TCA62735AFLG TOSHIBA | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 18
Technical content
TOSHIBA CMOS INTEGRATED CIRCIUTS SILICON MONOLITHIC TCA62735AFLG Charge Pump type DC/DC Converter for White LED Driver The TCA62735AFLG is a charge pump type DC/DC Converter specially designed for constant current driving of White LED. This IC can outputs LED current 120mA or more to 2.8-4.2V input. This IC observes the power-supply voltage and the output voltage, and does an automatic change to the best of step up mode 1, 1.5 or 2 times. It is possible to prolong the battery longevity to its maximum. This IC is especially for driving back light white LEDs in LCD of PDA, Cellular Phone, or Handy Terminal Equipment. This device is Pb-free product. Characteristics
- Fabricating with CMOS Process
- Package : VQFN16-P-0404-0.65
- Input Voltage : 2.8V (Min)
- Switching Frequency : 1MHz (Typ.)
- Output Drive Current Capability : Greater than 120mA
- 4 Channels Built in Constant Sink Current Drivers (3 or 4 LEDs can be driven.)
- Sink Current Adjustment by External Resistance
- Soft Start Function
- Output Open Detection Function
- Thermal Shut Down Function (TSD) VQFN16-P-0404-0.65 Weight: 0.016 g (Typ.)
Pin Assignment (top view) Explanation of Terminals No Symbol Function 1 EN Logic input terminal. (input a chip enable signal) EN = ”H” → Operation mode, EN = ”L” → Shutdown mode
2 CTL0
3 CTL1
4 CTL2
Logic input terminal. (Selection of an output number) Please refer to the truth table on page 15. 5 ISET Resistance connection terminal for setting up output current. 6 VOUT Output terminal. 7 VIN Power supply terminal.
8 C1+
9 C1−
10 C2−
11 C2+
Capacitance connection terminal for charge pump. 12 GND GND terminal.
13 ILED4
14 ILED3
15 ILED2
16 ILED1
Constant Sink Current Driver terminal. EN CTL0 CTL1 CTL2 GND C2+ C2− C1− ILED1 ILED2 ILED3 ILED4 ISET VOUT VIN C1+
C1+ C1– VIN VOUT C2+ C2 – Feed Back Circuit Up Converting Time Change CTL0 EN CTL1 CTL2 Control Logic Charge pump Circuit Constant Current Regulator
- ILED1~4 2. ISET 3. EN, CTL0, CTL1, CTL2 4. VOUT 5. C1+, C2+ 6. C1- 7 . C 2 - C1+, C2+ ILED1~4 VIN VIN EN,CTL0,CTL1,CTL2 VOUT C1- C2- VIN ISET
Absolute Maximum Ratings (Ta = 25°C if without notice) Characteristics Symbol Ratings Unit Power Supply Voltage V IN −0.3~+6.0 V Input Voltage V IN(LOGIC) −0.3~VIN+0.3(*1) mA Output Current I OUT 200 mA/ch Operating Temperature T opr −40~+85 °C Storage Temperature T stg −55~+150 °C Junction Temperature T j 150 °C *1 : please do not exceed 6V. Recommended Operating Condition (Ta=-40°C to 85°C if without notice) Characteristics Symbol Test Condition Min Typ Max Unit Power Supply V IN - 2.8 - 4.2 V Logic Input Voltage V IN(LOGIC) EN,CTL0,CTL1,CTL2 0 - V IN V Capacitance for Charge Pump C1,C2 - 0.8 1.0 2.2 µF Capacitance for output COUT - 0.8 1.0 4.7 µF Capacitance for input CIN - 0.8 2.2 10.0 µF R SET resistance RSET - 8.2 12 47 k Ω
Electrical Characteristics
DC-DC Regulator part (VIN=3.6V, Ta=25°C, if it is not specified.) Characteristics S y m b o l Test Circuits Test Condition Min Typ Max Unit 2 time up converting 120 - - 1.5 time up converting 120 - - Output Current Ability I OUT(MAX) 1 1 time up converting 120 - - mA Consumption Current I IN(ON) 2 EN=”H”, R SET=47kΩ - 1 2 mA Stand By Consumption Current I IN(OFF) 2 EN=”L” - 0 1 µA High V IH 3 EN, CTL0,CTL1,CTL2 VIN=2.8V~4.2V 0.7VIN - - Logic Input Voltage Low V IL 3 EN,CTL0,CTL1,CTL2 VIN=2.8V~4.2V - - 0.3V IN V Logic Input Current I leak 3 EN,CTL0,CTL1,CTL2 - - 0.1 µA Clock Frequency f OSC 4 - - 1000 - kHz TOTAL R ON R ON 1 1.5 time up converting - 5 10 Ω 1X mode to 1.5X mode transition voltage VTRANS1X 4 LED Vf=3.6V, RSET=12kΩ VIN falling - 4.0 - V Constant Current Driver part (VIN=3.6V, Ta=25°C, if it is not specified.) Characteristics Symbol Test Circuits Test Condition Min Typ Max Unit RSET=47kΩ - 5.1 - RSET=12kΩ - 19.6 - Constant Current Drive Setting I LED1~4 5 RSET=8.2kΩ - 28 - mA ISET Terminal Output Voltage V SET 5 RSET=8.2kΩ - 0.61 - V Between Chs |ILED-LED-ERR|5 - ʵ 2.5 ʵ % Constant Current Accuracy Between ICs |ILED-ERR| 5 - ʵ 5 ʵ % Constant Sink Current Supply Voltage Regulation |∆ILED| 5 VIN=3.6V center,VIN=2.8~4.2V IOUT=80mA ʵ 1 ʵ % Output leakage current I LEAK1~4 5 EN="L" ʵ ʵ 1 µA
