ (1/Cq) (4) Then I Vm ≈ 2 ∏ x WV DC x √2 x f x C (5) I.2.2. Power Dissipation Limit The maximum RMS current for the power dissipation limited operating condition is di- rectly proportional to the maximum power dissipation of the device and the Equivalent Series Resistance: IP(RMS) = √ Pdmax. ESR (6) Pd max. is the maximum power dissipation of the device as defined in reference to a given mounting surface with known characteristics. The thermal resistance (VC) of a ceramic capacitor operating in a given application is a key factor to establish the device power rating: Pdmax. = Tmax.–Tamb. VC (7) I.2.3. Maximum current The maximum current is : I max = minimum (d Ip(RMS), Ivm) Considering the general trend of the current with the frequency: (5) shows that Ivm increases with the frequency (6) shows that Ip(RMS) decreases with the frequency (ESR increases with frequencies in a general trend with skin effect) Therefore typically the maximum current is limited

• By Ivm at low frequencies
• By Ip(RMS) at higher frequencies I.3. HEAT TRANSFER I.3.1. Thermal Convection Convection is a heat transfer produced by the motion of a mass of fluid such as air or water when the heated fluid is caused to move away from the source of heat, carrying energy with it. Convection above a hot surface occurs because at constant pressure, hot air expands, becomes less dense, and rises. I.3.2. Thermal Radiation Radiation is a heat transfer produced by the emission of electromagnetic waves which carry energy away from the emitting object. For ordinary temperatures, the radiation is in the infrared region of the electromagnetic spectrum. The relationship governing radiation from hot objects is called the Stefan-Boltzmann law: P = e x j x A x (T 4 –Tc 4 ) (8) Where: P is the net radiated power e is the emissivity coefficient (1 for ideal radiator) j is the Stefan’s constant (5.6703.10-8 W/m 2 .K4) A is the radiating area T is the temperature of radiator TC is the ambient temperature I.3.3. Thermal Conduction Conduction is a heat transfer by means of molecular agitation within a material without any motion of the material as a whole. If one end of a metal rod is at a higher tempera- ture, then energy will be transferred down the rod toward the colder end because the higher speed particles will collide with the slower ones with a net transfer of energy to the slower ones. For a heat transfer between two flat surfaces, such as heat loss through the wall of a house, the rate of conduction heat transfer is: Q = k x A x (Thot –Tcold) t d (9) Where: Q is the heat transferred with the time t k is the thermal conductivity of the barrier A is the conducting area T is the t emperature d is the thickness of the barrier Conceptually, the thermal conductivity can be thought as the rate of heat loss per unit area to the rate of change of temperature. (10) The net heat transfer is in the opposite direction of the temperature gradient For a stationary state and without internal heat source: [1]

2 T= 0 therefore for one dimensional equation T = Ax +B (A and B are constants)

Considering the following capacitor where T max. is the maximum temperature of capacitor (°C) located at the center of the capacitor T amb. is the application ambient temperature in operating conditions (°C) located at both terminations if the thermal transfer of the connections is enough efficient. Temperature profile inside the capacitor The thermal resistance Vc of the capacitor is composed on two parallel thermal resis- tance V: General Information

128www.exxelia.com info@exxelia.com Taping : dimensions Page revised 06/20 The thermal resistance Vc of the capacitor is: 1 = 2 Vc V (11) and V = L/2 A x l (12) therefore Vc = L 4 x A x l (13) Where l is the coefficient of thermal conductivity of the ceramic body W.cm –1 .C –1 A is the section surface (thickness x width) (cm 2 ) L is the length of the capacitor (cm) The geometry of the capacitor (A/S) influences the thermal resistance. For example 07 11 size (Exxelia reference=SHD) has a factor A/S more beneficial than 1111 size to reduce thermal resistance of the capacitor. Considering the non-stationary state, we must solve equation (10). For example if we consider a capacitor an initial temperature Tamb and a final temperature Tmax, we may use the following equation for the temperature evolution: [2] T(t) = Tmax. – (Tmax. –T amb.)exp (– t ) mCpVc (14) Where : m is the mass of the capacitor Cp is the thermal capacity Vc is the capacitor thermal resistance Example of the temperature evolution inside the capacitor where T amb = 25°C and T max = 28.3°C I.4. Global Power Model All the above parameters have to be kept in mind when designing a high RF power function. The capacitors used in the application should be fine-tuned to make sure their voltage rating, their current rating and their heat transfer capabilities are in line with the required specifications. Moreover, the specifications do not only include the capacitor by itself, but also the PCB properties and the environment where the complete system operates. Let’s consider for instance the Global Power Model of a single capacitor mounted on a PCB studied at a working frequency of 50 MHz. The component characteristics are as-follows: Type: EXXELIA CLE series Voltage rating: 7’000 V DC Capacitance value: 22 pF First, the size of the component will give the capacitor thermal resistance – its ability to dissipate heat. Then, in the PCB specification, we will look for its thermal resistance properties. The environment – how the system is working in normal/maximum opera - tion – will tell us the theoretical ambient temperature. Finally, the capacitor electrical par ameters will be used – capacitance value, voltage rating and ESR. All these data are compelled in a simulation program which calculates the maximum current rating of the capacitor for the considered system, at one particular frequency: As previously written, the current rating assigned to a capacitor is stated in one of two ways: voltage limited or power dissipation limited. The software calculates both limita- tions: Iv for the voltage and Ip for the power. Finally, the smallest value is taken as it rep resents the first limitation the user will reach when using the system. In the example above at 50MHz, the capacitor, according to its power dissipation limita- tion, should handle around 52A (Ip) but the voltage limitation will actually not allow it to h andle more than 34A (Iv). If the capacitance function has to handle more current, then the designer has to switch to the “n-chip” model and to use a combination of several capacitors, a.k.a as Power Capacitor Solutions. II. POWER CAPACITOR SOLUTIONS More RF power means either a higher current or a higher voltage, sometimes both. As the current and voltage laws are quite fixed for capacitors – physical limitations give few options on dielectric thickness and number of electrodes which are key to handle more power in a single component – the only way to handle more power, for a given ultra-low ESR series, is to increase the number of capacitors. This led to a new branch of capacitor knowledge dedicated to thermal and power anal - ysis, mechanical assembly, high temperature PCB soldering and specific RF test pro- cedures. Th e Power Capacitor Solutions are especially dedicated to applications where high reliability, high operating voltages, high operating currents, ultra-low ESR and tighter tolerances are required. Most of these applications are found in the following markets: Medical Electronics; Broadcasting Equipment; Semiconductor Manufacturing; Inductive Heating; LASER Power Supplies; MRI High Magnetic Environments; Military Systems. II.1. Parallel Combinations To deal with a higher operating current or to further reduce our ultra-low ESR, one can use combinations of HiQ ceramic capacitors in parallel – current rating multiplied. General Information

129 info@exxelia.comwww.exxelia.com General characteristics RF CAPACITORS Page revised 06/20 II.2. Series Combinations To deal with a higher operating voltage, one can use combinations of HiQ ceramic ca- pacitors in series, within the same dielectric die or using separate entities – voltage ra ting multiplied. II.3. Matched Sets To achieve non-standard total capacitance values or ultra-tight tolerances, EXXELIA can match capacitors using computer specific software. Another use of matched sets is to reduce the overall purchasing costs; when several capacitors are used in parallel, a given tight tolerance can still be obtained on the final assembly while using wider tolerance single chips. III. GUIDELINES Several factors have to be considered when designing high RF power applications and these factors are in fact all linked to the overall thermal management of the entire de- sign. III.1. Influence of ESR The capacitors with ultra-low ESR provide a higher maximum current for power dissi- pation limited operating conditions – as Ip = ƒ( 1 ) ESR – allowing the overall design to handle more RF power. Of course, the dissipation factor characteristics also have to be compliant with this increased power. In the example below, a 300W CW module at 350MHz is pushed above its limits to em - phasize the importance of ESR. In the same conditions, several capacitor types are monitored as DUT and the results are shown below: III.2. Influence of Magnetism The choice of Power Capacitor Solutions in high magnetic field environment is critical. EXXELIA has conducted several tests with both his final customers and external labo- ratories to extend his knowledge and develop better solutions. These solutions play a maj or role in reducing the overall system temperature. Please contact EXXELIA for any further information. III.3. Generic Comments The main guidelines to lower the overall thermal load on the design are listed hereafter: The thermal conductivity of all devices involved as well as board trace dimensions and material thickness have to be evaluated; The main part of the heat transfer is achieved by thermal conduction. Actually, around 80% of the power is dissipated by conduction, 15% by convection and 5% by radiation. Therefore, the greater part of heat transfer is through the terminations of the capacitors. In order to further improve the thermal path of a porcelain capacitor, one should use leads such as non-magnetic micro-strip silver ribbons. The leads also offer another advantage: when the thermal expansion coefficients of the ca - pacitor and the board are mismatched, they may act as a mechanical strain relief; To avoid reducing drastically the thermal conductivity at some specific locations within the circuit, one should avoid reducing the width of the board trace and using wires; Heat sinks and blown cool air will also help to reduce the additional sources of heat generated by passive components, FETs and active gain blocks; Paschen’s law defines the voltage rating for a given pressure. Therefore, depending on the operating conditions, the pressure parameter has to be considered (coating, voltage safety margin...); Using Power Capacitor Solutions with parallel combinations will extend the RF pow - er handling. For instance, N capacitors in parallel will led approximately to an ESR which is N-times lower than the one of a single capacitor, thus increasing the maxi- mum current handling capability by a factor of d N. IV. CONCLUSION This article has described the major factors to consider while designing a Power Ca- pacitor Solution for high RF power applications. The benefits of using Power Capacitor Solutions are numerous: high RF power, enhanced reliability with pre-tests, ultra-low ESR, reduced costs with matched sets, availability of specific capacitance values and tolerances, fewer assembly stages, customized styles... To ensure the highest level of reliability in high RF power designs, factors such as heat transfer, maximum voltage and current ratings, thermal characteristics of the circuit devices and ways to remove the heat should be taken into account. EXXELIA designs Application-Specific Solutions based on parallel and series combina - tions of designer-acclaimed capacitors. Customer requirements are addressed by com- puter matching sets, a wide range of mechanical configurations, a protective coating an d adapted ribbons or wires which have enabled EXXELIA to extend overall perfor- mance while decreasing the total cost of ownership. EXXELIA - by knowing the ESR and power dissipation of its capacitors at the application operating frequencies - helps the designers by simulating the thermal behavior of the assembly and proposing the optimum Power Capacitor Solution. Ref [1] Thermal Conductivity wikipédia [2] Cours de thermique P .ROUX (2016) General Information

131 info@exxelia.comwww.exxelia.com General characteristics RF CAPACITORS Page revised 06/20 On November the 9th 2011, the test set was completed without any problem to report. III. CONCLUSIONS These tests have shown the reliability of Temex-Ceramics capacitors in operation. Each of the HiQ capacitors under test has been exposed during 4 months to their maximum RF power signal rating, heated up to 125°C continuously and without any failure or event to report. This endurance test, along with the European Space Agency qualification (see ESA. pdf on our website), the regular life test performed on standard production lots (see Reliability_Data.pdf) and the MIL class R rating (see MIL.pdf) highlight, the high quality and reliability associated with EXXELIA capacitors. IV. APPENDIX The capacitance of the capacitor under test may vary during the temperature ramp up time. Additionally it may vary if there is a beginning of destruction process. If the frequency was kept constant, the RF power coupled into the capacitor under test will decrease. Hence the temperature control loop will increase the RF power. This may lead to a situation where the temperature decreases when the RF power cannot be increased any more. In order to cope with this, there is a second control loop that varies the frequency in order to minimize the reflected power. So the RF power amplifier stage will always be able to deliver the necessary power to keep the temperature constant. As PC board, a ceramic material from Rogers is used, the RO4350 material. Comparing to the standard FR4 material the ceramic board has the following advantages: improved heat conductivity; improved heat resistance and improved electrical strength. Due to the improved electrical strength, it was possible to have a ground plane on the bottom side of the board. The coupler bar rests on a PTFE insulation. It was meant to be a heat insulation. However, during pre-tests, it became apparent that the PTFE material spreads the heat more than expected. In order to improve the heat insulation towards ground and the ambient air, the complete setup is now surrounded by a layer of glass wool. All these efforts led to the following results: the temperature difference between the RF on time and the RF off time is less than 10°C and a total RF power of approximately 35 Watts is sufficient to heat the capacitors to 125°C. The capacitors under test are soldered with a non lead solder, Sn95Ag4Cu1 which has an extended temperature range also. Figure 4 shows the test setup. Figure 4 Both control loops are realized by a micro controller. Additionally, the micro controller provides an RS-232 interface to set some configuration values. A LC display shows warning messages also and some status information like temperature, RF power, etc. The test generator works completely self sustained. It controls the temperature, RF power, frequency and all other parameters. The test generator takes also care that it remains itself within safe limits like maximum cool plate temperature, maximum forward power, maximum reflec ted power, frequency within a given bandwidth, etc. The test generator is connected to a remote computer. General Information

132www.exxelia.com info@exxelia.com Taping : dimensions Page revised 06/20 NON MAGNETIC CAPACITORS ULTRA-LOW ESR, RF & MICROWAVE SYSTEMS In today’s world of medical systems, there is a trend in MRI equipment to increase the magnetic field – mostly from 1.5T to 3.0T. The higher signal strength obtained can then be translated into higher spatial resolution, enabling doctors to see finer details on the images. Whence the importance of non magnetic properties in the electronic compo - nents used in such systems. At present, components with a significant magnetic response create parasitic black dots on the images, which may result in inaccurate or more difficult diagnosis – for instance the electrolytic capacitors aluminum or tantalum-based (paramagnetic). Not only this, but magnetic losses will overheat the system and reduce the reliability of the electronic components. Problems such as these - system temperature and component reliability - due to a significant magnetic response can moreover occur in any electronic equipment, though usually with a lower level of criticality. To further improve reliability in such systems: The electronic components used in MR systems, like the multilayer ceramic capaci - tors from EXXELIA, must have a very low magnetic response (diamagnetic); A classification is needed for R&D engineers designing such systems, to quantify the magnetic response. This way, any component used in new developments – ir- respective of its configuration, with wires or ribbons, etc. - would be guaranteed for MR a pp lications; Non magnetic components should also be proposed for non medical applications involving high RF power, so as to minimize losses and thereby improve the overall system performance. (the Bordeaux Institute of Chemistry of condensed materials), a laboratory under the http://www.cnrs.fr/index.html I. MAGNETIC FIELD NOTIONS I.1. Magnetic Permeability This is the degree of magnetization of a material that responds linearly to an applied magnetic field. The magnetic permeability (µ) of a given material is related to the permeability of vacuum (µ0, in Henries per meter) times its relative permeability R , no unit): µ = µ 0 x µ R µ0 is a universal constant, the magnetic constant, and has the value. 4 ∏ x 10 –7 H/m µR is related to the material under test. In vacuum, air, gases, ... µ R is equal to 1. These materials do not modify magnetic field lines. There are three types of materials: Diamagnetic (silver, copper, gold, lead, ...) in which µ R ≤ 1 and close to 1 Paramagnetic (platinum, aluminum, magnesium, ...) where µ R ≥ 1 and close to 1 Ferromagnetic (nickel, cobalt, iron, ...) with µ R >> 1 I.2. Paramagnetism Paramagnetism is a form of magnetism which occurs only in the presence of an exter- nally applied magnetic field. Paramagnetic materials are attracted to magnetic fields, and hence have a relative magnetic permeability µ R greater than one - or, equivalently, positive magnetic susceptibility. However, unlike ferromagnets, which are also attract- ed to magnetic fields, paramagnets do not retain any magnetization in the absence of an externally applied magnetic field. I.3. Diamagnetism Diamagnetism is a weak repulsion from a magnetic field. It is form of magnetism that is exhibited by a substance only in the presence of an externally applied magnetic field. All materials show a diamagnetic response in an applied magnetic field but for materi- als which show some other form of magnetism (such as ferromagnetism or paramag- netism), the diamagnetism is completely overpowered. General Information