Test Circuit1: Output Current Ability, TOTAL RON Test Circuit2: Consumption Current, Stand By Consumption Current C1- C2- C2+ CTL2 CTL1 CTL0 EN ILED4 ILED3 ILED2 ILED1 RSET=47kΩ CIN=2.2µF COUT=1.0µFC1=1.0µF VIN=3.6V C2=1.0µF C1+ VIN VOUT ISET A C1- C2- C2+ CTL2 CTL1 CTL0 EN ILED4 ILED3 ILED2 ILED1 CIN=2.2µF COUT=1.0µFC1=1.0µF VIN=2.8V~4.2V C2=1.0µF C1+ VIN VOUT ISET GND A ˣ IOUT=120mA V V (VIN×1.5) - VOUT IOUT VIN VOUT RON=
Test Circuit3: Logic Input Voltage, Logic Input Current Test Circuit4: Clock Frequency, 1X mode to 1.5X mode transition voltage C1=1.0µF C2=1.0µF C1- C2- C2+ CTL2 CTL1 CTL0 EN ILED4 ILED3 ILED2 ILED1 RSET=47kΩ CIN=2.2µF COUT=1.0µF VIN=2.8V~4.2V C1+ VIN VOUT ISET A A A A V V V V VIN(LOGIC)=0Vʙ4.2V VIN(LOGIC)=0Vʙ4.2V VIN(LOGIC)=0Vʙ4.2V VIN(LOGIC)=0Vʙ4.2V C1- C2- C2+ CTL2 CTL1 CTL0 EN ILED4 ILED3 ILED2 ILED1 RSET=12kΩ CIN=2.2µF COUT=1.0µFC1=1.0µF VIN=2.8V~4.2V C2=1.0µF C1+ VIN VOUT ISET V A GND F
Test Circuit5: Constant Current Drive Setting, ISET Terminal Output Voltage, Constant Current Accuracy Test Circuit5: Constant Sink Current Supply Voltage Regulation, Output leakage current C1- C2- C2+ CTL2 CTL1 CTL0 EN ILED4 ILED3 ILED2 ILED1 RSET=47kΩ, 12kΩ, 8.2kΩ CIN=2.2µF COUT=1.0µFC1=1.0µF VIN=2.8V~4.2V C2=1.0µF C1+ VIN VOUT ISET A A A A V
*This data is provided for reference only. Thorough evaluation and testing should be implemented when designing your application's mass production design. Quiescent Current v s. IOUT Current 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 20 40 60 80 100 120 IOUT Current (mA) Quiescent Current (mA) VIN=2.7V VIN=3.6V VIN=4.3V Efficiency v s. VIN 100 VIN (V) Efficiency (%) 4LEDs at 20mA LED Vf=3.51V Quiescent Current vs. VIN 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 VIN (V) Quiescent Current (mA) 4LEDs at 30mA 4LEDs at 20mA 4LEDs at 5mA Efficiency v s. IOUT 100 0 20 40 60 80 100 120 IOUT (mA) Efficiency (%) VIN=3.0V VIN=3.3V VIN=3.6V VIN=3.9V VIN=4.2V LED Vf=3.3V Ta=25°C Ta=25°C Ta=25°C Ta=25°C
IOUT Current vs. VIN 100 120 140 160 VIN (V) IOUT Current (mA) 4LEDs at 30mA 4LEDs at 20mA 4LEDs at 5mA ILED Current vs. VIN VIN (V) ILED Current (mA) 4LEDs at 30mA 4LEDs at 20mA 4LEDs at 5mA 1x Mode Transition Voltage vs. ILED Current 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.1 5 1 01 52 02 53 0 I LE D Current (mA) VIN_transition voltage (V) LED Vf=3.2V,4ch ON LED Vf=3.4V,4ch ON LED Vf=3.6V,4ch ON C1- C2- C2+ CTL2 CTL1 CTL0 EN ILED4 ILED3 ILED2 ILED1 RSET=8.2kΩ~47kΩ CIN=2.2µF COUT=1.0µFC1=1.0µF VIN=2.8V~4.2V C2=1.0µF C1+ VIN VOUT ISET V A A V GND
- Evaluation conditions LED : NACW215 (NICHIA Corp.) CIN : C1608JB1C225K (TDK Corp.) COUT : C1608JB1C105K (TDK Corp.) C1 : C1608JB1C105K (TDK Corp.) C2 : C1608JB1C105K (TDK Corp.) Ta=25°C Ta=25°C Ta=25°C
The current of the terminal ILED1 to 4 is set by resistance RSET connected with the terminal ISET. ILED can be set according to the next expression. C1- C2- C2+ GND CTL2 CTL1 CTL0 EN RSET CIN=2.2µF COUT=1.0µF C1=1.0µF VIN=2.8V~4.2V C2=1.0µF ILED4 ILED3 ILED2 ILED1 C1+ VIN VOUT ISET 400 × 0.61[V] RSET[kΩ] ILED[mA] = RSET vs ILED 0 5 10 15 20 25 30 35 40 45 50 RSET (kΩ) ILED(mA)