133 info@exxelia.comwww.exxelia.com General characteristics RF CAPACITORS Page revised 06/20 Substances which display only, or mostly, diamagnetic behavior are termed diamag- netic materials, or diamagnets. Materials referred to as diamagnetic are those which are usually considered by non-physicists as “non magnetic”, and include water, DNA, most organic compounds such as petroleum and certain plastics, and many metals such as mercury, gold and bismuth. I.4. Ferromagnetism Ferromagnetism is defined as the phenomenon by which materials, such as iron, in an external magnetic field, become magnetized and remain so for a period after the material is no longer in the field. I.5. Magnetic Susceptibility Magnetic susceptibility (Xv) is the degree of magnetization of a material in response to an applied magnetic field. If Xv is positive, then (1+Xv) > 1 and the material is said to be paramagnetic. In this case, the magnetic field is strengthened by the presence of the material. Conversely, if Xv is negative, then (1+Xv) < 1, and the material is termed diamagnetic. As a result, the magnetic field is weakened in the presence of the material. Class Xv dependant on B? Dependent on temperature? Hysterisis? Example Xv Diamagnetic No No No Water –9 x 10 –6 Paramagnetic No Yes No Aluminum 2.2 x 10 –5 Ferromagnetic Yes Yes Yes Iron 3000 I.6. Units The International System of Units (abbreviated “SI” from the French “Système Interna- tional d’unités”) is the modern form of the metric system. It is the world’s most widely us ed system of units, both in everyday commerce and in science. The older metric sys- tem included several base units. The SI was developed in 1960 from the old meter-ki- logram-second (MKS) system, rather than the centimeter-gram-second (CGS) system, whi ch, likewise, had a number of variants. The SI introduced several newly named units. The SI is not static, but a living set of standards in which units are created and definitions are modified through international agreement as the technology of measurement progresses. Parameter CGS System Correcting Factor SI unit Magnetic Induction B G (gauss) 10 –4 T (tesla) Applied Field H Oe (oersted) 10 3 /4π A/m Magnetization Mg emu/erg/G 1 A.m 2 /kg Mass Susceptibility Xg cm 3 /g 4π x 10 –3 m 3 /kg Permeability µ – 4π x 10 –7 H/m NB: when a material is paramagnetic, the best way to describe it is in terms of magnetic susceptibility Xg. When the material is ferromagnetic, magnetization Mg is preferred. The following formula could be used: Mg = Xg x H One should also note that: Xv = Xg. [density] II. EXPERIMENTAL SETUP II.1. Magnetometer Measurements were taken using a Quantum Design magnetometer, model MPMS-5. The MPMS provides solutions for a unique class of sensitive magnetic measurements in key areas such as high-temperature superconductivity, biochemistry and magnetic recording media. This began developing significantly in 1988 with the discovery of a new class of superconducting materials. While the basic application has not changed greatly, its use has expanded to more than 530 installations worldwide. The modular MPMS design integrates a SQUID detection system - Superconducting Quantum Interference Device, a precision temperature control unit residing in the bore of a high field superconducting magnet, and a sophisticated computer operating sys - tem: Maximum Sample Size: 9 mm; Field Uniformity: 0.01% over 4 cm; Temperature Range: 1.9-400 K; Sensitivity of 10 –7 emu-CGS. II.2. Superconducting Quantum Interference Device The main components of a SQUID (see Fig. 1) magnetometer are: (a) a superconducting magnet; (b) a superconducting detection coil which is coupled inductively to the sam- ple; (c) a SQUID connected to the detection coil; (d) a superconducting magnetic shield. A description of each one is given below: Fig. 1 II.2.1. Superconducting Magnet A superconducting magnet is a solenoid made of superconducting wires (see Fig. 2). The solenoid must be kept at liquid helium temperature in a liquid-helium medium. The uniform magnetic field is produced along the axial cylindrical bore of the coil. Supercon- ducting solenoids that produce magnetic fields in the range 5-18 Tesla are now com- mercially available. A superconducting magnet requires an appropriate programmable b ipolar power supply for operation. Fig. 2 General Information

134www.exxelia.com info@exxelia.com Taping : dimensions Page revised 06/20 II.2.2. Superconducting Detection Coil This is a single piece of superconducting wire, configured as a second-order gradiome- ter (see Fig. 3). This pick-up coil system is placed in the uniform magnetic field region of the solenoidal superconducting magnet. Fig. 3 II.2.3. SQUID High sensitivity is possible because this device responds to a fraction of the flux quan- tum. The SQUID device is usually a thin film that functions as an extremely sensitive current-to-voltage-converter. A measurement is taken in this equipment by moving the sample through the second-order gradiometer. Hence, the magnetic moment of the sample induces an electric current in the pick-up coil system. A change in the magnetic flux in these coils modifies the persistent current in the detection circuit. The current change in the detection coils then produces a variation in the SQUID output voltage pro - portional to the magnetic moment of the sample. II.2.4. Superconducting Magnetic Shield This is used to shield the SQUID sensor from the fluctuations of the ambient magnetic field in the magnetometer’s location and from the large magnetic field produced by the superconducting magnet. II.2.5. Applications This kind of equipment can be used to measure: (a) the real and imaginary components of the AC magnetic susceptibility as a function of frequency, temperature, AC magnetic field amplitude and DC magnetic field value; (b) the DC magnetic moment as a function of temperature, DC magnetic field, and time. II.3. Capsule Magnetization The sample under testing has to be placed in a small capsule of 5-mm diameter and 8-mm length. Submitted to a magnetic field, the sample acquires a magnetization. The capsule is then placed in a 6-cm tube which results in a field strength variation. This is then measured in the SQUID and converted into a magnetization (uem-CGS unit in our case). Thin paper is used to secure the sample in place inside the capsule. Measurements were made with a controlled temperature (298.0±0.1K) and in the 0 to 3.5T range (35’000 Oe) as the magnetic field declined. The first step before measuring any sample is to define the magnetization of the sam - ple carrier, i.e. the capsule with some thin paper. Then, as the samples are measured, all t he magnetization values are corrected using the pattern below: The signal from the capsule is diamagnetic and very weak. The signal from the capsule +the paper assembly is more complex to determine, combining a strong diamagnetic signal and a small ferromagnetic contribution (impurities in the paper material). A constant corrective factor was then applied on all the measurements as a first ap - proximation. III. LABORATORY MEASUREMENTS The aim of this study is to define a range of magnetization values within which electron- ic components may be considered as non-magnetic and suitable for critical medical and high RF po wer applications. Several components were therefore tested to define a spectrum as wide as possible. For instance, if we consider the high-Q multilayer ceramic capacitor: we started with the chip alone, without even its terminations, adding a new variable - such as copper or silver-palladium or nickel terminations, silver ribbons and finally laser marking - at each subsequent stage. Using this protocol, it is easy to see the effect of each variable on the final magnetization. The magnetization in the charts below is given per gram. Each sample - or set of sam - ples - is then weighed before the test run. The following designs were tested: Designation Number of Samples Weight (mg) Batch Number 501 CHB 4R7 3 155.1 C706527 501 CHB 4R7 BC 1 61. 5 C 649212 501 CHB 4R7 BC1L 1 133.6 C6492 12-0 501 CHB 4R7 BAL 1 57. 5 5219 6 501 CHB 4R7 BS 1 61. 2 C645208-2 silver leads type 1 2 55.4 CK/6297 silver leads type 2 2 57. 2 CK/BC/2205 AT9401 1 58.6 OT0041006P AT9402 1 60.8 OT0111206P AT9410 2 194.0 OT0020806P The descriptions of the samples used are as follows: 501 CHB 4R7 B size (1111) capacitor, 4.7pF , no termination 501 CHB 4R7 BC B size (1111) capacitor, 4.7pF , copper termination 501 CHB 4R7 BC1L B size (1111) capacitor, 4.7pF , copper termination, leads 501 CHB 4R7 BAL B size (1111) capacitor, 4.7pF , silver-palladium termination 501 CHB 4R7 BS B size (1111) capacitor, 4.7pF , nickel termination silver leads type 1 silver leads used with B size capacitors silver leads type 2 silver leads currently undergoing qualification AT940 cer amic trimmer capacitor, 0.6 to 2.0pF , gold termination AT9402 cer amic trimmer capacitor, 1.0 to 5.0pF , gold termination AT9410 cer amic trimmer capacitor, 4.0 to 18pF , gold termination III.1. DUT: 501 CHB 4R7 This sample shows a slightly paramagnetic behavior. Its magnetic susceptibility Xg is around 10 –7 uem.CGS/g which is a very low value. General Information