Method of Current Dimming control 1) Input PWM signal to SHDN terminal I LED can be set according to the next expression. f PWM will recommend 100Hz. *In this PWM control operation, This IC repeats ON/OFF. In this result, rush current is occur when ON timing with supplying charge to C OUT. Please note it. 0.61[V] × 400 × ON Duty[%] RSET[kΩ] ILED[mA] = C1- C2- C2+ GND CTL2 CTL1 CTL0 EN ILED4 ILED3 ILED2 ILED1 RSET=12kΩ CIN=2.2µF COUT=1.0µF C1=1.0µF VIN=3.6V PWM signal fPWM=100Hz, ON Duty50% C2=1.0µF C1+ VIN VOUT ISET Ch1 : VPWM Ch2 : IIN Ch3 : VOUT Ch4 : IOUT PWM Duty vs. IOUT 100 0 2 04 06 08 0 1 0 0 PWM Duty (%) IOUT (mA)
2) Input analog voltage to ISET terminal 1. Precondition
- Please set the range of the analog voltage input by 0 to 0.61V. 2. The maximum current is defined as αmA. 3. A minimum current is defined as βmA. 4. I LED can be set according to the next expression. R1[kΩ] + R2[kΩ] R1[kΩ] × R2[kΩ] R2[kΩ] β[mA] - α[mA] 0.61[V] ILED[mA] = VADJ[V] × + α[mA] ILED v s. VADJ 0 0.2 0.4 0.6 VADJ (V) ILED (mA) This method is without repeating IC ON/OFF, and no need to consider holding rash current. C1- C2- C2+ GND CTL2 CTL1 CTL0 EN ILED4 ILED3 ILED2 ILED1 R2=47kΩ CIN=2.2µF COUT=1.0µFC1=1.0µF VIN=2.8V~4.2V C2=1.0µF C1+ VIN VOUT ISET R1=16kΩ VADJ=0V~0.61V
3) Input Logic signal User can adjust ILED with Logic signal input as indicated in recommended circuit. The Resistor connected the ON-State Nch MOS Drain and RSET determines ILED. I LED can be set according to the next expression. About combined resistance R[kΩ] M1 M2 R[k Ω] ON ON ON OFF OFF ON OFF OFF This method is without repeating IC ON/OFF, and no need to consider holding rash current. 400 × 0.61[V] R[kΩ] ILED[mA] = R1 RSET C1- C2- C2+ GND CTL2 CTL1 CTL0 EN ILED4 ILED3 ILED2 ILED1 COUT=1.0µFC1=1.0µF C1+ VIN VOUT ISET C2=1.0µF CIN=2.2µF VIN=2.8V~4.2V RSET[kΩ] × R1[kΩ] × R2[kΩ] R1[kΩ]×RSET[kΩ] + R 2[kΩ]×RSET[kΩ] + R 1[kΩ]×R2[kΩ] RSET[kΩ] × R1[kΩ] RSET[kΩ] + R1[kΩ] RSET[kΩ] × R2[kΩ] RSET[kΩ] + R2[kΩ] RSET[kΩ]
Selection of an output number by CTL0, CTL1, and CTL2 Terminal Truth Table Attention in use *Soft Start Function This device is integrated Soft start function. When the power supply is ON or output is start ed to operate, the transition time is controlled in order to decrease the rush current. ( Reference data: The output voltage is time 200µs of made from 0 to 4.0V at the V IN=2.8V time.) *Inrush Current of Input Current The inrush current flows when start-up and mode switching. (Reference data: Inrush current at CE1/CE2="L" to “H” is 500mA.) *Thermal Shut Down Function This device has Thermal Shutdown Function to protect from thermal damage when the output is shorted. The temperature to operate this function is set around from 140 to 160°C. (This is not guaranteed Value.) *The Selection of Capacitor for Charge Pump, Input and Output The input capacitor is effective to decrease the impedance of power supply and also input current is averaged. The input capacitor should be selected by impedance of power supply, it is better to choose with lower ESR (Equivalent Series Resistor). (i.e. ceramic capacitor etc.) Regarding to the capacitance values, it is recommended to choose in the range from 0.8 µF to 10 µF, however larger than 2.2 µF should be better. The output capacitor is effective to dec rease the ripple noise of the output line. Also, it is better to choose the capacitor.) Regarding to the capacitance values, it is recommended to choose in the range from 0.8 µF to 4.7 µF, however larger than 1.0 µF should be better. The capacitor for charge pump operation is also selected the capacitor with low ESR. .) Regarding to the capacitance values, it is recommende d to choose in the range from 0.8 µF to 2.2 µF, however larger than 1.0 µF should be better. Input Output CTL2 CTL1 CTL0 EN ILED4 ILED3 ILED2 ILED1 L L L H L L H H L H L H L H H H H L L H Please do not set it. H L H H OFF ON ON ON H H L H ON ON ON ON H H H H OFF OFF OFF OFF L L L L OFF OFF OFF OFF L L H L OFF OFF OFF OFF L H L L OFF OFF OFF OFF L H H L OFF OFF OFF OFF H L L L OFF OFF OFF OFF H L H L OFF OFF OFF OFF H H L L OFF OFF OFF OFF H H H L OFF OFF OFF OFF