135 info@exxelia.comwww.exxelia.com General characteristics RF CAPACITORS Page revised 06/20 III.2. DUT: 501 CHB 4R7 BC This sample has a slightly paramagnetic behavior. Its magnetic susceptibility Xg is around 10 –7 uem.CGS/g which is a very low value. III.3. DUT: 501 CHB 4R7 BS This sample exhibits a very strong magnetic behavior with a magnetization around 0.6 uem.CGS/g. III.4. DUT: 501 CHB 4R7 BAL This sample has paramagnetic behavior with a magnetic susceptibility Xg around 2.3x10 –7 uem.CGS/g. III.5. DUT: 501 CHB 4R7 BC1L This sample shows a paramagnetic behavior with a magnetic susceptibility Xg around 0.4x10 –7 uem.CGS/g. III.6. DUT: SILVER LEADS These two samples exhibit very similar diamagnetic behavior. The magnetic susceptibil- ity Xg is in both cases around -1.6x10 –7 uem.CGS/g. III.7 . DUT: AT9401 This sample has a paramagnetic behavior with a relatively high magnetic susceptibility Xg, around 7 .1x10 –7 uem.CGS/g. General Information

136www.exxelia.com info@exxelia.com Taping : dimensions Page revised 06/20 III.8. DUT: AT9402 This sample has a paramagnetic behavior with a relatively low magnetic susceptibility Xg around 10 –7 uem.CGS/g. III.9. DUT: AT9410 This sample has a paramagnetic behavior with a relatively low magnetic susceptibility Xg around 10 –7 uem.CGS/g. IV. ANALYSIS IV.1. Influence Of Leads From the above chart, the following points may be deduced: The copper termination slightly increases the magnetic susceptibility of the chip but the total value remains very low and the paramagnetic behavior is suitable for non-magnetic applications; As the ribbon shows strong paramagnetic behavior, the assembly made with the capacitor and the leads has an even lower magnetic susceptibility than the chip alone. This means that for a very strong requirement for non-magnetic criteria, the assembly made of capacitor and leads is better than the capacitor itself; In theory, it should be possible to decrease the magnetic susceptibility of the as - sembly – capacitor and leads – still further to reach a nearly a nil value, by using thic ker or longer silver leads. These would also improve the heat transfer and there- fore allow higher working power. IV.2. INFLUENCE OF TERMINATIONS IV.2.1. Copper Versus Nickel Terminations From the above chart, the following points may be deduced: We are comparing here a magnetic termination – nickel barrier one – and a non-magnetic termination – copper barrier one. Naturally, the nickel termination cannot be used for non-magnetic applications but it enables us to define a limit above which a termination should not be classified as non-magnetic; As we are using a logarithmic axis, the best magnetization value to consider for this limit seems to be around 0.10 uem.CGS/g; Both copper and silver-palladium terminations are below this theoretical limit of 0.10 uem.CGS/g and can therefore be considered as non-magnetic. VI.2.2. Copper Versus Silver-Palladium Terminations From the above chart, the following points may be deduced: The copper or silver-palladium terminations slightly increase the magnetic suscep- tibility of the chip but the total value remains very low and the paramagnetic behav- ior is suitable for non-magnetic applications; General Information

137 info@exxelia.comwww.exxelia.com General characteristics RF CAPACITORS Page revised 06/20 The capacitor with silver-palladium terminations exhibits a magnetic susceptibility around three times higher than that of the capacitor with copper terminations. This means that for a very strong requirement for non-magnetic criteria, the copper ter- minations are better than the silver-palladium ones; B oth these terminations are suitable for non-magnetic applications as their magne- tization is always below 0.10 uem.CGS/g. IV.3. Trimmer Capacitors On the basis of the 0.10 uem.CGS/g limit previously discussed, the behavior of ceramic trimmer capacitors could also be studied. From the above chart, the following points may be deduced: These three ceramic trimmer capacitors are all suitable for non-magnetic applica- tions, as their magnetization is always below 0.10 uem.CGS/g; Th e AT9402 and AT9410 exhibit very good paramagnetic behavior and are therefore recommended for applications with a very strong non-magnetic requirement. IV.4. PERMEABILITY IV.4.1. Definitions Some engineers prefer to define the magnetic behavior of a component using its per- meability. Therefore, an empirical limit above which components are not suitable for no n-magnetic applications seems to have been set at 1.0005 for the relative perme- ability µ R . This relative permeability could be deduced from our measurements using the following method: Mass susceptibility Xg is given by the slope of the Mg = f (H) curve Volume susceptibility Xv is equal to: Xg x [density] Relative permeability is finally equal to: 1 + Xv IV.4.2. Examples Let’s consider the 501 CHB 4R7 BC we measured previously. From the experimental curve, we find a mass susceptibility Xg of 10 –7 uem.CGS. As our components exhibit a density around 4, the volume susceptibility Xv is then equal to 4 x 10 –7 uem.CGS. Finally, permeability µ R is then equal to 1.0000004, which is well below the theoretical limit of 1.0005 Even if there is no mass susceptibility Xg for a magnetic component – except at very low fields but customer’s applications are far above this range – we can run the exercise for the 501 CHB 4R7 BS studied previously. From the first two dots on the experimen - tal curve, we find a mass susceptibility Xg of 0.5 x 10 –3 uem.CGS. As our components exhibit a density around 4, the volume susceptibility Xv is then equal to 2 x 10 –3 uem. CGS. Finally, permeability µ R is then equal to 1.002, which is, as expected, well above the theoretical limit of 1.0005 V. CONCLUSIONS C.N.R.S. and EXXELIA have conducted a comprehensive study of the non-magnetic be- havior of electronic components. This document describes the results of that study on mul tilayer porcelain capacitors and ceramic trimmer capacitors. It flags up the following points: The measurements made on magnetic and non-magnetic components enable us to define a first limit for magnetization of around 0.10 uem.CGS/g above which compo - nents can no longer be rated as non-magnetic; All our non-magnetic components – both porcelain capacitors and ceramic trimmer capacitors – are below this limit and are therefore Magnetism-free Rated. To enable R&D engineers to quickly distinguish in the EXXELIA portfolio which components are guaranteed for non-magnetic applications, the following specific logo will be added to specific series in our Application datasheets: The above logo certifies that a specific electronic component is Magnetism-free Rated; Concerning non-magnetic applications - mainly medical systems -, the best solu- tion to obtain a very low magnetization ceramic capacitor is to use one with copper t ermin ations; The silver leads, made from pure silver, are completely non-magnetic; Concerning standard applications like telecom, industrial, military or space systems, as any system induces a magnetic field, the use of non-magnetic components would rule out magnetic losses and therefore improve the overall performances, particularly in switch-mode operations. General Information