VQFN16-P-0404-0.65 Unit : mm Weight: 0.016 g (Typ.) 4.00Typ. 3.75Typ. 3.75Typ. 0.9MAX 0.65Typ. 0.60 0.25MIN 0.28 4.00Typ. 0.07 0.05 0.15 0.10
- Block Diagrams Some of the functional blocks, circuits, or constants in the block diagram may be omitted or simplified for explanatory purposes. 2. Equivalent Circuits The equivalent circuit diagrams may be simplified or some parts of them may be omitted for explanatory purposes. 3. Timing Charts Timing charts may be simplified for explanatory purposes. 4. Application Circuits The application circuits shown in this document are provided for reference purposes only. Thorough evaluation is required, especially at the mass production design stage. Toshiba does not grant any license to any industrial property rights by providing these examples of application circuits. 5. Test Circuits Components in the test circuits are used only to obtain and confirm the device characteristics. These components and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment. IC Usage Considerations Notes on handling of ICs [1] The absolute maximum ratings of a semiconductor device are a set of ratings that must not be exceeded, even for a moment. Do not exceed any of these ratings. Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. [2] Use an appropriate power supply fuse to ensure that a large current does not continuously flow in case of over current and/or IC failure. The IC will fully break down when used under conditions that exceed its absolute maximum ratings, when the wiring is routed improperly or when an abnormal pulse noise occurs from the wiring or load, caus ing a large current to continuously flow and the breakdown can lead smoke or ignition. To minimize the effects of the flow of a large current in case of breakdown, appropriate settings, such as fuse ca pacity, fusing time and insertion circuit location, are required. [3] If your design includes an inductive load such as a motor coil, incorporate a protection circuit into the design to prevent device malfunction or breakdown caused by the current resulting from the inrush current at power ON or the negative current resulting from the back electromotive force at power OFF. IC breakdown may cause injury, smoke or ignition. Use a stable power supply with ICs with built-in protection functions. If the power supply is unstable, the protection function may not operate, causing IC breakdown. IC breakdown may cause injury, smoke or ignition. [4] Do not insert devices in the wrong orientation or incorrectly. Make sure that the positive and negative terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the absolute maximum rating, and exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may result injury by explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong orientation or incorrectly even just one time. [5] Carefully select external components (such as inputs and negative feedback capacitors) and load components (such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a speaker with low input withstand voltage, overcurrent or IC failure can cause smoke or ignition. (The over current can cause smoke or ignition from the IC itself.) In particular, please pay attention when using a Bridge Tied Load (BTL) connection type IC that inputs output DC voltage to a speaker directly.