4www.exxelia.com info@exxelia.com Page revised 06/20 Taping : dimensionsGeneral Information MATERIALS EXPERT For 50 years and as a market leader, EXXELIA’s comprehensive knowledge of the materials properties and performances have enabled us to design capaci- tors in Porcelain, NPO, BX, 2C1, BP , X7R and –2200ppm/°C ceramics. CUSTOM DESIGNS Our catalog products don’t meet your application? Based on the valuable experience accumulated over the design of 2,000+ spe- cific ceramic capacitors, you can trust EXXELIA to define a qualitative custom solution in a time effective manner. NO OBSOLESCENCE Choosing a standard or custom EXXELIA product means you won’t have to wor- ry about obsolescence. TYPICAL APPLICATIONS

• Aerospace & Defense: cockpit panels, flight control, radio systems, missile guidance systems…
• Space: military and commercial satellites, launcher…
• Medical: MRI, external defibrillators, implantable devices…
• Telecommunications: base stations…
• Oil and gas: drilling tools, MWD, LWD, wellheads… ISO 9001 AND AS9100C Quality is at the core of Exxelia’s corporate culture. Each sites has its own cer- tifications. CERTIFICATIONS Capacitors manufactured by EXXELIA comply with American and European standards and meet the requirements of many international standards. For Space qualified parts (ESA QPL), please refer to our catalog «Ceramic ca- pacitors for Space applications». QUALITY & RELIABILITY EXXELIA is committed to design and manufacture high quality and reliability products. The test cycles reproducing the most adverse operating conditions over extended periods (up to 10 000 hours) have logged to date well over 5.10 hours/°Component. Failure rate data can be provided upon request. CONFLICT MINERALS EXXELIA is committed to an approach based on «Conflict Minerals Compli- ance». This US SEC rule demands complete traceability and a control mecha- nism for the mineral procurement chain, encouraging importers to buy only «certified» ore. We have discontinued relations with suppliers that procure from the Demo- cratic Republic of the Congo or an adjoining country. ENVIRONMENT EXXELIA is committed to applying a robust environmental policy, from product design through to shipment. To control its environmental footprint and recon- cile this with the company’ functional imperatives, our environmental policy provides for the reduction or elimination of hazardous substances. We also focus on compliance with European Union directives and regulations, notably REACH and RoHS. RoHS COMPLIANCY SMD CAPACITORS The capacitor terminations are generally protected by a nickel barrier formed by electrolytic deposit. This barrier gives chip capacitors leaching performance far exceeding the requirements of all applicable standards. The nickel barrier guarantees a minimum resistance to soldering heat for a period of 1 minute at 260°C in a tin-lead (60/40) or tin-lead-silver (62/36/2) bath without noticeable alteration to the solderability. It also allows repeated soldering-unsoldering and the longer soldering times required by reflow techniques. However nickel barrier amplifies thermal shock and is not recommended for chip sizes equal or greater than CNC Y (30 30) - (C 282 to C 288 - CNC 80 to CNC 94). LEADED COMPONENTS As well as for SMD products, leaded capacitors ranges can also be RoHS. These products, which are characterized by the suffix «W» added to the commercial type, are naturally compatible with the soldering alloys used in RoHS mounting technology. The connections coating is generally an alloy SnAg (with a maxi- mum of 4% Ag). However, on a few products that EXXELIA will precise on re- quest, the coating is pure silver. 10 - 60 µm Metallization Silver-Palladium (or Silver) Nickel barrier Tinning: Tin-Lead No RoHs Pure Tin RoHS (W) CerUflex (polymer) 2 - 3 µm 3 - 8 µm

5 info@exxelia.comwww.exxelia.com Page revised 01/11 General characteristics GENERAL INFORMATION Selection Guide Main Characteristic Model Size Dielectric Voltage Capacitance Temperature Coating Leads Mounting Main Applications Page Uncoated Varnished Conformal coated Molded Self-protected DIL Ribbon Axial Radial SMD Through hole STANDARD CEC / CNC SERIES Low and Medium Voltage Chips Capacitors 0402 to 3040 NPO BX 2C1 X7R 10V to 1,000V 1pF to 12 µF –55°C to +125°C • • Precision, stability, decoupling 22 NON MAGNETIC CHIPS SERIES Low and Medium Voltage Chips Capacitors 0505 to 2220 NPO X7R 50V to 500V 10pF to 1 µF –55°C to +125°C • • Precision, stability, decoupling 26 OP SERIES Open Mode Chips Capacitors 0805 to 2220 NPO X7R 10V to 100V 1pF to 4.7 µF –55°C to +125°C • • Precision, stability, decoupling. Signifi cantly reduce risk of short circuit CER /CNR SERIES Low Inductance Chips Capacitors 0306 to 0 612 NPO X7R 16V to 100V 1pF to 270nF –55°C to +125°C • • Decoupling, low ESL, medical embedded 30 C3N / C4N / C3E / C4E SERIES Capacitors Arrays - NPO X7R 25V to 200V 4.7pF to 33nF –55°C to +125°C • • Medical embedded, miniaturisation 32

30 S4 SERIES

• NPO X7R 40V to 100V 470pF to 820nF –55°C to +125°C • • • Railway 33 TCE / TCX / TCN / TXR MOLDED SERIES Radial Molded Capacitors NPO BX 2C1 X7R 25V to 500V 1pF to 4.7 µF –55°C to +125°C • • • Precision, stability, decoupling 34 LA SERIES Radial Molded Capacitors NPO Temp. coeff. 25V to 63V 1pF to 680nF –55°C to +125°C • • • Decoupling 36 TCE / TCX / TCN / TXR AXIAL SERIES Axial Molded Capacitors NPO BX - 2C1 X7R 25V to 500V 1pF to 3.9 µF –55°C to +125°C • • • Precision, stability, decoupling 38 TCE / TCX / TCN / TXR CONFORMAL COATED SERIES Radial Dipped Capacitors NPO BX - 2C1 X7R 25V to 500V 1pF to 6.8 µF –55°C to +125°C • • • Precision, stability, decoupling 40 NON MAGNETIC CONFORMAL COATED SERIES Radial Dipped Capacitors - NPO X7R 63V to 500V 180pF to 1 µF –55°C to +125°C • • • Precision, stability, decoupling 42 CK SERIES Radial Molded Capacitors - BX 25V to 250V 10pF to 1 µF –55°C to +125°C • • • Decoupling 44 HIGH VOLTAGE C Series High voltage chips Capacitors 1812 to 16080 NPO C4xx X7R 200V to 10kV 10pF to 39 µF –55°C to +125°C • • Power supply, voltage multiplier, radars.
• aerospace
• space
• defence
• railways TCL / TCK Series High voltage Molded & Varnished leaded Capacitors NPO C4xx X7R 200V to 10kV 10pF to 39 µF –55°C to +125°C • • • • 54 TCF Series High voltage Conformal coated leaded Capacitors NPO C4xx X7R 200V to 10kV 10pF to 39 µF –55°C to +125°C • • • 57 TKD Series High voltage Conformal coated leaded Capacitors NPO C4xx X7R 200V to 10kV 10pF to 39 µF –55°C to +125°C • • • 60 CS Series High voltage Stacked Capacitors 2220 to 16080 NPO C4xx X7R 1kV to 10kV 220pF to 15 µF –55°C to

6www.exxelia.com info@exxelia.com Page revised 06/20 Taping : dimensionsMain Characteristic Model Size range Dielectric Voltage range Capacitance range Temperature range Coating Leads Mounting Main Applications Page Uncoated Varnished Conformal coated Molded Self protected DIL Ribbon Axial Radial SMD Through hole HIGH CAPACITANCE R SERIES (CHIPS) High Capacitance Chips Capacitors 2225 to 45107 X7R 50V to 500V 47nF to 27 µF –55°C to +125°C

• • Switch Mode Power Supply, filtering, smoothing, decoupling.
• aerospace
• space
• defence R SERIES (LEADED) Radial Leaded Conformal Coated Capacitors - X7R 50V to 500V 47nF to 27 µF –55°C to +125°C
• •• 77 TEF SERIES Radial Leaded Conformal Coated Capacitors - NPO 63V to 500V 10nF to 680nF –55°C to +125°C
• •• 80 SV / SC SERIES High Capacitance Stacked Capacitors 2225 to 125205 X7R 50V to 500V 47nF to 390 µF –55°C to +125°C CNC3X SERIES High Capacitance Stacked Capacitors 2220 to 4040 X7R 16V to 25V 1.2 µF to 68 µF –55°C to +125°C CEC5X SERIES High Capacitance Stacked Capacitors 3033 to 80150 NPO 63V to 500V 10nF to 6.8 µF –55°C to +125°C TEP / TEV SERIES High Capacitance Stacked Capacitors - NPO 63V to 500V 10nF to 6.8 µF –55°C to +125°C
• •• 93 TCN8X SERIES High Capacitance Molded Stacked Capacitors - X7R 63V to 500V 0.47 µF to 120 µF –55°C to +125°C
• •• 95 HIGH TEMPERATURE CE / CN SERIES High Temperature Chips Capacitors 0402 to 3040 NPO X7R 16V to 100V 1pF to 8.2 µF –55°C to +250°C
• • Oil drilling, motor control, braking systems. 100 SCT SERIES High Temperature Stacked Capacitors 2225 to 125205 X7R 50V to 500V 47nF to 390 µF –55°C to +2 15°C TCE / TCN MOLDED SERIES HT High Temperature Molded Capacitors - NPO X7R 16V to 100V 1pF to 10 µF –55°C to +220°C
• •• • 107 TCE / TCN SELF-PRO- TECTED SERIES High Temperature Self-Protected Capacitors - NPO X7R 25V to 500V 10pF to 3.9 µF –55°C to +250°C
• •• • 109 TCH SERIES High Temperature High Voltage Capacitors - NPO X7R 200V to 10kV 10pF to 15 µF –55°C to +250°C
• •• 111 FEED-THRU TBC SERIES Discoidal Capacitors - NPO X7R 25V to 1kV 10pF to 12 µF –55°C to +125°C
• • Very low ESL 115 BPM SERIES Planar Array - X7R 25V to 200V 330pF to 68nF –55°C to +125°C
• • Very low ESL, miniaturisation 117 Selection Guide

7 info@exxelia.comwww.exxelia.com Page revised 06/20 General characteristics GENERAL INFORMATION Selection Guide Main Characteristic Model Size range Dielectric Voltage range Capacitance range Temperature range Coating Leads Mounting Main Applications Page Uncoated Varnished Conformal coated Molded Self protected DIL Ribbon Axial Radial SMD Through hole HIGH Q XBL SERIES Broadband

0402 X7R 16V 100nF

–55°C to +125°C • • DC Blocking, Coupling, Bypassing 138 UBL SERIES Broadband –55°C to +125°C • • 140 UBZ SERIES Broadband

0201 X5R

–55°C to +105°C • • 142 CH SERIES Classic HiQ 0505

1111 P100

1.5kV 0.1pF to 1nF –55°C to +175°C • • •• Cellular base station amplifier, MRI. 144 SH SERIES Super HiQ 0402 to 1210 NPO 25V to 1.5kV 0.2pF to 1nF –55°C to +150°C • • •• Cellular base station equipment Broadband Point to point/ multi-point radios RF generators 147 SHD / SHR SERIES Reverse Geometry 0709

0711 NPO 500V

0.5pF to 100pF –55°C to +175°C • • 150 NHB SERIES High Self Resonant Frequency

1111 NPO 500V

0.3pF to 100pF –55°C to +175°C • • 152 CP SERIES High Power 2225

4040 P100

–55°C to RF power amplifier Plasma chamber MRI coils 154 CL SERIES High Power 2225 to 7065 NPO 200V to 7kV 1pF to 10nF –55°C to RF power amplifier Plasma chamber MRI coils 158 ADDITIONAL AVAILABLE RANGES (consult our website) STANDARD TCE1X Series - NPO 63V to 100V 0,5pF to 10nF –55°C to +125°C • •• Precision, stability, decoupling - TCN19 Series - 2C1 63V to 250V 10pF to 1 µF –55°C to +125°C • •• Decoupling TCN3X Series - 2C1 50V to 100V 100pF to 1,8 µF –55°C to +125°C • •• - LA6 Series - 2C1 25V to 63V 100pF to 1 µF –55°C to +125°C • •• - HIGH VOLT. H Series 0805 to 6560 NPO X7R 1kV to 10kV 2pF to 390nF –55°C to Power supply, voltage multiplier, radars. HIGH CAPACITANCE CNC5X Series 3033 to 80150 X7R 63V to 500V 0,1 µF to 180 µF –55°C to Switch Mode Power Supply, filtering, smoothing, decoupling.

• aerospace
• space
• defence CNC8X Series (chips) 3033 to 33110 X7R 63V to 400V 47nF to 27 µF –55°C to +125°C • • - CNC8X Series (DIL) 3333 to 80150 X7R 63V to 400V 47nF to 180 µF –55°C to TCP / TCV8X Series 3333 to 80150 X7R 63V to 400V 47nF to 180 µF –55°C to +125°C • •• - TCP / TCV5X Series 3033 to 80150 X7R 63V to 500V 0,1 µF to 180 µF –55°C to +125°C • •• - TCF Series - X7R 63V to 500V 0,1 µF to 18 µF –55°C to +125°C • •• - HIGH TEMP. CNC25X Series 3033 to 5550 X7R 50V 1 µF to 33 µF –55°C to Oil drilling, motor con- trol, braking systems. - HIGH Q CNW Series - X7R 100V to 300V 10nF to 1 µF –55°C to Power amplifier SPT519 / CAW CEW Series - NPO 100V to 300V 10nF to 1 µF –55°C to

8www.exxelia.com info@exxelia.com Page revised 06/20 Taping : dimensions MLCC STRUCTURE Terminations Ceramic Tin Tin / Lead Gold (Solderable layer) Electrodes Margins Silver or Silver / Palladium (electrodes contact layer) Polymer (crack protection layer) Nickel or Copper barrier (leaching protection layer) EQUIVALENT CIRCUIT Capacitor is a complex component combining resistive, inductive and capaci- tive phenomena. A simplified schematic for the equivalent circuit is: Ls Rs C IR DIELECTRIC CHARACTERISTICS Insulation Resistance (IR) is the resistance measured under DC voltage across the terminals of the capacitor and consists principally of the parallel resistance shown in the equivalent circuit. As capacitance values and hence the area of dielectric increases, the IR decreases and hence the product (C x IR) is often specified in Ω.F or MΩ. µF. The Equivalent Series Resistance (ESR) is the sum of the resistive terms which generate heating when capacitor is used under AC voltage at a given frequency (f). Dissipation factor (DF) is the ration of the apparent power input will turn to heat in the capacitor: DF = 2π f C ESR When a capacitor works under AC voltage, heat power loss (P), expressed in Watt, is equal to: P = 2π f C Vrms 2 DF The series inductance (Ls) is due to the currents running through the elec- trodes. It can distort the operation of the capacitor at high frequency where the impedance (Z) is given as: Z = Rs + j (Ls.q - 1⁄(C.q)) with q = 2πf When frequency rises, the capacitive component of capacitors is gradually canceled up to the resonance frequency, where : Z = Rs and LsC.q 2 = 1 Above this frequency the capacitor behaves like an inductor. P100 NPO N2200 (C4xx) BX 2C1 X7R Dielectric material Porcelain Magnesium titanate or Neodynium baryum titanate Barium zirconate titanate Baryum titanate (BaTiO 3 ) Dielectric constant 15 – 18 20 – 85 450 2,000 – 5,000 Electrode technology PME (Precious Metal Electrodes): Ag/Pd Capacitance variation between –55°C and +125/°C without DC voltage (100±30)ppm/°C (0±30)ppm/°C (–2,200±500) Capacitance variation between –55°C and +125/°C with DC rated voltage 0 -15% 15% –25% 20% –30% Not applicable Piezo-electric effect None None Yes Dielectric absorption None Few % Few % Thermal shock sensitive + + ++ Ceramic Capacitors Technology

9 info@exxelia.comwww.exxelia.com Page revised 06/20 General characteristics GENERAL INFORMATION Ceramic Capacitors Technology MANUFACTURING STEPS SLIP CASTING ELECTRODE SCREEN PRINTING STACKING A slurry, a mix of ceramic powder, binder and solvents, is poured onto conveyor belt inside a drying oven, resulting in a dry ceramic sheet. The electrode ink, made from a metal powder mixed with solvents, is printed onto the ceramic sheets using a screen printing process. The sheets with electrode printed are stacked to create a multilayer structure. TERMINATIONS SINTERING PRESSING Each terminal of the capacitor is dipped in the termination ink, mix of metal powder, solvents and glass frit and the parts are fired in an oven. The parts are sintered in an oven with a precise temperature profile which is very important to the characteristics of the capacitors. Pressure is applied to the stack to fuse all the separate layers, this created a monolithic structure. TERMINATIONS PLATING FINAL TESTING PACKAGING Stacking + leads soldering + encapsulation (see pages 10-11)

10www.exxelia.com info@exxelia.com Page revised 06/20 Taping : dimensions SMD TERMINATIONS NON RoHS COMPLIANT Code RoHS COMPLIANT Code Magnetic Recommended mounting process Storage (months)*Epoxy bonding Iron soldering Wave soldering Vapor phase soldering Infrared soldering Wire bonding Ag Q Ag QW / P No •••• 18 Ag/Pd/Pt - Ag/Pd/Pt W / A No ••• 24 Ag + Ni + dipped Sn/Pb Ag/Pd/Pt + dipped Sn/Pb 60/40 H Ag/Pd/Pt + dipped Sn HW No • 24 Ag + Ni + electrolytic Sn/Pb 95/5 C Ag + Ni + electrolytic Sn CW / S Yes •••• 18 Ag + Ni + electrolytic Sn/Pb 60/40 D - - Yes •••• 18 - - Ag + Cu + electrolytic Sn Ag + Ni + dipped Sn/Pb 60/40 E Ag + Ni + electrolytic Sn EW Yes •• 24 Ag + Ni + Au G Ag + Ni + Au GW Yes •••••• 36 Ag + Polymer + Ni + Sn/Pb YC Ag + Polymer + Ni + Sn YCW Yes •••• 18 Ag + Polymer + Ni + Sn/Pb YD - - Yes •••• 18 Ag + Polymer + Ni + Au YG Ag + Polymer Nickel (Ni) or Copper (Cu) barriers amplify thermal shock and are not recommended for chip sizes larger than 3030. * Storage must be in a dry environment at a temperature of 20°C with a relative humidity below 50%, or preferably in a package enclosing a desiccant. Maintenance only. * Non magnetic chips series only. SMD ENVIRONMENTAL TESTS Ceramic chip capacitors for SMD are designed to meet test requirements of CECC 32100 and NF C 93133 standards as specified below in compliance with NF C 20700 and IEC 68 standards:

• Solderability: NF C 20758, 260°C, bath 62/36/2.
• Adherence: 5N force.
• Vibr ation fatigue test: NF C 20706, 20 g, 10 Hz to 2,000 Hz, 12 cycles of 20 minutes each.
• Rapid temperature change: NF C 20714, –55°C to + 125°C, 5 cycles.
• Combined climatic test: IEC 68-2-38.
• Damp heat: NF C 20703, 93 %, H.R., 40°C.
• Endurance test: 1,000 hours, 1.5 U RC , 125°C. STORAGE OF CHIP CAPACITORS TINNED OR NON TINNED CHIP CAPACITORS Storage must be in a dry environment at a temperature of 20°C with a relative humidity below 50 %, or preferably in a packaging enclosing a desiccant. STORAGE IN INDUSTRIAL ENVIRONMENT:
• 2 years for tin dipped chip capacitors,
• 18 months for tin electroplated chip capacitors,
• 2 years for non tinned chip capacitors,
• 3 years for gold plated chip capacitors. STORAGE IN CONTROLLED NEUTRAL NITROGEN ENVIRONMENT:
• 4 years for tin dipped or electroplated chip capacitors,
• 4 years for non tinned chip capacitors,
• 5 years for gold plated chip capacitors. Storage duration should be considered from delivery date and not from batch manufacture date. The tests carried out at final acceptance stage (solderabili- ty, susceptibility to solder heat) enable to assess the compatibility to surface mounting of the chips. User Guide

11 info@exxelia.comwww.exxelia.com Page revised 06/20 General characteristics GENERAL INFORMATION User Guide SURFACE MOUNTING DIL LEADS P style PL style L style J style RIBBON LEADS Micro-strip (type 1) Short Micro-strip (type 1S) Axial (Type 2) Radial (Type 3) R style RX style RJ style Please contact Exxelia sales for any lead configuration not shown. TROUGH-HOLE MOUNTING AXIAL AND RADIAL Radial leads (Type 6) Radial leads (4 leads) Axial leads (Type 7) DIL leads: N style ENCAPSULATION STYLES Ceramic encapsulation (selfprotected) Varnish Conformal coating Molding LEAD STYLES

12www.exxelia.com info@exxelia.com Page revised 06/20 Taping : dimensions SOLDERING ADVICES FOR REFLOW SOLDERING Dimensions in inches (in mm) Reflow soldering Wave soldering I 1 I 2 I 3 I 1 I 2 I 3 User Guide Large chips above size 2225 are not recommended to be mounted on epoxy board due to thermal ex- pansion coefficient mismatch between ceramic ca- pacitor and epoxy. Where larger sizes are required, it is recommended to use components with ribbon or other adapted leads so as to absorb thermo-me- chanical strains. RECOMMENDED FOOTPRINT FOR SMD CAPACITORS Ceramic is by nature a material which is sensitive both thermally and mechan- ically. Stresses caused by the physical and thermal properties of the capaci- tors, substrates and solders are attenuated by the leads. Wave soldering is unsuitable for sizes larger than 2220 and for the higher ends of capacitance ranges due to possible thermal shock (capacitance values giv- en upon request). Infrared and vapor phase reflow, are preferred for high reliability applications as inherent thermo-mechanical strains are lower than those inherent to wave soldering. Whatever the soldering process is, it is highly recommended to apply a thermal cycle, see hereafter our recommended soldering profile: Preheat zone 100 150 200 250 0 12 3 4 5 Time (min) Temperature (°C) 215°C 250°C 20°C >50°C/s Natural cool down RoHS No RoHS 0 100 150 200 250Temperature (°C) 0 12 3 4 5 Time (min) 20°C 215°C-225°C 245°C-255°C Natural cool down RoHS No RoHS 100 150 200 250 0 12 3 4 Time (min) Temperature (°C) 20°C 300 250°C 280°C Natural cool down RoHS No RoHS RECOMMENDED VAPOR PHASE REFLOW PROFILE RECOMMENDED IR REFLOW PROFIL RECOMMENDED WAVE SOLDERING PROFILE SOLDERING ADVICES FOR IRON SOLDERING Attachment with a soldering iron is discouraged due to ceramic brittleness and the process control limitations. In the event that a soldering iron must be used, the following precautions should be observed:

• Use a substrate with chip footprints big enough to allow putting side by side one end of the capacitor and the iron tip without any contact between this tip and the component,
• place the capacitor on this footprint,
• hea t the substrate until the capacitor’s temperature reaches 150°C minimum (preheating step, maximum 1°C per second),
• pla ce the hot iron tip (a flat tip is preferred) on the footprint without touching the capacitor. Use a regulated iron with a 30 watts maximum power. The recommended temperature of the iron is 270 ±10°C. The tem- perature gap between the capacitor and the iron tip must not exceed 120°C,

13 info@exxelia.comwww.exxelia.com Page revised 06/20 General characteristics GENERAL INFORMATION

• leave the tip on the footprint for a few seconds in order to increase locally the foo tprint’s temperature,
• use a cored wire solder and put it down on the iron tip. In a preferred way use Sn/Pb/Ag 62/36/2 alloy,
• wait until the solder fillet is formed on the capacitor’s termination,
• take away iron and wire solder,
• wait a few minutes so that the substrate and capacitor come back down to the preheating temperature,
• solder the second termination using the same procedure as the first,
• let the soldered component cool down slowly to avoid any thermal shock. PACKAGING TAPE AND REEL The films used on the reels correspond to standard IEC 60286-3. Films are de- livered on reels in compliance with document IEC 286-3 dated 1991. Minimum quantity is 250 chips. Maximum quantities per reel are as follows:
• Super 8 reel - Ø 180: 2,500 chips.
• Super 8 reel - Ø 330: 10,000 chips.
• Super 12 reel - Ø 180: 1,000 chips. Reel marking complies with CECC 32 100 standard:
• Model.
• Rated capacitance.
• Capacitance tolerance.
• Rated voltage.
• Batch number. User Guide Sizes Nr. of chips/ package Oriented chips Dimensions in inches (in mm) A B C D E DIMENSIONAL CHARACTERISTICS OF CHIPS TRAY PACKAGES HIGH Q CAPACITORS TAPE AND REEL PACKAGING SPECIFICATIONS Chips tray depth: C E E A D D B TRAY PACKAGES Sizes Type (1) W ±0.3 inches (mm) F ±0.05 inches (mm) P1 ±0.1 inches (mm) T max. inches (mm) Reel Size inches (mm) Quantity per Reel (1): Horizontal (H) or Vertical (V) orientation in cavities.

14www.exxelia.com info@exxelia.com Page revised 06/20 Taping : dimensions EIA STANDARD CAPACITANCE VALUES Following EIA standard, the values and multiples that are indicated in the chart below can be ordered. E48, E96 series and intermediary values are available upon request. (± 20%) E12 (± 10%) E24 (± 5%) 10 10 12 12 15 15 18 18 22 22 27 27 33 33 39 39 47 47 56 56 68 68 82 82 EIA CAPACITANCE CODE The capacitance is expressed in three digit codes and in units of pico Farads (pF). The first and second digits are significant figures of the capacitance value and the third digit identifies the multiplier. For capacitance value < 10pF , R designates a decimal point. See examples below: EIA code Capacitance value in pF in nF in µF 2R2 2.2 0.0022 0.0000022 6R8 6.8 0.0068 0.0000068 220 22 0.022 0.000022 470 47 0.047 0.000047 181 180 0.18 0.00018 2 21 220 0.22 0.00022 102 1,000 1 0.001 272 2,700 2.7 0.0027 123 12,000 12 0.012 683 68,000 68 0.068 124 120,000 120 0.12 564 560,000 560 0.56 335 3,300,000 3,300 3.3 825 8,200,000 8,200 8.2 156 15,000,000 15,000 15 686 68,000,000 68,000 68 107 100,000,000 100,000 100 227 220,000,000 220,000 220 PART MARKING VOLTAGE CODES Use the following voltage code chart for part markings: Voltage (V) Code Letter code 25 250 A 40 400 B 50 500 C 63 630 D 100 101 E 200 201 G 250 251 H 400 401 K 500 501 L 1,000 102 M 2,000 202 P 3,000 302 R 4,000 402 S 5,000 502 T 7 ,500 752 U 10,000 103 W PART MARKING TOLERANCE CODES Use the following tolerance code chart for part markings: Tolerance Letter code ±0.25pF CU ±0.5pF DU ±1pF FU ±1% F ±2% G ±5% J ±10% K ±20% M User Guide

15 info@exxelia.comwww.exxelia.com Page revised 06/20 General characteristics GENERAL INFORMATION RELIABILITY LEVELS Exxelia proposes different reliability levels for the ceramic capacitors for both NPO and X7R ceramics. ÆÆ Æ ÆÆ Æ Æ ¬¬¬¬Æ ¬¬¬Æ ¬¬Æ ÆÆ Æ ÆÆ Æ ÆÆÆÆ CECC EXXELIA TECHNOLOGIES chips capacitors are qualified according to CECC32101-801 100% electrical and visual control

• Voltage proof
• Insulation Resistance
• Capacitance value
• Dissipation factor IN PROCESS control According ESCC n°3009/3001 Documentation: according ESCC n°3009/3001 Chart F2 According ESCC n°3009/3001 Rapid Change of Temperature 5 cycles –55°C +125°C Damp Heat 85°C • 85 % RH 240 h • 1.5 V On 40 parts Standard Only for rated voltage <500V F T5 CoC Standard CoC CoC F CoC ESA ESCC EXXELIA TECHNOLOGIES chips capacitors are qualified (QPL) according to ESCC n°3009 (chips) and ESCC n°3001 (leaded) Level FM Rapid Change of Temperature 10 cycles –55°C +125°C Burn-in (100% control) 168 h, 125°C, 1.5 Un Solderability Test On 10 parts Chart F3 According ESCC n°3009/3001 User Guide

16www.exxelia.com info@exxelia.com Page revised 06/20 Taping : dimensions As the world’s leading manufacturer of specific passive components, we stand apart through our ability to quickly evaluate the application specific engineering challenges and provide a cost-effective and efficient solutions. For requirements that cannot be met by catalog products, we offer leading edge solutions in custom configuration: custom geometries, packaging, characteristics, all is possible thanks to our extensive experience and robust development process, while maintaining the highest level of reliability. Where necessary, special testing is done to verify requirements, such as low dielectric absorption, ultra-high insulation resistance, low dissipation factor, stability under temperature cycling or under specified environmental conditions, etc. HIGH CAPACITANCE

• High energy density
• Specific case sizes
• Specific shape of connections (high resistance to vibrations) HIGH TEMPERATURE
• Up to 250°C
• Specific shape of connections
• 2,000 hours life time
• HMP soldering OTHERS
• Screen printed resistors
• Complex components
• Full functions available HIGH VOLTAGE
• Up to 50 kV
• Specific circular shape